JP3201489B2 - Heat-resistant synthetic resin film having composite metal layer and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a heat-resistant synthetic resin film having a composite metal layer useful as TAB and the like, and a method for producing the same.

[0002]

2. Description of the Related Art Conventionally, a TAB material used for mounting a semiconductor or the like is formed by laminating a heat-resistant plastic such as a polyimide and a good conductive metal foil such as a copper foil using an adhesive, or A material in which a heat-resistant resin is directly applied to a metal foil surface is used. However, in the former case, there is no adhesive having the heat resistance enough to withstand the mounting, and thus there is a problem in the thermal characteristics. In the latter case, the occurrence of curling is severe, and in order to prevent this, a rolling process or the like is performed as a post-process to forcibly deform. For this reason, the obtained material for TAB may cause cracks, or the bonding between the metal foil and the plastic may be reduced, causing voids at the bonding interface. Further, in this case, there is also a problem that the post-processing is required, so that the manufacturing cost is increased.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a heat-resistant synthetic resin film having a composite metal layer that does not substantially curl, and a method for producing the same.

[0004]

According to a first aspect of the present invention, at least one surface of a heat-resistant synthetic resin layer has a resistance value of 10 Ω · cm or less and a film thickness of 100 Ω.
A heat-resistant synthetic resin film having a metal thin film layer of Å to 1 μm further having a conductive metal layer thereon, wherein the heat-resistant synthetic resin layer is formed on the metal thin film layer. In addition, the present invention relates to a heat-resistant synthetic resin film having a composite metal layer, wherein the heat-resistant synthetic resin film has a curling property of 20% or less. The second aspect of the present invention is to form a metal thin film layer having a resistance value of 10 Ω · cm or less on a base material, and then form a heat-resistant synthetic resin layer on the metal thin film layer, and then peel the base material. Forming a laminate comprising the metal thin film layer and the heat-resistant synthetic resin layer, and further forming a conductive metal layer on the metal thin-film layer. .

Regarding the curling property, a sample was cut out into a square having a side of 100 mm, and the sample was left horizontally in an environment of a temperature of 20 ° C. and a humidity of 65% with the metal surface facing upward for 3 hours. The maximum height hmm of the crest generated by the above is measured, and (h / 100) × 100
The curling property was indicated by (%). As the base material, a thermoplastic polyester such as polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone (PES), polysulfone, polyarylate, polytetrafluoroethylene (PTFE),
A polymer material of a relatively heat-resistant type such as cellulose acetate (TAC) is preferable, and is usually used in the form of a film.
The thickness of the film is usually about 25 to 250 μm, and can be conveniently used, but is not limited thereto. Also,
There is no special relationship between wall thickness and peelability.

Examples of a material for forming a metal thin film layer having a resistance value of 10 Ω · cm or less include iridium, cobalt, nickel, tungsten, stainless steel, etc., from materials having good conductivity such as gold, silver, copper, and aluminum. can do. The metal forming the metal thin film layer having a resistance value of 10 Ω · cm or less and the metal forming the conductive metal layer may be the same or different.

[0007] Examples of the resin constituting the heat-resistant synthetic resin layer include polyparabanic acid and polyimide. Polyparabanic acid can be obtained by reacting with the reaction formula [I]

Embedded image And the like. Where R
Is

Embedded image And the like. The polyparabanic acid thus obtained has a glass transition point of 290 to 350 ° C.
Dimethylformamide (DMF), n-methylpyrrolidone (NMP), dimethylacetamide (DMA
The film can be formed by a casting method by dissolving in a polar solvent such as C) (see Functional Materials, August 1990, pp. 6-10, Plastics Vol. 37, No. 7, pp. 84-86). As described in JP-B-36-10999 and JP-B-39-348, polyimide is obtained by organic condensation of a polyamic acid obtained by polycondensation of an acid anhydride such as pyromellitic anhydride with a diamine. A heat-resistant synthetic resin film can be obtained by a known method in which a solvent solution is cast and subjected to a ring-closing reaction to form a film on a polyimide film. Examples of the organic solvent include DMF, DMAC, NM
P, dimethyl sulfoxide, dimethyl sulfone and the like can be exemplified. The thickness of the heat-resistant synthetic resin layer can be usually 3 to 200 μm, preferably 5 to 15 μm.
0 μm.

[0008] A protective layer can be formed on the good conductive metal layer of the present invention, if necessary. It is particularly effective when the good conductive metal is easily oxidized like copper, and for example, a metal excellent in weather resistance such as nickel and chromium is preferable. The thickness of the protective layer is from 100 to 5 μm, preferably from 500 to 1 μm.

As a method for forming a metal thin film layer on a substrate, there are vapor deposition, sputtering, ion plating, C
VD, electroless plating, or the like can be used. This metal thin film has a thickness of 100 to 1 μm, preferably 400 to 1 μm.
2000 $.

As a means for forming the conductive metal layer on the metal thin film layer, methods such as electroplating, electroless plating, sputtering, ion plating and vapor deposition can be used, and the thickness of the layer is 1000 to 50 μm, preferably 1-20μ
m. In the case where the conductive metal layer is formed on the metal thin film layer in this manner, a small void (void) may be generated between the two, and it is preferable to discharge air in the void by calendaring.

[0011]

Example 1 A dimethylformamide (DMM) film was formed on a nickel-deposited surface of a 100 μm-thick polyethylene terephthalate film formed by depositing nickel to a thickness of 500 ° by a vacuum deposition method.
F) Polyparabanic acid resin (abbreviated as PPA; trade name: Tonen Chemical Co., Ltd. Soldax) dissolved in F) was cast into a film having a thickness of 10 μm, dried, peeled off from the polyethylene terephthalate film, and nickel deposited. The layer was transferred to the polyparabanic acid film side to prepare a polyparabanic acid film with a nickel vapor deposition layer. afterwards,
This polyparabanic acid film with a nickel vapor-deposited layer was formed by depositing 8 μm of copper in a copper pyrophosphate plating bath,
The resultant was dried by heating to 100 ° C. to obtain a heat-resistant film in which a metal composed of copper / nickel / PPA was composited. The peelability and curling properties of the obtained composite heat-resistant film were as shown in Table 1. Example 2 Copper having a thickness of 400 μm formed by a sputtering method and having a thickness of 50 μm
On the copper surface of the polycarbonate film, a polyparabanic acid resin having the same composition as in Example 1 was cast into a film so as to have a thickness of 6 μm, and after drying, peeled off from the polycarbonate film of the base material, and the copper was coated on the polyparabanic acid film side. After the transfer and transfer, it was immersed in an electrolytic copper plating bath to form a copper layer having a thickness of 3 μm, and a heat-resistant film in which a metal composed of copper / copper / PPA was composited was obtained. Table 1 shows the peelability and curling properties of the obtained film.

[Table 1] * ^{1 For} peelability, apply an adhesive tape that is commercially available as 1/2 inch cellophane tape from both sides of the film,
This is indicated by the tensile force at the time of peeling by pulling from the 180 ° direction (vertical direction). * ² Curling properties are as defined above. In the case of a conventional commercial product, when the curling test of the present invention was performed, the sample was rounded and rounded, and the curling property could not be measured.

[0012]

According to the present invention, there is provided a heat-resistant material having a metal layer suitable for TAB, in which curling is suppressed to a very low level as compared with the conventional curling property of 20% or less (the curling property cannot be measured). A synthetic resin film was provided.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Junichi Hirata 56 Imaiue-cho, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujimori Industries Co., Ltd. (72) Inventor Keisuke Ebina 4-1-1 Tsukiji, Chuo-ku, Tokyo Tonen Chemical Co., Ltd. In-company (72) Inventor Shunichi Doi 1-5-1, Marunouchi, Chiyoda-ku, Tokyo Nitto Chemical Industry Co., Ltd. (56) References JP-A-3-116847 (JP, A) JP-A-3-222444 (JP) , A) JP-A-2-219636 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60

Claims (3)

(57) [Claims] At least one surface of a heat-resistant synthetic resin layer has a resistance value of 10 Ω · cm or less and a film thickness of 100 ° to 1 μm.
The metal thin film layer is a heat-resistant synthetic resin film further having a conductive metal layer thereon, and the heat-resistant synthetic resin layer is formed on the metal thin film layer, A heat-resistant synthetic resin film having a composite metal layer, wherein the heat-resistant synthetic resin film has a curling property of 20% or less. 2. A metal thin film layer having a resistance value of 10 Ω · cm or less is formed on a base material, and a heat-resistant synthetic resin layer is formed on the metal thin film layer. A method for producing a heat-resistant synthetic resin film having a composite metal layer, comprising forming a laminate comprising a metal thin-film layer and a heat-resistant synthetic resin layer, and further forming a conductive metal layer on the metal thin-film layer. 3. The method for producing a heat-resistant synthetic resin film having a composite metal layer according to claim 2, wherein the substrate is a polyethylene terephthalate film.