JP3208888B2 - Liquid resin composition - Google Patents
Liquid resin compositionInfo
- Publication number
- JP3208888B2 JP3208888B2 JP01156593A JP1156593A JP3208888B2 JP 3208888 B2 JP3208888 B2 JP 3208888B2 JP 01156593 A JP01156593 A JP 01156593A JP 1156593 A JP1156593 A JP 1156593A JP 3208888 B2 JP3208888 B2 JP 3208888B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- liquid resin
- thixotropic
- magnesium silicate
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims description 22
- 239000007788 liquid Substances 0.000 title claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 230000009974 thixotropic effect Effects 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 8
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000391 magnesium silicate Substances 0.000 claims description 8
- 229910052919 magnesium silicate Inorganic materials 0.000 claims description 8
- 235000019792 magnesium silicate Nutrition 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000013008 thixotropic agent Substances 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、エポキシ樹脂を含む
液状樹脂組成物に関するもので、特に、そのチクソトロ
ピー性の安定化を図るための改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid resin composition containing an epoxy resin, and more particularly to an improvement for stabilizing thixotropy.
【０００２】[0002]
【従来の技術】従来のエポキシ樹脂を含む液状樹脂組成
物は、たとえば、セラミック発振子、セラミックフィル
タ、コンデンサのような電子部品のための外装樹脂とし
て用いられている。2. Description of the Related Art A conventional liquid resin composition containing an epoxy resin is used as an exterior resin for electronic components such as ceramic oscillators, ceramic filters, and capacitors.
【０００３】このような液状樹脂組成物には、その流動
特性を改善するため、チクソトロピー性付与剤が配合さ
れている。[0003] Such a liquid resin composition contains a thixotropic agent in order to improve its flow characteristics.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、液状樹
脂組成物において、チクソトロピー性付与剤だけでは、
初期には設計どおりのチクソトロピー性が得られても、
経時的に、その特性は徐々に低下していく。それゆえ、
経時変化の大きな液状樹脂組成物では、チクソトロピー
性の低下により、数日で実用に適さなくなる。However, in the liquid resin composition, only the thixotropic agent is used.
Initially, even if thixotropic properties as designed are obtained,
Over time, its properties gradually decrease. therefore,
A liquid resin composition that changes greatly with time becomes unsuitable for practical use in a few days due to a decrease in thixotropic property.
【０００５】そこで、この発明の目的は、チクソトロピ
ー性が経時的に安定な液状樹脂組成物を提供しようとす
ることである。Accordingly, an object of the present invention is to provide a liquid resin composition having a thixotropic property that is stable over time.
【０００６】[0006]
【課題を解決するための手段】本発明の液状樹脂組成物
は、エポキシ樹脂５〜１５ｗｔ％、チクソトロピー性付
与剤５ｗｔ％以下、平均粒径５〜３０μｍのケイ酸マグ
ネシウム１ｗｔ％以上、残部がチクソトロピー性付与剤
およびケイ酸マグネシウム以外の無機充填剤からなる不
揮発成分と有機溶剤とを含む液状樹脂組成物であって、
前記有機溶剤を液状樹脂組成物の１５〜３５ｗｔ％含有
することを特徴とする。 SUMMARY OF THE INVENTION The liquid resin composition of the present invention
Is 5 to 15 wt% of epoxy resin, with thixotropic property
Silicate mug with an additive of 5 wt% or less and an average particle size of 5 to 30 μm
Nesium 1 wt% or more, the remainder is thixotropic agent
And inorganic fillers other than magnesium silicate
A liquid resin composition containing a volatile component and an organic solvent,
15 to 35 wt% of the organic solvent in the liquid resin composition
It is characterized by doing.
【０００７】上述した組成において、エポキシ樹脂を５
〜１５ｗｔ％としたのは、５ｗｔ％未満では、硬化物の
表面がザラザラし、実用に適さないためであり、１５ｗ
ｔ％を超えると、有機溶剤の揮発速度が遅くなり、実用
に適さないためである。In the above composition, the epoxy resin is
If the content is less than 5 wt%, the surface of the cured product becomes rough and unsuitable for practical use.
If the amount exceeds t%, the rate of volatilization of the organic solvent becomes low, which is not practical.
【０００８】チクソトロピー性付与剤およびケイ酸マグ
ネシウム以外の無機充填剤は、通常、シリカである。シ
リカは、結晶性または非結晶性のいずれであってもよ
い。また、無機充填剤は、シリカを主成分としながら、
必要に応じて、増量のためのもの（たとえば、炭酸カル
シウム）、強度を高めるためのもの（たとえば、ガラス
繊維）、着色のためのもの（たとえば、酸化鉄、酸化チ
タン等の顔料）等を含んでいてもよい。このような無機
充填剤の組成比が９５ｗｔ％を超えると、硬化物の表面
がザラザラし、実用に適さない。 Thixotropic agent and mug silicate
The inorganic filler other than nesium is usually silica. Silica may be either crystalline or non-crystalline. Also, while the inorganic filler is mainly composed of silica,
If necessary, include those for increasing the amount (for example, calcium carbonate), those for increasing the strength (for example, glass fiber), those for coloring (for example, pigments such as iron oxide and titanium oxide) and the like. You may go out. When the composition ratio of the inorganic filler exceeds 95 wt%, the surface of the cured product rough, have such suitable for practical use.
【０００９】チクソトロピー性付与剤としては、微粒シ
リカなど、既に技術常識となっているごく普通のものを
用いることができる。チクソトロピー性付与剤の組成比
を５ｗｔ％以下としたのは、これより多いと、粘度が高
すぎて、作業性が悪くなるためである。[0009] As the thixotropic agent, fine particles
Rica and other ordinary things that are already common technical knowledge
Can be used. The reason why the composition ratio of the thixotropy-imparting agent is set to 5 wt% or less is that if it is more than this, the viscosity is too high and the workability deteriorates.
【００１０】有機溶剤の組成比を１５〜３５ｗｔ％とし
たのは、１５ｗｔ％未満では、粘度が高すぎて作業性が
悪くなり、３５ｗｔ％を超えると、粘度が低くなりすぎ
て無機充填剤の沈降が激しくなり、実用に適さないため
である。The reason why the composition ratio of the organic solvent is set to 15 to 35 wt% is that if it is less than 15 wt%, the viscosity is too high and workability deteriorates, and if it exceeds 35 wt%, the viscosity becomes too low and the inorganic filler becomes too low. This is because sedimentation becomes severe and is not suitable for practical use.
【００１１】ケイ酸マグネシウムの平均粒径を５〜３０
μｍとしたのは、５μｍ未満とすると、機械的強度の低
下が大きく、粘度も高くなり、実用に適さないためであ
り、３０μｍを超えると、硬化物の表面がザラザラし、
実用的でなくなるためである。The average particle size of magnesium silicate is 5-30.
The reason for setting it to μm is that if it is less than 5 μm, the mechanical strength is greatly reduced, the viscosity becomes high and it is not suitable for practical use, and if it exceeds 30 μm, the surface of the cured product becomes rough,
This is because it is not practical.
【００１２】なお、この発明にかかる液状樹脂組成物
は、上述した組成の他に、必要に応じて、樹脂特性を改
善するための適当な添加剤（たとえば、シランカップリ
ング剤、分散剤、消泡剤）を含んでいてもよい。The liquid resin composition according to the present invention may further comprise, if necessary, suitable additives (for example, a silane coupling agent, a dispersing agent, (Foaming agent).
【００１３】[0013]
【発明の作用および効果】この発明において、ケイ酸マ
グネシウムがチクソトロピー性の安定化に寄与する。し
たがって、この発明によれば、チクソトロピー性の経時
変化の小さい液状樹脂組成物を得ることができ、このよ
うな液状樹脂組成物を用いることにより、安定した作業
性を長期間維持することができ、しかも無機充填剤の沈
降も遅くなって、液状樹脂組成物の使用可能な時間を長
くすることができる。In the present invention, magnesium silicate contributes to stabilization of thixotropy. Therefore, according to the present invention, it is possible to obtain a liquid resin composition having a small change with time in thixotropy, and by using such a liquid resin composition, stable workability can be maintained for a long time, Moreover, the sedimentation of the inorganic filler is also slowed, and the usable time of the liquid resin composition can be extended.
【００１４】[0014]
【実施例】この発明に従って、以下のような実験を実施
した。表１には、この発明の実施例１および２ならびに
比較例となる液状樹脂組成物の配合組成が示されてい
る。表１において、（ａ）液状樹脂組成物全体の配合組
成および（ｂ）不揮発分の配合組成が示されている。EXAMPLES The following experiments were conducted in accordance with the present invention. Table 1 shows the compositions of the liquid resin compositions of Examples 1 and 2 of the present invention and Comparative Examples. In Table 1, (a) the composition of the entire liquid resin composition and (b) the composition of the nonvolatile components are shown.
【００１５】[0015]
【表１】 なお、表１において、ケイ酸マグネシウムとしては、平
均粒径２２μｍのものを用いた。また、エポキシ樹脂、
無機充填剤、チクソトロピー性付与剤、添加剤および有
機溶剤としては、以下のものをそれぞれ用いた。[Table 1] In Table 1, magnesium silicate having an average particle size of 22 μm was used. Also, epoxy resin,
The following were used as an inorganic filler, a thixotropic agent, an additive, and an organic solvent.
【００１６】エポキシ樹脂：ビスフェノールＡ型エポキ
シ樹脂（平均分子量１６００） 無機充填剤：非結晶性シリカ（平均粒径３０μｍ） チクソトロピー性付与剤：微粒シリカ 添加剤：シランカップリング剤（γ−グリシドキシプロ
ピルトリメトキシシラン） 表１に示した比較例では、ケイ酸マグネシウムを全く含
んでおらず、実施例１では、不揮発分の配合組成として
１．０６ｗｔ％（約１ｗｔ％）含んでおり、実施例２で
は、不揮発分の配合組成として３．１８ｗｔ％（約３ｗ
ｔ％）含んでいる。これら各試料のチクソトロピー性の
経時変化を評価するため、各試料の液状樹脂組成物の粘
度を、ＢＨ型粘度計３号ロータで、４ｒｐｍおよび２０
ｒｐｍの順に測定し、次式により、チクソトロピック指
数を求めた。Epoxy resin: bisphenol A type epoxy resin (average molecular weight: 1600) Inorganic filler: non-crystalline silica (average particle size: 30 μm) Thixotropic agent: fine-particle silica Additive: silane coupling agent (γ-glycidoxy) (Propyltrimethoxysilane) The comparative example shown in Table 1 does not contain magnesium silicate at all, and Example 1 contains 1.06 wt% (about 1 wt%) as a non-volatile content. In No. 2, 3.18 wt% (about 3 w
t%). In order to evaluate the time-dependent change in the thixotropic property of each of these samples, the viscosity of the liquid resin composition of each sample was measured at 4 rpm and 20 rpm using a BH type viscometer No. 3 rotor.
rpm, and a thixotropic index was determined by the following equation.
【００１７】チクソトロピック指数＝（４ｒｐｍの粘
度）／（２０ｒｐｍの粘度） 各試料のチクソトピック指数の経時変化が、表２および
図１に示されている。Thixotropic index = (viscosity at 4 rpm) / (viscosity at 20 rpm) The change with time of the thixotropic index of each sample is shown in Table 2 and FIG.
【００１８】[0018]
【表２】 これら表２および図１からわかるように、液状樹脂組成
物の不揮発分において、ケイ酸マグネシウムを１ｗｔ％
以上といった少量配合させるだけで、チクソトロピー性
の経時変化が小さくなっている。[Table 2] As can be seen from Table 2 and FIG. 1, 1 wt% of magnesium silicate was contained in the nonvolatile components of the liquid resin composition.
The thixotropy change with the lapse of time is reduced only by adding a small amount as described above.
【図１】この発明に従って実施した実験において得られ
た各試料のチクソトロピック指数の経時変化を示す図で
ある。FIG. 1 is a diagram showing the time-dependent changes in the thixotropic index of each sample obtained in an experiment conducted according to the present invention.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 63/00 - 63/10 C08K 3/34 - 3/36 H01L 23/29 H01L 23/31 ──────────────────────────────────────────────────の Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C08L 63/00-63/10 C08K 3/34-3/36 H01L 23/29 H01L 23/31
Claims (2)
ロピー性付与剤５ｗｔ％以下、平均粒径５〜３０μｍの
ケイ酸マグネシウム１ｗｔ％以上、残部がチクソトロピ
ー性付与剤およびケイ酸マグネシウム以外の無機充填剤
からなる不揮発成分と有機溶剤とを含む液状樹脂組成物
であって、前記有機溶剤を液状樹脂組成物の１５〜３５
ｗｔ％含有することを特徴とする液状樹脂組成物。 1. An epoxy resin having a content of 5 to 15% by weight,
5% by weight or less of a ropiness imparting agent and an average particle size of 5 to 30 μm.
Magnesium silicate 1wt% or more, the remainder is thixotropic
-Inorganic fillers other than property imparting agents and magnesium silicate
RESIN COMPOSITION CONTAINING NONVOLATILE COMPONENT CONTAINING ORGANIC AND ORGANIC SOLVENT
Wherein the organic solvent is 15 to 35 of a liquid resin composition.
A liquid resin composition characterized by containing wt%.
グネシウム以外の無機充填剤がシリカを含有することを
特徴とする請求項１記載の液状樹脂組成物。 2. A thixotropic agent and a silicic acid polymer.
The fact that inorganic fillers other than gnesium contain silica
The liquid resin composition according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01156593A JP3208888B2 (en) | 1993-01-27 | 1993-01-27 | Liquid resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01156593A JP3208888B2 (en) | 1993-01-27 | 1993-01-27 | Liquid resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06220304A JPH06220304A (en) | 1994-08-09 |
| JP3208888B2 true JP3208888B2 (en) | 2001-09-17 |
Family
ID=11781463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01156593A Expired - Lifetime JP3208888B2 (en) | 1993-01-27 | 1993-01-27 | Liquid resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3208888B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790321B2 (en) | 2000-06-26 | 2004-09-14 | Kabushiki Kaisha Toshiba | Method of manufacturing surface acoustic wave device |
-
1993
- 1993-01-27 JP JP01156593A patent/JP3208888B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790321B2 (en) | 2000-06-26 | 2004-09-14 | Kabushiki Kaisha Toshiba | Method of manufacturing surface acoustic wave device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06220304A (en) | 1994-08-09 |
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