JP3199556B2 - Cooled amplifier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooled amplifier,
In particular, it relates to a cooled amplifier used in microwave or millimeter waves.

[0002]

2. Description of the Related Art In a low-noise amplifier used in a microwave band or a millimeter wave band, the amplifier itself is cooled to reduce noise. This kind of low noise amplifier is generally called a cooled low noise amplifier, and various proposals have been made.
Further, even in a high-output type amplifier, the amplifier itself is cooled, and high output and high efficiency are achieved.

FIG. 7 is a technical report MW of the Institute of Electronics, Information and Communication Engineers.
9 shows the structure of a cooled low noise amplifier reported in 92-149 “HEMT Direct Cooled Low Noise Amplifier”. In the cooled low noise amplifier shown in FIG.
A low-noise amplifier (HEMT device) 2 is loaded on the cooling surface. The electronic cooling element 1 is a device using the Peltier effect, and a cooling effect is obtained by supplying a voltage.

The thermoelectric cooler 1 and the low noise amplifier 2 are mounted in a central cavity of an amplifier housing 3. An external input terminal 4 and an external output terminal 5 are provided in a peripheral portion of the amplifier housing 3 at positions facing each other. A microstrip line substrate 6 having a strip shape is disposed between the external input terminal 4 and the input terminal of the low noise amplifier 2. Similarly, a strip-shaped microstrip line substrate 7 is provided between the external output terminal 5 and the output terminal of the low noise amplifier 2.

[0005] In the cooled low-noise amplifier, a microwave or millimeter wave transmission wave is input from an external input terminal 4. This transmission wave is transmitted through the metal conductor 6C of the microstrip line substrate 6, and the transmitted transmission wave is transmitted to the low noise amplifier 2
Is input to The input transmission wave is amplified by the low noise amplifier 2. The amplified transmission wave is output from the low-noise amplifier 2, and this transmission wave is output through the metal conductor 7C of the microstrip line substrate 7 and the external output terminal 5.

At this time, heat generated in the low noise amplifier 2
Also, the heat that is transmitted to the microstrip lines 6 and 7 from the outside and flows into the low-noise amplifier 2 is absorbed by the cooling surface of the electronic cooling element 1, and the low-noise amplifier 2 is cooled. A space is formed in the central cavity between the cooling surface of the electronic cooling element 1 and the amplifier housing 3, the amount of heat flowing into the cooling surface of the electronic cooling element 1 is reduced, and the cooling efficiency of the low noise amplifier 2 is reduced. Is enhanced.

Further, the microstrip line substrates 6 and 7 are formed in a strip shape, and are connected between the cooling surface of the electronic cooling element 1 and the amplifier housing 3 in a bridge structure. That is, the amount of heat flowing into the cooling surface of the electronic cooling element 1 is reduced, and also in this regard, the cooling efficiency of the low noise amplifier 2 is improved.

[0008]

However, the following points are not taken into consideration in the above-mentioned cooled low noise amplifier.

First, although the microstrip line substrate 6 is formed in a strip shape, a metal conductor 6 is provided between the external input terminal 4 of the amplifier housing 3 and the input terminal of the low noise amplifier 2.
Connected with C. Therefore, the amount of heat flowing into the low noise amplifier 2 through the metal conductor 6C increases, and
Cannot be cooled sufficiently.

Second, if the length of the microstrip line substrate 6 is increased and the width of the microstrip line substrate 6 is reduced, the amount of heat flowing into the low-noise amplifier 2 can be reduced, and the low-noise amplifier 2 Cooling can be performed sufficiently. However, conversely, the electric resistance of the metal conductor 6C increases, and the transmission loss of the transmission wave increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has been made in order to reduce the amount of heat flowing into an amplifier without increasing the transmission loss of a transmission wave transmitted through a line substrate. The purpose is to provide a type amplifier.

Another object of the present invention is to provide a miniaturized cooled amplifier.

[0013]

In order to achieve the above object, the invention described in claim 1 comprises an amplifier disposed on a cooling surface of an electronic cooling element having a cooling function,
In a cooled amplifier in which a transmission wave is input to the amplifier through a microstrip line or a transmission wave amplified from the amplifier is output, the microstrip line is divided in a shape that interrupts a heat transfer path, and the divided The microstrip lines are connected via a wavelength coupling line.

According to a second aspect of the present invention, in the cooled amplifier according to the first aspect, the wavelength coupling line is formed of a quarter wavelength coupling line having a DC cut function. I do.

According to a third aspect of the present invention, there is provided an amplifier provided on a cooling surface of an electronic cooling element having a cooling function, and a transmission wave is input to the amplifier through a microstrip line or amplified from the amplifier. Wherein the microstrip line is divided so as to cut off a heat transfer path, and the divided microstrip lines are connected via an interdigital capacitor. And

According to a fourth aspect of the present invention, there is provided an amplifier provided on a cooling surface of an electronic cooling element having a cooling function, and a transmission wave is input to the amplifier through a microstrip line or amplified from the amplifier. In the cooled amplifier outputting the transmitted transmission wave, an inductor having a narrow line width is provided in a part of the microstrip line.

The invention described in claim 5 has a cooling function.
An amplifier provided on the cooling surface of the electronic cooling element
The transmission wave is input to the amplifier or the amplifier
-Type amplifier that outputs amplified transmission waves
Input of the transmission wave to the amplifier, or from the amplifier
In front of the coplanar line substrate that outputs the amplified transmission wave
The cooling surface is bonded with an adhesive .

The invention described in claim 6 has a cooling function.
An amplifier provided on the cooling surface of the electronic cooling element
The transmission wave is input to the amplifier or the amplifier
-Type amplifier that outputs amplified transmission waves
Input of the transmission wave to the amplifier, or from the amplifier
A slot line board that outputs the amplified transmission wave is provided.
Characterized in that was.

The invention described in claim 7 has a cooling function.
An amplifier provided on the cooling surface of the electronic cooling element
The transmission wave is input to the amplifier or the amplifier
-Type amplifier that outputs amplified transmission waves
Input of the transmission wave to the amplifier, or from the amplifier
Install a slot line board to output the amplified transmission wave.
Heat transfer path through the slot line of the slot line substrate.
Characterized in that a choke portion is provided so as to block the air flow .

[0020] The invention described in claim 8 is the above-described claim.
7. The cooled amplifier according to 7, wherein the choke portion is
Is constituted by a quarter-wave choke section .

[0021]

[Action] In the invention described in claim 1, the first
In addition, the heat transfer path is divided by dividing the microstrip line.
Is interrupted and flows to the amplifier through the microstrip line.
Since the amount of heat entering is reduced, the cooling performance of the cooled amplifier
Performance can be improved.

Further , in the invention described in claim 1,
Second, the divided microstrip line is
Interconnected through a wavelength coupling line,
Affects the electrical characteristics of the transmission wave transmitted through the
Since there is no transmission wave, loss of the transmission wave can be prevented.

According to the second aspect of the present invention, since the wavelength coupling line is formed of a quarter wavelength coupling line having a DC cut function, the size of the cooled amplifier can be reduced. In the invention described in claim 3, first, the heat transfer path of the microstrip line is cut off by the interdigital capacitor, and the amount of heat flowing into the amplifier through the microstrip line is reduced. The cooling performance of the amplifier can be improved. Second, since the microstrip lines are connected to each other via an interdigital capacitor and do not affect the electrical characteristics of the transmission wave transmitted through the microstrip line, loss of the transmission wave can be prevented. Third, the interdigital capacitor has a direct current cut function and can be used as a part of a matching circuit of the amplifier by appropriately selecting a capacitance value. The size of the amplifier can be reduced.

In the invention described in claim 4, first, the resistance value of the heat transfer path is increased in the inductor portion formed in the microstrip line, and the amount of heat flowing into the amplifier through the microstrip line is reduced. Therefore, the cooling performance of the cooling amplifier can be improved . The second
In addition, since the inductor section can be used as a part of a matching circuit of the amplifier, the size of the amplifier itself is reduced, and as a result, the size of the cooled amplifier can be reduced.

According to the fifth aspect of the present invention, first, as compared with a microstrip line substrate,
Since there is no conductor on the backside of the substrate,
Reduces the amount of heat flowing into the amplifier through the coplanar line substrate
Thus, the cooling performance of the cooling amplifier can be improved. Second
In addition, the electrical characteristics of the transmission wave transmitted through the microstrip line
Since the characteristics are not affected, loss of the transmission wave can be prevented.
You.

Further, in the invention described in claim 5,
Third, the coplanar waveguide substrate and the electronic cooling element
Conductive connection such as solder to the connection between the cooling surface and the amplifier housing
There is no need to use an adhesive. That is, conductive bonding
As a result of using no agent, the resistance value of the heat transfer path is more reduced.
Since the number of layers can be increased, the cooling performance of the cooled amplifier is further improved.
I can do it. In addition, the bonding work is
A simple insulating adhesive can be used.

In the invention according to claim 6 , first, since no conductor is present on the back surface of the slot line substrate compared to the microstrip line substrate, the amount of heat flowing into the amplifier through the slot line substrate is reduced. And the cooling performance of the cooled amplifier can be improved. Second
In addition, since the electrical characteristics of the transmission wave transmitted through the microstrip line are not affected, loss of the transmission wave can be prevented. Third, it is not necessary to use a conductive adhesive such as solder for joining between the slot line substrate and the cooling surface of the electronic cooling element or the amplifier housing. That is, as a result of not using the conductive adhesive, the resistance value of the heat transfer path can be further increased, so that the cooling performance of the cooling amplifier can be further improved. Further, an insulative adhesive that can be easily bonded as compared to a conductive adhesive can be used.

According to the invention described in claim 7 , in addition to the operation and effect obtained by the invention described in claim 6 , first, the choke portion formed in the slot line of the slot line substrate may be used. Since the heat transfer path is cut off and the amount of heat flowing into the amplifier through the slot line is reduced, the cooling performance of the cooled amplifier can be improved. Second, since the slot lines are connected to each other via a choke portion and do not affect the electrical characteristics of a transmission wave transmitted through the slot line, loss of the transmission wave can be prevented.

According to the eighth aspect of the invention, the same operation and effect as those obtained by the second aspect of the invention can be obtained.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. The overall basic configuration of the cooled low noise amplifier according to the present embodiment is the same as that of the cooled low noise amplifier shown in FIG. In the first, second, third, and sixth embodiments, only the main part of the cooled low-noise amplifier is shown, and in the case where the description is duplicated, the duplicate description will be omitted.

Embodiment 1 FIG. 1 shows the configuration of a microstrip line substrate of a cooled low noise amplifier according to the first and second aspects of the present invention.

As shown in FIG. 1, a metal conductor 9 as a microstrip line is formed on the surface of a microstrip line substrate 8 of a cooled low noise amplifier. The microstrip line substrate 8 is formed in an elongated strip shape along the direction in which the transmission wave is transmitted. The metal conductor 9 is transmitted between the input between the external input terminal 4 and the input terminal of the low-noise amplifier 2 or between the output between the external output terminal 5 and the output terminal of the low-noise amplifier 2 shown in FIG. Is transmitted. Microwaves or millimeter waves are used as transmission waves.

A wavelength coupling line 10 is formed at the center of the metal conductor 9, and the wavelength coupling line 10 is formed in such a shape that a heat transfer path formed by the metal conductor 9 itself is cut off. That is, in the wavelength coupling line 10 between inputs, the metal conductor 9 is connected to the external input terminal 4 side and the low noise amplifier 2.
The divided portions of the metal conductor 9 are separated from each other while maintaining a constant interval along the direction in which the transmission wave is transmitted. Similarly, in the wavelength coupling line 10 between outputs,
The metal conductor 9 is divided into the external output terminal 5 side and the low noise amplifier 2 side, and the divided portions of the metal conductor 9 are separated from each other while maintaining a constant interval along the direction in which the transmission wave is transmitted. The wavelength coupling line 10 is constituted by a coupling line of approximately 1/4 wavelength having a DC cut function.

As described above, in the first aspect of the present invention, first, the heat transfer path is cut off by dividing the metal conductor 9 as the microstrip line,
Since the amount of heat flowing into the low noise amplifier 2 through the metal conductor 9 is reduced, the cooling performance of the cooling amplifier can be improved.

Second, the divided metal conductors 9 are connected to each other via a wavelength coupling line 10 and do not affect the electrical characteristics of the transmission wave transmitted through the metal conductor 9. Loss can be prevented.

Further, according to the second aspect of the present invention, since the wavelength coupling line 10 is formed of a quarter wavelength coupling line having a DC cut function, the size of the cooled amplifier can be reduced.

Embodiment 2 FIG. 2 shows the configuration of a microstrip line substrate of a cooled low noise amplifier according to a third embodiment of the present invention.

As shown in FIG. 2, in a metal conductor 9 formed as a microstrip line on the surface of a microstrip line substrate 8 of a cooled low-noise amplifier, an interdigital capacitor 11 is formed at the center. The basic configuration is the same as that of the wavelength coupling line 10 of the first embodiment, and the interdigital capacitor 11 is formed in a shape in which the heat transfer path formed by the metal conductor 9 itself is cut off. That is, in the interdigital capacitor 11, the metal conductor 9 is divided, and both divided portions of the metal conductor 9 are configured as electrodes of the interdigital capacitor 11. The two electrodes are separated at a constant interval. Further, both electrodes are each formed in a comb shape, and both electrodes are arranged so as to bite each other.

Further, the interdigital capacitor 11 has a DC cut function, the capacitance value is appropriately selected, and the interdigital capacitor 11 is used as a part of the matching circuit of the low noise amplifier 2.

As described above, in the third aspect of the present invention, first, the heat transfer path of the metal conductor 9 as the microstrip line is cut off by the interdigital capacitor 11, The amount of heat flowing into the low-noise amplifier 2 through the filter is reduced, so that the cooling performance of the cooling amplifier can be improved.

Second, since the metal conductors 9 are connected to each other via an interdigital capacitor 11 and do not affect the electrical characteristics of a transmission wave transmitted through the metal conductor 9,
The transmission wave loss can be prevented.

Third, the interdigital capacitor 1
1 has a DC cut function, and can be used as a part of a matching circuit of the low noise amplifier 2 by appropriately selecting a capacitance value. Therefore, the low noise amplifier 2 itself is reduced in size, and as a result, a cooling amplifier is used. Can be downsized.

Embodiment 3 FIG. 3 shows the configuration of a microstrip line substrate of a cooled low noise amplifier according to the fourth aspect of the present invention.

As shown in FIG. 3, an inductor portion 12 is formed at the center of a metal conductor 9 formed as a microstrip line on the surface of a microstrip line substrate 8 of a cooled low noise amplifier. Inductor part 1
Reference numeral 2 denotes a portion in which the line width of a portion of the metal conductor 9 is formed to be small. The line width of the inductor portion 12 is formed to be smaller than the line width of the metal conductor 9. The metal conductor 9 is set to have a resistance value of, for example, 50Ω, while the inductor section 12 is set to have a higher impedance than this numerical value. The inductor section 12 can increase the resistance value of the heat transfer path and reduce the amount of heat flowing into the low noise amplifier 2 or the electronic cooling element 1.

Further, the inductor section 12 is used as a series inductor in a part of the matching circuit of the low noise amplifier 2, so that the cooling type low noise amplifier can be downsized.

As described above, in the invention according to the fourth aspect, first, the resistance value of the heat transfer path is determined by the inductor portion 12 formed on a part of the metal conductor 9 as the microstrip line. Is increased, and the amount of heat flowing into the low noise amplifier 2 through the microstrip line is reduced, so that the cooling performance of the cooled amplifier can be improved.

Second, since the metal conductors 9 as the microstrip lines are connected to each other via the inductor section 12 and do not affect the electrical characteristics of the transmission wave transmitted through the metal conductor 9, the transmission wave Loss can be prevented.

Third, since the inductor section 12 can be used as a part of the matching circuit of the low-noise amplifier 2, the low-noise amplifier 2 itself is reduced in size, and as a result, the cooled low-noise amplifier can be reduced in size. .

Embodiment 4 FIG. 4 shows the configuration of a cooled low-noise amplifier according to another embodiment .

As shown in FIG. 4, in the cooled low noise amplifier, between the microstrip line substrate 6 and the cooling surface of the electronic cooling element 1, and between the microstrip line substrate 7 and the cooling surface of the electronic cooling element 1. Are each provided with a chip capacitor 14. The microstrip line substrate 6
And a metal conductor 13 is formed on the back surface of the microstrip line substrate 7, respectively. A metal carrier 15 is disposed on a cooling surface of the electronic cooling element 1, and a low noise amplifier 2 is disposed on a surface of the metal carrier 15.

The chip capacitor 14 is a metal conductor 13
The thermal conductivity is formed to be smaller than that of. Specifically, the chip capacitor 14 is connected to the microstrip line substrates 6, 7
Are arranged between each metal conductor 13 and the metal carrier 15. Accordingly, in the heat transfer path from the metal conductor 13 to the metal carrier 15, the chip capacitor 14 acts as a thermal resistor, and the resistance value of the heat transfer path can be increased, so that the amount of heat reaching the metal carrier 15 from the metal conductor 13 can be reduced. .

The transmission wave transmitted through the metal conductor 13 can pass through the chip capacitor 14 without causing any loss. Further, the chip capacitor 14 is used as a part of a matching circuit of the low noise amplifier 2, and the size of the cooled low noise amplifier can be reduced.

As described above, in this embodiment , first, the chip capacitor 1 having a low thermal conductivity is used.
4, the resistance value of the heat transfer path from the metal conductor 13 as a microstrip line to the thermoelectric cooler 1 is increased, and the amount of heat flowing into the thermoelectric cooler 1 is reduced. Can be improved.

Second, since the electrical characteristics of the transmission wave transmitted through the metal conductor 13 are not affected, the loss of the transmission wave can be prevented.

Third, since the chip capacitor 14 can be used as a part of the matching circuit of the low-noise amplifier 2, the low-noise amplifier 2 itself is reduced in size, and as a result, the cooled low-noise amplifier can be reduced in size. .

[0056] The configuration of the invention in which cooled low-noise amplifier according to a fifth embodiment according to claim 5 shown in FIG.

As shown in FIG. 5, in the cooled low noise amplifier, coplanar line substrates 16 and 17 are used in place of the microstrip line substrates 6 and 7 described in the first to fourth embodiments. Coplanar line board 1
Reference numeral 6 is provided on the input side between the external input terminal 4 arranged on the amplifier housing 3 and the input terminal of the low noise amplifier 2. The coplanar line substrate 17 includes the external output terminal 5 and the low noise amplifier 2.
Is disposed on the output side between the output terminals. Although a metal portion is provided on the back surface of the microstrip line substrate, the coplanar line substrates 16 and 17 have no metal portion on the back surface of the substrate. Therefore, because there is no metal part,
The thermal resistance of the heat transfer path formed by the coplanar waveguide substrate 16 or 17 is increased, and the amount of heat flowing into either the low noise amplifier 2 or the electronic cooling element 1 is reduced.

When the microstrip line substrate is used, the bonding between the microstrip line substrate and the amplifier housing 3 or the cooling surface of the electronic cooling element 1 is performed using a conductive adhesive such as solder. However, when the coplanar waveguide substrates 16 and 17 are used, since the insulating material is used as the substrate material, the joining can be performed with the insulating adhesive.

The coplanar waveguide substrates 16 and 1
Instead of 7, slot line substrates 16 and 17 can be used. The effects obtained by using the slot line substrates 16 and 17 are basically the same as those obtained by using the coplanar line substrates 16 and 17.

As described above, in the invention described in claim 5 , first, no metal conductor exists on the back surface of any of the coplanar line substrates 16 and 17 as compared with the microstrip line substrate. Therefore, the amount of heat flowing into the low noise amplifier 2 through one of the coplanar line substrates 16 and 17 is reduced, and the cooling performance of the low noise amplifier 2 can be improved.

Second, the coplanar waveguide substrates 16, 1
7, since there is no effect on the electrical characteristics of the transmission wave transmitting any of the transmission waves 7, loss of the transmission wave can be prevented.

Third, bonding between the coplanar waveguide substrate 16 and the cooling surface of the electronic cooling element 1 or the amplifier housing 3,
It is not necessary to use a conductive adhesive such as solder for joining between the coplanar waveguide substrate 17 and the cooling surface of the electronic cooling element 1 or the amplifier housing 3. That is, as a result of not using the conductive adhesive, the resistance value of the heat transfer path can be further increased, so that the cooling performance of the low noise amplifier 2 can be further improved. Further, an insulative adhesive that can be easily bonded as compared to a conductive adhesive can be used. Further, in the invention described in claim 6 , the same effect as the invention described in claim 5 can be obtained by using the slot line substrates 16 and 17.

Embodiment 6 FIG. 6 shows a configuration of a slot line substrate of a cooled low noise amplifier according to the seventh and eighth aspects of the present invention.

As shown in FIG. 6, in the cooled low noise amplifier, a slot line substrate 18 is used instead of the microstrip line substrate, and the metal conductor 9 provided on the surface of the slot line substrate 18 has The choke section 19 is configured. The choke 19 has a quarter-wave choke structure. The choke portion 19 is divided in a shape that blocks a heat transfer path formed by the metal conductor 9, and the amount of heat flowing into the low noise amplifier 2 or the electronic cooling element 1 through the slot line substrate 18 is reduced. Further, since the two divided metal conductors 9 are connected to each other via the choke portion 19, loss of the transmission wave transmitted through the metal conductor 9 does not occur.

As described above, according to the seventh aspect of the present invention, in addition to the functions and effects obtained by the sixth aspect of the present invention, first, the slot line of the slot line substrate 18 Since the heat transfer path is cut off by the choke portion 19 formed in the metal conductor 9 as a function, and the amount of heat flowing into the low noise amplifier 2 through the metal conductor 9 is reduced, the cooling performance of the low noise amplifier 2 can be improved.

Second, the metal conductor 9 is connected to the choke 19
And does not affect the electrical characteristics of the transmission wave transmitted through the metal conductor 9, so that the loss of the transmission wave can be prevented.

Further, according to the eighth aspect of the invention, the same operation and effect as those obtained by the second aspect of the invention can be obtained.

The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist thereof.

[0069]

As described above, according to the present invention,
It is possible to provide a cooled amplifier capable of reducing the amount of heat flowing into the amplifier without increasing the loss of the transmission wave transmitted through the line board.

Further, according to the present invention, in addition to the above effects, a downsized cooled amplifier can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a microstrip line substrate of a cooled low noise amplifier according to the first and second aspects of the present invention.

FIG. 2 is a perspective view of a microstrip line substrate according to the invention described in claim 3;

FIG. 3 is a perspective view of a microstrip line substrate according to the invention described in claim 4;

FIG. 4 is a sectional view of a cooled low noise amplifier according to another embodiment .

FIG. 5 is a perspective view of a cooled low-noise amplifier according to the invention described in claims 5 and 6 ;

FIG. 6 is a perspective view of a slot line substrate of a cooled low-noise amplifier according to the invention described in claims 7 and 8 ;

FIG. 7 is a perspective view of a conventional cooled low noise amplifier.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electro-cooling element 2 Low noise amplifier 3 Amplifier case 4 External input terminal 5 External output terminal 6, 7, 8 Microstrip line board 9, 13 Metal conductor 10 Wavelength coupling line 11 Interdigital capacitor 12 Inductor part 14 Chip capacitor 15 Metal Carrier 16, 17, 18 Coplanar line substrate or slot line substrate 19 Choke portion

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-13509 (JP, A) JP-A-61-23346 (JP, A) JP-A-64-17456 (JP, A) JP-A-59-23 143406 (JP, A) JP-A-6-216673 (JP, A) JP-A-5-191156 (JP, A) JP-A 64-54412 (JP, U) JP-A 5-82129 (JP, U) Japanese Utility Model 1-72716 (JP, U) Japanese Utility Model 62-2254 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01P 1/30 H01L 23/38 H01P 3/08 H01P 5/02 H03F 3/60

Claims (8)

(57) [Claims] An amplifier is provided on a cooling surface of an electronic cooling element having a cooling function, and a transmission wave is input to the amplifier through a microstrip line, or an amplified transmission wave is output from the amplifier. In the cooled amplifier, the microstrip line is divided in a shape that blocks a heat transfer path, and the divided microstrip lines are connected via a wavelength coupling line. 2. The cooled amplifier according to claim 1, wherein said wavelength coupling line is a quarter wavelength coupling line having a DC cut function. 3. An amplifier provided on a cooling surface of an electronic cooling element having a cooling function, wherein a transmission wave is input to the amplifier through a microstrip line, or an amplified transmission wave is output from the amplifier. In the cooled amplifier, the microstrip line is divided in a shape that blocks a heat transfer path, and the divided microstrip lines are connected via an interdigital capacitor. 4. An amplifier provided on a cooling surface of an electronic cooling element having a cooling function, wherein a transmission wave is input to the amplifier through a microstrip line, or an amplified transmission wave is output from the amplifier. In the cooled amplifier, an inductor portion having a narrow line width is provided in a part of the microstrip line. 5. A cooling amplifier comprising an amplifier disposed on a cooling surface of an electronic cooling element having a cooling function, wherein a transmission wave is input to the amplifier or a transmission wave amplified from the amplifier is output. A coplanar line substrate for inputting a transmission wave to the amplifier or outputting a transmission wave amplified from the amplifier,
A cooled amplifier characterized by being bonded to the mounting surface with an adhesive . 6. A cooling amplifier comprising an amplifier disposed on a cooling surface of an electronic cooling element having a cooling function, wherein a transmission wave is input to the amplifier or a transmission wave amplified from the amplifier is output. And a slot line board for inputting a transmission wave to the amplifier or outputting a transmission wave amplified from the amplifier. 7. A cooling amplifier comprising an amplifier disposed on a cooling surface of an electronic cooling element having a cooling function, wherein a transmission wave is input to the amplifier or a transmission wave amplified from the amplifier is output. A slot line substrate for inputting a transmission wave to the amplifier or outputting a transmission wave amplified from the amplifier is provided, and a choke portion is provided in a slot line of the slot line substrate in a shape for blocking a heat transfer path. A cooled amplifier characterized by the following. 8. The cooled amplifier according to claim 7 , wherein the choke section is constituted by a quarter-wave choke section.