JP3201084B2 - Solder welding device for solid-state image sensor and method for manufacturing solid-state color imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image sensor solder welding apparatus and a solid-state color image pickup apparatus for fixing a solid-state image sensor such as a charge-coupled device (CCD) used in a fixed color image pickup apparatus to a color separation prism. And a method for producing the same.

[0002]

2. Description of the Related Art Generally, in a color image pickup apparatus using a plurality of image sensors, in order to obtain a stable color image,
It is necessary to reliably maintain a state in which the subject images of the respective color components captured by the respective image sensors are superimposed, that is, a state in which the registration adjustment is accurately performed. Conventionally, in a color imaging apparatus using a solid-state image sensor such as a CCD sensor, each solid-state image sensor that captures a subject image of each color component is screwed to each light-emitting surface of a color separation prism with a screw. However, no sufficient mounting accuracy was obtained in any case.

In order to solve the above problem, the present applicant has proposed a solid image sensor solder welding apparatus disclosed in Japanese Patent Application Laid-Open No. 62-128536. As shown in FIG. 5, three solid-state image sensors 2, 3, and 4 whose registration is adjusted with respect to each light-emitting surface of the color separation prism 1 are fixed by soldering. Mounting pieces 5a, 6a, 7a of holders 5, 6, 7 mounted on sensors 2, 3, 4 and mounting pieces (not shown) of holders mounted on each light emitting surface of color separation prism 1.
Is a device for high frequency heating and solder welding.

FIG. 6 is a plan view of a main part showing a conventional solder welding apparatus for a solid-state image sensor. The illustrated solder welding apparatus is roughly divided into movable arms 12 and 13 that rotate around support shafts 10 and 11, respectively.
The heating electrodes 14 and 15 are provided with a pair of heating electrodes 14 and 15 and a high-frequency power supply 16 for supplying a high-frequency current to the heating electrodes 14 and 15. One end of each of the heating electrodes 14 and 15 is not shown. Are formed with a plurality of openings corresponding to the three primary colors R (red component light), G (green component light), and B (blue component light).
A turn coil is formed. When the image sensor is mounted, the solid-state image sensors 2, 3, and 4 are registered and adjusted by a registration adjustment mechanism (not shown), and a high-frequency current is supplied from the high-frequency power supply 16 to each of the heating electrodes 14 and 15. The holder 5 attached to each solid-state image sensor 2, 3, 4
The mounting pieces 5a, 6a, 7a of 6, 7 were simultaneously heated with high frequency, and the solid-state image sensors 2, 3, 4 were fixed to each light emitting surface by solder welding.

[0005]

However, in the above-described conventional soldering apparatus, the solid-state image sensors 2, 3, and 4 corresponding to the R, G, and B systems are simultaneously solder-welded by supplying current from the high-frequency power supply 16. The solid-state image sensors 2, 3, and 4 corresponding to the R, B, and G systems are displaced from each other by the action of surface tension due to melting of solder and the action of expansion and contraction due to heating and cooling. A G solid-state image sensor 2 serving as a reference,
A relative mounting error has occurred between the solid-state image sensors 3 and 4 of the R and B systems.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a solid- state image sensor solder welding apparatus and a solid-state color image pickup apparatus capable of mounting and fixing each solid-state image sensor with higher registration accuracy than before.
An object of the present invention is to provide a method for manufacturing an image device .

[0007]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and comprises a solid-state image sensor which is adjusted in registration with respect to each light-emitting surface of a color separation prism. In a solder welding apparatus for a solid-state image sensor, which is fixed to each light emitting surface by solder welding via mounting pieces formed on both sides of a holder attached to the holder, a heating electrode portion for heating and welding the mounting piece of the holder to one end. Are formed and three electrode arms each having an electrode contact portion provided at the other end. The electrode contact portions of the electrode arms are arranged in one direction and mounting pieces formed on both sides of the holder. And a pair of electrode arms provided corresponding to each other, and a bifurcated movable contact portion arranged at one end so as to sandwich the electrode contact portion of the electrode arm with a gap, and the other end has a high circumference. A pair of power supply plates to which a power supply is connected, and an arm drive mechanism that moves the power supply plates in the direction in which the electrode contact portions are arranged, and switches the contact positions of the pair of power supply plates with respect to the pair of electrode arms, A sensor mechanism for detecting a contact switching position of the power supply plate with respect to the electrode arm group, and a movable contact portion of the power supply plate is pressed based on a detection signal output from the sensor mechanism, so that the And a contact drive section for connecting the movable contact section of the power supply plate.

In a method of manufacturing a solid-state color image pickup device in which a solid- state image sensor is fixed to each light-emitting surface of a color separation prism corresponding to the R, G, and B systems by solder welding, first, A fixed image sensor is adjusted on the G-system light emitting surface by registration and fixed by soldering. Then, each of the R and B-system light is fixed based on the mounting position of the solid-state image sensor fixed on the G-system light emitting surface. The solid-state image sensors are positioned at the registration adjustment positions on the emission surfaces and fixed by solder welding.

[0009]

In the solder welding apparatus for a solid-state image sensor according to the present invention, the pair of power supply plates is moved relative to the pair of electrode arms by moving the pair of power supply plates in the direction in which the electrode contact portions are arranged by the arm driving mechanism. The contact position is switched, and the contact switching position is detected by the sensor mechanism. Also, when a detection signal is output from the sensor mechanism, the contact drive section operates based on the detection signal, and connects the electrode contact section of the electrode arm and the movable contact section of the power supply plate. A high-frequency current flowing from a power supply is supplied to an electrode arm corresponding to the contact switching position via a power supply plate.

Also, the production of the solid-state color image pickup device of the present invention.
In the method , first, a solid-state image sensor is fixed to a G-system light emitting surface serving as a reference by soldering, and then each of the R- and B-system lights is fixed based on the mounting fixing position of the G-system solid-state image sensor. Since the solid-state image sensors are respectively fixed to the emission surfaces by solder welding, the respective solid-state image sensors do not mutually displace.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of an essential part showing one embodiment of a solder welding device for a solid-state image sensor according to the present invention. The illustrated solder welding device for a solid-state image sensor mainly includes three electrode arms 21, 22, and 23 corresponding to R, B, and G, and as shown in FIG. Mounting pieces 5a, 6a, 7a formed on
And a pair of electrode arms 20 provided correspondingly to the electrode arms 21, 22, and 2 of the electrode arm group 20.
A sensor for detecting a pair of power supply plate 24 for supplying a 3, and an arm driving mechanism for switching the contact positions of the power supply plate 24 against the electrode arm group 20, the contact switching position of the power supply plate 24 against the electrode arm group 20 It includes a mechanism and a contact driver for turning on and off a connection state between the electrode arms 21, 22, 23 and the power supply plate 24.

First, as shown in FIG. 2, a pair of electrode arm groups 20 each have three independent electrode arms 2.
1, 2, 23, each electrode arm 2
A heating electrode part 2 for heating and welding the mounting pieces 5a, 6a, 7a of the holders 5, 6, 7 to one end of the first, second, and 23.
1a, 22a and 23a are formed, and electrode contact portions 21b, 22b and 23b are provided at the other end. And
A one-turn coil is formed for each of the electrode arms 21, 22, 23, and each of the electrode contact portions 22b, 22
b and 23b are respectively arranged in one direction.

On the other hand, a pair of power supply plates 2
4 has a bifurcated movable contact portion 24a disposed at one end so as to sandwich the electrode contact portions 21b, 22b, 23b of the electrode arms 21, 22, 23 with a gap, and at the other end not shown. High frequency power supply is connected.

On the other hand, the arm drive mechanism has a pair of left and right moving blocks 26 supporting the pair of power supply plates 24 via brackets 25, respectively, and is fitted to these moving blocks 26 and arranged in parallel with each other. A ball screw shaft 27 and a guide shaft 28,
And a drive motor 29 connected to one end of the ball screw shaft 27. When the ball screw shaft 27 is rotated by the operation of the drive motor 29, the pair of moving blocks 26 approach and separate from each other according to the direction of rotation.

The sensor mechanism includes the pair of movable blocks 2
6 and an optical sensor 31 disposed below the position detecting plate 30. The electrode contact portions 21b, 22b, 2
Each projection formed on the position detection plate 30 corresponding to the arrangement pitch of 3b shields the light emitted from the optical sensor 31, and at the same time, a detection signal is output from the optical sensor 31, and based on this detection signal, The contact switching position of the power supply plate 24 with respect to the electrode arm group 20 is detected.

The contact driver is provided with the power supply plate 24.
, And a pair of upper and lower pushers 32 disposed near the movable contact portion 24a.
As shown in FIG. 3, the rod tip is disposed in contact with the upper side and the lower side of the bifurcated movable contact 24a.

The pair of electrode arms 20 is supported by a crank unit 34 via a crank arm 33. When a drive cylinder 35 connected to the crank unit 34 operates, the crank unit 34 is pivoted. To turn upward.

Next, the operation of the solder welding device for a solid-state image sensor according to this embodiment will be described. First, when the drive motor 29 is operated, the ball screw shaft 27
The pair of moving blocks 26 relatively move in the direction of contact and separation while being guided by the guide shaft 28 by the rotation of the pair, and accordingly, the pair of power supply plates 24
By moving in the arrangement direction of 1a, 22a, and 23a, the contact positions of the pair of power supply plates 24 with respect to the pair of electrode arms 20 are switched. At this time, the contact switching position of the power supply plate 24 with respect to the electrode arm group 20 is detected by each projection of the position detection plate 30 blocking the sensor light of the optical sensor 31. Further, when a detection signal is output from the sensor mechanism, the contact drive unit, that is, the pusher 32 operates based on the detection signal. At this time, pusher 3
The electrode contact portions 21 of the electrode arms 21, 22, and 23 corresponding to the contact switching positions are pressed by pressing the movable contact portions 24a of the power supply plate 24 as shown in FIG.
a, 22a, 23a and the movable contact 24a of the power supply plate 24 are connected.

Therefore, when the solid-state image sensor is fixed to each light-emitting surface of the color separation prism corresponding to the R, B, and G systems, first, the solid-state image sensor is mounted on the reference G-system light-emitting surface. After adjusting the registration,
The power supply plate 24 is moved by the operation of the drive motor 29, and the movable contact portion 24a of the power supply plate 24 is changed to the electrode contact portion 21a of the G-system electrode arm 21 based on the detection signal from the sensor mechanism (30, 31). In this state, the pusher 32 is operated to operate the electrode contact 21a of the electrode arm 21 and the movable contact 2 of the power supply plate 24.
4a, and a high-frequency current from a high-frequency power supply (not shown) is supplied to the electrode arm 21 via the power supply plate 24, thereby inducing an eddy current in the heating electrode portion 21a of the electrode arm 21 to thereby perform high-frequency heating. Is performed, and the solid-state image sensor is fixed to the G-system light emitting surface by solder welding.

Subsequently, after the solid-state image sensor is fixed to the G-system light emitting surface as described above, the operation of the pusher 32 is temporarily stopped, and the electrode contact portion 21a of the electrode arm 21 and the movable contact of the power supply plate 24 are moved. The connection state with the unit 24a is released. Then, registration of each of the R-system and B-system solid-state image sensors is adjusted with reference to the mounting position of the G-system solid-state image sensor previously fixed, and thereafter, the same operation as the above-described G-system solid-state image sensor is performed. The contact position of the power supply plate 24 with respect to the electrode arm group 20 is sequentially switched according to the procedure, and a high-frequency current from a high-frequency power supply (not shown) is supplied to the electrode arms 22 and
23, and the R-type and B-type solid-state image sensors are fixed by solder welding.

As described above, first, the reference G solid-state image sensor is adjusted by registration and fixed by soldering, and then, based on the mounting position of the previously fixed G solid image sensor, R, B If each solid-state image sensor of the system is adjusted by registration and fixed by soldering, the solid-state image sensors will not be displaced from each other as in the conventional simultaneous-heating-type soldering apparatus, and will be a reference. Each of the R and B solid-state image sensors can be attached and fixed to the G-based solid image sensor with higher accuracy. After the G-type solid-state image sensor is fixed, whichever of the R-type and B-type solid-state image sensors may be fixed first.

[0022]

As described above, according to the present invention, the contact position of the power supply plate with respect to the electrode arm group is switched by the arm drive mechanism, and the contact drive section is detected while the contact switching position is detected by the sensor mechanism. When activated, the electrode contact portion of the electrode arm can be connected to the movable contact of the power supply plate . Therefore , when mounting the image sensor, first, the G-based solid-state image sensor serving as a reference is adjusted by registration and fixed by soldering, and then, based on the mounting position of the previously fixed G-based solid-state image sensor, R , B solid state image sensors are adjusted by registration and fixed by soldering.
Since each solid-state image sensor does not cause a positional shift between each other, a G-based solid-state image sensor serving as a reference and R,
Mounting error with each B-type solid-state image sensor is small.
You. As a result, each solid-state image sensor can be mounted and fixed with higher registration accuracy than before, and the pixels can be reduced by half in the horizontal direction for each scanning line.
Adjustment of so-called spatial pixel shift by shifting the pitch is also facilitated.

[Brief description of the drawings]

FIG. 1 is a perspective view of an essential part showing an embodiment of a solder welding device for a solid-state image sensor according to the present invention.

FIG. 2 is a schematic diagram showing a configuration of an electrode arm group.

FIG. 3 is a main part side view showing a configuration of a contact driving unit.

FIG. 4 is a side view of an essential part for explaining the operation of the contact driver.

FIG. 5 is a perspective view showing a mounting state of a color separation prism and each solid-state image sensor.

FIG. 6 is a main part plan view showing a conventional solder welding device for a solid-state image sensor.

[Explanation of symbols]

 Reference Signs List 20 electrode arm group 21, 22, 23 electrode arm 21a, 22a, 23a heating electrode part 21b, 22b, 23b electrode contact part 24 power supply plate 24a movable contact part 25 bracket 26 moving block 27 ball screw shaft 28 guide shaft 29 drive motor 30 Position detecting plate 31 Optical sensor 32 Pusher

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B23K 1/002 B23K 1/00 H01L 21/52 H01L 27/14 H04N 1/028

Claims (2)

(57) [Claims] 1. A solid-state image sensor whose registration is adjusted with respect to each light-emitting surface of a color separation prism,
In a soldering apparatus for a solid-state image sensor, which is fixed to each of the light emitting surfaces by soldering via mounting pieces formed on both sides of a holder attached to the solid-state image sensor, the mounting piece of the holder is heated and welded to one end. And three electrode arms each provided with an electrode contact portion at the other end, and each electrode contact portion of the electrode arm is arranged in one direction and the holder A pair of electrode arms provided corresponding to the mounting pieces formed on both sides of the two ends, and having at one end a forked movable contact portion disposed so as to sandwich the electrode contact portion of the electrode arm with a gap, A pair of power supply plates connected to a high-frequency power source at the other end; and moving the pair of power supply plates in the direction in which the electrode contact portions are arranged. An arm driving mechanism for switching a contact position of the pair of power supply plates with respect to a sensor mechanism for detecting a contact switching position of the power supply plate with respect to the electrode arm group; and a detection mechanism output from the sensor mechanism. By pressing the movable contact part of the power supply plate,
A solder welding device for a solid-state image sensor, comprising: a contact driver for connecting an electrode contact portion of the electrode arm to a movable contact portion of the power supply plate. 2. A method of manufacturing a solid-state color image pickup device in which solid- state image sensors are fixed to respective light-emitting surfaces of color separation prisms corresponding to R, G, and B systems by solder welding. The fixed image sensor is adjusted to the light emitting surface of the system by soldering and fixed by soldering. Then, each light of the R and B systems is determined based on the mounting position of the solid image sensor fixed to the light emitting surface of the G system. A solid color sensor characterized by fixing a solid-state image sensor to a light-emitting surface by adjusting a registration position and soldering the solid-state image sensor.
-A method for manufacturing an imaging device .