JP3202870B2 - Soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet type solder in which a solder melt is jetted from an outlet to form a jet wave, and the jet wave is brought into contact with the wiring board while being conveyed to solder the wiring board. The present invention relates to a mounting device.

[0002]

2. Description of the Related Art Various soldering apparatuses have been developed to improve solderability. One of the technical flows at the base thereof is miniaturization of electronic components and high-density mounting on a wiring board. Along with that, a micro-soldering technique for a wiring substrate having a so-called fine pitch pattern has been developed.

On the other hand, the reliability of electronic devices is an important technology that is said to be determined by soldering technology. This is because the quality of the soldered portion determines most of the reliability of the electronic device on which the wiring board is mounted. In other words, the quality of the soldered portion is a question as to whether strong mechanical connection strength and good electrical connectivity are maintained even under various environmental stresses.

Next, a conventional soldering apparatus will be described.

In the following, the following six publications will be used for the description of the prior art.

The technique of Japanese Utility Model Publication No. 48-35236 (known as Publicly Known Example 1) The technology of Japanese Utility Model Publication No. 56-3101 (known as Known Example 2) The technology of Japanese Utility Model Publication No. 51-32616 (known example 3)・ The technology of JP-A-60-18992 (known as known example 4) ・ The technology of Japanese Patent Publication No. 59-5390 (known as known example 5) ・ The technology of Japanese Utility Model Publication No. Sho 52-127263 (known example 6) FIG. 10 is a perspective view showing the technique of the jet-type solder bath of the first known example. That is, a first solder wave portion is formed at the jet port A1, and then a second solder wave portion is formed at the bent portion A3 of the waveform control plate A2. Then, the solder irritation and the solder bridge (same as a short circuit or a solder short) remaining in the soldering portion of the soldered body soldered by the first soldering wave portion are heated by the second soldering wave portion. It is a technology to remove.

FIG. 11 is a side sectional view showing the technique of the solder jet tank according to the second prior art. That is, the solder B2 is caused to flow in the direction opposite to the direction of transport of the printed circuit board B1 (in the direction of the arrow), and a plurality of waves B4 are formed by the wave-forming projections B3. This technology solves problems such as short-circuit adhesion (synonymous with solder bridge and solder short) and solder not adhering to a target portion (synonymous with unsoldering or no solder).

FIG. 12 is a plan view for explaining the technique of the soldering apparatus of the third conventional example. That is, the horizontal soldering mechanism provided below the jet-type solder tank C1 causes the jet-type solder tank C1 to rotate.
In this technique, the flow direction of the solder which is ejected from the solder jet port C2 and flows out is inclined with respect to the traveling direction (the direction of the arrow) of the printed circuit board C3, so that the so-called solder separation property is improved and the generation of icy solder is eliminated. . Therefore, this technique has the effect of eliminating the occurrence of solder bridges in places where the distance between the soldered portions is small.

FIGS. 13 (a), 13 (b) and 13 (c) are plan views illustrating a soldering apparatus according to a known example 4. FIG. That is, the shape of the outlet D1 of the jet tank is bent in a direction perpendicular to the direction of transport of the printed circuit board D2 (in the direction of the arrow). I have. Therefore, this technique has the same contents as the soldering technique described in the above-mentioned known example 3. That is,
The only difference is that the geometry of the outlet D1 is different.
1, the flow direction of the molten solder D3 ejected and flowing out is inclined with respect to the traveling direction of the printed circuit board D2.
This is a technology that improves the separation of 3.

FIGS. 14 (a), 14 (b) and 14 (c) are side sectional views showing the technique of the solder bath of the fifth prior art. That is, 2
In a jet-type solder bath having two or more jet nozzles E1, bent portions E2, E3, and E4 are provided in the jet nozzle E1 to provide directivity in the jet direction of the solder E5 in the transport direction of the printed circuit board or in the opposite direction. Excessive solder E in soldering area
This is a technology that aims to eliminate the occurrence of solder adhesion and short-circuiting of solder, as well as to eliminate unsoldering.

FIG. 15 is a perspective view showing the technique of the wave soldering machine of the known example 6. That is, the jet F
1, the angle F5 of the blades F3 and F4 for guiding the flow of F2
By adjustable by the rotation of the F6 shaft F7, F8, and allows adjustment of the falling angle of the jet solder was to optimal drop angle pattern sequence for various printed circuit board can be easily selected technology It is.

[0012]

There are many indices for evaluating the quality of a soldered portion. One of them is a fillet shape.

FIGS. 16 (a) and 16 (b) are views for explaining a fillet shape. FIG. 16 (a) is a side sectional view for explaining a case of a lead type electronic component, and FIG. 16 (b) is a chip type. FIG. 4 is a side sectional view for explaining the electronic component of FIG. In these figures, 1 is a wiring board, 2 is a land pattern, 3 is a lead-type electronic component, 4 is a lead wire, 5 is a chip-type electronic component, 6 is an electrode, and 7 is the lead wire 4 or the electrode 6. This is a fillet formed by solder solidified on the surrounding land pattern 2.

That is, as exemplified by the solid lines in FIGS. 16A and 16B, the shape of the Mt. Fuji fillet 7 is generally recommended as an index indicating a good soldering state. That is, when good wettability is ensured, FIG.
This is because the shape of the Mt. Fuji fillet 7 is obtained.

By the way, in a physical stress environment which receives acceleration such as vibration and shaking, the shape of the fillet shown by the broken line is superior to the shape of the fillet 7 shown by the solid line in FIG. That is, a large contact area can be taken, so that the stress dispersed in the contact portion is small, and this is excellent in maintaining the mechanical connection strength. Therefore, electrical connectivity is also maintained. However, in the case of the shape of the fillet 7 as indicated by the dashed line, stress concentrates on the connection tip portion (points a and b indicated by arrows), and the connection portion is likely to peel off. Therefore, it is not generally recommended.

There are many factors that determine the shape of the fillet 7. For example, the relationship between the diameter of the lead wire 4 of the electronic component 3 and the size and shape of the land pattern 2 The type of flux used The preheating temperature The soldering temperature (solder temperature) The type of solder bath (static or jet type) The jet type solder This is the shape of the jet wave in the tank.

However, in any case, in the wiring board 1 in which the electronic components 3 and 5 are miniaturized and densely packed by high-density mounting, the shape of the fillet 7 as shown by the broken line in FIG. It is considered difficult to achieve both. That is, in general, FIG.
This is because when the thickness of the fillet 7 is increased as shown by the broken line in FIG.

Regarding the improvement of the fillet shape for improving the reliability of the soldering described above, none of the known examples 1 to 6 cited as examples of the prior art is mentioned as a problem or an object. Until now, the problems and objectives have been raised only to eliminate soldering defects such as a soldering phenomenon, excessive adhesion, a solder bridging phenomenon, and no solder to which solder is not attached. In other words, a technology that attempts to achieve both a micro-soldering technology and a highly reliable technology is still under development.

FIG. 17 is a view for explaining the process parameters at the peel back point. In this figure, the same symbols as those in FIG. 16 indicate the same parts, 8 is a conveyor for conveying the wiring board 1, 9 is a solder melt, 10
Is a nozzle for jetting the solder melt 9, and 11 is an outlet,
The longitudinal direction is provided in a direction intersecting the transport direction A of the wiring substrate 1 (hereinafter, referred to as a substrate transport direction). Reference numerals 12 and 13 denote forward and rearward and forward flow guide plates with respect to the substrate transport direction A, 14 denotes a jet wave on the flow guide plate 12, 15 denotes a jet wave on the flow guide plate 13, PBP is a peelback point.

Here, θs is the elevation angle of the conveyed wiring board 1 with respect to the horizontal plane, and θ is the separation angle at the peel back point PBP. Here, the separation angle θ
Means that the jet wave 15 (14) formed by the solder melt jetting out from the outlet and flowing down along the guide plate is in a direction in which the jet wave flows at a point away from the wiring board 1 and The angle between the tangent direction S and the transfer direction A is in the same plane as the soldering surface of the wiring board.

Generally, in order to increase the thickness of the shape of the fillet 7 shown in FIG. 16, it is necessary to increase the transport speed VP of the wiring board 1 at the peel back point PBP and the jet wave 15
It is known that it is good to make the flow velocity υF close to this. It is also known that a large separation angle θ at the peel back point PBP should be adopted in order to prevent the occurrence of solder shorts (bridges).

The technical problem of the present invention is to achieve this in the factor technology of the following factors that define the shape of the fillet. In other words, by realizing a soldering apparatus that achieves both increase in fillet thickness and elimination of solder bridges, a soldering apparatus that can manufacture a highly reliable wiring board even in a high-density mounting wiring board is realized. The purpose is

[0023]

SUMMARY OF THE INVENTION According to the present invention, there is provided a method for controlling a flow rate of a solder melt at a peel back point by controlling a solder flow state at a peel back point at which a wiring board is separated from a jet wave. The feature is that the angle and the angle can be adjusted.

For this reason, the invention according to claim 1 of the present invention is directed to a peel back port in which a wiring board is separated from a jet wave.
A ridge member capable of adjusting the flow rate and separation angle of the solder melt at the point is provided on the wave guide plate on the carry-out side.
Forward and backward adjustably mounted to the吹口in
At the same time as the wave guide plate on the carry-out side
It is provided so that forward and backward adjustment is possible in the direction .

[0025] The invention described in Claim 2, the吹口
The ejection directivity of the ejected solder melt is determined by the
The loading side of the wiring board should be
When the origin coordinates are set, the loading side of the wiring board that forms the outlet
The angle of the nozzle body to the horizontal
The angle of the exit side nozzle body with respect to the horizontal plane is increased .

[0026]

[0027]

[0028]

[0029]

[0030]

According to the first aspect of the present invention, the laminar flow of the solder melt ejected from the outlet and flowing down the wave guide plate has a flow velocity which is determined by the fluid resistance of the ridge member and its convex shape. Suffers from slowing and uplift. Therefore, the flow velocity and the height of the laminar flow of the solder melt ejected from the outlet and flowing down change. That is, the wave shape, that is, the flow form, formed by the solder melt ejected and flowing from the outlet changes. Of course, these are affected by the size and shape of the ridge member and the flow rate of the solder melt ejected from the outlet. As a result, it is possible to adjust the flow rate and the separation angle of the solder melt at the peel back point by adjusting the protrusion and the backward movement of the convex member to the blow port and adjusting the flow rate of the solder melt discharged from the blow port. .

Further, since the flow rate of the solder melt at the peel back point can be reduced and adjusted, it is also possible to adjust the front-back balance of the flow of the crest of the solder melt formed above the blow port, At the equilibrium point, the flow velocity of the solder melt at the crest becomes extremely slow, and the crest having good flatness can be formed. That is, the fluctuation of the jet wave generated by the flow of the solder melt is extremely reduced. As a result, uniform solderability can be obtained.

By the way, in order to increase the thickness of the fillet shape, it is good to make the conveying speed of the wiring board at the peel back point close to the flow rate of the solder melt, and on the other hand, to prevent the solder short, the peeling It is known that a large separation angle at the back point should be used.

That is, by adjusting the projecting member forward and backward with respect to the outlet and adjusting the delivery amount of the pump mechanism, the flow velocity of the jet wave flowing down is made close to the conveying speed of the wiring board, and the flowing angle is made large. Thus, a thick fillet shape and a soldering process that does not cause solder short can be realized.

Further, the wave guide plate on the carry-out side is soldered.
Forward and backward in the ejection direction of
Adjustment of the balance in the transport direction of the wiring board.
And be able to. In other words, it is squirted from the outlet and distributed.
The flow rate of the solder melt flowing down to the wiring board loading side and the wiring board
The ratio with the flow rate of the solder melt flowing down to the carry-out side can be adjusted .

[0035] The invention according to claim 2 is characterized in that
Many parts of the solder melt that is jetted out
Flows in the opposite direction to the solder flow
The height of the laminar flow of the melt is also higher than that of the configuration according to claim 1.
It becomes. On the other hand, solder flowing down to the circuit board unloading side of the outlet
The flow rate of the melt decreases and its flow rate also decreases. Thus, by forward and backward adjustment of the convex member, conveying a flow rate of the solder melt in peel back point of the wiring board
The spacing angle while close to the speed increase can be Rukoto.

Of course, the solder melt
The flow rate can be adjusted by the pump function,
By using them together, the peelback point
The range of adjustment of the flow rate of the melt can be widened. Ma
Also, the balance before and after the solder melt flow at the crest
It can be easily adjusted .

[0037]

[0038]

[0039]

[0040]

[0041]

[0042]

[0043]

[0044]

【Example】

<Embodiment 1> FIGS. 1 (a) and 1 (b) show a first embodiment of the present invention. FIG. 1 (a) is a side sectional view of a nozzle portion, and FIG. 1 (b) is a nozzle portion. FIG. In these figures, the same reference numerals as those in FIG. 17 indicate the same parts.

The outlet 11 of the nozzle 10 is provided with a flow-down guide plate 21 having a large descending angle on the side of loading the wiring board 1, ie, on the front side of the nozzle 10 with respect to the board transport direction A, and on the exit side, On the front side with respect to the substrate transport direction A, a wave guide plate 22 having a small descending angle is provided. The wave guide plate 22 is provided with a flow state adjusting member 23 for adjusting the flow state of the solder melt. The flow state adjusting member 23 includes an elongated convex member 24 provided in parallel with the outlet 11 and a plate-shaped member 25 formed integrally with the convex member 24. This plate-like member 25
Has a long hole 26 formed therein, and a screw 27 is inserted therethrough to lock and fix to the wave guide plate 22. Therefore,
The position can be adjusted by advancing and retreating the ridge member 24 along the long hole 26 in the same direction as the substrate transport direction A toward the blowing port 11 side.

The side plate 28 prevents the solder melt 9 jetted from the outlet 11 from flowing to the side. FIG.
In (a), the illustration of the side plate 28 is omitted. The solder melt 9 is sent to the nozzle 10 by a pump mechanism (not shown), and the amount of the solder melt 9 can be generally adjusted by adopting a structure capable of adjusting the rotation speed of the pump mechanism (not shown). It has a configuration.

In the example shown in FIG. 1, a so-called horizontal transfer soldering apparatus for transferring the wiring board 1 in the horizontal direction is used as an example. Reference numeral 29 denotes a crest above the outlet 11.

Generally, the horizontal transfer of the wiring board 1 is performed as shown in FIG.
6 has the advantage that there is no inclined gravity exerted on the electronic components 3 and 5 mounted on the wiring board 1 shown in FIG. 6, and the electronic components 3 and 5 after soldering do not tilt or float. However, it is said that the separation angle θ at the peel back point PBP is small, and there is a disadvantage that a solder short is easily generated when soldering the wiring board 1 having the fine pitch pattern. However, in the first embodiment, the flow rate ΔF of the solder melt 9 is set to be larger than the transfer speed V
Adjustable according to P.

Next, the operation will be described.

The solder melt 9 spouted from the outlet 11 is divided into the carry-in side and the carry-out side of the wiring board 1, and is guided by the flow-down guide plate 21 and the wave guide plate 22, respectively, and flows down at the speed ΔR and the speed ΔF. Note that, in FIG.
Is horizontally transferred from the left side to the right side (substrate transfer direction A) in the figure. The transport speed of the wiring board 1 is VP.

The solder melt 9 ejected from the outlet 11 forms jet waves 14 and 15 having a height H from the edge of the outlet 11.
Then, the solder melt flowing down the wave guide plate 22 is raised by the ridge member 24 for adjusting the flow form, and then flows down the wave guide plate 22. Therefore, a valley or a step having a height h is formed between the outlet 11 and the convex member 24.

On the other hand, the jet waves 14,
Fifteen crests 29 are formed, and the solder melt flows down from the crests 29 toward the valleys at a separation angle θ. In addition, it is also possible to balance the flow rate of the solder melt flowing in the front-back direction (the direction of the carry-in side and the direction of the carry-out side of the wiring board 1) of the blowing port 11 by the ridge member 24. The flow velocities ΔR and ΔF in the portion (1) are significantly reduced, and a flat crest 29 can be formed. Of course, the equilibrium point slightly changes depending on the flow rate of the total solder melt 9 spouted from the outlet 11.

FIGS. 2 and 3 are diagrams for explaining the first and second operation examples of FIG. 1. FIG. 3 shows the ridge member 24 moved and adjusted to a position closer to the blowing port 11 in FIG. The case is illustrated. In this comparison, the difference in process parameters resulting from the difference in the flow state of the jet wave 15 flowing down is explained.

That is, in the adjustment example shown in FIG.
The solder melt that flows down in the direction opposite to the substrate transport direction A at a speed ΔR 1 flows down at a speed ΔR 2 at the position of the flow-down guide plate 21. Then, υR1 <υR2. Further, the solder melt flowing down from the crest 29 in the same direction as the substrate transport direction A at the speed ΔF1 flows down at the speed ΔF2 at the peel back point PBP. And υF1 <υF2.

By the way, the velocity of the solder melt flowing down in the same direction as the substrate transport direction A is reduced because the flow is prevented by the ridges 24. That is, υR2> υ
F2. Of course, these flow rates υR2, υF2 also change depending on the delivery amount of the pump mechanism, but the above relationship is basically the same.

Therefore, by adjusting the position of the ridge member 24 with respect to the outlet 11, the peel back point PB
The flow velocity ΔF2 at P can be adjusted to the transport speed VP of the wiring board 1 (ΔF2 ≒ VP). The range of adjustment can be further widened by using the adjustment of the delivery amount of the solder melt 9 by a pump mechanism.

On the other hand, the solder melt 9 ejected from the outlet 11
The laminar flow of the valley 3 having a height h1 is located immediately before the ridge member 24.
It flows down while forming 0. That is, in a state where the wiring board 1 is in contact with the jet waves 14 and 15, a peel back point PBP having a separation angle θ1 is formed from the wave crest 29 having the height H1 toward the valley 30. Note that the separation angle θ
1 is defined by the degree of deceleration of the flow velocity by the ridge member 24. And, the greater the degree of deceleration, the more the crest 29
And the valley 30 have a large drop, and the separation angle θ1 increases.

Therefore, the peel back point PBP
The separation angle θ1 can be increased while adjusting the flow rate ΔF2 of the solder melt at the same time as the transport speed VP of the wiring board 1, thereby increasing the thickness of the fillet 7 shown in FIG. can do.

By the way, the position of the ridge member 24 is changed
When the distance is extremely far from the peak, the valley portion 30 formed by the ridge member 24 reduces the flow velocity decelerating effect on the crest portion 29, and has little effect.

[0060] In this case, by increasing the flow rate of the solder melt 9 ejected from吹口11, so that it is possible to reduce the θ1A the separation angle in the peel back point PBP as indicated by the one-dot chain line in FIG. 2 But the flow velocity of the jet wave 15 at the peel back point PBP υ
F2 increases slightly with increasing flow rate.

On the other hand, the example of adjustment shown in FIG. 3 is an example in which the ridge member 24 is adjusted to be close to the outlet 11, and also in this example of adjustment, υR11 <υR12, υF11 <υF12, υR12> υF1.
The relationship between 2 is basically the same. Θ10 is an angle formed by the wave guide plate 22 with respect to the horizontal plane.

However, the valley 30 as shown in FIG. 2 is not formed, and the step 31 having the height h2 is formed. And h2>
h1. In this case, the height of the jet waves 14 and 15 above the outlet 11 is H11, which is extremely higher than H1, but the flow rate of the jet waves 14 flowing down to the downflow guide plate 21 increases, so that the flow rate is generally H1. Is the same as Therefore, the separation angle at the peel back point PBP is θ2, and θ2 <θ1. That is, ΔF12 <ΔF2, but θ2 <θ1.

[0063] In this case, when reducing the flow rate of the solder melt 9 ejected from吹口11, so that it is possible to increase the θ2A the separation angle in the peel back point PBP as indicated by the one-dot chain line in FIG. 3 But the flow velocity of the jet wave 15 at the peel back point PBP υ
F12 hardly increases due to flow reduction.

As described above, the forward and backward adjustment of the ridge member 24 with respect to the outlet 11 and the delivery of the solder melt 9 by the pump mechanism are adjusted, whereby the laminar flow ejected from the outlet 11 is adjusted. It is possible to adjust the flow behavior of the solder melt in a solder-like manner, thereby making it possible to adjust the soldering process parameters at the peel back point PBP.

That is, the conveying speed VP of the wiring board 1 and the flow velocity ΔF of the solder melt at the peel back point PBP are appropriately adjusted to be close to each other, and the separation angle θ is set to be large, thereby increasing the fillet wall thickness. Solder short can be eliminated.

The sectional shape of the ridge member 24 is as follows.
A shape such as a semicircle or a circle as in this embodiment is preferable. A rectangular member tends to give an irregular oscillating movement to the laminar flow of the solder melt, which is not always preferable.

FIG. 4 is a view for explaining the third operation example of FIG. 1. In FIG. 4, an example is shown in which the wave guide plate 22 of FIG. 3 is increased to θ20 in FIG. It is.

In this case, a step 31 having a height h3 is formed, and the flow velocity ΔF32 of the jet wave 15 at the peel back point PBP is slightly increased. Also, the separation angle is θ3
And the height of the jet wave at the top of the outlet 11 decreases very slightly,
12, but this drop is negligible,
H12 ≒ H11. That is, an operation mode similar to that in the case where the delivery amount of the solder melt 9 is reduced by the pump mechanism is shown. Note that also in this adjustment example, υR31 <υR32, υR31
The relationship of F31 <υF32, υR32> υF32 is basically the same.

That is, by using the adjustment of the descending angle of the wave guide plate 22 together, the adjustment range of the flow state is further expanded, and the conveying speed VP of the wiring board 1 at the peel back point PBP and the falling speed ΔF32 of the solder melt are reduced. The range of selection of soldering process parameters for achieving both close proximity and a large separation angle θ3 is further expanded.

FIG. 5 is a view for explaining the fourth operation example of FIG. 1. In FIG. 5, the directivity of the solder melt 9 ejected from the outlet 11 is ejected on the loading side of the wiring board 1, that is, in the direction opposite to the board conveying direction A. 9 is an operation example showing a case of a configuration given with. That is,
Loading-side nozzle body 10A of wiring board 1 forming blow port 11
The angle θ40 of the nozzle body 10B on the unloading side of the wiring board 1 with respect to the horizontal plane is set to be larger than the angle θ30 of the horizontal plane.

In this operation example, a large part of the solder melt 9 ejected from the outlet 11 flows in a direction opposite to the substrate transport direction A. For this reason, the height H2 of the laminar flow of the solder melt 9 flowing above the outlet 11 can be made higher than that in the first to third operation examples. On the other hand, the flow rate of the solder melt flowing down to the discharge side of the wiring board 1 of the blow port 11, that is, to the wave guide plate 22 side, decreases, and the flow rate ΔF42 also decreases.

Therefore, the height h4 of the valley portion 30 formed immediately before the ridge member 24 is also reduced, and the separation angle θ4 at the peel back point PBP can be made large.

Therefore, the peel back point PBP
The range of adjustment of the flow velocity ΔF42 of the jet wave 15 and the range of selection of the separation angle θ4 can be further expanded. <Embodiment 2> FIGS. 6 (a), 6 (b) and 7 show a second embodiment of the present invention. FIGS. 6 (a) and 6 (b) are side sectional views of a blower portion. FIG. 7 is a partially cutaway perspective view illustrating the entirety of the outlet.

The difference from the first embodiment is that each section is provided with an adjusting mechanism, and the other sections are not different.

That is, as shown in FIG. 6 (a), the flow-down guide plate 21 on the carry-in side of the wiring board 1 can be adjusted to move forward and backward (vertically move) at the edge of the outlet 11 in the direction in which the solder melt 9 is ejected. In the same manner, the wave guide plate 22 can be moved forward and backward in the direction in which the solder melt 9 is ejected at the edge of the outlet 11, and the nozzle on the discharge side of the wiring board 1, that is, the outlet 11 is formed. The point is that the nozzle 10C can be adjusted forward and backward in a direction in which the width W of the outlet 11 can be adjusted. In order to realize these, each member is locked and fixed by screws 27 through long holes 26 as illustrated in FIG.

In FIG. 6B, the wave guide plate 2
2 and a fulcrum shaft of a hinge 31 are provided at the edge of the outlet 11 so that the wave guide plate 22 can rotate. And FIG.
The angle of the wave guide plate 22 is adjusted by adjusting the rotation of the eccentric cam 32 provided on the side plate 28 with the adjusting screw 33 as illustrated in FIG.

Next, the operation will be described.

[0078] In the second embodiment, is provided with the adjusting mechanism of each unit in addition to the first embodiment, the adjustment range of liquidity appearance state can Ku further expansion.

For example, by setting the heights of the flow-down guide plate 21 and the wave guide plate 22 at the outlet 11 in an unbalanced state, most of the solder melt 9 ejected from the outlet 11 flows to the lower guide plate. become. If the height of the wave guide plate 22 is increased, the flow rate of the solder melt toward the wave guide plate 22 decreases, the flow speed of the melt decreases, and the separation of the peel back point PBP when the wiring board 1 is in contact with the wiring board 1. The angle θ can be increased. Then, the flow velocity and the angle thereof are determined by the ridge member 2.
4 can be adjusted by the forward / backward adjustment. In this state, a flow state similar to the example described in FIG. 5 can be obtained.

Further, if the width W of the blowing port 11 is reduced by advancing the blowing port forming nozzle 10C, the flat portion of the crest 29 is also narrowed, and the contact time between the conveyed wiring board and the solder is shortened. Conversely, if the width W of the outlet 11 is increased, the contact time becomes longer. Therefore, the contact time can be optimally selected according to the transport speed VP of the wiring board 1.
Also in this case, by the action of the ridge member 24, the flow velocity ΔF of the solder melt at the peel back point PBP and the transport velocity VP of the wiring board 1 are appropriately adjusted to be close to each other, and the separation angle θ is also increased. can do. <Embodiment 3> Figs. 8 (a), (b) and Fig. 9 show a third embodiment. Fig. 8 (a) is a plan view of a blow port, and Fig. 8 (b) is Fig. 8.
FIG. 9A is a side cross-sectional view taken along the line II, and FIG. 9 is a perspective view illustrating the entirety of the outlet.

In the third embodiment, the shape of the air outlet 11 in the horizontal plane is formed in the shape of a square. Therefore, there is an advantage that the occupied length of the nozzle 10 in the board transfer direction A of the wiring board 1 is short. That is, even in a conventional apparatus in which the longitudinal direction of the blower 11 is disposed so as to intersect the direction orthogonal to the substrate transport direction A, it is easy to replace the nozzle 10 of the third embodiment.

The basic structure is the same as that of the first and second embodiments, and the flow-down guide plate 21 is provided on the side of the outlet 11 where the wiring board 1 is carried in the direction in which the solder melt 9 is ejected. The wave guide plate 22 is provided so as to be able to move forward and backward (movable up and down), and is provided on the carry-out side so as to be able to move forward and backward in the direction of ejecting the solder melt. Further, the ridge member 24 is provided on the wave guide plate 22.
Is provided substantially parallel to the outlet 11 so as to be adjustable in forward and backward directions.

The wave guide plate 22 is provided on the nozzle body 10A for forming the blow port so as to be able to advance and retreat, and the nozzle body 10A for forming the blow port is provided in the chamber 34. Further, the nozzle body 10A for forming the outlet is provided in the chamber 34 so as to be able to advance and retreat in a direction in which the width W of the outlet 11 in the transport direction can be adjusted.

As shown in the drawings, the mounting mechanism capable of adjusting the forward / backward movement is provided with a screw 27 for locking and a long hole 26.
This is a mechanism that is inserted into and locked / fixed.

Further, the chamber 34 on the loading side of the wiring board 1
Is oriented vertically, and the outlet-forming nozzle body 10A on the discharge side is directed in a direction in which the solder melt 9 is jetted in a direction opposite to the substrate transfer direction A. Then, the wiring board 1 is
It is a configuration to carry in from the convex side of the character. However, there is no problem even if the configuration is such that it is carried in from the opposite direction.

Incidentally, the opening angle θ50 of the air outlet 11 in the shape of “K” was set to 130 °. However, good solderability is obtained even at a small opening angle smaller than this. Practically, it is about 140 to 60 °.

Next, the operation will be described.

In the same manner as in the first and second embodiments, the forward and backward adjustment of the ridge member 24 and the flow rate of the molten solder jetted from the outlet 11 are adjusted, and the peel back point PBP is adjusted.
The flow rate and the separation angle θ of the solder melt in the above are adjusted. Further, if the nozzle body 10A for forming a blow port is adjusted forward and backward, the blow port width W can be adjusted, and the contact time between the wiring board 1 and the jet waves 14 and 15 can be adjusted. Also,
By adjusting the height (advance / retreat adjustment) of the flow-down guide plate 21 and the wave guide plate 22 at the outlet 11, the flow rate of the solder melt flowing from the blow-out port 11 to the flow-down guide plate side 21 and the solder flowing to the wave guide plate 22 side The ratio with the flow rate of the melt can be varied.

That is, these adjustments make it possible to set the process parameter to the desired optimum value for the peel back point PBP.

Further, since the jet flow direction of the solder melt 9 and the substrate transfer direction A are obliquely intersecting, there is an advantage that the separation angle θ at the peel back point PBP can be further increased. [Other Embodiments] In the first to third embodiments, examples have been described in which the wave guide plate 22 and the ridge member 24 are provided at the edge of the outlet 11 on the carry-out side of the wiring board 1. However, a similar wave guide plate 22 is provided on the loading side of the wiring board 1.
Needless to say, it is possible to provide the ridge member 24 for adjusting the flow state.

If such a configuration is adopted, the wiring board 1
The flow state of the solder melt on the loading side can also be adjusted, and the angle and flow velocity at which the wiring board 1 comes into contact with the jet wave 14 can also be adjusted.

Of course, depending on the purpose, a similar wave guide plate 22 and a ridge member 24 for adjusting the flow state may be provided only on the loading side of the wiring board 1. There is an excellent effect for enabling the wiring board 1 to stably enter the jet wave 14. That is, there is an advantage that the solder melt can be prevented from being spread from the end of the wiring board 1 opposite to the contact surface of the solder melt 9 to the upper surface side.

[0093]

As described above, according to the first aspect of the present invention, the wiring board is separated from the jet wave.
Flow rate of solder melt at peel back point and
A ridge member that enables adjustment of the separation angle is provided on the carry-out side
Since it is provided on the wave guide plate so as to be able to advance and retreat with respect to the blow port, a soldering process that achieves both adjustment of the proximity between the wiring board and the solder flow rate at the peel back point and adopting a large separation angle is realized. Accordingly, it is possible to realize a thick fillet shape and a soldering process in which solder short-circuit does not occur. Also, the fluctuation of the jet wave generated by the flow of the solder melt is extremely reduced, and uniform solderability can be obtained.

Further, the wave guide plate on the carry-out side is soldered.
It is provided so that it can be adjusted forward and backward in the direction of ejection.
Easily adjust the front and back balance of the solder melt spouting from it
To complement the adjustment effect of the convex member
Acts to be. Therefore, the flow rate and separation of the solder melt
The range of adjustment of the angle can be wider.
Ri, along with greater control of the fillet shape can it to prevent solder short. In addition, uniform solderability is obtained.

[0095] Further, an invention according to claim 2, the jetting directionality of the solder melt jetted from吹口, within which the opposite direction to the conveying direction of the wiring board, origin carry-in side of the wiring substrate When the coordinates are used, the angle of the nozzle body on the carry-out side of the wiring board with respect to the horizontal plane is made larger than the angle of the nozzle body on the carry-in side of the wiring board forming the blow port, so that the ejection height of the solder melt is increased. And the flow rate of the solder melt flowing to the wiring board unloading side is reduced. This further widens the adjustment range of the flow rate and the separation angle of the solder melt at the peel back point. Therefore, the controllability of the process is further improved, the controllability of the fillet shape is further improved, and occurrence of solder short-circuit can be prevented.

[0096]

[0097]

[0098]

[0099]

As described above, by adjusting the flow state of the solder melt at the peel back point, the process parameters can be optimally adjusted, that is, the thickness of the fillet can be increased and the solder bridge can be eliminated. Can be compatible.

As a result, there is an advantage that a highly reliable wiring board can be manufactured even in a high-density mounting wiring board, and a highly reliable electronic device / equipment can be manufactured.

[Brief description of the drawings]

FIG. 1 is a side sectional view and a plan view showing a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a first operation example of FIG. 1;

FIG. 3 is a diagram illustrating a second operation example of FIG. 1;

FIG. 4 is a diagram illustrating a third operation example of FIG. 1;

FIG. 5 is a diagram illustrating a fourth operation example of FIG. 1;

FIG. 6 is a side sectional view showing a second embodiment of the present invention.

FIG. 7 is a partially cutaway perspective view showing a second embodiment of the present invention.

FIG. 8 is a diagram showing a third embodiment of the present invention.

FIG. 9 is a perspective view showing a third embodiment of the present invention.

FIG. 10 is a perspective view showing a conventional jet-type solder bath of publicly known example 1.

FIG. 11 is a side sectional view showing a conventional solder jet tank of known example 2.

FIG. 12 is a plan view showing a conventional soldering apparatus of publicly known example 3.

FIG. 13 is a plan view showing a conventional soldering apparatus of known example 4.

FIG. 14 is a side cross-sectional view showing a conventional solder bath of Known Example 5.

FIG. 15 is a side sectional view showing the technology of the conventional wave soldering machine of Known Example 6.

FIG. 16 is a diagram illustrating a fillet shape.

FIG. 17 is a diagram illustrating process parameters at a peel back point.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 9 Solder melt 10 Nozzle 11 Blow-off port 12 Descending guide plate 13 Descending guide plate 14 Jet wave 15 Jet wave 21 Flow-down guide plate 22 Wave guide plate 23 Flow state adjusting member 24 Convex member 25 Plate member PBP Peel back point

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/34

Claims (2)

(57) [Claims] We claim: 1. direction intersecting with respect to the transport direction of the wiring board by the pump mechanism from吹口formed such that the longitudinal direction is ejected solder melt to form a jet flow, wherein
The above-mentioned solder melts on the wiring board loading and unloading sides of the outlet.
A flow guide plate and a wave guide plate for guiding the liquid flow are installed.
Only, while the soldering apparatus for performing soldering of the wiring substrate in contact with the jet flow while conveying the wiring board, peel back point of said wiring board and the jet flows are separated
A convex ridge member capable of adjusting the flow speed and the separation angle of the solder melt at the outlet side is provided on the wave guide plate on the carry-out side.
When stomach Ru provided to be forward and backward adjustable relative the吹口
In both cases, the guide plates on the carry-in side and the carry-out side are
A soldering device characterized by being provided so as to be able to advance and retreat in the outgoing direction . 2. Direction of ejection of solder melt ejected from an outlet.
Within the range in which the reverse
When the origin side of the wiring board is set to the origin coordinates,
Angle of the nozzle body on the loading side of the wiring board to be formed with respect to the horizontal plane
With respect to the horizontal surface of the nozzle body on the carry-out side of the wiring board.
The soldering apparatus according to claim 1, wherein the angle is increased .