JP3201185B2 - Coin identification device - Google Patents
Coin identification deviceInfo
- Publication number
- JP3201185B2 JP3201185B2 JP30201294A JP30201294A JP3201185B2 JP 3201185 B2 JP3201185 B2 JP 3201185B2 JP 30201294 A JP30201294 A JP 30201294A JP 30201294 A JP30201294 A JP 30201294A JP 3201185 B2 JP3201185 B2 JP 3201185B2
- Authority
- JP
- Japan
- Prior art keywords
- coin
- thickness
- sensor
- output
- sensors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Of Coins (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、硬貨の正偽及び種類を
電気的に識別する硬貨識別装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coin discriminating apparatus for electrically discriminating the authenticity and type of coins.
【0002】[0002]
【従来の技術】近年、自動販売機が普及し、これに使用
される硬貨識別装置には高い識別性能が要求されてい
る。2. Description of the Related Art In recent years, vending machines have become widespread, and a coin discriminating apparatus used therein has been required to have high discrimination performance.
【0003】従来、この種の硬貨識別装置は、硬貨投入
口と、この投入口に連結された硬貨通路と、この硬貨通
路の側壁に配置された識別センサと、この識別センサの
出力により投入された硬貨の特徴を検知する検知手段
と、硬貨の正偽及び硬貨の種類の基準となるデータをあ
らかじめ記憶する記憶回路と、前記検知手段の出力と前
記記憶回路の基準のデータとを比較する比較回路と、こ
の比較回路の比較結果により硬貨の正偽及び種類を判定
する判定回路とを備えていた。そして、識別センサ及び
検知手段としては、材質、厚み、外径センサの出力及び
各センサの出力の最大変化量を検知する手段を備えてお
り、投入された硬貨の通過時における各センサの出力の
最大変化量により硬貨の材質、厚み、外径を検知して識
別を行っていた。Conventionally, a coin discriminating apparatus of this type has a coin insertion slot, a coin passage connected to the coin insertion slot, an identification sensor disposed on a side wall of the coin passage, and a coin inserted by an output of the identification sensor. Detecting means for detecting the characteristics of the coin, a storage circuit for storing in advance the data of the authenticity of the coin and reference data of the type of the coin, and a comparison for comparing the output of the detecting means with reference data of the storage circuit. And a determination circuit for determining the authenticity and type of the coin based on the comparison result of the comparison circuit. As the identification sensor and the detection means, there are provided means for detecting the material, thickness, the output of the outer diameter sensor and the maximum change amount of the output of each sensor, and the output of each sensor when the inserted coin passes. The coin was identified by detecting the material, thickness and outer diameter of the coin based on the maximum change amount.
【0004】[0004]
【発明が解決しようとする課題】しかしながら従来の構
成では、厚みとして検知していたのは硬貨のほぼ中央部
の厚みであった。それは、センサの発生する磁界が広が
りを持ち、磁界中の平均の厚みが最大になったときの値
を検知していたためである。この値は物理的な最大厚み
とは必ずしも一致しておらず、中央部の厚みに近いもの
となっていた。However, in the conventional structure, the thickness detected at the center of the coin is detected as the thickness. This is because the value generated when the magnetic field generated by the sensor has a spread and the average thickness in the magnetic field becomes maximum is detected. This value did not always match the physical maximum thickness, and was close to the thickness at the center.
【0005】このため、正貨とほぼ同じ材質、外径で中
央部の厚みの近い類似外国硬貨などの偽貨を不正使用さ
れることがあった。[0005] For this reason, counterfeit coins such as similar foreign coins having substantially the same material and the same outer diameter as the genuine coin and having a central portion with a small thickness have sometimes been illegally used.
【0006】本発明は、このような偽貨の不正使用を防
止することが可能な硬貨識別装置を提供することを目的
とするものである。[0006] An object of the present invention is to provide a coin identification device capable of preventing such illegal use of counterfeit coins.
【0007】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明の硬貨識別装置は、2個の厚みセンサを用い、
これらのセンサの合成出力波形から硬貨の外周部の厚み
を検知する検知手段を備え、前記の2個の厚みセンサは
それぞれ、コイルを巻いたコアを2つ硬貨通路に対向し
て配置し、これらのコイルを相互インダクタンスが負に
よるように直列逆相接続して構成し、前記の2個の厚み
センサの間隔を硬貨通路に平行に測って識別しようとす
る硬貨の外径の90%以上95%以下とし、前記の2個
の厚みセンサの高さを硬貨通路底面から測って識別しよ
うとする硬貨の外径の30%以上70%以下としたもの
である。In order to achieve this object, a coin discriminating apparatus of the present invention uses two thickness sensors,
E Bei detecting means for detecting the thickness of the outer peripheral portion of the coin from the combined output waveform of the sensors, the two thickness sensor Said
In each case, two cores wound with coils face the coin passage
And place these coils so that mutual inductance is negative.
In this way, the two opposite thicknesses are connected in series
Attempt to identify by measuring the sensor spacing parallel to the coin path
Between 90% and 95% of the outer diameter of the coin
Measure the height of the thickness sensor from the bottom of the coin aisle to identify it.
This is 30% or more and 70% or less of the outer diameter of the coin to be sought .
【0008】[0008]
【作用】この構成により、検知手段で硬貨の外周部の厚
みを検知することができるので、正貨と中央部の厚みは
近似しているが外周部の厚みは異なる偽貨を識別し、不
正使用を防止することが可能になる。According to this structure, the thickness of the outer peripheral portion of the coin can be detected by the detecting means. Use can be prevented.
【0009】[0009]
【実施例】以下に本発明の一実施例について図面を参照
しながら説明する。An embodiment of the present invention will be described below with reference to the drawings.
【0010】図2は本発明による硬貨識別装置の概要を
示した構成図である。硬貨識別装置本体1の上部には硬
貨投入口2が設けられており、この投入口2から下方に
向かって硬貨通路3が連結されている。硬貨通路3の側
壁には第1の厚み・材質兼用センサ4と、第2の厚みセ
ンサ5と、外径センサ6が配置されている。第2の厚み
センサ5と外径センサ6の中心は、硬貨通路3に対して
同一垂直線上に配置されている。また硬貨通路3は硬貨
識別装置本体1の下部に位置する硬貨の出口7に連結さ
れている。FIG. 2 is a configuration diagram showing an outline of a coin identification device according to the present invention. A coin insertion slot 2 is provided at an upper portion of the coin identification device main body 1, and a coin passage 3 is connected downward from the insertion slot 2. On the side wall of the coin passage 3, a first thickness / material combined sensor 4, a second thickness sensor 5, and an outer diameter sensor 6 are arranged. The centers of the second thickness sensor 5 and the outer diameter sensor 6 are arranged on the same vertical line with respect to the coin passage 3. The coin passage 3 is connected to a coin outlet 7 located at the lower part of the coin discriminating apparatus main body 1.
【0011】図3は第1の厚み・材質兼用センサ4近傍
の断面図で、説明上第2の厚みセンサ5と外径センサ6
に関する部分は省略している。硬貨8が転動する硬貨通
路3は一方の側壁をなす基板9と、もう一方の側壁をな
す基板10により構成されている。基板9と基板10に
はそれぞれフェライト材のE型コア11,12が対向し
て取り付けられている。E型コア11,12は識別しよ
うとする最大の硬貨8の外径より小さい長さのものを用
い、最大外径の硬貨8の中心がE型コア11,12の中
心付近を通過するような位置に配置している。第1の厚
み・材質兼用センサ4は、E型コア11とその内部に巻
かれた2本のコイル13,14及びE型コア12とその
内部に巻かれた2本のコイル15,16より構成されて
いる。FIG. 3 is a cross-sectional view showing the vicinity of the first thickness / material combined sensor 4.
The parts related to are omitted. The coin passage 3 on which the coin 8 rolls is composed of a substrate 9 forming one side wall and a substrate 10 forming the other side wall. E-shaped cores 11 and 12 made of a ferrite material are attached to the substrates 9 and 10 so as to face each other. The E-shaped cores 11 and 12 have a length smaller than the outer diameter of the largest coin 8 to be identified, and the center of the coin 8 having the largest outer diameter passes near the center of the E-shaped cores 11 and 12. Position. The first thickness / material combined sensor 4 includes an E-shaped core 11, two coils 13 and 14 wound inside the E-shaped core 11, and an E-shaped core 12 and two coils 15 and 16 wound inside the E-shaped core 12. Have been.
【0012】図1は制御回路の構成を示すブロック図で
ある。第1の厚みセンサ17は硬貨通路3に対向して配
置されたE型コア11,12と、これらのE型コア1
1,12の内部に巻回されたコイル13,15から構成
され、コイル13,15は相互インダクタンスが負にな
るように直列逆相接続されている。第2の厚みセンサ5
も同様の構成で、対向するコアに巻回されたコイルは直
列逆相接続されている。さらに、第1の厚みセンサ17
のコイル13,15と第2の厚みセンサ5のコイルは直
列接続され、第1の発振回路19を構成している。FIG. 1 is a block diagram showing the configuration of the control circuit. The first thickness sensor 17 includes E-shaped cores 11 and 12 that are arranged to face the coin passage 3 and these E-shaped cores 1 and 12.
The coils 13 and 15 are wound inside the coils 1 and 12, and the coils 13 and 15 are connected in series and anti-phase so that mutual inductance becomes negative. Second thickness sensor 5
Has the same configuration, and the coils wound around the opposing cores are connected in series and in opposite phases. Further, the first thickness sensor 17
The coils 13 and 15 and the coil of the second thickness sensor 5 are connected in series to form a first oscillation circuit 19.
【0013】材質センサ18も第1の厚みセンサ17と
同様の構成であるが、対向するE型コア11,12に巻
回されたコイル14,16は相互インダクタンスが正に
なるように直列同相接続されている。本実施例では第1
の厚みセンサ17と材質センサ18とがE型コア11,
12を兼用しており、図2及び図3に第1の厚み・材質
兼用センサ4として示している。外径センサ6は材質セ
ンサ18と同様の構成で、対向するコアに巻回されたコ
イルは直列同相接続されている。さらに、材質センサ1
8のコイル14,16と外径センサ6のコイルは直列接
続され、第2の発振回路20を構成している。The material sensor 18 has the same structure as the first thickness sensor 17, but the coils 14, 16 wound around the opposing E-shaped cores 11, 12 are connected in series and in-phase so that mutual inductance becomes positive. Have been. In this embodiment, the first
Thickness sensor 17 and material sensor 18 are E-shaped core 11,
12 and is shown as a first thickness / material combined sensor 4 in FIGS. 2 and 3. The outer diameter sensor 6 has the same configuration as the material sensor 18, and the coils wound around the opposing cores are connected in series and in phase. Further, the material sensor 1
The eight coils 14 and 16 and the coil of the outer diameter sensor 6 are connected in series to form a second oscillation circuit 20.
【0014】発振回路19,20の出力はそれぞれ、半
波整流回路21,22に接続されている。第1の半波整
流回路21の出力は、外周部の厚み検知手段23と、中
央部の厚み検知手段24に入る。また第2の半波整流回
路22の出力は、外周部の厚み検知手段23、中央部の
厚み検知手段24、材質検知手段25及び外径検知手段
26に入る。差の計算手段27には、外周部の厚み検知
手段23の出力と、中央部の厚み検知手段24の出力と
がそれぞれ接続されている。各検知手段23〜27の出
力は、それぞれ比較回路28〜32の一方の入力に入
る。比較回路28〜32の他方の入力には記憶回路33
の出力が接続されている。比較回路28〜32の出力は
判定回路34に入り、判定回路34は判定信号35を出
力する。The outputs of the oscillation circuits 19 and 20 are connected to half-wave rectifier circuits 21 and 22, respectively. The output of the first half-wave rectifier circuit 21 enters the thickness detecting means 23 at the outer peripheral part and the thickness detecting means 24 at the central part. The output of the second half-wave rectifier circuit 22 enters the thickness detecting means 23 at the outer peripheral part, the thickness detecting means 24 at the central part, the material detecting means 25, and the outer diameter detecting means 26. The output of the thickness detecting means 23 at the outer peripheral part and the output of the thickness detecting means 24 at the central part are connected to the difference calculating means 27, respectively. The output of each of the detection means 23 to 27 enters one input of the comparison circuits 28 to 32, respectively. A storage circuit 33 is connected to the other inputs of the comparison circuits 28 to 32.
Output is connected. The outputs of the comparison circuits 28 to 32 enter a judgment circuit 34, and the judgment circuit 34 outputs a judgment signal 35.
【0015】以上のように構成された硬貨識別装置につ
いて、以下にその動作を説明する。硬貨投入口2から投
入された硬貨8がセンサ4〜6に近づくと、コイル13
〜16のインピーダンスが変化し、それにつれて発振回
路19,20の発振レベルが変化する。この変化量は、
厚みセンサ17,5では主に硬貨8の厚みによって、材
質センサ18では主に硬貨8の材質によって、外径セン
サ6では主に硬貨8の外径によって異なるように形成さ
れている。半波整流回路21,22ではそれぞれ、発振
回路19,20の発振波形を正弦波から発振レベルを示
す信号に変換する。The operation of the coin identification device configured as described above will be described below. When the coin 8 inserted from the coin insertion slot 2 approaches the sensors 4 to 6, the coil 13
The impedance of the oscillation circuits 19 and 20 changes accordingly. This change is
The thickness sensors 17 and 5 are formed so as to differ mainly depending on the thickness of the coin 8, the material sensor 18 is formed mainly according to the material of the coin 8, and the outer diameter sensor 6 is formed so as to differ mainly depending on the outer diameter of the coin 8. The half-wave rectifier circuits 21 and 22 convert the oscillating waveforms of the oscillating circuits 19 and 20 from a sine wave to a signal indicating an oscillating level, respectively.
【0016】次に、各検知手段23〜26の動作を図4
及び図5を用いて説明する。図4は硬貨通過時の第2の
半波整流回路22の出力波形40を、図5は第1の半波
整流回路21の出力波形50,60を示す。共に縦軸が
発振レベルの変化量で、横軸が時刻である。図5の実線
は日本の五百円硬貨の波形50で、破線は材質、外径が
五百円硬貨とほぼ等しく中央部の厚みの近似した類似外
国硬貨の波形60である。第1の半波整流回路21の出
力が五百円硬貨と外国硬貨で特に異なる部分は、硬貨8
の外周部が厚みセンサ5,17近傍を通過するタイミン
グと一致しており、この時の出力は硬貨8の外周部の厚
みを示すと考えられる。本発明はこの際の第1の半波整
流回路21の出力により、硬貨8の外周部の厚みを検知
しようとするものである。なお第2の半波整流回路22
の出力波形40は、五百円硬貨と外国硬貨では図4に示
すようにほぼ同じ波形となる。Next, the operation of each of the detecting means 23 to 26 will be described with reference to FIG.
This will be described with reference to FIG. FIG. 4 shows an output waveform 40 of the second half-wave rectifier circuit 22 when the coin passes, and FIG. 5 shows output waveforms 50 and 60 of the first half-wave rectifier circuit 21. In each case, the vertical axis represents the amount of change in the oscillation level, and the horizontal axis represents time. The solid line in FIG. 5 is a waveform 50 of a 500 yen coin in Japan, and the broken line is a waveform 60 of a similar foreign coin whose material and outer diameter are almost the same as those of the 500 yen coin and whose thickness at the center is approximated. The part where the output of the first half-wave rectifier circuit 21 is particularly different between a 500 yen coin and a foreign coin is that the coin 8
Is coincident with the timing when the outer peripheral portion of the coin passes through the vicinity of the thickness sensors 5 and 17, and the output at this time is considered to indicate the thickness of the outer peripheral portion of the coin 8. The present invention seeks to detect the thickness of the outer periphery of the coin 8 based on the output of the first half-wave rectifier circuit 21 at this time. The second half-wave rectifier circuit 22
Is substantially the same as that of the 500 yen coin and the foreign coin as shown in FIG.
【0017】材質検知手段25は、硬貨8が材質センサ
18を通過する間の発振レベルの最大変化量、即ち波形
40の第1の極大値を検知する。外径検知手段26は、
硬貨8が外径センサ6を通過する間の発振レベルの最大
変化量、即ち波形40の第3の極大値を検知する。外周
部の厚み検知手段23は、硬貨8が2つの厚みセンサ1
7,5の両方にかかった位置で発振レベルの最大変化量
を検知する。本実施例では硬貨8の外周部が第1の厚み
センサ17にかかった位置を利用し、誤検知を防止する
ため第2の半波整流回路22の波形40が第2の極小を
取った時刻410の直後の第2の半波整流回路22の五
百円硬貨の波形50、外国硬貨の波形60の極大値を検
知し、五百円硬貨の外周部の厚み51、外国硬貨の外周
部の厚み61を得ている。中央部の厚み検知手段24
は、硬貨8が厚みセンサ17,5のどちらかの中心を通
過するタイミングで発振レベルの変化量を検知する。本
実施例では第2の半波整流回路22の出力が第3の極大
を取った時刻420を利用して、硬貨8が第2の厚みセ
ンサ5の中央を通過するタイミングを取っている。この
時刻420に第1の半波整流回路21の出力を検知し、
五百円硬貨の中央部の厚み52、外国硬貨の中央部の厚
み62を得ている。第2の半波整流回路22の出力が第
3の極大を取った時刻420をより正確に求めるため、
第2の極小値41に一定値43を加えた値をしきい値4
2とし、このしきい値42を上回る時刻421と、下回
る時刻422の中間の時刻を第3の極大を取った時刻4
20としている。The material detecting means 25 detects the maximum change amount of the oscillation level while the coin 8 passes through the material sensor 18, that is, the first maximum value of the waveform 40. Outer diameter detection means 26
The maximum change amount of the oscillation level while the coin 8 passes through the outer diameter sensor 6, that is, the third maximum value of the waveform 40 is detected. The thickness detecting means 23 in the outer peripheral portion is configured such that the coin 8 has two thickness sensors 1.
The maximum change amount of the oscillation level is detected at the position where both of 7 and 5 are applied. In the present embodiment, the time at which the waveform 40 of the second half-wave rectification circuit 22 takes the second minimum value is used to prevent erroneous detection by using the position where the outer peripheral portion of the coin 8 is applied to the first thickness sensor 17. The maximum value of the waveform 50 of the 500-yen coin and the waveform 60 of the foreign coin of the second half-wave rectifier circuit 22 immediately after 410 is detected, and the thickness 51 of the outer periphery of the 500-yen coin and the outer periphery of the foreign coin are detected. The thickness 61 is obtained. Central part thickness detecting means 24
Detects the change amount of the oscillation level at the timing when the coin 8 passes through the center of one of the thickness sensors 17 and 5. In the present embodiment, the timing at which the coin 8 passes through the center of the second thickness sensor 5 is set using the time 420 when the output of the second half-wave rectifier circuit 22 has reached the third maximum. At this time 420, the output of the first half-wave rectifier circuit 21 is detected,
The thickness 52 at the center of the 500 yen coin and the thickness 62 at the center of the foreign coin are obtained. To more accurately determine the time 420 at which the output of the second half-wave rectifier circuit 22 has reached the third maximum,
A value obtained by adding a constant value 43 to the second minimum value 41 is a threshold value 4
The time between the time 421 exceeding the threshold value 42 and the time 422 below the threshold value 422 is the time point 4 when the third maximum is taken.
20.
【0018】各検知手段23〜26は、検知した値をそ
れぞれ対応する比較回路28〜31に出力する。差の計
算手段27は、外周部の厚み検知手段23の出力と中央
部の厚み検知手段24の出力との差を計算して、五百円
硬貨の外周部と中央部の厚みの差53、外国硬貨の外周
部と中央部の厚みの差63を比較回路32に出力する。
記憶回路33には、正貨の種類毎に基準となる値が記憶
されている。比較回路28〜32では各検知手段23〜
27からの入力を記憶回路33の基準と比較し、許容範
囲内で一致していればその正貨の種類を示す信号を出力
し、どの種類の基準値とも一致しない場合には偽貨であ
ることを示す信号を出力する。判定回路34では、比較
回路28〜32からの信号が全て同じ正貨の種類を示す
場合に限りその正貨の種類を示す信号を、それ以外の場
合には偽貨を示す信号を判定信号35として出力する。Each of the detecting means 23 to 26 outputs the detected value to the corresponding comparing circuit 28 to 31. The difference calculating means 27 calculates the difference between the output of the thickness detecting means 23 at the outer peripheral portion and the output of the thickness detecting means 24 at the central portion, and calculates the difference 53 between the outer peripheral portion and the central portion of the 500 yen coin, The difference 63 between the outer peripheral portion and the central portion of the foreign coin is output to the comparing circuit 32.
The storage circuit 33 stores a reference value for each type of genuine coin. In the comparison circuits 28 to 32, the detection means 23 to
The input from the storage circuit 27 is compared with the reference of the storage circuit 33, and if it matches within the allowable range, a signal indicating the kind of the genuine coin is output. If it does not match any kind of reference value, it is a fake coin. Output a signal indicating that The determination circuit 34 outputs a signal indicating the type of genuine coin only when the signals from the comparison circuits 28 to 32 all indicate the same type of genuine coin, and a signal indicating a false coin otherwise. Output as
【0019】以上のように本実施例によれば、硬貨8の
外周部の厚み検知手段23を備えたことにより、硬貨8
の外周部の厚み51,61を検知することができるの
で、正貨と中央部の厚みは近似しているが外周部の厚み
は異なる偽貨を識別し、不正使用を防止することが可能
になる。また、硬貨8の中央部の厚み検知手段24と差
を計算する手段27を備えたことにより、硬貨8の外周
部と中央部の厚みの差53,63を検知することができ
る。そのため、中央部及び外周部の厚みはどちらも正貨
との差が不十分であるが、外周部と中央部の厚みの差5
3,63は異なるような偽貨も識別することも可能にな
る。As described above, according to the present embodiment, the provision of the thickness detecting means 23 on the outer peripheral portion of the coin 8 allows
The thickness 51, 61 of the outer periphery can be detected, so that it is possible to discriminate between a genuine coin and a fake coin having a similar thickness at the center but different thicknesses at the outer periphery, thereby preventing unauthorized use. Become. Further, by providing the thickness detecting means 24 at the center of the coin 8 and the means 27 for calculating the difference, it is possible to detect the difference 53, 63 between the outer peripheral part and the central part of the coin 8. For this reason, the difference between the thickness of the central portion and the outer peripheral portion is not enough for a genuine coin, but the difference in thickness between the outer peripheral portion and the central portion is 5%.
3 and 63 can also identify different counterfeit coins.
【0020】実験により、2個の厚みセンサ17,5の
間隔は、日本の五百円硬貨(外径26.5mm)に対し
て、硬貨通路に平行に測って24.5mmで最も精度が
良くなり、24〜25mm(硬貨の外径の90〜95
%)の範囲で良好な結果が得られた。また、高さは硬貨
の中央がセンサの中央の近くを通過するような配置であ
るほど良く、硬貨通路底面から測って8〜18.5mm
(硬貨の外径の30〜70%)の範囲で精度を維持する
ことができる。According to an experiment, the interval between the two thickness sensors 17 and 5 is 24.5 mm, which is measured in parallel with the coin passage, with respect to a Japanese 500 yen coin (outer diameter 26.5 mm). 24-25mm (90-95 of the outer diameter of the coin)
%), Good results were obtained. Further, the height is preferably set so that the center of the coin passes near the center of the sensor, and the height is 8 to 18.5 mm measured from the bottom of the coin passage.
Accuracy can be maintained in the range (30 to 70% of the outer diameter of the coin).
【0021】そして各々の厚みセンサ17,5を構成す
るコアは縦方向が硬貨の通過方向と平行になるように配
置すると、効果的であった。また、五百円硬貨に対して
は、コアの長さが小さいほど精度が良くなり、17mm
以下(硬貨の外径の65%以下)の範囲で良好な結果が
得られた。また、幅は5.5mmで最も良く、4〜8m
m(硬貨の外径の15〜30%)の範囲で精度を維持す
ることができる。It is effective to arrange the cores constituting the thickness sensors 17 and 5 so that the vertical direction is parallel to the coin passing direction. Also, for a 500 yen coin, the shorter the core length, the better the accuracy, and 17 mm
Good results were obtained in the following range (65% or less of the outer diameter of the coin). The width is best at 5.5 mm, and 4 to 8 m
m (15 to 30% of the outer diameter of the coin).
【0022】なお本実施例では2つの厚みセンサ17,
5を備えた例を示したが、1つの厚みセンサでも硬貨8
の外周部が近傍を通過する際の出力を利用すれば、本実
施例の方法に限らず硬貨8の外周部の厚みを検知するこ
とが可能である。In this embodiment, two thickness sensors 17 and
Although the example provided with the coin 5 is shown, the coin 8
If the output when the outer peripheral portion of the coin 8 passes through the vicinity is used, the thickness of the outer peripheral portion of the coin 8 can be detected without being limited to the method of the present embodiment.
【0023】また本実施例では、2つの厚みセンサ1
7,5のコイルを直列接続して1つの発振回路19を構
成しているが、各々のセンサのコイルで別々の発振回路
を構成しても良い。この場合、それぞれ半波整流した
後、和を計算する手段で本実施例と同様の発振レベルの
合成波形50,60を得ることができる。そしてこのよ
うな構成では、一方の厚みセンサの出力波形の中央の時
刻において、硬貨中央部の厚みを検知することも可能で
ある。例えば、厚みセンサの出力があらかじめ定めてお
いたしきい値を上回った時刻と下回った時刻の中間の時
刻に検知すれば良い。In this embodiment, two thickness sensors 1 are used.
While one oscillation circuit 19 is configured by connecting the coils 7 and 5 in series, separate oscillation circuits may be configured by the coils of each sensor. In this case, the combined waveforms 50 and 60 having the same oscillation level as in this embodiment can be obtained by means for calculating the sum after each half-wave rectification. In such a configuration, it is also possible to detect the thickness of the coin central portion at the time at the center of the output waveform of one thickness sensor. For example, the detection may be performed at a time between the time when the output of the thickness sensor exceeds a predetermined threshold value and the time when the output falls below a predetermined threshold value.
【0024】本実施例のように材質センサ18を備えれ
ば、このセンサの出力の2つの極大の時刻の中心時刻
に、硬貨中央部の厚みを検知することも可能である。If the material sensor 18 is provided as in the present embodiment, it is possible to detect the thickness of the central portion of the coin at the center time of the two maximum times of the output of this sensor.
【0025】さらに本実施例では硬貨通過時の発振レベ
ル変化を識別に用いた例を示したが、硬貨によるコイル
のインピーダンス変化を利用したものであれば、インダ
クタンス、周波数、位相等の変化を用いることもでき
る。Further, in this embodiment, an example in which a change in the oscillation level when passing a coin is used for discrimination is shown. However, if the change in impedance of a coil due to a coin is used, a change in inductance, frequency, phase, etc., is used. You can also.
【0026】第1の厚みセンサ17と材質センサ18を
兼用しているのは、硬貨中央部の厚みを材質センサ18
でタイミングを取って検知する場合の精度を確保するた
めである。同時に小型化やコストダウンも可能である
が、各々別のセンサであっても構わない。The reason why the first thickness sensor 17 and the material sensor 18 are also used is that the thickness of the coin central portion is determined by the material sensor 18.
This is to ensure the accuracy in the case where the detection is performed at a proper timing. At the same time, miniaturization and cost reduction are possible, but separate sensors may be used.
【0027】[0027]
【発明の効果】以上のように本発明の硬貨識別装置は、
硬貨の外周部の厚みを検知する手段を備えるため、硬貨
の外周部の厚みを検知することができるので、正貨と中
央部の厚みは近似しているが外周部の厚みは異なる偽貨
を識別し、不正使用を防止することが可能である。As described above, the coin identification device of the present invention
Since there is a means for detecting the thickness of the outer peripheral portion of the coin, it is possible to detect the thickness of the outer peripheral portion of the coin. It is possible to identify and prevent unauthorized use.
【図1】本発明の一実施例における制御回路の構成を示
すブロック図FIG. 1 is a block diagram showing a configuration of a control circuit according to an embodiment of the present invention.
【図2】本発明の一実施例における硬貨識別装置の概要
を示す構成図FIG. 2 is a configuration diagram showing an outline of a coin identification device according to an embodiment of the present invention.
【図3】本発明の一実施例における第1の厚み・材質兼
用センサ近傍の断面図FIG. 3 is a cross-sectional view of the vicinity of a first thickness / material combined sensor in one embodiment of the present invention.
【図4】本発明の一実施例における第2の半波整流回路
の出力波形図FIG. 4 is an output waveform diagram of a second half-wave rectifier circuit according to one embodiment of the present invention.
【図5】本発明の一実施例における第1の半波整流回路
の出力波形図FIG. 5 is an output waveform diagram of a first half-wave rectifier circuit according to one embodiment of the present invention.
2 硬貨投入口 3 硬貨通路 4 第1の厚み・材質兼用センサ 5 第2の厚みセンサ 6 外径センサ 8 硬貨 11 E型コア 12 E型コア 13 コイル 14 コイル 15 コイル 16 コイル 17 第1の厚みセンサ 18 材質センサ 19 第1の発振回路 20 第2の発振回路 21 第1の半波整流回路 22 第2の半波整流回路 23 外周部の厚み検知手段 24 中央部の厚み検知手段 25 材質検知手段 26 外径検知手段 27 差の計算手段 28 比較回路 29 比較回路 30 比較回路 31 比較回路 32 比較回路 33 記憶回路 34 判定回路 35 判定信号 40 第2の半波整流回路の出力波形 41 第2の極小値 42 しきい値 43 一定値 50 第1の半波整流回路の出力波形(五百円硬貨) 51 外周部の厚み(五百円硬貨) 52 中央部の厚み(五百円硬貨) 53 外周部と中央部の厚みの差(五百円硬貨) 60 第1の半波整流回路の出力波形(外国硬貨) 61 外周部の厚み(外国硬貨) 62 中央部の厚み(外国硬貨) 63 外周部と中央部の厚みの差(外国硬貨) 410 第2の極小を取った時刻 420 第3の極大を取った時刻 421 しきい値を上回った時刻 422 しきい値を下回った時刻 2 Coin slot 3 Coin passage 4 First thickness and material combined sensor 5 Second thickness sensor 6 Outer diameter sensor 8 Coin 11 E-shaped core 12 E-shaped core 13 Coil 14 Coil 15 Coil 16 Coil 17 First thickness sensor REFERENCE SIGNS LIST 18 material sensor 19 first oscillation circuit 20 second oscillation circuit 21 first half-wave rectification circuit 22 second half-wave rectification circuit 23 outer peripheral thickness detecting means 24 central thickness detecting means 25 material detecting means 26 Outer diameter detection means 27 Difference calculation means 28 Comparison circuit 29 Comparison circuit 30 Comparison circuit 31 Comparison circuit 32 Comparison circuit 33 Storage circuit 34 Judgment circuit 35 Judgment signal 40 Output waveform of second half-wave rectification circuit 41 Second minimum value 42 Threshold value 43 Constant value 50 Output waveform of first half-wave rectifier circuit (500 yen coin) 51 Thickness of outer peripheral portion (500 yen coin) 52 Thickness of central portion (500 yen coin) 53 Difference in thickness between outer peripheral portion and central portion (500 yen coin) 60 Output waveform of first half-wave rectifier circuit (foreign coin) 61 Thickness of outer peripheral portion (foreign coin) 62 Central portion Thickness (foreign coin) 63 Difference in thickness between outer peripheral part and central part (foreign coin) 410 Time when second minimum is taken 420 Time when third maximum is taken 421 Time when threshold is exceeded 422 Threshold is set Time below
フロントページの続き (56)参考文献 特開 平5−54229(JP,A) 特開 昭61−262991(JP,A) 実開 昭57−147710(JP,U) 実公 昭43−5051(JP,Y1) (58)調査した分野(Int.Cl.7,DB名) G07D 5/00 - 5/10 Continuation of the front page (56) References JP-A-5-54229 (JP, A) JP-A-61-26991 (JP, A) JP-A-57-147710 (JP, U) JP-A-43-5051 (JP, A) , Y1) (58) Field surveyed (Int. Cl. 7 , DB name) G07D 5/00-5/10
Claims (10)
硬貨通路と、この硬貨通路の側壁に配置された識別セン
サと、この識別センサの出力により投入された硬貨の外
周部の厚みを検知する検知手段と、硬貨の正偽及び種類
の基準となるデータをあらかじめ記憶する記憶回路と、
前記検知手段の出力と前記記憶回路の基準のデータとを
比較する比較回路と、この比較回路の比較結果により硬
貨の正偽及び種類を判定する判定回路とを備え、前記検
知手段は2個の厚みセンサを用い、これらのセンサの合
成出力波形から硬貨外周部の厚みを検知すると共に、前
記の2個の厚みセンサはそれぞれ、コイルを巻いたコア
を2つ硬貨通路に対向して配置し、これらのコイルを相
互インダクタンスが負になるように直列逆相接続して構
成し、前記の2個の厚みセンサの間隔を硬貨通路に平行
に測って識別しようとする硬貨の外径の90%以上95
%以下とし、前記の2個の厚みセンサの高さを硬貨通過
底面から測って識別しようとする硬貨の外径の30%以
上70%以下とした硬貨識別装置。1. A coin insertion slot, a coin passage connected to the insertion slot, an identification sensor arranged on a side wall of the coin passage, and a thickness of an outer peripheral portion of the coin inserted by an output of the identification sensor. Detecting means for detecting, and a storage circuit for storing in advance data serving as a reference for authenticity and type of coins,
A comparison circuit that compares the output of the detection means with reference data of the storage circuit; and a determination circuit that determines the authenticity and type of the coin based on the comparison result of the comparison circuit. Using a thickness sensor, the thickness of the outer periphery of the coin is detected from the composite output waveform of these sensors ,
Each of the two thickness sensors described above is a core wound with a coil.
Are arranged opposite to the coin path, and these coils are
Connect in series and anti-phase so that mutual inductance is negative.
And make the distance between the two thickness sensors parallel to the coin path
90% or more of the outer diameter of the coin to be measured and identified 95
% Or less, and the coin passes through the height of the two thickness sensors.
30% or less of the outer diameter of the coin to be identified by measuring from the bottom
A coin discriminating device whose upper limit is 70% or less .
ンサを構成すると共に、前記コアの長さを識別しようと
する硬貨の外径の65%以下とし、前記コアの幅を識別
しようとする硬貨の外径の15%以上30%以下とし、
前記コアの開口部が硬貨通路に対向し縦方向が硬貨の通
過方向と平行になるようにセンサを配置した請求項1記
載の硬貨識別装置。2. A thickness sensor formed by winding a coil around an E-shaped core and identifying the length of the core.
65% or less of the outer diameter of the coin to be used, and identify the width of the core
15% or more and 30% or less of the outer diameter of the coin to be
The opening of the core faces the coin passage, and the coin passes through the coin in the vertical direction.
Coin discrimination apparatus according to claim 1 wherein placing the sensors so as to be parallel to the over-direction.
続し、1つの発振回路に接続した請求項1記載の硬貨識
別装置。3. The coin discriminating apparatus according to claim 1, wherein the coils constituting the two sensors are connected in series and connected to one oscillation circuit.
発振回路を接続し、これらの発振回路の出力波形の和を
計算する手段を備えた請求項1記載の硬貨識別装置。4. The coin discriminating apparatus according to claim 1, further comprising means for connecting an oscillating circuit to each of the coils constituting the two sensors and calculating a sum of output waveforms of the oscillating circuits.
周部と中央部の厚みの差を計算する手段を備えた請求項
1記載の硬貨識別装置。5. The coin discriminating apparatus according to claim 1, further comprising: means for detecting the thickness of the coin central portion; and means for calculating the difference between the thickness of the outer peripheral portion and the thickness of the central portion.
いて、硬貨中央部の厚みを検知する請求項5記載の硬貨
識別装置。6. The coin discriminating apparatus according to claim 5, wherein the thickness of the coin central portion is detected at the time of the center of the output waveform of the thickness sensor.
タイミングを取って硬貨中央部の厚みを検知する請求項
5記載の硬貨識別装置。7. A coin sensor according to claim 1, further comprising another sensor for detecting the thickness of the central portion of the coin at an appropriate timing based on an output from the sensor.
5. The coin identification device according to 5 .
最大となった時刻に硬貨中央部の厚みを検知する請求項
7記載の硬貨識別装置。8. A coin outer diameter sensor for detecting a thickness of a coin central portion at a time when an output of the sensor becomes maximum.
7. The coin identification device according to 7 .
2つの極大の時刻の中心時刻に硬貨中央部の厚みを検知
する請求項7記載の硬貨識別装置。9. The coin discriminating apparatus according to claim 7, further comprising a material sensor, wherein the thickness of the coin central portion is detected at a center time between two maximum times of the output of the sensor.
のセンサで兼用する請求項9記載の硬貨識別装置。10. The coin discriminating apparatus according to claim 9 , wherein one of the thickness sensors and the material sensor are shared by one sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30201294A JP3201185B2 (en) | 1994-12-06 | 1994-12-06 | Coin identification device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30201294A JP3201185B2 (en) | 1994-12-06 | 1994-12-06 | Coin identification device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08161574A JPH08161574A (en) | 1996-06-21 |
| JP3201185B2 true JP3201185B2 (en) | 2001-08-20 |
Family
ID=17903834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30201294A Expired - Fee Related JP3201185B2 (en) | 1994-12-06 | 1994-12-06 | Coin identification device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3201185B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100443853C (en) * | 2004-04-21 | 2008-12-17 | 爱德森(厦门)电子有限公司 | Method and device for on-line detecting depth of curie point temperature layer from surface of hot steel plate |
| JP6277350B2 (en) * | 2014-12-16 | 2018-02-14 | 旭精工株式会社 | Coin identification device |
-
1994
- 1994-12-06 JP JP30201294A patent/JP3201185B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08161574A (en) | 1996-06-21 |
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