JP3199014B2 - Daughter card side connector and high speed transmission compatible connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of electrically connecting electronic circuit boards constituting an electronic device or computer,
The present invention also relates to a connector structure suitable for electrically connecting high-speed transmission signals between electronic circuit boards through a short path.

[0002]

2. Description of the Related Art A daughter card electrically connected to a pattern in which a signal of a mother card is transmitted has a logic element (LSI) on the daughter card as the transmission signal speeds up.
Etc.) to shorten the transmission distance between the pattern of the mother card and the logic element closer to the mother card side, and further reduce the pitch and size of the connector contacts connecting the mother card and the daughter card to the daughter card. In this method, the length of the signal pattern between the logic element and the contact of the connector and the length of the contact conductor of the connector are reduced. Conventionally, this kind of high-speed transmission compatible connector has a structure shown in FIG. L mounted on daughter card 38
In order to shorten the transmission distance between the SI 31 and the mother card on which the daughter card 38 is mounted, a conductive film 34 is formed on the surface of the connector 33. The conductive coating 34 is
Hole 3 into which contacts 35 and 36 of connector 33 are press-fitted.
LSIs are also formed on the inner walls of 7, 39 and patterned.
The pad 33 to which the terminal 32 is soldered and the connector 33
Are electrically connected between the arbitrary holes 37 and 39. By directly mounting the LSI 31 on such a connector 33, the transmission distance between the LSI 31 and the mother card is reduced by the LSI.
The terminal length of the connector 33 existing between the contact 35 and the terminal 36 is shorter than the case where the connector 31 is mounted on the daughter card 38.

In such a structure, an etching step is added after plating or applying a conductive film in order to form a conductive film 34 on the surface of the connector 33.

[0004]

A first problem of the prior art is that the transmission line from the logic element to the contact of the connector is a transmission line of a conductive film adhered to the connector surface and is susceptible to electrical noise. It is.

[0005] The reason is that it is possible to form a conductive coating on the connector surface, but it is difficult to form a GND pattern by laminating a signal pattern around a signal pattern for forming an impedance adjustment and a microstrip structure. This is because the transmission path becomes weak against electric noise.

A second problem with the prior art is that the conductive coating adheres to the surface of the connector and to the holes into which the contacts and terminals are press-fitted. That is, the price increases due to the increase in the number of processes and processes required for the control.

The reason for this is that the number of steps for attaching a conductive coating increases, and it becomes difficult to control the attachment of a predetermined amount of the conductive coating to all through holes, resulting in a decrease in yield.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a connector capable of shortening a transmission distance between a high-speed transmission signal pattern on a mother card and a logic element on a daughter card and further supporting a high-speed transmission signal resistant to electrical noise. It is in.

Another object of the present invention is to provide a connector which can be mass-produced and yield improved by simplification of the structure and manufacturing aspects and which can be manufactured at a low cost.

[0010]

According to the first aspect of the present invention, there is provided a first insulator, and a first contact portion for electrically contacting a mother card side connector mounted on the mother card. A daughter card-side connector mounted on the daughter card, the connector including a daughter card-side contact provided on the first insulator;
The insulator has a fitting portion for fitting with a printed board on which a logic element is mounted, and a part of the printed board.
Is provided in the daughter card side connector.
At least a part of the daughter card side contact has a second contact portion that electrically contacts the printed board fitted in the fitting portion. can get.

According to a second aspect of the present invention, the fitting portion is an insertion opening opened on a side opposite to a fitting surface of the first insulator with respect to the mother card side connector. The daughter card side connector according to item 1 is obtained.

According to the third aspect of the present invention, female first and second contacts are provided on the first insulator as the daughter card-side contacts, and the second contacts are provided on the second contacts. The daughter card side connector according to claim 1 or 2 is provided.

According to a fourth aspect of the present invention, the daughter card side connector according to the first or second aspect, a second insulator, and a mother provided on the second insulator and electrically contacting the daughter card side contact. A high-speed transmission compatible connector having card side contacts and comprising a combination with a mother card side connector mounted on the mother card is obtained.

According to a fifth aspect of the present invention, the daughter card side connector according to the third aspect, a second insulator, and a male provided on the second insulator and electrically contacting the first and second contacts. A high-speed transmission compatible connector having the third contact of the mold and being combined with a mother card side connector mounted on the mother card is obtained.

[0015]

In the contact of the daughter card side connector attached to the daughter card, a first contact portion that contacts the mother card side connector of the mother card and a second contact portion is provided in a direction opposite to the first contact portion. As a result, a small printed circuit board on which a logic element such as an LSI is mounted can be directly fitted. Further, by connecting this small printed circuit board to a daughter card, the logic element on the daughter card and the high-speed transmission signal of the mother card can be connected. The signal transmission distance to the pattern is shortened, and the electrical characteristics such as impedance matching and microstrip structure are improved by the pattern of the small printed circuit board.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a preferred embodiment of the present invention, a high-speed transmission-compatible connector is provided with an LSI or the like from the opposite side of the female connector attached to the daughter card to the male connector attached to the mother card. By providing a mating part that can be attached and connected to a small printed circuit board on which the logic element is mounted, the transmission distance between the logic element of the daughter card and the signal pattern of the mother card can be shortened. Adjustment and microstrip structure become easy. More specifically, two contact portions of the female connector contacts attached to the daughter card are provided, the first contact portion contacts the male connector attached to the mother card, and the second contact portion contacts the male connector. It comes into contact with the small printed circuit board inserted from the insertion opening of the small printed circuit board on which a logic element such as an LSI provided on the surface opposite to the fitting surface is mounted. The small printed circuit board is connected to the daughter card via a flexible printed circuit board by soldering or the like.

Another feature is that the connector has a simple structure and can be manufactured at low cost. Specifically, the contact of the connector has a simple structure that is formed by press working and mounted on the housing.

Next, this embodiment will be described in detail with reference to the drawings.

Referring to FIGS. 1 and 2, the connector for high-speed transmission according to the present embodiment comprises a first contact (daughter card side contact) 3 having a first contact portion 7 and a soldering terminal 14, and a first contact. The second contact portion 5 in addition to the contact portion 7
A plurality of second contacts (daughter-card-side contacts) 6 each having a female connector (daughter-card-side connector) 1 mounted on the first insulator 21 at arbitrary positions, and fitted with the female connector 1 A male connector (mother card side connector) 2 having a third contact (mother card side contact) 4 attached to the second insulator 22 at a position where the first and second contacts 3 and 6 come into contact with the contact portion 7. Consisting of a combination of

The female connector 1 is provided with an insertion port (fitting portion) 16 on the surface opposite to the surface fitted with the male connector 2 for mounting the small printed circuit board 9 on which the LSI 8 is mounted. The contact pad 15 of the small printed circuit board 9 mounted from the insertion port 16 is in contact with the second contact portion 5 of the second contact 6. The small printed board 9 has a flexible board 10 attached to a side opposite to a side provided with a portion of the second connector 6 of the female connector 1 in contact with the second contact portion 5, and the flexible board 10 is a daughter card. 11 are connected to the soldering posts 13 by soldering or the like.

The male connector 2 is set on the mother card 12 such that the surface opposite to the surface fitted with the female connector 1 is in contact with the surface of the mother card 12, and the terminal of the third contact 4 is soldered. It is attached by attaching or press fitting. The third contact 4 is mounted on the second insulator 22 corresponding to the positions of the first and second contacts 3 and 6 of the female connector 1. The male connector 2 is a daughter card 1 mounted on a mother card 12 in plurals.
A plurality of the female connectors 1 are mounted at positions corresponding to the positions of the female connectors 1.

Further, the small printed circuit board 9, the female connector 1
Daughter card 11 to which the male connector 2 is attached
Is mounted on the mother card 12 to which is attached, and is connected to the signal pattern of the mother card 12. In this state, the signal transmission path between the LSI 8 on the small printed circuit board 9 and the mother card 12 includes the pattern of the small printed circuit board 9 on which the LSI 8 is mounted, the second contact portion 5 of the second contact 6, and the second The signal pattern of the mother card 12 passes through the first contact portion 7 of the contact 6 and the third contact 4, and becomes a route.

[0023]

The first effect of the present invention is that a printed circuit board pattern is used for a signal transmission path between an LSI on a daughter card and a signal pattern of a mother card.
It is more resistant to electrical noise than the conventional method, and can respond to signal transmission at a higher speed than conventional signal transmission.

The reason is that if a pattern formed by a printed circuit board is used for a signal transmission path, impedance matching and a microstrip structure can be achieved, and the apparatus is resistant to electric noise.

The second effect of the present invention is that both the contact of the daughter card connector and the contact of the mother card connector have simple shapes and are inexpensive.
High-speed transmission compatible connector becomes low price.

The reason is that since the contact shape is formed by simple bending, the mass production is excellent and the yield is good.

[Brief description of the drawings]

FIG. 1 is a perspective view of a high-speed transmission compatible connector according to an embodiment of the present invention.

FIG. 2 shows a cross section taken along the line AA in FIG. 1,
(A) is a sectional view at the time of non-fitting, (b) is a sectional view at the time of fitting.

FIG. 3 is a cross-sectional view of a conventional high-speed transmission compatible connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Female connector 2 Male connector 3 1st contact 4 3rd contact 5 2nd contact part 6 2nd contact 7 1st contact part 8 LSI 9 Small printed circuit board 10 Flexible board 11 Daughter card 12 Mother card 13 Soldering Post 14 Solder terminal 15 Contact pad 16 Insertion opening 21 First insulator 22 Second insulator 31 LSI 32 Terminal 33 Connector 34 Conductive coating 35 Contact 36 Terminal 37 hole 38 Daughter card 39 hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 12/00-12/38 H01R 23/68

Claims (5)

(57) [Claims] The first insulator includes a first contact portion that electrically contacts a mother card-side connector mounted on a mother card, and a daughter card-side contact provided on the first insulator. A daughter card connector mounted on the daughter card, wherein the first insulator is electrically connected to the mother card.
A mating portion for mating with a printed circuit board on which a logic element connected to is mounted, a part of the printed circuit board is provided in the daughter card side connector, and at least one of the daughter card side contacts Some are
A daughter card-side connector having a second contact portion that electrically contacts the printed circuit board fitted to the fitting portion. 2. The connector according to claim 1, wherein the fitting portion is an insertion opening opened on a side opposite to a fitting surface of the first insulator with respect to the mother card side connector.
The daughter card side connector described. 3. A method according to claim 1, wherein female daughter first and second contacts are provided on the first insulator as the daughter card side contacts, and the second contact is provided on the second contact. The daughter card side connector according to claim 1 or 2, wherein 4. A motherboard comprising the daughter card side connector according to claim 1 or 2, a second insulator, and a mother card side contact provided on the second insulator and electrically contacting the daughter card side contact. High-speed transmission compatible connector consisting of a combination with a mother card connector mounted on the card. 5. The daughter card-side connector according to claim 3, a second insulator, and a male third contact provided on the second insulator and electrically contacting the first and second contacts. , A high-speed transmission compatible connector consisting of a combination with a mother card side connector mounted on the mother card.