JP3207787B2 - Wafer processing method, surface grinder and work support member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method for ultra-precise and parallel fine grinding of both surfaces of a hard thin wafer used for a semiconductor, a surface grinding machine and a work supporting member used in the processing method. It is about.

[0002]

A wafer cut from an ingot is rough in both surface roughness and shape accuracy. Therefore, when lapping is performed on a wafer that has been cut from an ingot, it takes a very long time and processing efficiency is not good. Also, in single-side grinding of a wafer, the shape of the wafer after one-side grinding from the ingot is flat during suction because the vacuum chuck chucks one side of the work, but the shape returns to its original shape when the work is removed from the vacuum chuck. There is a tendency.

According to the processing of a wafer by grinding which is attempted to improve the processing efficiency and the processing accuracy by the above-described lapping, a required surface accuracy can be obtained in a short processing time. However, as long as the chucking of the wafer is performed by a vacuum chuck, the shape accuracy cannot be obtained.

The present invention is a further development of the prior art described below, and provides a wafer processing method capable of obtaining surface accuracy and shape accuracy in a short time, and a surface grinding machine and a work supporting member used in the processing method. The purpose is to do.

[0005]

According to a first aspect of the present invention, there is provided a method of processing a wafer after cutting from an ingot.
A forward position where the wafer is loosely fitted and protruded from the inner periphery toward the inside to engage with the notch of the wafer, and a retracted position from this advanced position.
A workpiece drive section to take a retracted position, the workpiece drive
A double-sided surface grinder that has a set hole where the part protrudes, a thin plate thinner than the wafer and a larger diameter than the grindstone, and a pair of grindstones that grind the wafer on the grindstone end face with the grindstone end faces facing each other. With the work drive unit retracted.
After inserting the c in the set hole, move the work drive
In a state in which the wafer is advanced toward the center, the notch of the wafer is engaged with the work driving unit, and the wafer is loosely fitted in the set hole, the wafer is rotated by driving the rotating plate, and the grindstone is rotated to rotate the wafer. This is a method for processing a wafer, characterized in that grinding is performed by acting on both surfaces.

A second invention according to the present application is characterized in that the grindstone is a cup grindstone and the grinding is performed so that the grinding action surface of the cup grindstone overlaps the center of the wafer. It is a processing method.

According to a third aspect of the present invention, a pair of cup grindstones are disposed with both grindstone end faces opposed to each other, and the plate face of a disc-shaped work having a notch on the outer periphery at the grindstone end faces is machined. In a double-sided surface grinding machine, the work is loosely fitted, and
A forward position to protrude and engage the notch of the work ;
A rotating plate having a larger size than the grinding wheel diameter to allow proximity thin grindstone end face than the workpiece with a setting hole to have a workpiece drive section to take retracted position retracted from the advanced position, the workpiece drive section Driving means for moving back and forth,
A support member for rotatably supporting the rotary plate, said support
Driving means provided on a member for driving the rotary plate to rotate ,
It was equipped with a two-sided surface grinding machine according to claim.

[0008] A fourth invention according to the present application is a pair of cup grinders.
Stones are arranged with both grinding wheel end faces facing each other.
Double-ended plane for processing the plate surface of a disk-shaped workpiece with a notch
In the grinding machine, loosely fit the work and move it from the inner
Work drive unit protruding and engaging with the notch of the work
Grindstone end face thinner than the work with a set hole having
Has a size larger than the grinding wheel diameter so that it can be approached
The rotating plate and the work driving unit have a radius with respect to the rotating plate.
Movably in the direction of
A spring member for urging toward the center of the rotating plate;
A) to retract the drive unit against the spring force of the spring member.
A support for rotatably supporting the rotary plate with the actuator
A member and a rotary plate provided on the support member are driven to rotate.
Double-sided plane laboratory, comprising:
It is a cutting machine .

A fifth invention according to the present application is directed to a rotating plate
The work drive has at least a surface in contact with the work
A third or fourth invention characterized by being made of a soft material
2. A double-sided surface grinder described in 1. above .

A sixth invention according to the present application is directed to a support for the rotating plate.
The holding member moves to a guide member provided at right angles to the grinding wheel axis.
It is a slide table that freely engages
A double-sided surface grinder according to a fifth aspect of the present invention .

[0011] A seventh invention according to the present application is a grinding wheel end face having an outer periphery.
Grinding on a Flat Surface of a Disk-shaped Work with a Notch
Work is loosely fitted to the work support member used for the board.
And project from the inner circumference toward the inside to engage the notch of the workpiece.
It has a set hole with a work drive
The rotating plate, which is thinner and has a larger diameter than the grindstone,
The moving part is mounted movably in the radial direction with respect to the rotating plate
And moving the work drive unit toward the center of the rotating plate.
A spring member for urging the work drive unit,
An actuator for retracting against the spring force of
A supporting means for rotatably supporting the rolling plate; and
And a driving means for driving the rotating plate to rotate.
And a work supporting member .

According to an eighth aspect of the present invention, a work drive unit comprises:
A material that is at least in contact with the workpiece and is softer than the workpiece
The work support according to the seventh aspect, comprising:
It is a member .

According to a ninth aspect of the present invention, there is provided a rotary plate comprising:
That the side in contact with the workpiece is made of a softer material than the workpiece
A work support member according to the seventh or eighth aspect of the invention .

According to a tenth aspect of the present invention, there is provided the above-mentioned supporting means.
Is movably fitted to the guide means parallel to the plate surface of the rotating plate.
Any one of the seventh to ninth aspects of the invention.
A work supporting member according to (1).

According to an eleventh aspect of the present invention, the rotating plate is
The outer peripheral side of the part thinner than the center work is the work
Characterized by being thicker and annular than thinner parts
A work support according to any one of the seventh to tenth aspects.
It is a member.

[0016]

2. Description of the Related Art Wafers such as silicon wafers are obtained by cutting an ingot with an inner saw or a wire saw and then finishing the polishing with a lapping machine.

On the other hand, finishing a wafer by grinding is disclosed, for example, in Japanese Utility Model Publication No. 3028734, Machine and Tool, 1995.
July to July, pages 60 to 64, Journal of the Japan Society of Abrasive Technology Vo
l. 39 No. 4 1995. JUL. It is disclosed on pages 20 to 23 and the like.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to FIGS.

(Embodiment 1) This embodiment has explained the overall configuration.

As shown in FIGS. 1 to 4, the double-sided surface grinding machine of this embodiment has a lower frame 11, on which an upper frame 111 is fixed. The lower frame 11 is provided with a lower grindstone rotating / elevating mechanism 12 and a work supporting member 14, and the upper frame 111
Is provided with an upper whetstone rotating / elevating mechanism 13. The upper and lower rotating whetstones 1 are respectively mounted on both whetstone rotating elevating mechanisms 12 and 13.
5 and 16 are arranged, and the grinding action surfaces 15a and 16a of the upper or lower end faces of the rotary grindstones 15 and 16 are arranged to face each other so as to be parallel to each other. Then, while the thin plate-shaped work 17 is supported by the work support member 14, the rotating grindstones 15, 1 of the two grindstone rotating elevating mechanisms 12, 13 are rotated.
The two surfaces of the workpiece 17 are simultaneously ground by the grinding action surfaces 15a, 16a of the rotary grindstones 15, 16, which are inserted and disposed between the six.

As shown in FIGS. 2 and 3, the grinding wheel base 20 of the lower grinding wheel rotating and lifting mechanism 12 is mounted on the lower frame 11 via a so-called V-flat guide 21 through a lower rotating grinding wheel 15.
Are supported so as to be movable in a direction perpendicular to the rotation axis of the rotator. The lower wheel head moving motor 22 is disposed on the side of the lower frame 11, and the rotation of the motor 22 causes the wheel head 20 to move horizontally through a ball screw 23 screwed into a ball nut 23 a fixed to the wheel head 20. Move laterally. The lower shaft support 24 is supported so as to be able to move up and down in the rotation axis direction of the lower rotary grindstone 15 via a vertical guide 24 a provided integrally with the grindstone table 20. The lower grindstone head elevating motor 25 is provided with a guide portion 24 at a lower portion of the grindstone head 20.
a rotation transmitting mechanism 2, which is provided on the side of
The lower shaft support 24 is moved up and down by being guided by the guide portion 24a via a ball screw 27 screwed into a ball nut (not shown) fixed to the bracket 6 and the bracket 24b fixed to the lower shaft support 24. This elevating stroke is slight.

The lower grindstone shaft 28 is rotatably supported in the lower shaft support 24, and the lower rotating grindstone 15 is mounted via a grindstone holder 29 integrally formed on the upper end thereof.

A grinding wheel drive motor 34 is disposed inside the lower shaft support 24, and its stator is fitted and fixed to the lower shaft support 24, and its rotor is fitted to and fixed to the lower grind shaft 28, and is used for grinding. The rotation of the motor 34 causes the lower rotating grindstone 15 to rotate at a high speed via the lower grinding wheel shaft 28.

As shown in FIG. 3, the upper shaft support 38 of the upper grindstone rotating / elevating mechanism 13 is supported via a guide 39 integrated with the upper frame 111 so as to be able to move up and down in the rotational axis direction of the lower grindstone 16. ing. The elevating motor 40 is disposed on the side of the upper frame 111, and the rotation of the motor 40 causes the bracket 3 fixed to the upper shaft support 38.
The upper shaft support cylinder 38 is moved up and down via a ball screw 41 screwed into a ball nut 41a fitted and fixed to 8a.

The upper grinding wheel shaft 42 is rotatably supported in the upper shaft support cylinder 38, and the upper rotating wheel 16 is mounted on the lower end thereof via a grinding wheel holder 43 formed integrally. A grindstone drive motor 48 is disposed inside the upper shaft support 38, and its stator is fitted and fixed to the upper shaft support 38, and its rotor is fitted and fixed to the upper grindstone shaft 42 and rotates the motor 48 during grinding. Thereby, the upper rotating grindstone 16 rotates at a high speed via the upper grindstone shaft 42.

As shown in FIGS. 2 and 4, the support table 52 of the work supporting member 14 has upper and lower grinding wheels
It is disposed on the lower frame 11 between 2 and 13. The slide table 53 is supported by a pair of guide rails 54 disposed on both sides of the lower rotary grindstone 15 on the support table 52 so as to be movable in the same direction as the moving direction of the grindstone table 20 of the lower grindstone rotary elevating mechanism 12. Have been. As shown in FIG. 4, the slide table moving motor 55 is
The ball screw 56 connected to the motor shaft of the motor 55 is screwed into a ball nut 56a fixed to the slide table 53 by the rotation of the motor 55, so that the slide table 53 can be moved. ing.

An annular rotary plate 57 is disposed in the slide table 53, and is rotatably supported via three guide rollers 58 rotatably supported by the slide table 53 (see FIG. 5). . The rotating plate 57 has a work supporting plate 60 mounted on an annular thick outer peripheral frame 57a.
A gear 59 is formed on a lower outer periphery of the outer peripheral frame 57a. The work support plate 60 is formed thinner than the work 17,
The lower surface of the outer peripheral frame 57a is horizontally stretched via a tension mechanism (not shown) so as not to be bent and deformed by the gravity, and a set hole 60a for setting the work 17 in a detachable manner is formed at the center thereof. I have. This set hole 6
0a has a diameter at which the work 17 is loosely fitted. A rotating plate rotating motor 61 is provided on a slide table 53, and a gear 62 that meshes with a gear 59 of a rotating plate 57 is fixed to a motor shaft of the motor 61. Then, by the rotation of the motor 61, the rotating plate 57 is
Rotates. The inner diameter of the outer peripheral frame 57 a has a diameter such that the upper rotary grindstone 16 descending offset with respect to the rotary plate 57 can approach the work supporting plate 60.

As shown in FIG. 4, the set hole 60a of the work supporting plate 60 has an inner periphery which is engaged with a notch 17a serving as a reference for the crystal orientation of the work 17 which is an unground wafer cut from the ingot. A work drive unit 60b protruding toward the side is provided. Notch 1 of this work 17
The shape of 7a is a V-groove shape as in the present embodiment, and the driving portion 60b is shaped to substantially complement the notch 17a of the work. However, notch 1 of work 17
7a may be separately provided on the work 17 in order to drive the work 17 at a position other than the position for knowing the crystal orientation.

Although the work set hole 60a is a circle in this example, the work set hole 60a is not limited to a circle and may have any shape so that the position of the work 17 can be determined. 17 may be in contact with the outer periphery.

Next, the operation of the double-sided surface grinder configured as described above will be described.

In this double-sided surface grinding machine, when performing a grinding process, the work 17 is supported by the work supporting member 14.
The upper and lower rotary grindstones 15 and 16 are inserted and disposed between the upper and lower rotary grindstones 15 and 16 while the upper and lower grindstone rotary elevating mechanisms 12 and 13 are loosely fitted to the work support plate 60. In this state, the upper and lower rotary grindstones 15, 16 are rotated at a high speed while the upper and lower grindstone rotary elevating mechanisms 12, 13 are rotated at a high speed, the rotary plate rotating motor 61 is driven to rotate at a low speed, and the work supporting plate 60 serves as a rotary drive means. Gear 6
The work 17 held by the set holes 60a is rotated through the rotation of the workpieces 2 and 59. Then, the upper rotary grindstone 16 of the upper grindstone rotary elevating mechanism 13 descends and approaches the work 17, and the grinding action surfaces 15 a,
Both surfaces of the work 17 are simultaneously ground by 16a.

FIG. 7 is a front view showing the grinding surface of the grinding tool, and FIG. 8 is a longitudinal sectional view including the center of FIG. In the present embodiment, the same members are used for the rotating grindstones (grinding tools) 15 and 16 described above. Here, the whole of the grinding tool is represented by reference numeral 1.

The grinding tool 1 is provided with a diamond grindstone 3 as a rotary grindstone and work contact members 4 and 5 as work supports on the end face of a base plate 2 made of an iron disc. These are all arranged in an annular shape with a width.
That is, a work contact member 4 having a diameter larger than the diameter of the diamond grindstone 3 is provided near the outer periphery of the base plate 2 and a work contact member 5 smaller than the diameter of the diamond grindstone 3 is provided near the center of the base plate 2. Note that only one of the work contact members 4 and 5 may be provided.

The diamond grindstone 3 is obtained by hardening diamond abrasive grains with a binder and fixing it to the base plate 2. The work contact members 4 and 5 are suitably made of a material which is worn by the work 17 and has lubricity, for example, an oil-impregnated ceramic.

The grinding surface 3a of the diamond grinding wheel 3 and the contact surfaces 4a and 5a of the workpiece contact members 4 and 5 with the workpiece are on the same plane perpendicular to the grinding wheel axis. The rear surface of the base plate 2 is fitted to the convex fitting portion 6a of the grindstone holder 6 (used in place of the reference numerals 29 and 43) with a cylindrical concave fitting portion 2a on the back surface of the base plate 2. The bolt 7 is inserted into the bolt hole of the base plate 2 with the front surface of the grinding wheel holder 6 and the front surface of the grinding wheel holder 6 in close contact with each other.

The operation of the above configuration will be described. Slide table 5 with upper rotating wheel 16 raised
3, the center OW of the work set hole 60a is offset from the center OG of the grinding tool 1 by e. This offset e is the average radius of the diamond grindstone 3. The work center OW must always overlap the diamond grindstone 3. Here, the lower rotating grindstone 15 is raised to approach the lower surface of the work support plate 60, and the work 17 is engaged with the work driving portion 60b projecting the notch 17a of the work 17 into the work setting hole 60a, thereby bringing the work 17 into work. It is fitted into the set hole 60a and placed on the lower rotary grindstone 15.
As a result, the upper and lower surfaces of the work 17 project upward and downward, respectively, from the upper and lower surfaces of the work support plate 60. Here the upper rotating whetstone 1
6 descends and approaches the work 17.

Here, when the grindstone driving motors 34 and 48 and the work plate rotating motor 61 are energized, the upper and lower rotating grindstones 15 and 16 and the work 17 are rotated, respectively. Here, when the upper rotating grindstone 16 is lowered and cut into the work 17,
The diamond grindstone 3 grinds both surfaces of the work 17 respectively. Except where the grinding surface 3a of the diamond grindstone 3 is acting (the arc band passing through the center of the work 17), the work 17 is near the outer periphery of the work 17 by the work contact members 4 and 5 on both sides. More support. The work contact members 4 and 5 are made of a material that does not wear the work 17 but is worn by the work 17 or a material that wears the work 17 but wears faster than the diamond grindstone 3. The workpiece contact members 4 and 5 are made of, for example, alumina abrasive grains or silicon carbide abrasive grains bonded with a soft binder.

When the work 17 is finished, the upper rotary grindstone 16 is lifted, and the portion 17b (see FIG. 7) of the work 17 protruding from the lower rotary grindstone 15 to the outer peripheral side is lifted, and the work 17 is removed from the set hole 60a. The work 17 is taken out.

In the above description, the work 17 has a wafer diameter of 200 mm and a work rotation speed of 10 r. p. m, the outer diameter of the diamond grindstone 3 is 160 m, the inner diameter is 130 mm, and the upper and lower rotating grindstones 15 and 16 are rotated in the same direction at the same speed. p. m, the TTV was 0.3 μm, and the grinding time was 2 minutes.

(Embodiment 2) FIGS. 9 and 10 show an example of a grinding tool 1 using a diamond impregnated grindstone. On the surface of the base plate 2, a diamond impregnated grindstone 8 is provided by providing a plurality of concentric circles alternately in radial directions in the same direction with respect to a radial circle. Grinding is performed in a range where the workpiece 17 is entirely covered by the grinding tool 1 from a position where the outer periphery of the workpiece 1 passes.

(Embodiment 3) If the main purpose is to grind one side of the work 17, the above-mentioned double-headed grinding machine is used to rotate the lower rotating grindstone 15 or not.
The processing may be performed by rotating the grinding wheel loosely, or the lower rotating grindstone 15 may be changed to a member that loosens the work on the workpiece 17.

According to the embodiment of the present invention, as described above, a wafer supporting plate, which is thinner than a wafer having a work set hole in which a driving portion is projected to a notch provided to indicate the crystal orientation of the wafer, is rotated and driven. Since the grindstone is simultaneously applied to the upper and lower surfaces of the wafer for grinding, there is an effect that the wafer is reliably fed in rotation, the grinding action is applied to the entire surface of the wafer and both surfaces are simultaneously ground. And because of the grinding, good surface roughness can be secured in a short time, and when the wafer is sucked by the vacuum chuck, the wafer is pulled into the suction surface of the vacuum chuck, and is flattened. When processing is removed from the vacuum chuck, the shape is restored by the elasticity and the shape accuracy is deteriorated. However, according to this embodiment, since the work is not flattened to support the work, the shape accuracy is good.

In the grinding tool used in the embodiment of the present invention, a diamond grindstone is arranged in an annular shape on the end face of the base plate, and a workpiece contact portion is provided in an annular shape on the inner and outer circumferences. Since only a part of the wafer is pressed by the grinding action surface of the grindstone, the problem of how to support the wafer can be solved without providing work supporting means to the apparatus main body.

According to this grinding tool, the thin plate is not circular in shape, and is also effective in processing a thin plate having a shape in which the portion other than the portion where the grinding action surface of the grindstone is in contact is not supported, for example, a square plate, a polygon, or an irregular shape. .

Although the vertical double-sided surface grinding machine has been described as the grinding machine of the embodiment, a horizontal double-sided surface grinding machine may be used.

(Embodiment 4) FIG. 11 is a plan view showing another embodiment 4 of a work supporting member, and FIG. 12 is a longitudinal sectional view of FIG.

The fourth embodiment differs from the previous embodiments in the structure of the work support plate 60 attached to the rotary plate 57, but is otherwise the same.

The outer peripheral frame 57 of the rotating plate indicated by the reference numeral 57
A work support plate 60 is fixed to a. The work support plate 60 is formed by integrally forming a hollow work holding plate 60d (work holding member) on the inner periphery of a hollow disk-shaped metal plate 60c.

When the work holding plate 60d and the metal plate 60c are combined, they are the same as the work support plate 60 of the above-described embodiment. The work holding plate 60d is integrally molded, welded or bonded to the metal plate 60c. The thickness of the metal plate 60c and the work holding plate 60d is always smaller than the thickness of the work 17 or the wafer. The metal plate 60c and the work holding plate 60d have the same thickness or different thicknesses. The work holding plate 60d is made of a material softer than the work 17 such as a synthetic resin or a hard rubber copper alloy or an aluminum alloy.

In the fourth embodiment, the work drive unit 60b is provided with a set hole 6 which is an inner periphery of the work holding plate 60d.
0a protrudes inside the work holding plate 60d.
That is, the work drive unit 60b is formed so as to protrude from the metal plate 60c so as to cross the work holding plate 60d in the radial direction.

According to the fourth embodiment, since the work 17 is held and rotated by the work holding plate 60d made of a material softer than the work 17, the outer peripheral portion of the work 17 is affected by a change in grinding resistance. This has the effect of preventing chattering from occurring with the inner periphery of 60d and, as a result, damage such as chipping to the outer periphery of the work 17 from occurring.

When the width in the radial direction of the work holding plate is reduced as described above, it is the same as the case where the inner periphery of the metal plate 60c is plated with metal. Further, a synthetic resin material may be welded to the inner periphery of the metal plate. That is, the inner periphery of the metal plate 60c is also included in this embodiment.

(Fifth Embodiment) In the fifth embodiment, there is a possibility that the notch 17a of the work 17 may be chipped when the rotary plate 57 is rotated in a state where the work driving unit 60b is fitted to the notch 17a of the wafer or the like. This is to prevent it.

As shown in FIGS. 13 and 14, the work drive unit 60b is a main body 60 of a work support plate 60 made of metal.
a notch 6 cut into a square in the radial direction from the inner circumference of e
0f, the root portion 60b of the work drive portion 60b
1 is integrally formed or bonded so as to be fixed to the main body 60e. Alternatively, the main body 60e and the work driving unit 60
b is welded. The work drive unit 60b is made of synthetic resin,
A material softer than the work 17 such as an aluminum alloy or a copper alloy, for example, a wafer, is selected.

In the above description, the thickness of the work driving portion 60b and the thickness of the work supporting plate body 60e, which is a metal plate, are smaller than the thickness of the work 17.

According to the fifth embodiment, it is possible to prevent the wafer notch from being damaged by chipping or the like due to a change in grinding resistance or the like.

(Sixth Embodiment) FIGS. 15 and 16 show a sixth embodiment. In the sixth embodiment, the work supporting plate 60 integrally has an outer circumferential disk 60g of a metal plate and an inner circumferential work support plate 60h of synthetic resin, and the outer circumferential disk 60g and the inner circumferential work 60g. The support plate 60h is integrally molded, welded, or bonded. In the sixth embodiment, a work drive unit 60b is integrally provided on the inner periphery of the work support plate 60h.

The outer peripheral side disk 60g is made of, for example, an iron material, and the work supporting plate 60h is made of a non-ferrous metal, for example, a copper alloy.
The work 17 such as an aluminum alloy or a synthetic resin is made of a material softer than a wafer, for example.

According to the sixth embodiment, the outer peripheral side disk 60
Since g is fixed to the outer peripheral frame 57a, the rigidity is maintained, and the work support plate 60h and the work drive unit 60b formed here are softer than the work 17, so that the work 17 is chipped due to a change in grinding resistance or the like. Can be prevented from occurring.

In the sixth embodiment, the work supporting plate 60h is provided so as to extend to both sides of the edge of the plate surface of the outer peripheral disk 60g in the above-described manner, and the thickness of the work supporting plate 60h is set to the outer peripheral disk. It is thicker than 60 g. Therefore, the work supporting plate 60h is bonded to the outer peripheral side disk 60g by bonding, heat welding, or the like.
When fixing to the work support plate 60h, a circumferential groove is provided on the outer periphery of the work support plate 60h, and the groove is fitted into the inner periphery of the outer peripheral disk 60g.

However, when the thickness of the work supporting plate 60h is small, it is difficult to form a groove for fitting with the outer peripheral side disk 60g, and when it is difficult to bond or weld with each other on the thickness side, As shown in FIGS. 17 and 18, one side edge of the work support plate 60h may be superimposed on the outer peripheral disk 60g, and the contacted surfaces may be bonded or welded to be integrated.

(Embodiment 7) In each of the above-described embodiments, the work drive unit is integral with or fixed to the work support plate and is immovable.

In the seventh embodiment, the work drive unit is elastically held with respect to the work support plate. 19 to 2
2 shows the seventh embodiment.

FIG. 19 is a plan view of the work supporting member as viewed from above. On the upper surface of the work supporting plate 60 of the rotating plate 57, a work driving unit 60b is provided in a radial direction toward the center of the rotating plate 57.
Is provided.

The work drive section 60b has a projecting end 60b2 that fits into the notch 17a of the work 17, and the projecting end 60b
A cylindrical stud 63 provided on the lower surface of the bracket 66 at the middle of the body 60b3 extending rearward from the position retracted from
And is attached to the outer peripheral frame 57a. The stud 63 has a neck lower than the height of the bracket 66 by δ / 2. The stud 63 has a nut 64
Is screwed. Therefore, the work drive unit 60b can move slightly. Also, the upper surface of the torso 60b3 and the bracket 66
There is a gap of δ / 2 between them.

That is, δ is 0.1 mm or less. That is, the work driving member 60b4 having the protruding end 60b2 and the trunk portion 60b3 hardly moves up and down. The body 60b3 is rectangular, and the cushioning material 65 is provided so as to sandwich both sides thereof. The mounting bracket 66 to which the cushioning material 65 is adhered and welded is fixed to the upper surface of the work support plate 60 with a bolt (not shown). Therefore, the work drive member 60b constituting the work drive unit 60b
Numeral 4 is braked by the cushioning material 65 and is slightly movable in a horizontal plane so as to reduce the impact applied to the tip 60b2. The thickness of the work driving member 60b4 on the side of the protruding end 60b2 is smaller than the thickness of the work 17, and the width thereof is the same as the width of the radial slit 6 provided on the work support plate 60.
0i.

When the rotating plate 57 rotates, the work driving unit 6
The protrusion 60b2 of 0b engages with the notch 17a of the work 17 to rotate the work 17. When the grinding load fluctuates, the rotational force for driving the work 17 fluctuates and is applied to the protruding end 60b2 of the work drive unit 60b, but the notch 17a of the work 17 and the work drive unit are provided by the cushioning material 65 on both sides of the body 60b3. The shock generated between the protruding ends 60b2 of the 60b is reduced. As a result, even when the work 17 is, for example, a wafer, the notch 17a of the work 17 is damaged,
No chipping occurs on the outer periphery of the work 17.

(Eighth Embodiment) FIGS. 23 to 27 show an eighth embodiment.

As shown in FIGS. 23 and 27, a work drive unit 60b is disposed immediately inside the outer peripheral frame 57a of the rotary plate 57. The rotating plate 57 and the work drive member 60b4 are on the same plane, and the protruding end 60b2 of the work drive member 60b4 can be engaged with the notch 17a of the work 17. The work drive unit 60b connects the work drive member 60b4 to the work 17
The actuator 6 moves so as to take a position (see FIG. 25B) that protrudes in the radial direction and engages with the notch 17a and a position that retreats from the notch 17a (see FIG. 25A).
7 is attached. The actuator 67 is fixed to a manifold 68 fixed to the lower surface of the outer peripheral frame 57a. The rotating plate rotating motor 61 is a servomotor, and is energized by a control device (not shown) to rotate the rotating plate 57.
Is rotated, and the rotating plate 57 is stopped at a fixed position.

At the fixed position stop position of the rotary plate 57, the rotary plate 57 advances and retreats toward the entrance 68a of the manifold 68, and a position where the distal end portion 69a fits into the entrance 68a and a position where the distal end portion 69a retreats from the entrance 68a. A fluid pressure cylinder 71 having a plunger 69 is fixed to the slide table 53. Compressed air is supplied to and discharged from the fluid pressure cylinder 71 from a pressure fluid source, for example, an air compressor 72 via a switching valve 73.

FIG. 26 shows the actuator 67. The actuator 67 includes a cylinder body 67a having a cylindrical cylinder chamber, a plunger 67b which can be fitted and retracted in the cylinder body 67a, a compression coil spring 74 contracted in a rear cylinder chamber 67r of the cylinder body 67a, and a plunger. The tip is fitted into an axial groove 67b1 of the plunger 67b provided around the periphery of the cylinder 67b, and has a small screw 75 screwed into the cylinder body 67a, so that the plunger 67b does not rotate with respect to the cylinder body 67a. ing. The work drive member 60b4 is fitted in a slot 67b2 provided in the horizontal direction at the tip of the plunger 67b, and the work drive member 60b4 is pressed by a small screw 76 screwed into the plunger 67b. A port 67c communicating with the front cylinder chamber 67f of the actuator 67 communicates with a compressed air passage 68b of the manifold 68.

As shown in FIG. 27, the inlet 68a of the compressed air passage 68b of the manifold 68 has a conical shape. The distal end portion 69a of the plunger 69 that closely fits into the cylinder body 71a of the fluid pressure cylinder 71 is connected to the manifold 68 described above.
Has a conical shape corresponding to the entrance 68a. At the center of the plunger 69, a passage 69c for compressed air is provided which penetrates in the reciprocating direction of the plunger 69. This passage 69c
Have a small hole or orifice (not shown) to ensure the advance of the plunger 69b. Thus, the rear cylinder chamber 71r of the cylinder main body 71a of the fluid pressure cylinder 71 communicates with the plunger tip 69a. Front cylinder chamber 71f, rear cylinder chamber 71r of cylinder body 71a
Are connected to the switching valve 73 at ports 71b and 71c, respectively. The switching valve 73 is a three-way switching valve when using compressed air as a pressure source.

The operation of the eighth embodiment having the above configuration will be described.

In the state where the previous machining has been completed and the double-sided surface grinding machine has stopped operating, the plunger 69 of the fluid pressure cylinder 71 is at the retracted position, and the distal end portion 69a of the plunger 69 is moved from the inlet 68a of the manifold 68. The plunger 6 which is retracted and has the work driving member 60b4 attached thereto.
Reference numeral 7b is at the forward end which has been advanced by the spring force of the compression coil spring 74. At the forward end position of the plunger 67b, the projecting end 60b2 of the work driving member 60b4 is located closer to the center of the rotary plate 57 than the position of the notch 17a of the work 17.

To mount the work 17, the switching valve 73 is switched so that the rear cylinder chamber 71 r of the fluid pressure cylinder 71 is mounted.
Compressed air is supplied to The compressed air escapes from the rear cylinder chamber 71r to the outside through the passage 69c.
Due to the throttle resistance of 9c, the plunger 69b generates a thrust in the forward direction and moves forward, and the plunger tip 69a is provided with the manifold 6 provided on the rotating plate 57 stopped at a fixed position.
8, the compressed air is fitted into the plunger 6
Nine passages 69c, the passage 68b of the manifold 68, and the port 67c enter the front cylinder chamber 67f of the actuator 67, and retreat the plunger 67b against the spring force of the compression coil spring 74. As a result, the work driving member 60b4 moves backward. In this state, the notch 17a of the work 17 is moved to the protruding end 60b2 of the work drive member 60b4.
And fitted into the set hole 60a. The manner of holding the work 17 at this time is the same as in the above-described embodiment when setting the work 17 on the double-sided surface grinder.

Next, when the compressed air from the air compressor 72 is switched by the switching valve 73, the compressed air is
The compressed air in the rear cylinder chamber 71r is released into the atmosphere while being sent to the front cylinder chamber 71f, and the plunger 69 retreats, and the plunger tip 69a leaves the inlet 68a of the manifold 68. At the same time, the compressed air in the front cylinder chamber 67f of the actuator 67 is supplied to the port 6
7c, the air is discharged from the inlet 68a into the atmosphere through the passage 68b. Therefore, the plunger 67b moves forward by the spring force of the compression coil spring 74, which has been contracted leftward by the compressed air pressure in the front cylinder chamber 67f, and the work drive member 6
Ob4 advances toward the notch 17a of the work 17. At this time, between the triangular protrusion 60b2 of the work driving member 60b4 and the V-shaped notch 17a of the work 17, FIG.
25, the work drive member 60b4 is rotated by the spring force of the compression coil spring 74 so that the projecting end 60b2 enters the notch 17a, and the work 17 rotates in the set hole 60a. From (a) to (b)
As described above, the protruding end 60b2 of the work driving member 60b4 and the notch 17a coincide. When the work 17 is set on the work support member 14 in this manner, the notch 17a of the work 17 is used.
Even if is set roughly, it is set in the correct position.

As described above, the manifold 68, the actuator 67, and the work driving member 60b4 rotate integrally with the rotating plate 57. Therefore, since there is no backlash in the state where the spring force of the compression coil spring 74 acts between the projection 60b2 of the work driving member 60b4 and the notch 17a of the work 17 due to the fluctuation of the grinding resistance, the projection 60b2 and the notch 17a collide. The work 17 can be prevented from being damaged such as chipping. Also, when attaching and detaching the work 17 to and from the rotary plate 57, the notch 1
The work 17 can be roughly set in the setting hole 60a since the work drive member 60b is separated from the work drive member 7a.

When the grinding of the work 17 is completed, the rotary plate 57 stops at a fixed position. When the switching valve 73 is switched, the plunger 69 moves forward, and its tip portion 69a fits into the inlet 68a of the manifold 68 and the passage 6 of the manifold 68.
9c, compressed air is fed into the front cylinder chamber 67f of the actuator 67 through the port 67c of the actuator 67, and the plunger 67b is retracted against the spring force of the compression coil spring 74, so that the notch 17a of the workpiece 17 and the workpiece driving member 60b4. A gap is generated between the protrusion 60b2 and the protrusion 60b2. Here, the processed work 17 is removed, and the unprocessed work 17 is fitted into the set hole 60a.

(Embodiment 9) Embodiment 9 differs from Embodiment 7 in that fluctuations in grinding resistance are detected. 28 to 30
The ninth embodiment is shown in FIG. The entire structure of the work supporting member is the same as that of the seventh embodiment shown in FIGS.

As shown in FIG. 30, the work drive member 60b
4 is sandwiched by the cushioning material 65. A hole is provided in the buffer material 65, and a pressure detector 77 (77a, 77b) is provided between each of the two sides of the body 60b3 of the work drive member 60b4 and the inner wall of the mounting bracket 66. The pressure detector 77 is a piezoelectric element, but may be a displacement meter or the like. The pressure detected by the pressure detector 77 is piezoelectrically converted, amplified by operational amplifiers 78a and 78b, respectively, and the control device 79 including a comparator calculates the difference between the pressures detected by the pressure detectors 77a and 77b. Via 81, the work rotation speed, the grinding wheel rotation speed and the grinding wheel cutting are controlled.

As shown in FIGS. 28 and 29, between the pressure detectors 77a and 77b, two slip rings 82 concentric with the rotary plate 57 provided on the lower surface of the work support plate 60 slide on the slip ring 82, respectively. The two brushes 83 take out to the operational amplifiers 18a and 18b. Alternatively, although not shown, a radio wave transmitter (not shown) is provided in each of the pressure detectors 77a and 77b, and the pressure detector 77 is provided via a wireless receiver.
The signals a and 77b may be input to the operational amplifiers 78a and 78b.

According to the ninth embodiment, the grinding resistance becomes abnormally large due to the wear of the grindstone, and the notch 17
If there is a possibility that cracks or cracks may occur in a, it can be dealt with by reducing the speed of the grindstone and the work, reducing the cuts, and the like.

(Embodiment 10) FIG. 31 shows a preferred embodiment of a work drive unit.

FIG. 31 shows a V-shaped notch 17 of the work 17.
The abdomen of the work drive unit 60b is formed into a protruding curved surface 60b so that the work drive unit 60b contacts the V-shaped abdomen with respect to a.
5 is assumed. This curved surface is a circle, a quadratic curve, an involute, or the like. By adopting this shape, the corner 17c between the notch 17a and the outer periphery of the work 17 does not hit the corner 17c of the work 17, so that chipping of the corner 17c of the work 17 where chipping is particularly likely to occur can be prevented.

[0085]

Weather-processing method according to the wafer of the present invention, according to the present invention
Set of c is easy. Since the wafer can be forcibly rotated and the both surfaces of the wafer can be ground at the same time, the processing time is short, and the surface roughness and the shape accuracy are good.

In the above, both sides of the wafer are machined using a grindstone exhibiting a different grinding action, so that only one side is subjected to a required finish, and the other side to which no circuit is provided is subjected to a necessary finish. Things go.

In the above, the entire surface of the wafer can be ground by setting the grinding action surface of the cup grindstone to the center of the wafer.

Advancing position for engaging the notch of the work on the inner circumference
A rotating plate having a work drive portion having a retracted position from the advancing position and having a set hole into which the workpiece is fitted, a grindstone end face which is thinner than the workpiece and can be approached, and a support member rotatably supporting the rotating plate. To move the work drive
According to the double-sided surface grinder provided with the moving means and the rotary driving means of the rotary plate, the work can be set roughly, a thin work can be efficiently processed, and a product having excellent shape accuracy (warp) can be obtained. Also, here, the work drive unit is located at the center of the rotating plate.
If a spring member that biases toward
Can be prevented from occurring.

The work supporting member of the present invention can be easily attached to a double-headed grinding machine, and the main body of the grinding machine can be used almost as it is.

According to the work supporting member of the present invention in which the surface of the work drive unit that is in contact with the work or the work drive unit is made of a softer material than the work, there is no possibility that the notch of the work may be damaged such as a crack.

According to the work supporting member of the present invention in which the side of the rotating plate that contacts the work is made of a softer material than the work, there is an effect of preventing damage such as chipping of the work and cracking of the notch of the work. The rotating plate is thinner than the work in the center
The outer periphery of the part is thicker and annular than the part thinner than the work
Therefore, the strength and rigidity of the rotating plate can be secured.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a double-ended surface grinder according to the present invention.

FIG. 2 is a longitudinal sectional view of a main part of a lower frame portion.

FIG. 3 is a longitudinal sectional view of a main part of an upper frame portion.

FIG. 4 is a plan view of a work supporting member.

FIG. 5 is a longitudinal sectional view showing a slide table unit.

FIG. 6 is a perspective view of the same.

FIG. 7 is a front view of the grinding tool.

8 is a longitudinal sectional view of FIG.

FIG. 9 is a front view showing another example of the grinding tool.

FIG. 10 is a longitudinal sectional view of FIG. 9;

FIG. 11 is a plan view of a main part of a work supporting member according to a fourth embodiment.

FIG. 12 is a longitudinal sectional view of FIG.

FIG. 13 is a plan view of a main part of a work supporting member according to a fifth embodiment.

FIG. 14 is a longitudinal sectional view of FIG.

FIG. 15 is a plan view of a main part of a work supporting member according to a sixth embodiment.

FIG. 16 is a longitudinal sectional view of FIG.

FIG. 17 is a plan view of a modification of the sixth embodiment.

18 is a longitudinal sectional view of FIG.

FIG. 19 is a plan view of a main part of a work supporting member according to a seventh embodiment.

20 is a longitudinal sectional view of FIG.

FIG. 21 is a perspective view of a work drive unit according to the seventh embodiment.

FIG. 22 is a longitudinal sectional view of FIG.

FIG. 23 is a plan view of a work supporting member according to the eighth embodiment.

24 is a longitudinal sectional view of FIG.

FIGS. 25A and 25B are plan views showing the operation of a work drive member, respectively.

FIG. 26 is a longitudinal sectional view of an actuator to which a work driving member is attached.

FIG. 27 is an enlarged side view showing a part of FIG. 24 in a partial cross section.

FIG. 28 is a plan view of a work supporting member according to the ninth embodiment.

FIG. 29 is a longitudinal sectional view of FIG. 28.

FIG. 30 is a perspective view of a part of the load detection means according to the ninth embodiment as seen through;

FIG. 31 is a plan view of the tenth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Grinding tool 2 ... Base plate 2a ... Concave fitting part 3 ... Diamond grindstone 3a ... Grinding working surface 4, 5 ... Work contact member 4a, 5a ... Work contact surface 6 ... Grindstone holder 6a ... Convex fitting part 7 ... Bolts 8 ... Diamond Imp Grinding Wheel 11 ... Lower Frame 12 ... Lower Wheel Rotary Elevating Mechanism 13 ... Upper Wheel Rotating Elevating Mechanism 14 ... Work Supporting Member 15 ... Lower Rotating Wheel 15a ... Grinding Surface 16 ... Upper Rotating Wheel 16a ... Grinding Surface Reference Signs List 17 Work (wafer) 17a Notch 17b Part 17c Corner 20 Grinding wheel base 21 Guide 22 Lower motor wheel moving motor 23 Ball screw 23a Ball nut 24 Lower shaft support 24a Guide 24b Bracket 25: Lowering wheel head raising / lowering motor 26: Rotation transmission mechanism 27: Ball screw 28: Lower wheel shaft 29: Wheel holder 34 Wheel drive motor 38 Upper shaft support 38a Bracket 39 Guide 40 Lifting motor 41 Ball screw 41a Ball nut 42 Upper wheel shaft 43 Wheel holder 48 Wheel drive motor 52 Support table 53 Slide table 54 ... guide rail 55 ... slide table moving motor 56 ... ball screw 56a ... ball nut 57 ... rotating plate 57a ... outer peripheral frame 58 ... guide roller 59 ... gear 60 ... work support plate 60a ... set hole 60b ... work drive unit 60b1 ... Root part 60b2 ... Tip 60b
3 ... Body 60b4 ... Work drive member 60b5 ... Curved surface 60c ... Metal plate 60d ... Work support plate 60e ... Main body 60f ... Cut portion 60g ... Outer side disk 60h
... Work support plate 60i Slit 61 Rotating plate rotating motor 62 Gear 63 Stud 63a Trunk 64 Bolt 65 Buffer material 66 Bracket 67 Actuator 67a Cylinder body 67b
… Plunger 67b1… groove 67b2… slit groove
67c ... port 67f ... front cylinder chamber 67r ... cylinder chamber 68 ... manifold 68a ... inlet 68b ... compressed air passage 69 ... plunger 69a ... tip 69b ... plunger 69c ... passage 71 ... fluid pressure cylinder 71a ... cylinder body 71
b, 71c: port 71f: front cylinder chamber 71r
.. Rear cylinder chamber 72 Air compressor 73 Switching valve 74 Compression coil spring 75 Small screw 76 Small screw 77, 77a, 77b Pressure detector 78a, 78b Operational amplifier 79 Controller 81 Numerical controller 82 ... Slip ring 83 ... Brushi 111 ... Upper frame

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyohashi Wada 100 Fukuno-cho, Higashi-Tonami-gun, Toyama Pref. (56) References JP-A 8-162430 (JP, A) JP-A 3-266430 (JP, A) JP-A 60-155358 (JP, A) JP-A 4-13076 (JP) , Y2) U.S. Pat. No. 5,533,924 (US, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B24B 7/17 B24B 41/06 H01L 21/304 621

Claims (11)

(57) [Claims] In a method of processing a wafer after cutting from an ingot, a wafer is loosely fitted, and is advanced from an inner periphery to an inside and is engaged with a notch of the wafer;
A workpiece drive section to take a retracted position, the workpiece drive
A rotating plate having a set hole from which the part protrudes, a thinner piece than the wafer and a larger diameter than the grindstone, and a double-sided surface grinder that has a pair of grindstones and grinds the wafer at the grindstone end face with the grindstone end faces facing each other. Prepared, and insert the wafer into the set hole with the work drive unit retracted.
After inserting the work drive, advance the work drive toward the center of the rotating plate.
In a state where the notch of the wafer is engaged with the work drive unit and the wafer is loosely fitted in the set hole, the wafer is rotated by driving the rotating plate, and the grindstone is rotated to act on both surfaces of the wafer. A wafer processing method characterized by performing grinding. 2. The wafer processing method according to claim 1, wherein the grinding wheel is a cup grinding wheel, and the grinding is performed such that a grinding action surface of the cup grinding stone overlaps with a center of the wafer. 3. A pair of cup grinding is disposed opposite both grinding end faces, the two-sided surface grinding machine for machining a plate surface of the disc-shaped workpiece having a notch on the outer circumference at the grindstone edge, loosely fitted the workpiece A forward position protruding from the inner periphery toward the inside and engaging with the notch of the work;
A rotating plate having a larger size than the grinding wheel diameter to allow proximity thin grindstone end face than the workpiece with a setting hole to have a workpiece drive section to take retracted retracted position, the drive for advancing and retreating the workpiece drive section means and said support member to the rotating plate rotatably supported, two-sided surface grinding machine, characterized by comprising a driving means for rotating said rotary plate is provided on the support member. 4. A double-headed surface grinding machine in which a pair of cup grindstones are disposed with both grindstone end faces facing each other, and a disc-shaped work having a notch on the outer periphery at the grindstone end faces is machined. A work hole protruding from the inner circumference to the inside and having a work drive unit that engages with the notch of the work, and has a size larger than the grindstone diameter so that the grindstone end face can be approached thinner than the work. A rotating plate, the work drive unit is mounted movably in the radial direction with respect to the rotary plate, and a spring member for urging the work drive unit toward the center of the rotary plate; and An actuator for retracting against a spring force of a spring member, a support member for rotatably supporting the rotary plate, and a driving means provided on the support member for driving the rotary plate to rotate. Double-sided surface grinder. 5. The double-sided surface grinding machine according to claim 3, wherein at least a surface of the rotating plate that is in contact with the workpiece is made of a material softer than the workpiece. 6. The double-sided surface grinding machine according to claim 5, wherein the support member of the rotary plate is a slide table movably engaged with a guide member provided in a direction perpendicular to a grinding wheel axis. 7. A work supporting member used for a grinding machine for processing a flat surface of a disk-shaped work having a notch on an outer periphery at an end surface of a grindstone, wherein the work is loosely fitted, and the work is protruded from an inner periphery to an inner side. A rotating plate having a thinner piece than the work and a larger diameter than the grindstone; and the work drive unit is mounted movably in the radial direction with respect to the rotating plate. A spring member for urging the work drive unit toward the center of the rotary plate; an actuator for retracting the work drive unit against the spring force of the spring member; and a rotatable support for the rotary plate. A workpiece supporting member, comprising: a supporting unit configured to drive the rotating plate provided on the supporting unit. 8. The work supporting member according to claim 7, wherein the work drive section is made of a material softer than the work at least on a surface in contact with the work. 9. The work supporting member according to claim 7, wherein a side of the rotating plate that contacts the work is made of a material softer than the work. 10. The work supporting member according to claim 7, wherein said support means is movably fitted to guide means parallel to a plate surface of a rotary plate. 11. The rotating plate according to claim 7, wherein the outer peripheral side of the portion thinner than the work at the center is thicker and annular than the portion thinner than the work. The work support member according to any one of the preceding claims.