JP3214577B2 - Filter housing device for chemical copper plating solution filtration - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical copper plating solution for filtering a chemical copper plating solution containing copper powder or the like generated in a chemical copper plating (electroless copper plating) solution for a printed circuit board or the like using a cartridge filter. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a filter housing apparatus for filtering a plating solution, and more particularly to a filter housing apparatus for filtering a chemical copper plating solution, in which air pools and liquid pools are not easily formed and metallic copper is hardly deposited during filtration.

[0002]

2. Description of the Related Art A conventional filter housing device for filtering a chemical copper plating solution by using a cartridge filter to filter a chemical copper plating effluent contains a cartridge filter 1 which is vertically arranged as shown in FIG. In general, a plating solution was put into the housing 2 through an inlet 3 at an intermediate portion of the filter housing 2, and was discharged from a lower outlet 4 of the filter housing 2 through the cartridge filter 1. Reference numeral 2a denotes an openable top cover, and reference numeral 2b denotes a water level gauge.

[0003]

However, in such a conventional filtering apparatus, a plating solution is introduced from an intermediate portion of the filter housing 2 and the filter housing 2
Since air is naturally discharged from the lower part of the filter housing through the cartridge filter 1, it is easy for air to accumulate at the upper part of the filter housing and liquid to accumulate at the upper part of the plating solution in the filter housing. there were. In addition, when the air vent is provided, metallic copper is deposited on the air vent portion and the air vent tube, so that in some cases, the air vent portion and the air vent tube are clogged, and there is a drawback that the function as a filter cannot be achieved. For this reason, it is necessary to constantly drain the liquid from the air vent part, and there is also a disadvantage that the efficiency of the plating solution filtration work decreases, such as frequent filter replacement and in some cases, internal etching is required. there were.

[0004] In particular, in the above-mentioned conventional filtration apparatus, if liquid is formed in the filter housing and copper is deposited, or if copper is deposited on an air vent pipe or the like, copper powder or the like cannot be sufficiently removed. The quality of the plating solution after filtration deteriorates, and when reused in the plating operation, the quality of the plated product is poor and the efficiency of the plating operation is reduced. Had problems. The inventors of the present invention have conducted various studies to improve the above-mentioned drawbacks and problems, and as a result, a plurality of air reservoirs are not provided in the filter housing, and a plurality of liquid reservoirs are not provided in the plating solution. It has been found that it is effective to pressurize the plating solution inside the filter housing that contains the cartridge filter, and that the plating solution is not stagnant, in order to completely eliminate copper powder and the like. Was found to be an important element.

The present invention has been made in view of the above circumstances, and has a good filtering efficiency without generating air pools inside a filter housing and a liquid pool inside a contained plating solution, and completely removes copper powder and the like. It is an object of the present invention to provide a filter housing device for filtering a chemical copper plating solution which can be easily removed.

[0006]

According to the present invention, in order to achieve the above-mentioned object, a plurality of juxtaposed cartridge filters are accommodated in a filter housing having an inlet for a pumped plating solution at a lower portion thereof. While providing an outlet for the filtered plating solution on the upper side of the filter housing,
An upper lid mainly provided with a presser bar for pressing the inner lid holding the plurality of cartridge filters is provided so as to be openable and closable, and is inclined. Open and close by the pivot,
A press bar provided on the upper lid inclined upward in the outlet direction presses the inner lid holding the plurality of cartridge filters vertically, and the plating solution is filtered while the inside of the filter housing is pressurized. This is a filter housing device for filtering a chemical copper plating solution, characterized in that:

[0007]

Next, the operation of the present invention will be described. The used plating solution is fed under pressure from the lower inlet of the filter housing, and passes through a number of liquid inlets of the lower holding plate of the cartridge filter arranged vertically. Press fit into filter housing. The cartridge filters arranged in the filter housing are closed at the lower end, and the upper portion is held in a sealed state by an inner lid holding a plurality of cartridge filters. Therefore, the plating solution press-fitted into the filter housing. Is pressurized and enters the cartridge filters arranged vertically,
During that time, copper powder and the like are completely filtered by the side wall of the cartridge filter. On the other hand, since the upper part of the cartridge filter is open, the plating solution that has entered the cartridge filter is pushed out from the upper part of the cartridge filter, and flows out in the outlet direction along the upper lid inclined upward in the outlet direction. Therefore, in the filter housing device for filtering a chemical copper plating solution according to the present invention, no air pool is generated, and the plating solution flows from below to above in a pressurized state. do not do.

[0008]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view of this embodiment, and FIG. 2 is a top view thereof. In FIG. 1, five cylindrical cartridge filters 5 arranged in a ring shape have their lower ends closed by a stopper 6 and their upper ends opened by a core guide 7. The lower portion of the cartridge filter 5 is supported by a support plate 9 attached to a lower portion in the filter housing 8, and the support plate 9 has a center and a periphery thereof formed with five plating solution passage openings 10. Has been established. On the other hand, the upper part of the cartridge filter 5 is the inner lid 1 attached to the upper part in the filter housing 8.
It is held at 1. The bottom lid 12 provided at the lower portion of the filter housing 8 is provided with an inlet 13 for a plating solution, and the upper side wall of the filter housing 8 is provided with an outlet 14 for a filtered plating solution.

An inclined flange 15 is fixed to the inclined upper edge of the filter housing 8, and an upper cover 16 is provided on the opposite side of the flange 15 from the outlet 14.
The upper cover 16 is opened and closed by a pivot 18 provided outside the outer periphery of the filter housing 8 by the butterfly plate 17. At the center of the upper lid 16 inclined upward in the direction of the outlet 14, a pressing rod 19 for vertically pressing the inner lid 11 holding the plurality of cartridge filters 5 is provided. An operation handle 20 is attached to the upper lid 16, and around the upper lid 16, a closing fitting 21 for holding the upper lid 16 in a sealed state on the inclined flange 15 is provided.

Next, the operation of the present embodiment will be described. The used plating solution is press-fitted from the lower inlet 13 of the filter housing 8 and firstly,
Into the bottom cover 12 provided at the lower part of the vehicle. Then, the cartridge filters 5 arranged side by side in the filter housing 8 are arranged.
Since the lower end is closed by the stopper 6, the plating solution passes through a large number of liquid inlets 10 formed in the lower support plate 9 of the five cartridge filters 5 from the bottom lid 12, and passes through the central portion of the filter housing 8. Press-fit.

Next, the upper part of the center of the filter housing 8 is sealed by an inner lid 11 for holding a plurality of cartridge filters 5, so that the plating solution press-fitted into the filter housing 8 is kept in a pressurized state. As a result, the powder enters the cylindrical cartridge filters 5 arranged vertically, during which copper powder and the like are completely filtered by the side walls of the cartridge filters 5. On the other hand, this 5
Since the upper end of the cartridge filter is opened by the core guide 7, the plating solution that has entered the cartridge filter 5 is pushed out from the upper end opening of the cartridge filter and discharged into the space between the inner lid 11 and the upper lid 16. And then the upper lid 1 inclined upward in the exit direction
It flows out along 6 towards the exit 14.

Next, an experiment for explaining the effect of this embodiment will be described. The embodiment of the present invention used the one shown in FIG. 1, the comparative example used the conventional one shown in FIG. 6, and used the same filter for both. Plating solution used in this experiment is the KC-500 (available from Nikko), the contents of _{CuSO 4 · 5H 2 O10g / l} , EDT
A 28 g / l, formalin 2 ml / l, PH12.
5, Additives The amount was appropriate, and the plating solution temperature was set at 72 ° C. The material of the cartridge filter used in this experiment was polypropylene, and the pore size was 10 to 40 μm. In this embodiment, plating of a 65 μm plating film type was performed six times. In the comparative example, plating of a plating film type having a thickness of 65 μm was performed twice. The results of this experiment are shown in Table 1.

[0013]

[Table 1] As is apparent from the results of the above experiment, according to the present embodiment, all the plating solution entering the filter housing 8 is filtered through the filter 5, so that the filtration efficiency is high and the copper powder and the like can be completely removed. In addition, since the plating solution flows upward from the lower inlet 13 in a pressurized state, no air pool is formed and no liquid pool is generated.
It was found that almost no copper deposition was observed even in the plating solution after the formation of 0 μm, and even in the case of the plating solution after the formation of 390 μm, the filter replacement frequency was extremely low because it was not deposited on the housing wall surface.

[0014]

As described above, according to the present invention, a plurality of cartridge filters arranged side by side are accommodated in a filter housing having an inlet for a plating solution at a lower portion, and the filtered side plate is placed on the upper side surface of the filter housing. A solution outlet is provided, and the plating solution is filtered by setting the inside of the filter housing to a pressurized state by being provided on the upper lid inclined upward in the direction of the outlet, so that all the plating solution entering the filter housing passes through the filter. Filtering efficiency is high, copper powder etc. can be completely removed,
In addition, since the plating solution is forced to flow upward from the bottom, no air pool is formed, and no liquid pool is generated, so that there is an effect that metallic copper does not precipitate during filtration. As described above, since metallic copper does not precipitate during the filtration of the plating solution, the number of replacements of the filter is reduced, and the etching operation in the filter housing becomes unnecessary.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of the present embodiment.

FIG. 2 is a plan view of the present embodiment.

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is a sectional view taken along line BB of FIG. 1;

FIG. 5 is an explanatory view of a sealing device for an upper lid.

FIG. 6 is a longitudinal sectional view of a conventional example.

[Explanation of symbols]

 5 Cylindrical Cartridge Filter 6 Plug 7 Core Guide 8 Filter Housing 9 Lower Support Plate 10 Passage Port 11 Middle Lid 12 Bottom Lid 13 Inlet 14 Outlet 15 Flange 16 Upper Lid 17 Butterfly Plate 18 Axis 19 Presser Rod 20 Operating Handle 21 Closing Bracket

────────────────────────────────────────────────── ─── Continuation of the front page Examiner Wataru Sugie (56) References JP-A-4-322707 (JP, A) JP-A-2-273505 (JP, A) JP-A-3-22506 (JP, U) 1-73316, Kaihei (JP, U) Shokai 59-61816 (JP, U) 5181 (Taisho 12) (JP, Y1T) (58) Fields surveyed (Int. Cl. ⁷ , DB name) ) B01D 29/50 B01D 27/08 B01D 35/02

Claims (3)

(57) [Claims] A plurality of cartridge filters arranged side by side are housed in a filter housing having an inlet for a pumped plating solution at a lower portion, and an outlet for a filtered plating solution is provided on an upper side surface of the filter housing. ,
A filter housing apparatus for filtering a chemical copper plating solution, wherein an upper lid mainly provided with a presser rod for pressing an inner lid holding the plurality of cartridge filters is provided so as to be openable and closable and inclined. 2. An upper lid is opened and closed by a pivot provided outside the outer periphery of the filter housing, and a holding rod provided on the upper lid inclined upward in an outlet direction vertically moves an inner lid holding a plurality of cartridge filters. The filter housing device for filtering a chemical copper plating solution according to claim 1, wherein the filter housing device is configured to be pressed. 3. The filter for filtering a chemical copper plating solution according to claim 1, wherein the plating solution is filtered while the inside of the filter housing accommodating a plurality of cartridge filters arranged in parallel is pressurized. Housing device.