JP3208095B2 - Inspection equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection apparatus, and more particularly to a tape carrier package (TCP: Ta).
pe Carrier Package) product, that is, TAB (Tape automated bonding), wherein the inner leads of a tape carrier in which a lead pattern composed of inner leads and outer leads are formed in advance on a resin tape having a predetermined width and electrode pads of a semiconductor chip. The present invention relates to an inspection apparatus for inspecting electrical characteristics of a semiconductor device bonded (inner lead bonding) by a method.

[0002]

2. Description of the Related Art A semiconductor device (hereinafter, referred to as a TCP product) in which an inner lead of a tape carrier and an electrode pad of a semiconductor chip are joined by a TAB method is cut from a tape carrier by an outer bonding device, and then the tape is cut. The carrier is mounted on a wiring board or the like by bonding an outer lead of the carrier and a wiring pattern such as a wiring board. Usually, an electrical characteristic is inspected by a TCP handler before cutting from the tape carrier.

FIG. 4 shows a method of inspecting electrical characteristics of a TCP product by a TCP handler.
This will be described with reference to FIG.

FIG. 4 schematically shows the overall structure of a TCP handler. A tape carrier 1 on which a TCP product is fixed is moved from a supply-side tape reel 2 to a storage-side tape reel 3.
In the course of being conveyed, the probe card 6 passes between a probe card 6 fixed on a frog ring 5 placed on the performance board 4 and a pusher plate 7 having a shallow box shape. When the tape carrier 1 passes between the probe card 6 and the pusher plate 7, the TCP card is inspected for electrical characteristics by the probe card 6. In FIG. 4, reference numeral 8 denotes a sprocket for applying tension to the tape carrier 1.

FIG. 5 shows a state in which an electrical characteristic of a TCP product is inspected by the probe card 6.
In the figure, 10 is a semiconductor chip fixed to the tape carrier 1, 11 is an input terminal formed on the tape carrier 1 so as to be electrically connected to the outer lead on the input side, and 12 is an upper terminal on the tape carrier 1. , An output terminal 13 formed so as to be electrically connected to an output outer lead, and an input probe needle 14 provided at a portion of the probe card 6 corresponding to the input terminal 11 of the tape carrier 1. Reference numeral denotes an output-side probe needle provided at a portion of the probe card 6 corresponding to the output terminal 12 of the tape carrier 1. In FIG. 5, the inner leads and the outer leads formed on the tape carrier 1 are not shown.

A position where the input terminal 11 of the tape carrier 1 faces the input probe needle 13 of the probe card 6 and the output terminal 12 of the tape carrier 1 faces the output probe needle 14 of the probe card 6. When the tape carrier 1 stops, the pusher plate 7 descends toward the probe card 6 and presses the tape carrier 1 toward the probe card 6, and the input terminal 11, the input probe needle 13, and the output terminal 12 The output probe needles 14 are brought into contact with each other.

The input terminal 11 and the input probe needle 13
When an electric signal is applied to the probe card 6 from the performance board 4 via the frog ring 5 in a state where the output terminal 12 and the output probe needle 14 are in contact with each other, the electric signal is input to the probe on the input side of the probe card 6. The signal is transmitted from the terminal 13 and the output probe terminal 14 to the input terminal 11 and the output terminal 12 of the tape carrier 1,
The electrical characteristics of the semiconductor chip 10 are inspected. The bottom of the pusher plate 7 has a concave portion 15 for blowing hot air and a hot air supply hole 16 communicating with the concave portion 15 for blowing hot air.
And a hot air discharge hole 17 communicating with the hot air blowing recess 15 at the side of the pusher plate 7.
The hot air supplied from the hot air supply hole 16 to the hot air blowing recess 15 is blown onto the semiconductor chip 10 and then discharged from the hot air discharge hole 17. Thus, the electrical characteristics of the semiconductor chip 10 can be inspected at a high temperature.

FIG. 6 shows a structure of a lower surface of the probe card 6, FIG. 7 shows a cross-sectional structure of a conventional semiconductor device inspection apparatus, and FIG. 7 corresponds to a cross section taken along line VII-VII in FIG.

As shown in FIGS. 6 and 7, a ring-shaped probe card 6 is provided, for example, 8
The frog ring 5 is fixed to the performance board 4 by means of eight card fixing screws 22 and eight ring fixing screws 22 provided in the circumferential direction.

At the center of the probe card 6, a large number, for example, a total of 256 input probe needles 13 and output probe needles 14 are provided. The same number of card electrodes 23 as the total number of the needles 13 and the output probe needles 14 are provided. In FIG. 6, the dashed line indicates the card electrode 2.
3 shows an area where the number 3 is formed. Although not shown, a large number, for example, 256 connection wirings extend vertically and horizontally in a region of the probe card 6 where the input probe needles 13, the output probe needles 14, and the card electrodes 23 are not formed. , The input probe needle 13 and the output probe needle 14 and the card electrode 2 via the connection wiring.
3 are electrically connected to each other.

The periphery of the frog ring 5 is formed with, for example, 256 through holes penetrating vertically.
A lower pogo pin 24 and an upper pogo pin 25 are inserted into each through hole. The tip of the lower pogo pin 24 is urged downward by a spring, and the tip of the upper pogo pin 25 is urged upward by a spring. As a result, the lower pogo pins 24 are securely connected electrically to the board electrodes 26 formed on the upper surface of the performance board 4, and the upper pogo pins 25 are securely connected electrically to the card electrodes 23 of the probe card 6. The electric signal supplied from the performance board 4 is transmitted to the input probe needle 13 and the output probe needle 14 of the probe card 6 via the lower pogo pin 21 and the upper pogo pin 22 of the frog ring 5, respectively.

Inspection of electrical characteristics of a TCP product is as follows.
Specifically, it is performed by a function method as described below. That is, the voltage is applied from the input probe needle 13 and the output probe needle 14 of the probe card 6 to the input terminal 11 and the output terminal 12 of the tape carrier 1 while changing the voltage from a predetermined lower limit to a predetermined upper limit. By sequentially operating each functional element of the semiconductor chip 10 and determining the operating state of each functional element of the semiconductor chip 10 by a determination function (test program) incorporated in the frog ring 5, an input / output contact, a power terminal contact And various characteristic inspections such as DAC function. In this case, if all the data (voltage values) obtained in various characteristic tests are within a predetermined range, all the test items are determined to be good. When it is determined that all the inspection items are good, T
It is determined that the CP product is non-defective, and the process proceeds to the next TCP product inspection. On the other hand, if any of the obtained data is out of the predetermined range, the determination function of the frog ring 5 determines which inspection item is defective based on the data out of the predetermined range. . If it is determined that any of the test items is defective, the input terminal 11 and the output terminal 12 of the tape carrier 1 and the input probe needle 13 and the output probe of the probe card 6 The inspection (retry) is performed again for all the inspection items, starting again from the contact with the needle 14. This re-inspection is performed several times, and in all of the re-inspections performed several times, if any of the inspection items is determined to be defective, the TCP product is determined to be defective, while the TCP product is determined to be defective. In the inspection, if all the inspection items are determined to be good, the TCP product is determined to be non-defective.

[0013]

By the way, the number of input terminals 11 and output terminals 12 of the tape carrier 1 has been greatly increased with the increase in the degree of integration of the semiconductor chips 10 constituting the TCP product. Therefore, recently, the input probe needle 13 and the output probe needle 1 of the probe card 6 have been used.
The total number of 4 has increased about twice (the maximum total number has increased from 256 to 512), and the numbers of lower pogo pins 24 and upper pogo pins 25 have also increased about twice. Therefore, the input probe needle 13, the output probe needle 14 and the card electrode 23 formed on the probe card 6.
The number of connection wires for connecting
The area in which the card fixing screws 21 for fixing the probe card 6 to the frog ring 5 are restricted, and it is necessary to reduce the number of the card fixing screws 21 from, for example, eight to four, for example. Was.

However, when the number of card fixing screws 21 is reduced, a new problem as described below occurs. In other words, there is a problem that the inspection item determined to be defective differs for each inspection of the TCP product. For example, in the first inspection performed on a TCP product, a contact failure such as an input / output contact failure and a power supply terminal contact failure occurs. However, in the second inspection performed on the same TCP product, a DAC function failure occurs. This is a problem that a functional system failure such as the above occurs.
As described above, if the inspection items determined to be defective for each inspection are different, the reliability of the inspection is impaired and it is difficult to determine whether the TCP product is a non-defective product or a defective product.

In view of the above, the present invention avoids a situation in which the judgment result of an inspection item differs every time an inspection is performed, despite the fact that the number of fixing screws for fixing the probe card to the frog ring is reduced. Accordingly, an object of the present invention is to improve the reliability of the inspection and to easily and accurately determine the quality of the TCP product.

[0016]

SUMMARY OF THE INVENTION The present inventor has found that when the number of card fixing screws 21 for fixing the probe card 6 to the frog ring 5 is reduced, the judgment result of the inspection item differs every time the inspection is performed. As a result of various studies on
The area between the parts of the probe card 6 that are fixed to the frog ring 5 by the card fixing screws 21 is pressed upward by the upper pogo pins 25, and the area between the card fixing screws 21 of the probe card 6 becomes The tape carrier 1 is deformed so that the contact state between the input terminal 11 and the output terminal 12 of the tape carrier 1 and the input probe 13 and the output probe 14 of the probe card 6 becomes unstable. Was found.

The present invention has been made based on the above-mentioned findings, and has a rigid reinforcing member provided in a region corresponding to a region where a pogo pin of a frog ring is provided on the upper surface of a probe card. .

A semiconductor device inspection apparatus according to the present invention is directed to a semiconductor device inspection apparatus for inspecting electrical characteristics of a tape carrier package mounted on a performance board and fixed to a tape carrier. A frog ring having a pogo pin electrically connected to the input terminal on the upper surface, and a frog ring having an input terminal for receiving an electric signal output from the performance board on a lower surface, and provided on the frog ring. A probe card having a connection terminal electrically connected to the pogo pin of the frog ring on the lower surface, and having a probe needle at a position corresponding to the input / output terminal of the tape carrier package on the upper surface, and a frog on the upper surface of the probe card A rigid ring provided in the area corresponding to the pogo pins of the ring Bei a reinforcing member, and a fixing screw for fixing the reinforcing member and the probe card in frog ring
The reinforcing member has a ring-shaped planar shape, and
Frog ring pogo pin on top of robe card
Is provided only in the area corresponding to
The robe card is attached to the frog ring with four fixing screws.
It is fixed.

According to the semiconductor device inspection apparatus of the present invention, a rigid ring-shaped reinforcing member is provided in an area corresponding to the pogo pin of the frog ring on the upper surface of the probe card, and the reinforcing member and the probe card are fixed. Since the screw is fixed to the frog ring by the screw, the area between the parts fixed to the frog ring by the fixing screw in the probe card is pressed against the frog ring by the reinforcing member. Area does not deform.

In the semiconductor device inspection apparatus of the present invention,
Preferably, the reinforcing member is made of an insulating material.

In the semiconductor device inspection apparatus of the present invention, it is preferable that an insulating sheet is interposed between the probe card and the reinforcing member.

Further, in the semiconductor device inspection apparatus of the present invention, it is preferable that an insulating coating film is formed in a region where the reinforcing member is provided on the upper surface of the probe card.

In the semiconductor device inspection apparatus of the present invention, the reinforcing member preferably has an L-shaped cross section.

[0024]

FIG. 1 shows a cross-sectional structure of a semiconductor device inspection apparatus according to an embodiment of the present invention, and FIG. 2 shows a structure of a lower surface of a probe card in the semiconductor device inspection apparatus according to the embodiment. FIG. 3 shows the structure of the upper surface of the reinforcing member in the semiconductor device inspection apparatus according to the embodiment. FIG. 1 corresponds to the cross-sectional structure taken along the line II in FIG.

As shown in FIGS. 1 and 2, a large number, for example, a total of 512 input probe needles 13 and output probe needles 14 are provided at the center of the probe card 6, and a probe card 6 is provided. 6, card electrodes 23 as connection terminals are provided on the periphery of the same number as the total number of input probe needles 13 and output probe needles 14. In FIG. 2, the dashed line indicates the card electrode 23.
Indicates an area provided with. Although not shown, the input probe needle 1 in the probe card 6 is not shown.
3. In a region where the output probe needle 14 and the card electrode 23 are not formed, a large number of connection wires extend vertically and horizontally, and the input probe needle 13 and the output probe needle 14 are provided through the connection wires. And the card electrode 23 are electrically connected.

In the peripheral portion of the frog ring 5, for example, 512 through holes penetrating vertically are formed.
A lower pogo pin 24 as an input terminal and an upper pogo pin 25 as a pogo pin are inserted into each through hole. The tip of the lower pogo pin 24 is urged downward by a spring, and the tip of the upper pogo pin 25 is urged upward by a spring. As a result, the lower pogo pins 24 are securely connected electrically to the board electrodes 26 formed on the upper surface of the performance board 4, and the upper pogo pins 25 are securely connected electrically to the card electrodes 23 of the probe card 6. The electric signal supplied from the performance board 4 is transmitted to the input probe needle 13 and the output probe needle 14 of the probe card 6 via the lower pogo pin 21 and the upper pogo pin 22 of the frog ring 5, respectively.

The frog ring 5 is fixed to the performance board 4 by, for example, eight ring fixing screws 22 provided in the circumferential direction.

As a feature of this embodiment, a ring-shaped insulating sheet 30 made of an insulating resin is provided on a peripheral portion on the upper surface of the probe card 6, that is, in a region corresponding to the upper pogo pin 25 of the frog ring 5. On the insulating sheet 30, a ring-shaped reinforcing member 3 made of a rigid material such as stainless steel and having an L-shaped cross section is provided.
1 is provided.

As shown in FIGS. 1, 2 and 3, the probe card 6, the insulating sheet 30 and the reinforcing member 31 are connected to the frog ring 5 by four card fixing screws 21, for example.
It is fixed to.

According to the present embodiment, a rigid reinforcing member 31 is provided in a region corresponding to the upper pogo pin 25 of the frog ring 5 on the upper surface of the probe card 6, and the reinforcing member 31 and the probe card 6 are fixed to the card fixing screws. 2
Since the probe card 6 is fixed to the frog ring 5, the region between the portions of the probe card 6 that are fixed to the frog ring 5 by the card fixing screws 21 is pressed against the frog ring 5 by the reinforcing member 31. For this reason, the card fixing screw 2 in the probe card 6
1 does not deform the region between the parts fixed by the input terminals 1 of the tape carrier 1 shown in FIG.
1 and the output terminal 12 and the contact state between the input probe needle 13 and the output probe needle 14 of the probe card 6 are stabilized.

In the present embodiment, the reinforcing member 31 is made of a conductive material.
The connection sheet formed on the probe card 6 for connecting the input probe needle 13 and the output probe needle 14 to the card electrode 23 is short-circuited due to the interposition of the insulating sheet 30 between them. Is avoided.

In this embodiment, the reinforcing member 3
Since 1 has an L-shaped cross section, even if the thickness of the reinforcing member 31 is suppressed, deformation of the region between the portions of the probe card 6 which are fixed by the card fixing screws 21 is prevented. Can be prevented. But reinforcement member 3
If there is no problem even if the thickness of 1 is large, the reinforcing member 31 may have a rectangular cross section.

Instead of interposing the insulating sheet 30 between the probe card 6 and the reinforcing member 31, an insulating coating film is formed on the upper surface of the probe card 6 in a region corresponding to the upper pogo pins 25 of the frog ring 5. May be.

When the reinforcing member 31 is formed of an insulating material, the input probe needle 13 and the output probe needle 14 can be formed without the insulating sheet 30 or the formation of an insulating coating film. It is possible to avoid a situation in which the connection wires for connecting the power supply and the card electrode 23 are short-circuited.

[0035]

According to the semiconductor device inspection apparatus of the present invention, the region between the parts fixed to the frog ring by the fixing screws of the probe card is pressed against the frog ring by the reinforcing member. Since the area between the fixing screws in the probe card is not deformed, the contact state between the input / output terminal of the tape carrier and the probe needle of the probe card is stabilized. Therefore, according to the present invention, even if the number of fixing screws is reduced, it is possible to avoid a situation in which the judgment result of the inspection item differs for each inspection, so that the reliability of the inspection of the electrical characteristics is improved and the TCP product is improved. Is easy and accurate.

In the semiconductor device inspection apparatus of the present invention,
When the reinforcing member is formed of an insulating material, it is possible to reliably prevent a short circuit between the connection wires connecting the probe needle and the connection electrode in the probe card.

In the semiconductor device inspection apparatus of the present invention, if an insulating sheet is interposed between the probe card and the reinforcing member, even if the reinforcing member has conductivity,
It is possible to avoid a situation in which the connection wires for connecting the probe needles and the connection electrodes in the probe card are short-circuited.

Further, in the semiconductor device inspection apparatus of the present invention, if the insulating coating film is formed on the upper surface of the probe card in the region where the reinforcing member is provided, even if the reinforcing member has conductivity. In addition, it is possible to avoid a short circuit between the connection wires for connecting the probe needles and the connection electrodes in the probe card.

Further, in the semiconductor device inspection apparatus of the present invention, if the reinforcing member has an L-shaped cross section, even if the thickness of the reinforcing member is suppressed, the distance between the fixing screws in the probe card can be reduced. Region can be prevented from being deformed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor device inspection apparatus according to an embodiment of the present invention, showing a cross-sectional structure taken along line II in FIG.

FIG. 2 is a plan view of a lower surface of a probe card in the semiconductor device inspection apparatus according to the embodiment.

FIG. 3 is a plan view of an upper surface of a reinforcing member in the semiconductor device inspection apparatus according to the embodiment.

FIG. 4 is a schematic overall configuration diagram of a TCP handler in which the present invention and a conventional semiconductor device inspection apparatus are incorporated.

FIG. 5 is a diagram showing a state in which an electrical characteristic of a TCP product is inspected by a conventional semiconductor device inspection apparatus.

FIG. 6 is a plan view of a lower surface of a probe card in a conventional semiconductor device inspection apparatus.

7 is a cross-sectional view of a conventional semiconductor device inspection apparatus, showing a cross-sectional structure taken along line VII-VII in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape carrier 2 Supply side tape reel 3 Storage side tape reel 4 Performance board 5 Frog ring 6 Probe card 7 Pusher plate 8 Sprocket 10 Semiconductor chip 11 Input terminal 12 Output terminal 13 Input side probe needle 14 Output side probe needle 15 Temperature Air blowout recess 16 Hot air supply hole 17 Hot air discharge hole 21 Screw for fixing card 22 Screw for fixing ring 23 Card electrode (connection terminal) 24 Lower pogo pin (input terminal) 25 Upper pogo pin (pogo pin) 26 Board electrode Reference Signs List 30 Insulating sheet 31 Reinforcing member

Continued on the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 G01R 1/06-1/073 H01L 21/66

Claims (5)

(57) [Claims] 1. A device mounted on a performance board,
An inspection device for a semiconductor device for inspecting electrical characteristics of a tape carrier package fixed to a tape carrier, comprising: a lower surface having an input terminal for receiving an electric signal output from the performance board; A frog ring having a pogo pin electrically connected to the input terminal; and a connection terminal provided on the frog ring and electrically connected to a pogo pin of the frog ring on a lower surface. A probe card having a probe needle at a position corresponding to an input / output terminal of the tape carrier package on an upper surface, and a rigid ring-shaped provided at a region corresponding to a pogo pin of the frog ring on an upper surface of the probe card. The reinforcing member and the probe card A fixing screw for fixing to the ring , wherein the reinforcing member has a ring-shaped planar shape,
Of the frog ring on the upper surface of the probe card
The reinforcing member and the probe card are provided only in an area corresponding to the pogo pins, and the frog link is provided.
An inspection device for a semiconductor device, wherein the inspection device is fixed to a housing by four fixing screws . 2. The semiconductor device inspection device according to claim 1, wherein the reinforcing member is made of an insulating material. 3. The apparatus according to claim 1, wherein an insulating sheet is interposed between the probe card and the reinforcing member. 4. The semiconductor device inspection apparatus according to claim 1, wherein an insulating coating film is formed in a region on the upper surface of the probe card where the reinforcing member is provided. 5. The semiconductor device inspection apparatus according to claim 1, wherein the reinforcing member has an L-shaped cross section.