JP3203825B2 - Patterned substrate and method of making the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for an electronic device or the like.
Hoyo substrate with a pattern requiring precision alignment mark that
And how to make it.

[0002]

2. Description of the Related Art Conventionally, in order to form a pattern on a plane with a size, shape, and position accuracy, a photomask or a photolithography method in which the size, shape, and position accuracy of the photomask are directly printed, There are printing methods using screen, letterpress, intaglio, and lithographic printing plates as original plates, ink jet, bubble jet, and discharge drawing methods that form by moving the position of drawing points with a mechanism to eject fluid, depending on the needs of each. They have been properly used depending on dimensions, shapes, positional accuracy, cost, work efficiency, and the like.

[0003]

SUMMARY OF THE INVENTION Among the above-mentioned methods,
According to the photographic method or the photolithography method, a resolution of about 1 to 10 microns can be obtained, and a distance accuracy of 15
About 5 to 10 microns can be obtained at a distance of about 0 mm. By using these methods, functional patterns with high dimensional accuracy and sufficiently precise alignment marks can be made, but there are many steps such as coating, pre-baking, coating and removal of oxygen barrier film, exposure, development, rinsing, and after-baking. In addition to being time-consuming, the cost tends to be excessive, as it is difficult to use materials effectively. For this reason, it has often been used to meet the requirements of precision particularly required in industrial production.

[0004] In the printing method, material cost, equipment cost,
The production man-hours are small and the cost can be reduced. Also, in terms of the dimensional accuracy of the functional pattern, a fine line of about 15 to 20 microns can be created by the intaglio offset method, and high definition can be limited. However, as in the case of the alignment mark, the distance accuracy between the two marks formed apart from each other is less than 150 due to accumulation of elongation during printing.
It becomes several tens of microns at a distance of about millimeters, and the position of the alignment mark differs depending on the substrate, so it is not possible to align, or even if alignment is possible, the relative position of the functional pattern and the alignment mark is shifted ,
There have been problems such as the inability to align the desired function pattern.

This will be described with reference to FIG. The function pattern C10 is formed on the substrate C by intaglio offset printing.
To form At this time, the alignment mark 11 of the substrate C 9
a, 11b, 11c, and 11d are also formed at four places in the substrate at the same time. In this case, since expansion and contraction occur in the printing direction, points 11a and 11b should originally be points 12a and 12b.
Is formed by being shifted by L. Although not particularly shown in the figure, a similar situation occurs for 11c and 11d.
Since the accuracy of the distance between these two points is several tens of microns, a substrate made by this method does not function as an alignment mark when a plurality of sheets are overlapped.

[0006] In addition, a method of creating only by moving the position of a drawing point having a mechanism for ejecting a fluid has a resolution of 1
5-20 microns, the distance accuracy between two distant points
It is relatively good at 5 to 10 microns. However, since the drawing point moves to form a pattern by `` single stroke '', creating a pattern entirely by this method requires a lot of time to create one board depending on the board dimensions and patterns, The productivity was poor, and it was not used industrially.

Similarly, in the method of forming a pattern by removing a drawing material such as laser cutting and an electron beam, the productivity is inferior due to the same "one-stroke".

As described above, there has been no best method with high reproducibility of dimensions, shapes, and positional accuracy, high productivity, and low cost. With low material costs, equipment costs and processes, and short processing time , it is rich in industrial productivity and has good resolution.
In addition, a method with an excellent position accuracy has been desired.

[0009]

Means for Solving the Problems By offset printing,
The main functional pattern, the first alignment mark, and the solid coated portion including the second alignment mark creation portion are simultaneously formed, and then, starting from the first alignment mark,
A figure is drawn by cutting and removing the solid application portion, and a substrate as a second alignment mark is created. That is, the present invention
Is a function pattern and its
Forming first alignment marks on both sides of the functional pattern
And a second position for performing assembly work
Starting from the first alignment mark, the alignment mark
When forming the second alignment mark
Simultaneously with the formation of the first alignment mark.
Pattern as a method to remove the solid coated part formed on the
This is for making an attached substrate. Also obtained by that method
The first alignment mark and the second alignment mark
It is a substrate with a pattern provided with a pattern.

[0010]

According to this method, formation of the main features patterns for by printing, material costs, equipment costs, the number of production processes is small or the like, also has the productivity industrially advantageous in cost .

The alignment mark is formed by cutting and removing the solid applied portion. However, since the number of formed positions is as small as several per substrate and the shape is small , the working time is short and the time is uneconomical. There is no point .

The resolution is about 15 to 20 microns.
Further, the distance accuracy between two distant points is about 5 to 15 microns, and a pattern having a relatively high shape, size and position accuracy can be obtained.

[0014]

An embodiment of the present invention will be described with reference to FIG. 1 and the progress of the process (FIG. 2).

A thickness of 1.1 mm (hereinafter simply referred to as
Abbreviated as offset) on a substrate I made of glass with a length of 300 mm x 300 mm .
A first alignment mark of two points 5a and 5b is formed at a point which has a necessary creation function pattern A3 within a range of 50 mm inside each end face and which is 10 mm away from the outside of one side thereof. Also, a solid coated portion 6 having a diameter of about 5 mm centered on a point about 70 mm in the vertical direction (y direction) from 5a.
A, and a solid application portion 6B having a diameter of about 5 mm centered on a point about 70 mm in the vertical direction (y direction) from 5b,
Furthermore, a solid coated portion 6C having a diameter of about 5 mm centered on a point about 90 mm apart in the vertical direction (y direction) from the origin of 5a.
And a solid application portion 6 having a diameter of about 5 mm centered on a point about 90 mm apart in the vertical direction (y direction) from 5b as the origin.
Form D.

(FIG. 2) As shown in FIG.
After the position is detected by a CD or the like and set as an origin and precise position setting is performed by XY control, a second alignment mark 6a is placed at a point 70 mm in the vertical direction (y direction) from 5a on the 6A surface,
Also, at a point 70 mm away from the origin of 5b on the 6B surface, 6
b is formed using a laser cutting method.

Next, on the 6C plane, a second alignment mark 6c is set at a point 90 mm away from the origin in 5a in the vertical direction (y direction), and on the 6D plane, 6d is set at a point 90 mm away from the origin 5b in the 6D plane. Is similarly formed by the laser cutting method.

As described above, the substrate A having the first alignment marks 5a and 5b and the second alignment marks 6a, 6b, 6c and 6d shown in FIG. 1 is formed.

The substrate B used in combination with the substrate A is shown in FIG. 1.1 mm thick and 250 mm long and short
Li x250 by offset printing on a substrate b 2 to the millimeter glass and materials needed to create functional patterns B4 and 7a, the first alignment marks 7b, solid coating portion 8
A to 8D are formed. Next , the second alignment mark 8a is formed at a point 70 mm apart in the vertical direction (y direction) with the position of 7a as the origin, and 8b is formed at a point 70 mm away from 7b with the origin as the origin. A second alignment mark 8c is provided at a point 90 mm apart in the vertical direction (y direction) as the origin.
And 8d at a point 90 mm away from 7b as the origin,
It is formed by the same method as that for the substrate A.

FIG. 4 shows the state of combination of the substrate eros obtained by these production methods. The alignment marks 8a-8b and 6a-6b shown as an example have a high distance accuracy as described later, so that the alignment work is easily performed.

Table 1 shows the measured values of the distance between the second alignment marks on the substrate A prepared by the method according to the present embodiment.

[0022]

[Table 1]

Table 2 shows the measured values of the distance between the second alignment marks of the substrate B, which was prepared in the same manner as the substrate A and used in combination with the substrate A.

[0024]

[Table 2]

As described above, in the substrates A and B, 16
The distance accuracy between two alignment marks 0 mm apart is on the order of 5 to 15 microns. As described above, since the origin of the second alignment mark is the first alignment pattern formed at the time of forming the creation function pattern, the relative position between the second alignment mark and the creation function pattern is accurate. This does not hinder the work of assembling the substrates.

The method according to the present embodiment has the advantage of high accuracy in position and distance, and has no complicated steps such as coating, pre-baking, coating and removal of an oxygen barrier film, exposure, development, rinsing, and after-baking. Less processing time,
It is also advantageous in terms of cost, such as effective utilization of materials.

The main process is a printing method, and in terms of cost, material costs, equipment costs, production man-hours, etc. are small and inexpensive.
Is possible. Also, in terms of the dimensional accuracy of the functional pattern, a fine line of about 15 to 20 microns can be created by the intaglio offset method, and high definition can be realized.

The formation of the alignment mark uses a laser cutting method of a solid coating portion, which is a "one-stroke writing" with high positional accuracy but requires a long time to make. However, since only a few small shapes are created, the working time is not increased.

It has been confirmed that, as a method of forming a figure by cutting and removing a solid applied portion, an electron beam, a light beam, and the like can be used in addition to laser cutting.

As described above, according to the present method, the best precision pattern substrate with high reproducibility of dimensions, shapes and positional accuracy, high productivity and low cost can be obtained.

Further, there are many advantages such as low industrial costs such as low material costs, equipment costs and steps, and short processing time, good resolution, and excellent positional accuracy.

On the other hand, a measured value of the distance between the alignment marks on the substrate C when the conventional example shown in FIG. 5 where both the alignment marks and the forming function pattern are formed by the printing method is used. Is shown in (Table 3).

[0033]

[Table 3]

The distance accuracy between the alignment marks is 16
At a distance of 0 mm, the distance becomes about 50 to 90 microns, the relative position between the alignment mark and the created function pattern is also inaccurate, and the work of assembling the substrates is hindered.

[0035]

According to the present invention, since a desired functional pattern is formed by printing, high productivity and low cost are obtained. In addition, it is possible to provide a low-cost substrate having high reproducibility of dimensions, shapes, positional accuracy, and the like, excellent productivity, and low cost.

[Brief description of the drawings]

FIG. 1 is a plan view of a substrate with a pattern according to an embodiment of the present invention.

FIG. 2 is a plan view showing the process progress of an embodiment of the present invention.

FIG. 3 is a plan view of a substrate B combined with a substrate A according to an embodiment of the present invention.

FIG. 4 is a side view showing a combination state of the substrate A and the substrate B according to the embodiment of the present invention.

FIG. 5 is a plan view showing a conventional example of a substrate with a pattern formed entirely by a printing method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate B 2 Substrate B 3 Creation function pattern A 4 Creation function pattern B 5a, 5b First alignment mark 6a-6d of substrate A Second alignment mark 6A-6D of substrate A Solid coated portion 7a of substrate A , 7b First alignment mark of substrate B 8a to 8d Second alignment mark of substrate B 8A to 8D Solid coated part of substrate B 9 Substrate c 10 Creation function pattern C 11a to 11d Substrate C alignment mark 12a , 12b Original alignment marks 11a, 11b
What should be

Claims (2)

(57) [Claims] [Claim 1] In offset printing on a substrate feature pattern and on both sides of the functional patterns first to form the alignment mark assembly operation the purpose and the second alignment mark the first to be carried out When forming the alignment mark on both sides with the alignment mark as a starting point , the second position
Forming the alignment mark in the form of the first alignment mark;
It is a method to remove the solid coated part formed at the time of formation
How to make a patterned substrate. 2. A first obtained by the method of claim 1, wherein
Bei alignment mark and second alignment mark
Substrate with an example was the pattern.