JP3207844B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a production efficiency, a manufacturing method suitable semiconductors devices on the product quality.

[0002]

2. Description of the Related Art The prior art is disclosed in Japanese Patent Application Laid-Open No. 62-78836.
As described in the official gazette, a motor is used for the molding machine,
There is a type in which the resin is sealed by controlling the speed.

[0003]

The object of the invention is to be Solved However, the above-mentioned slave
In the next technology, disclosure of resin encapsulation by speed control will be disclosed
However, further improvement in production efficiency or product quality
The above has not been fully considered.

[0004]

[0005]

An object of the present invention is to solve the above technical problems and to provide a method of manufacturing a semiconductor device capable of improving production efficiency or product quality .

[0007]

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention comprises a plurality of pots for supplying a resin, and a plurality of cavity rows in which a plurality of cavities receiving the resin are arranged. Using a plunger arranged corresponding to the pot and a motor for driving the plunger,
A method of manufacturing a semiconductor device for supplying resin from a pot to a cavity by moving the plunger by controlling the speed of the motor, wherein the motor is driven at a first speed until the plunger moves to a predetermined position. After moving to the predetermined position, the speed of the motor is controlled to a second speed lower than the first speed, and thereafter, the process is shifted to torque control. It is assumed that. In addition, the motor is controlled so as to shift from speed control to torque control before filling the cavity with resin. Next, the to reach the resin in which the plunger is supplied to the pot to move
The plunger speed of to, characterized in that the faster than the speed of the plunger when the resin into the cavity is supplied
Things. In the above, it is characterized in that the motor is controlled to shift from speed control to torque control before filling the cavity with resin. The present invention also provides a plurality of pots for supplying a resin mixed with a filler, a plurality of cavity rows in which a plurality of cavities receiving the supply of the resin are arranged, and a plunger arranged corresponding to the pot. And a motor for electrically driving the plunger, and performing closed-loop control so that the rotation of the motor becomes a preset number of revolutions, thereby moving the plunger to supply resin from the pot to the cavity. The method of manufacturing
Until the plunger moves to a predetermined position, the motor is closed-loop controlled so as to have the first rotation speed, and after moving to the predetermined position, the motor is slower than the first rotation speed. It is characterized in that closed-loop control is performed so that the number of revolutions of the motor becomes the same, closed-loop control is performed on the motor so that the number of revolutions becomes the second, and then torque control is performed.
A plurality of pots for supplying a resin mixed with a filler, a plurality of cavity rows in which a plurality of cavities receiving the supply of the resin are arranged, a plunger arranged corresponding to the pot, and the plunger. And a motor that drives the motor electrically, and performs closed-loop control so that the rotation of the motor becomes a preset number of revolutions, thereby moving the plunger to supply the resin from the pot to the cavity. The motor is controlled to shift to torque control before the cavity is completely filled with resin. The rotation speed until the plunger moves and reaches the resin supplied to the pot is set to be higher than the rotation speed when the resin is supplied to the cavity, and further, the cavity is formed of resin. The motor is shifted to torque control at a position before filling is completed.

[0009]

[0010]

[0011]

According to the present invention, for example, fine speed control is performed.
After that, shift to torque control or fill the cavity with resin.
Move the motor from speed control to torque control before filling is complete.
By controlling to move, for example, in the cavity
Burr and insert deformation due to high pressure
And product quality can be improved. Ma
Also, until the plunger reaches the resin supplied to the pot,
Speed at which the resin is fed into the cavity
High speed, the resin is actually injected into the cavity.
Time, i.e. time not related to molding quality
Can be shortened, and the production efficiency can be improved .

[0012]

EXAMPLES Hereinafter, an embodiment of the present invention based on the drawings. 1 to 22 are applicable to the resin supply method described above.
FIGS. 23 to 25 show examples of the above-described resin.
This is an example of the method of supplying the slag.

FIG. 1 shows the configuration of an apparatus according to an embodiment of the present invention. FIG. 1 (a) is a bottom plan view of a mold, wherein 1 is a lower mold of the mold, and 2 is a plurality of pots (FIG. 1) for pressing and supplying resin relating to the mold resin.
(Three in the range of (a)), 3 are runners provided in each of the pots 2. A first gate 4 is provided at the tip of the runner 3, and a first cavity 5 is arranged so as to be connected to the first gate 4. A second gate 6 is provided after the first cavity 5, that is, on the downstream side during resin supply, and a second cavity 7 is connected to the second gate 6. Further, a third cavity is disposed downstream of the second cavity 7 via a third gate 8. The pots 2 are connected to each other by a pot connection flow path 10.

FIG. 1B shows a state in which the lead frame 11 is inserted between the upper die 12 and the lower die 1.
A-A section is shown. In the lead frame 11,
A chip 13 is mounted at a position corresponding to each of the first cavity 5, the second cavity 7, and the third cavity 9, and the chip 13 and the lead frame 1 are connected by a gold wire 14.
1 are connected to form an electric component to be molded.

FIG. 1C shows the upper mold 12 and the lower mold 1 closed,
FIG. 1 shows a state in which a plunger 17 is attached to a rod 15 of a molding machine (not shown) via a rigid connecting plate 16.
4A shows a BB cross section.

1 (a) to 1 (c), a resin (not shown) is put into each pot 2 and the rod 15 of the molding machine is lowered, whereby each plunger 1
7 also moves down in the pot 2 in conjunction with the rod 15. Then, each plunger 17 transfers the resin to the pot connection flow path 10 and each runner 3, and the resin fills each gate and cavity provided at the tip of each runner 3.

FIG. 2 is a plan view of a lead frame used in the mold shown in FIG. 1, and FIG. 3 is a plan view of a lower mold after the resin is filled using the lead frame.

In FIG. 2, a chip (not shown) is die-bonded on a tab 18 and wire-bonded to the tip of an internal lead 19 with a gold wire (not shown) to constitute a semiconductor component. As described above, semiconductor components are arranged in two vertical and horizontal directions on one lead frame.

FIG. 3 shows the lower mold in a state where the lead frame 11 shown in FIG. 2 is inserted between the lower mold 1 and the upper mold 12 shown in FIG. 1 is a plan view of FIG. After a lapse of a predetermined time, the resin 20 cures and the molded product 2
1 is obtained. Then, through a predetermined process, a resin mold semiconductor component is obtained. In this embodiment, the resin in the cavity continuously flows in a direction orthogonal to the pattern of the external leads 22 serving as the external terminals of the resin-molded semiconductor component.

Although the embodiment shown in FIGS. 1 to 3 shows an example in which the plunger 17 is provided above the pot 2, the plunger 1
Even when 7 is provided below pot 2, resin molded semiconductor parts having the same quality and the same productivity can be obtained.

FIG. 4 is a plan view of a lower mold of a mold according to a second embodiment of the present invention, FIG. 5 is a plan view of a lead frame used in the mold of FIG. 4, and FIG. FIG. 4 is a plan view of a lower mold after filling with resin.

The difference between FIG. 4 and FIG. 1A is that the second gate,
The third gate is not processed, and the second cavity 7,
That is, the third cavities 9 are independently arranged.

On the other hand, as shown in FIG. 5, the lead frame 11 used in the mold of FIG. 4 has the downstream second cavity 7 and the third cavity 9 at positions corresponding to the second and third gates. Slit 23 for transferring resin downstream
Is formed.

FIG. 6 shows a state in which the lead frame 11 shown in FIG. 5 is inserted between the lower die 1 shown in FIG. It is a top view. After correcting the weight variation in the pot connecting flow path 10, the resin 20 fills the first cavity 5 from the pot 2 through the runner 3 and the first gate 4, and fills the third cavity through the slit 23.
It is supplied into the cavity 9 and a molded product 21 is obtained. Thereafter, a resin molding semiconductor component is completed through a predetermined process.

In this embodiment, there is an effect that the gate processing cost of the mold can be reduced as compared with the first embodiment.

FIG. 7 is a plan view of a lower mold of a mold according to a third embodiment of the present invention, FIG. 8 is a plan view of a lead frame used in the mold of FIG. 7, and FIG. FIG. 4 is a plan view of a lower mold after filling with.

The difference between FIG. 7 and FIG. 1 (a) is that the branching not from the pot 2 of the runner 3 but from the pot connecting flow path 10,
That is, it is connected to the first gate 4 linearly. This has the effect of facilitating die processing and reducing processing costs.

On the other hand, the difference between the lead frame shown in FIGS. 8 and 5 is that a bridge 24 is provided in the slit 23. This prevents the slit 23 from being widened by the flow pressure of the resin being molded, and preventing the lead frame 11 from being deformed. As shown in FIG. 7, a gate is provided between the cavities of the mold, and the resin can flow downstream even if there is a bridge 24.

FIG. 9 shows a state in which the lead frame 11 shown in FIG. 8 is inserted between the lower die 1 shown in FIG. It is a top view. The resin 20 corrects the weight variation in the pot connection flow path 10 and fills the first cavity 5 from the pot connection flow path 10 through the runner 3 and the first gate 4.
The slit 23 and the second gate 6 thereunder (not shown)
Through the second cavity 7, the slit 23 and the third gate 8 (not shown) thereunder, to the third cavity 9, and the molded article 21 is obtained. In this method, both the slit 23 and each gate can be used as a flow path, and the flow resistance of the resin can be reduced. And Bridge 2
4, the lead frame 21 from the slit 23
Deformation can be prevented.

Further, due to the relationship between the cavity interval, the pot interval, and the pot diameter, the runner and the pot can be arranged in direct contact as shown in FIG.

It is needless to say that lead frames such as those shown in FIGS. 2, 5, 8 and 18, which will be described later, can be used for the dies shown in FIGS.

FIG. 11 is a plan view of a lower mold of a mold according to a fourth embodiment of the present invention. FIG. 12 is a plan view of a lower mold after filling a resin using the lead frame shown in FIG. FIG.

The difference between FIG. 11 and FIGS. 7 and 10 is that an air vent (hatched portion in the figure) 25 that contacts the pot communication 10, the second gate 6, and the third gate 8 and communicates with the outside of the mold is provided. It is. This air vent 25 has a depth of 10 μm
It has a depth of about 40 μm. On the other hand, the depth of the connection path 10 and the runner 3 is about several mm. The air vent 25 has an effect that air mixed in the resin when the resin collides near the center of the pot communication path 10 and air contained in the resin when passing through the gate are discharged to the outside of the mold. .

By the way, in the lower mold of FIG. 1A or FIG. 4, an air vent connected to a communication passage or a gate can be provided.

FIG. 12 shows a state in which the lead frame shown in FIG. 2 is inserted between the lower die 1 and the upper die (not shown) shown in FIG. FIG. With this method, voids remaining in the molded product 21 can be significantly reduced, and quality can be improved.

If the second gate 6 and the third gate 8 are arranged at positions as shown in FIG. 10 in the mold structure of FIG.
Needless to say, the lead frames shown in FIGS. 2, 5, 8, and 11 can be used.

FIG. 13 is a plan view of the lower mold, and FIG. 14 is a plan view of the lower mold after resin is filled using the lead frame shown in FIG.

The difference between FIG. 13 and FIG. 11 is that a dummy cavity 25 which is not connected to the third cavity 9 and is not used as a semiconductor component is provided together with the air vent 25 described above. The air entrapped in the mold cavity flows out into the dummy cavity 26, thereby further reducing the voids in the molded product and improving the quality.

Incidentally, it is possible to provide a dummy cavity in the lower mold having the shape shown in FIG. 1A or FIG.

It is needless to say that the lead frame shown in FIGS. 2, 5, 8, and 11 can be used if the mold shown in FIG. 13 is also arranged at the gate position as shown in FIG.

FIG. 15 is a plan view of a lower mold of a mold according to a sixth embodiment of the present invention, and FIG. 16 is a plan view of a lower mold after resin is filled using the lead frame shown in FIG. FIG.

The difference between FIG. 15 and FIG. 11 is that the resin discharged from the pot 2 passes through the pot outflow gate 27 having a smaller sectional area than the pot communication path 10 and is then guided to the pot communication path 10 and the runner 3. . Thereby, the void inside the resin can be compressed once, and the size of the void flowing into the cavity can be reduced. Further, as described above, the air contained in the resin is discharged to the outside of the mold through the air vent 25. This can reduce the voids in the molded product.

It is needless to say that the lead frame shown in FIGS. 2, 3, 8, and 11 can be used if the mold shown in FIG. 15 is also arranged at the gate position as shown in FIG.

FIG. 17 is a plan view of a lower mold of a mold according to a seventh embodiment of the present invention, FIG. 18 is a plan view of a lead frame used in the mold of FIG. 17, and FIG. FIG. 4 is a plan view of a lower mold after filling with resin.

The difference between FIG. 17 and FIG. 15 is that it has a pot outflow gate 25, and is further connected to the third cavity 9 to provide a dummy cavity 26, so that the air contained in the resin flowing in the cavity is finally discharged. Is trapped here. As a result, voids in the molded product can be reduced.

The difference between FIGS. 13 and 14 and FIGS. 17 and 19 is that in the embodiment of FIGS.
Dummy cavity 2 in lower mold 1 where it does not protrude
6, and a resin outflow slit 28 is also provided in the lead frame 11 at a position corresponding to the dummy cavity 26, so that the pot 2, the runner 3, the first gate 4, and the 2 gate 6,
There is also an effect that the third gate 8 and the dummy cavity 26 can be punched out at the same time and easily, and can be deleted, and it is also easy to automate a production process, and also has a function of greatly improving productivity.

FIG. 20 is a plan view of a lower mold of a mold according to an eighth embodiment of the present invention, FIG. 21 is a plan view of a lead frame used in the mold of FIG. 20, and FIG. FIG. 4 is a plan view of a lower mold after filling with resin.

FIG. 20 is the same as FIG. 7 except that the pot communication path 10 and the runner 3 are branched in the same manner, but the cavities are arranged obliquely, and the resin flows from the top of the cavity in the plan view to the top of the adjacent cavity. It is different to let. Also, there are two types of specifications in which the lengths of adjacent runners are different.

The lead frame shown in FIG.
Is a type projected in four directions, and FIGS.
The shape is different from the type in which the external leads 22 shown in 8 and 18 are exposed in two directions. In addition, FIGS.
The external lead 22 of 18 is arranged in parallel with one of the outer frames of the lead frame, while in FIG. 21, the outer frame of the lead frame and the external lead 22 form a predetermined angle.

FIG. 22 shows the lead frame 1 shown in FIG.
FIG. 21 is a plan view of the lower mold 1 in a state where resin supply is completed by inserting the lower mold 1 between the lower mold 1 shown in FIG. 20 and an upper mold (not shown). According to this method, a semiconductor component having the external leads 22 in four directions can be molded with high production efficiency.

In this embodiment, only an example of a combination of one mold structure and one lead frame structure is shown.
It goes without saying that various combinations similar to those described above up to the embodiment can be made.

In the above-described embodiment, an example in which three cavities are arranged in series with one runner and three molded products are taken out has been described. However, the present invention is not limited to this. Needless to say, regarding the number of molded products, the size of the molded product may be appropriately set in consideration of the ease of resin flow.

FIG. 23 is an overall configuration of an apparatus according to a ninth embodiment of the present invention, and FIG. 24 is a molding profile of this apparatus.
FIG. 25 shows the effect.

FIG. 23 shows the configuration of the entire resin mold semiconductor manufacturing apparatus according to the present invention, with FIG. 1 (c) showing a state in which the upper mold 12 and the lower mold 1 are closed and the mold is mounted on the molding machine 29. It is. Each plunger 17 is a rigid connection plate 16
To the rigid connecting plate 16 and the rod 1 of the molding machine.
5 is connected to the plunger 17 in the opposite direction. Also,
The resin 20 charged in each pot 2 is connected to the pot connection flow path 1
They are connected to each other through 0. Next, an outline of a driving device configuration of the rod 15 will be described. In this apparatus, when a rod lowering switch (not shown) is turned on, the plunger 17 connected to the rod 15 via the rigid connecting plate 16 is lowered to inject the resin 20 in the pot 2 into the mold. And a driving circuit for driving the servo motor 3 according to the electric motor.
0, a pulse generator 31 relating to an odometer capable of detecting the traveling distance of the servomotor 30, a primary current imax1, a secondary current imax2 (where imax1 > Imax2) and a predetermined traveling distance are set, and when the plunger lowering switch is turned on, the servo motor 30 is set to the speed control, and the motor maximum current is set to the primary current. When the distance has reached the set traveling distance, the motor maximum current is switched to the secondary current and set, and when the motor current has reached this secondary current, the servo motor 30 can be driven under torque control. And an electric circuit having a control unit 32, which decelerates the rotation of the servo motor 30 and converts it into linear motion to 5 to transmit a molding apparatus a ball screw jack 33 is provided connected to the servo motor 30 according to the deceleration and linear motion converting mechanism can be lowered the rod 15.

The details will be described below. Reference numeral 30 denotes a servomotor connected to the tachogenerator 34 and the pulse generator 31. Reference numeral 35 denotes the number of rotation signals from the tachogenerator 34. ), A motor driver capable of performing closed drove control, a pulse generator 31 capable of detecting the travel distance of the servo motor, that is, a plunger displacement, and a pulse generator 36, The microcomputer unit 37 which can take in the displacement signal from the
This console allows the microcomputer unit 36 to set the maximum motor current, the number of rotations of the servomotor 30, and the plunger displacement.

The operation of the molding apparatus configured as described above will be described with reference to FIGS. In this example, a resin having poor fluidity (a high-viscosity resin mixed with a large amount of filler) is used.

The primary current imax1, the secondary current imax2, the first
Plunger displacement d1 (a predetermined position where the lower end of plunger 17 is slightly higher than the upper end of a resin tablet (not shown) in pot 2), and second plunger displacement d2 (the lower end of plunger 17 is the first plunger displacement). A predetermined position below d1, that is, a position before the plunger 17 is filled with the resin, a first rotation speed N1, and a second rotation speed N2 (where N1> N2) are set.

Here, when a resin tablet (not shown) is put into the pot 2 and a plunger lowering switch (not shown) of the apparatus is turned on, the microcomputer unit 36 sends a speed control command to the motor driver 35 and a speed control command. 1 is output, and the motor maximum current becomes the primary current imax.
1 and the servo motor 30 rotates at the first rotation speed N1. This rotation is transmitted to the ball screw jack 33, where it is decelerated and converted into a downward movement of the rod 15 and each plunger 17.

The number of revolutions of the servomotor 30 is counted by the tachogenerator 34, and a rotation signal from the tachogenerator 34 is taken into the motor driver 35, and the rotation of the servomotor 30 is always kept at the first rotation speed N1. Closed rope control is performed so that The signal from the pulse generator 31 is transmitted to the microcomputer unit 36.
And is compared with the first plunger displacement d1.
The plunger 17 corresponds to the first rotation speed N1.
When the inside of the pot 2 descends at a high speed and the plunger displacement detected by the pulse generator 31 becomes the first plunger displacement d1, the rotation speed of the servo motor 30 is reduced by a command from the microcomputer unit 36 (point a in FIG. 24). ,
The plunger 17 descends at a low speed from the first rotational speed N1 to the second rotational speed N2.

The resin 20 heated and melted by the heaters (not shown) of the lower mold 1 and the upper mold 12 fills the pot connecting flow path 10 by lowering the plunger 17, and at the same time, as shown in FIGS. ), And are sequentially transported downstream through the first gate 4. Then, when the resin comes to just before the filling in the third cavity 9 at the most downstream,
That is, when the displacement of the plunger 17 becomes the second plunger displacement d2 (t1 in FIG. 24), the microcomputer unit 3
6 issues a command and the motor maximum current is the primary current imax
Switching from 1 to imax2. The servo motor 30
The second rotation speed N2 is maintained as it is. And resin 2
When 0 has been filled into all the cavities and the plunger 17 has stopped (t2 in FIG. 24), the motor current i holds the value of the secondary-side set value imax2, and the process proceeds to torque control.
The resin pressure P corresponding to imax2 is applied to the resin 20 for a predetermined time to complete the molding, and the molding apparatus is turned off.

Since such control is performed, the plunger 17 descends at the set speed until just before the filling with the resin having poor moldability is completed. In addition, since the load is reduced immediately before the completion of filling, there is no problem of generation of burrs and insert deformation due to application of high pressure in the cavity.

FIG. 25 shows an example of a void generation rate and an unfilled defect generation rate of a resin-encapsulated product molded by the apparatus according to the present invention using a conventional hydraulic open-loop molding machine for a mold shown in FIG. FIG. 4 is a defect generation diagram shown in comparison with a molded product. In FIG. 25, A shows a defect of a resin-sealed product molded by using a conventional hydraulic open loop type circuit, and B shows a defect of a resin-sealed product molded by the apparatus according to the present invention. It can be seen that defects are significantly reduced in the present invention.

In this embodiment, an example of closed loop control of electric drive is shown, but closed loop control of hydraulic drive may be used.

[0064]

As described above, according to the present invention,
Improve product quality of resin mold semiconductor
Wear. Further, production efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a first embodiment of the present invention, in which (a) is a plan view of a lower mold, and (b) is A of (a) in a state where an upper mold and a lower mold are closed.
-A sectional drawing, (c) is BB sectional drawing.

FIG. 2 is a front view of a lead frame used in the mold of FIG. 1;

FIG. 3 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the first embodiment.

FIG. 4 is a plan view of a lower die of the second embodiment.

FIG. 5 is a front view of a lead frame used in the mold shown in FIG. 4;

FIG. 6 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the embodiment of FIG. 2;

FIG. 7 is a plan view of a lower die according to the third embodiment.

FIG. 8 is a front view of a lead frame used in the mold shown in FIG. 7;

FIG. 9 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the third embodiment.

FIG. 10 is a plan view of a lower die of the third embodiment.

FIG. 11 is a plan view of the lower die of the fourth embodiment.

FIG. 12 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the fourth embodiment.

FIG. 13 is a plan view of a lower die of the fifth embodiment.

FIG. 14 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the fifth embodiment.

FIG. 15 is a plan view of a lower die of the sixth embodiment.

FIG. 16 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the sixth embodiment.

FIG. 17 is a plan view of a lower die of the seventh embodiment.

FIG. 18 is a front view of a lead frame used in the mold shown in FIG. 17;

FIG. 19 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the seventh embodiment.

FIG. 20 is a bottom plan view of the eighth embodiment.

FIG. 21 is a front view of a lead frame used for the mold of FIG. 20;

FIG. 22 is a plan view of a lower mold after resin is filled using the resin mold semiconductor device according to the eighth embodiment.

FIG. 23 is an overall configuration diagram of a semiconductor resin sealing device according to a ninth embodiment.

FIG. 24 is a molding profile diagram formed by the semiconductor resin sealing device according to the ninth embodiment.

FIG. 25 is a defect generation diagram shown in comparison with that of a conventional molding method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower mold 2 Pot 3 Runner 4 1st gate 5 1st cavity 6 2nd gate 7 2nd cavity 8 3rd gate 9 3rd cavity 10 Pot connection flow path 11 Lead frame 12 Upper mold 15 Cylinder rod 16 Rigid connection plate 17 Plunger 23 Slit 24 Bridge 25 Air vent 26 Dummy cavity 27 Pot outflow gate 28 Resin outflow slit 30 Servo motor 31 Pulse generator 32 Drive control unit 34 Tachogenerator

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Isamu Yoshida 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Pref.Hitachi Manufacturing Co., Ltd. (72) Inventor Kunihiko Nishi (56) References JP-A-62-78836 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/56 B29C 45/00-45/84

Claims (7)

(57) [Claims] 1. A plurality of pots for supplying a resin, a plurality of cavity rows in which a plurality of cavities receiving the supply of the resin are arranged, a plunger arranged corresponding to the pot, and the plunger. Using a driving motor,
A method of manufacturing a semiconductor device for supplying resin from a pot to a cavity by moving the plunger by controlling the speed of the motor, wherein the motor is driven at a first speed until the plunger moves to a predetermined position. After moving to the predetermined position, the speed of the motor is controlled to a second speed lower than the first speed, and thereafter, the process is shifted to torque control. Manufacturing method of a semiconductor device. 2. A plurality of pots for supplying a resin, a plurality of rows of cavities in which a plurality of cavities receiving the supply of the resin are arranged, a plunger arranged corresponding to the pot, and a plunger. Using a driving motor,
A method of manufacturing a semiconductor device for supplying resin from a pot to a cavity by controlling the speed of the motor to move the plunger , wherein the plunger moves to reach the resin supplied to the pot.
Resin into the cavity until the plunger speeds
The plunger speed when supplied
And a method of manufacturing a semiconductor device. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the motor is controlled to shift from speed control to torque control before filling the cavity with resin. 4. A plurality of pots for supplying a resin mixed with a filler, a plurality of cavity rows in which a plurality of cavities receiving the supply of the resin are arranged, and a plunger arranged corresponding to the pot. A motor for electrically driving the plunger, and performing closed-loop control so that the rotation of the motor becomes a preset number of revolutions, thereby moving the plunger to supply the resin from the pot to the cavity. A manufacturing method, wherein the motor is closed-loop controlled so as to reach a first rotation speed until the plunger moves to a predetermined position, and after the plunger is moved to the predetermined position, the motor is rotated in the first rotation. Closed loop control to a second rotation speed slower than the motor speed, closed loop control to the motor to a second rotation speed, and then torque control The method of manufacturing a semiconductor device according to claim Rukoto. 5. A plurality of pots for supplying a resin mixed with a filler, a plurality of cavity rows in which a plurality of cavities receiving the supply of the resin are arranged, and a plunger arranged corresponding to the pot. A motor for electrically driving the plunger, and performing closed-loop control so that the rotation of the motor becomes a preset number of revolutions, thereby moving the plunger to supply the resin from the pot to the cavity. A method for manufacturing a semiconductor device, comprising controlling the motor to shift to torque control before filling the cavity with resin. 6. A plurality of pots for supplying a resin mixed with a filler, a plurality of cavity rows in which a plurality of cavities receiving the supply of the resin are arranged, and a plunger arranged corresponding to the pot. A motor for electrically driving the plunger, and performing closed-loop control so that the rotation of the motor becomes a preset number of revolutions, thereby moving the plunger to supply the resin from the pot to the cavity. A method of manufacturing a semiconductor device, wherein the rotation speed until the plunger moves and reaches the resin supplied to the pot is higher than the rotation speed when the resin is supplied to the cavity. Production method. 7. The method of manufacturing a semiconductor device according to claim 5, wherein the motor is controlled to shift to torque control at a position before the cavity is completely filled with the resin.