JP3213094B2 - Surface polishing machine with sizing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar polishing apparatus with a sizing device, in which the sizing device automatically stops the processing when the thickness of the workpiece being polished becomes equal to a set value. It is about.

[0002]

2. Description of the Related Art As this type of flat surface polishing apparatus with a sizing device, for example, as disclosed in Japanese Patent Publication No. Sho 64-4126, a sun gear and an internal gear arranged coaxially, A work holding carrier meshed with a gear and driven into a planetary gear shape, a drive rotatable upper plate and a lower plate that grind the work held by the carrier from both sides, and a transition of the upper plate. It is known to have a sizing device that detects with a probe, converts the displacement amount into a work thickness, compares it with a set value, and stops processing when the thickness becomes equal to the set value. The probe is brought into contact with the center of the lower surface of the surface plate suspension that supports the upper surface plate, and the transition of the surface surface suspension is detected as the displacement of the upper surface plate.

However, the upper platen is provided with a plurality of studs hanging from the platen suspension and a lower end of the studs, which are suspended from a platen suspension attached to a piston rod of an elevating cylinder via a self-aligning bearing. Because it is supported via a plate, the vibration of the self-aligning bearing is transmitted to the surface plate hanging as it is, or the displacement of the upper surface plate is difficult to be accurately transmitted to the surface plate hanging due to the strain caused by the pressurization of the stud. There is a problem, and therefore, even if the displacement of the surface plate hanging is detected by the probe, it cannot be accurately detected as the displacement of the upper surface plate,
As can be seen from the experimental results shown in FIG. 4, a large error of ± 5 μm may occur between the finished dimension of the workpiece by the automatic sizing and the set value, and the error range may be ± 1 to 2 μm depending on the product. In this type of planar polishing, which must be less than or equal to, there is a problem in sizing accuracy. Also, the value of the meter that displays the measured value of the probe during machining is always 10
It was difficult to determine the size by varying the range between ３０30 μm, and it was also difficult to read on which side the automatic sizing worked.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a plane polishing apparatus with a sizing device capable of accurately detecting a displacement of a stool and performing sizing with high accuracy.

[0005]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a sun gear and an internal gear that are coaxially arranged, and a work holding mechanism that meshes with these two gears and is driven in a planetary gear shape. Carrier, an upper surface plate and a lower surface plate for polishing the work held by the carrier from both sides, and a displacement amount of the upper surface plate is detected by a probe, and the displacement amount is set as a thickness of the work. And a sizing device that stops machining when its thickness becomes equal to the set value,
The upper surface plate has a plurality of studs hanging from the surface plate suspension and a relay plate fixed to the lower end of the stud, which is suspended from a surface plate suspension attached to a lower end of a vertically movable rod via a self-aligning bearing. In the planar polishing apparatus with a sizing device attached via, a detection plate is attached to the relay plate fixed to the lower end of the stud in a non-contact state with the stud and the platen suspension, and the detection plate is attached. The upper surface plate is configured to detect the displacement of the upper surface plate by a probe via the probe.

[0006]

[Function] The displacement of the upper platen is detected by the probe through the detection plate, and the displacement is converted into the thickness of the work and compared with the set value. When the thickness becomes equal to the set value, the fixed size is set. The device stops working and the processing stops.

At this time, since the detection plate is attached to the relay plate fixed to the upper surface plate in a state independent of the stud and the surface plate suspension, the detection plate is provided with a self-aligning bearing or a surface plate. The vibration of the suspension is not transmitted, and the influence of the distortion due to the pressurization of the stud does not occur. For this reason, the displacement of the upper surface plate can be accurately detected through the detection plate. High-precision sizing can be performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described in detail with reference to the drawings. The flat polishing machine shown in FIG. A work 6 provided with an internal gear 4 and held on a carrier 5 driven in a planetary gear shape by both gears 3 and 4 is polished by sandwiching the work 6 from both sides by upper and lower platens 1 and 2.

The lower platen 2, the sun gear 3, and the internal gear 4
Are mounted respectively on drive shafts 8, 9, and 10 arranged coaxially and connected to a drive device 20 via gears at the lower ends of the drive shafts, while the upper surface plate 1 is A pressurizing cylinder 14 for applying a pressing force to the upper platen 1, a pressurizing rod 15 extending from the pressurizing cylinder, and a lower end of the pressurizing rod. Surface plate suspension 17 attached via a core bearing 16, a plurality of studs 1 hanging from the surface plate suspension
8, and a relay plate 1 fixed to the lower end of the stud
9, the engaging member 21 on the relay plate 19 is engaged with the driver 11a at the upper end of the drive shaft 11 at the lowered position shown in the drawing, and is driven by the driving device 20 via the driver 11a. It has become.

As shown in FIG. 2, a probe 25 of a sizing device is attached to the upper inside of the drive shaft 11. This sizing device detects the amount of displacement of the upper stool 1 that descends with the progress of polishing with the probe 25,
The amount of displacement is regarded as the thickness of the work 6 and compared with a set value T (FIG. 1) previously input to the control device 26, and when the thickness becomes equal to the set value, machining is automatically stopped. In order that the displacement of the upper surface plate 1 can be detected by the probe 25, a position where the upper surface plate 1 does not compete with the locking member 21 on the relay plate 19 to which the upper surface plate 1 is fixed,
A pair of columns 28, 28, which are opposite to the studs 18 hanging from the surface plate suspension 17, are erected, and these columns 2
The detection plate 29 is attached between the base plate 8 and 28 so as not to come into contact with the surface plate suspension 17, and the stylus 2 of the probe 25 is attached to the chip 30 fixed to the lower surface at the center of the detection plate 29.
The tip of 5a is in contact.

The probe 25 is of a contact type made of a magnetic scale or the like, and converts the displacement of the stylus 25a that comes into contact with the detection plate 29 into an electric signal as the displacement of the detection plate 29 and extracts it. However, a non-contact type probe such as an air gauge can be used. In the illustrated embodiment, the stylus 25a of the probe 25 is brought into contact with the detection plate 29 via the chip 30, but the probe 25 is directly attached to the detection plate 29 without providing such a chip 30. The displacement of the upper surface plate may be detected by contacting or facing (in the case of a non-contact type). In the drawing, reference numeral 31 denotes a cover also serving as a spring seat, and reference numeral 32 denotes a spring for urging the stylus 25a in a direction in which it comes into contact with the tip 30. Air gauge

In the planar polishing apparatus having the above configuration, prior to the polishing of the work 6, the zero point of the sizing device is adjusted, and the finishing thickness of the work is controlled by the control device 26.
Is set as the target value. The above-mentioned zero point adjustment is performed by lowering the upper surface plate 1 to the lowest point without loading the work 6 between the upper and lower surface plates 1 and 2, and setting the position of the upper surface plate 1 at that time detected by the probe 25 to the zero point. It is done by doing.

The work 6 is polished in the same manner as in a known flat-surface polishing apparatus while the upper platen 1 is raised and each carrier 5 is polished.
, The upper platen 1 is lowered, and the work 6
Is held between the lower platen 2 and a required processing pressure is applied to the work 6, and in this state, both gears 3, 4 and both platens 1, 2 are rotated in a predetermined direction and speed. Will be At this time, the upper platen 1 changes (falls) little by little with the progress of polishing. The amount of the change is detected by the probe 25 via the detection plate 29, and the detected amount of the change is the thickness of the work 6. Is compared with the set value in the control device 26, and when the thickness becomes equal to the set value, the sizing device operates, the drive device 20 is stopped by the control device 25, and the machining is completed.

At this time, since the detection plate 29 to which the probe 25 contacts is attached to the relay plate 19 fixed to the upper stool 1 in a state unrelated to the stud 18 and the stool 17, The vibration of the self-aligning bearing 16 and the surface plate suspension 17 is transmitted to the detection plate 29,
There is no influence of the distortion due to the compression of the stud 18, and therefore, it is possible to accurately detect the displacement of the upper stool 1 via the detection plate 29, and to achieve a high-precision sizing. It can be carried out.

FIG. 3 shows the result of a sizing experiment performed by the plane polishing apparatus of the present invention.
The experiment was performed a total of 11 times by changing m ² , 120 g / cm ² , and 80 g / cm ^2. The error between the finished dimensions of the work and the set value was ± 2 μm except for the last two times. The last two times are 3 μm and 4 μm, which is smaller than the conventional error of ± 5 μm,
It is understood that the sizing accuracy is improved.

[0016]

As described above, according to the present invention, the detection plate is attached to the relay plate to which the upper surface plate is fixed, independently of the stud and the surface plate suspension, and the upper surface plate is probed through the detection plate by the probe. The displacement of the upper surface plate can be accurately detected without being affected by the vibration of the self-aligning bearing, the suspension of the surface plate, and the distortion caused by the pressurization of the stud. , High-precision sizing can be performed.

[Brief description of the drawings]

FIG. 1 is a sectional view of an embodiment of a planar polishing apparatus with a sizing device according to the present invention.

FIG. 2 is an enlarged view of a main part of FIG.

FIG. 3 is a diagram showing the results of a sizing experiment performed by the plane polishing apparatus of FIG. 1;

FIG. 4 is a diagram showing the results of a sizing experiment performed by a conventional planar polishing apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Upper surface plate 2 Lower surface plate 3 Sun gear 4 Internal gear 5 Carrier 6 Work 13,15 Rod 16 Self-aligning bearing 17 Surface plate suspension 18 Stud 19 Relay plate 25 Probe 29 Detection plate

Claims (1)

(57) [Claims] 1. A sun gear and an internal gear arranged coaxially, a carrier for holding a work which meshes with both gears and is driven in the form of a planetary gear, and a work held by the carrier from both sides. The upper platen and lower platen to be sandwiched and polished, and the displacement of the upper platen are detected by a probe, the displacement is converted to the thickness of the work and compared with the set value, and the thickness is equal to the set value A sizing device for stopping the processing when it is completed, wherein the upper stool is suspended from the stool suspension attached to the lower surface of the vertically movable rod via a self-aligning bearing. In a planar polishing apparatus with a sizing device attached via a stud and a relay plate fixed to the lower end of the stud, the relay plate fixed to the lower end of the stud is not in contact with the stud and the surface plate suspension Detected in state Mounting Plates measuring device with a plane polishing apparatus characterized by being configured as to detect the transition of the upper surface plate by a probe through the plate for the detectable.