JP3217482B2 - Apparatus for peeling semiconductor chips from wafer sheet - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for peeling a semiconductor chip from a wafer sheet to which the semiconductor chip is adhered when manufacturing the semiconductor chip.

[0002]

2. Description of the Related Art Generally, when manufacturing a semiconductor chip, as shown in FIG. 1, a synthetic resin wafer sheet 2 is bonded to a lower surface of a donut-shaped frame 1 made of a metal plate with an adhesive. Then, on the upper surface of the wafer sheet 2,
A silicon wafer 4 on which a number of semiconductor chips 3 are formed in advance is bonded with an adhesive made of a thermoplastic synthetic resin such as an acrylic resin. In this state, the wafer 4 is diced into each semiconductor chip 3 by dicing. After dividing, each semiconductor chip 3 is separated from the wafer sheet 2.

Conventionally, when each semiconductor chip 3 is peeled off from the wafer sheet 2, the wafer sheet 2 with the semiconductor chip 3 is peeled off from the frame 1, or together with the frame 1, an organic material such as trichlene is used. It is immersed in a solvent solution to dissolve the adhesive made of thermoplastic synthetic resin.

[0004]

The method of stripping with an organic solvent has the advantage that the yield is high because there is very little risk of damaging the semiconductor chip.

However, on the other hand, in addition to using a large amount of the organic solvent, a cleaning step is required after peeling off with the organic solvent, and immersion in the organic solvent,
In addition, the process is extremely complicated because it requires pulling up from an organic solvent and shifting to a cleaning step, so that the cost required for peeling is greatly increased.

According to the present invention, the wafer is bonded to the upper surface of a wafer sheet .
Provided is an apparatus capable of mechanically and reliably separating a large number of semiconductor chips from a wafer sheet without using an organic solvent and without damaging the semiconductor chips. Is a technical issue.

[0007]

In order to achieve this technical object, the present invention provides a method of manufacturing a semiconductor device comprising: a first table on which a wafer sheet formed by bonding a large number of semiconductor chips is mounted;
A second table having an upper surface formed substantially in the same plane as the upper surface of the first table, with a relatively narrow gap provided between one end edge of the second table and one end edge of the first table ; One end edge of both tables
At least one edge of the first table is formed as a sharp edge
On the other hand, before a large number of semiconductor chips are bonded to the upper surface of the first table at a position below one end edge,
A take-up roll for winding one end of the wafer sheet downward around one acute edge of the first table on which the wafer sheet is placed; The semiconductor chip receiving sheet is disposed on the upper surface of the second table so as to move at a suitable speed from below the second table through the gap and away from the gap. A heating means for heating one table to an appropriate temperature is provided. ].

[0008]

In this configuration, one end of the wafer sheet placed on the upper surface of the first table is taken up by a take-up roll provided below the first table, so that the wafer sheet is taken up by the second table. While moving in the direction
It is bent downward from above around one sharp edge of the table, and then pulled downward.

As a result, a large number of semiconductor chips bonded to the upper surface of the wafer sheet are placed on the first table.
From the wafer sheet at one sharp edge at
After released, because that Setto the upper surface of the second table to the semiconductor chip receiving sheet moving at appropriate speed in a direction away from the gap through the gap from below of the second table, the respective semiconductor chip, While being separated from the wafer sheet, it is transferred to a semiconductor chip receiving sheet that moves from the wafer sheet.

[0010] When a semiconductor chip is bonded to a wafer sheet with an adhesive made of a thermoplastic synthetic resin such as an acrylic resin, the adhesive force is determined when the wafer is diced into individual semiconductor chips. It is made relatively strong so that peeling from the sheet does not occur.

Accordingly, as the wafer sheet is pulled downward around one acute edge of the first table, the semiconductor chips adhered to the upper surface of the wafer sheet are moved toward the semiconductor chip receiving sheet on the second table side. When the semiconductor chips are brought into contact with each other, a large external force acts on the respective semiconductor chips due to the strong adhesive force.
Not only is it likely to cause a fatal defect such as chipping or cracking on each semiconductor chip by being cut into a gap between the table and the like, and moreover, the isolation of the wafer sheet from each semiconductor chip is rapidly performed. As a result, the semiconductor chip frequently scatters due to the reaction.

Therefore, in the present invention, the first table is provided with a heating means for heating the first table to an appropriate temperature.

As described above, by heating the first table to an appropriate temperature by the heating means, the adhesive force of the thermoplastic synthetic resin adhesive to the wafer sheet of each semiconductor chip is rapidly reduced by the heating. Can be
As a result, as the wafer sheet to which the semiconductor chips are bonded is pulled downward around one acute edge of the first table, the semiconductor chips bonded to the upper surface thereof are easily separated from the wafer sheet. Yo
Therefore, when this semiconductor chip contacts the semiconductor chip receiving sheet on the second table side, the external force acting on the semiconductor chip can be reduced, so that the semiconductor chip is peeled off from the wafer sheet on the first table. When transferring to the semiconductor chip receiving sheet in the second table, it is possible to reliably reduce the possibility of causing a fatal defect such as chipping or cracking to the semiconductor chip and to prevent the semiconductor chip from scattering around. It can be reduced reliably.

[0014]

Thus, according to the present invention, peeling of a semiconductor chip from a wafer sheet can be achieved by mechanically removing the semiconductor chip from fatal defects and reducing the semiconductor chip scattering. Since there is no need to use an organic solvent such as trichlene as in the related art, there is an effect that the cost required for the peeling can be significantly reduced.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1, reference numeral 4 denotes a wafer sheet 2 having a large number of semiconductor chips 3 adhered to an upper surface thereof with an adhesive made of an acrylic thermoplastic resin or the like. Fig. 4 shows a first table that is mounted in a bonded state .

Reference numeral 5 denotes a second table disposed at a side portion of the first table 4, and the upper surface of the second table 5 is formed to be substantially flush with the upper surface of the first table 4. And the second table 5 stores the second table
A relatively narrow gap 6 is provided between one end 5a of the table 5 and one end 4a of the first table 4, and one end 4a of the first table 4 and the second table 5 are arranged. Are both formed as acute-angled edges.

A portion of the first table 4 below one end 4a is provided with an upper surface of the first table 4.
After one end of the wafer sheet 2 placed on the first table 4 goes around an acute edge 4a of the first table 4, it is pulled downward from above by a rotational drive by a motor (not shown).
The reel 9 on which the semiconductor chip receiving sheet 8 is wound is disposed below the second table 5, and the semiconductor chip unreeled from the reel 9 is disposed below the second table 5. The receiving sheet 8 is wound along a top surface of the second table 5 around one edge 5a of the second table 5, and then wound around a take-up roll 10 provided at a lower portion at the other end of the second table 5. The take-up roll 10 is driven to rotate by a motor (not shown), so that the semiconductor chip receiving sheet 8 is moved from below the second table 5 through the gap 6 between the semiconductor table 8 and the first table 4. It is configured to move at an appropriate speed in a direction away from the reference numeral 6.

In this case, the semiconductor chip receiving sheet 8 may be formed as an endless belt.

Further, the first table 4 contains the first
The table 4 is set to an appropriate temperature (for example, 55 to 60 ° C. when an acrylic adhesive for bonding the semiconductor chip 3 to the wafer sheet 2 is applied to the wafer sheet 2 at a temperature of 55 to 60 ° C.). An electric heater 11 for heating is embedded. A heater cover plate 12 made of Teflon is provided on the upper surface of the electric heater 10 such that the upper surface of the heater cover 12 is flush with the upper surface of the first table 4.

In this configuration, one end of the wafer sheet 2 placed on the upper surface of the first table 4 is placed on the first table 4 .
The wafer sheet 2 is wound around a first end edge 4a of an acute angle to be taken up by a take-up roll 7 disposed thereunder.
Is moved downward in the direction of the second table 5 together with the frame 1, is bent downward from above at the acute end edge 4 a of the first table 4, and then is pulled downward, so that the wafer sheet 2 Glued on top
Frame 1 and each semiconductor chip 3
Frame 1 and half
It peels off from the conductor chip 3 .

Accordingly, each semiconductor chip 3 bonded to the upper surface of the wafer sheet 2 moves the upper surface of the second table 5 from below the second table 5 through the gap 6 and away from the gap 6. Each of the semiconductor chips 3 is separated from the wafer sheet 2 while being in contact with the semiconductor chip receiving sheet 8 moving at an appropriate speed.
The wafer is transferred from the wafer sheet 2 to the semiconductor chip receiving sheet 8 that moves.

In this case, since the electric heater 11 is provided on the first table 4, the wafer sheet 2 can be heated. Therefore, the adhesive force of the adhesive of the semiconductor chip 3 to the wafer sheet 2 is sharply increased by the heating. Can be weakened.

As a result, as the wafer sheet 2 is pulled downward from the acute end edge 4a of the first table 4, the semiconductor chips 3 adhered to the upper surface of the wafer table 2 are pulled down.
It will easily peel off from the wafer sheet 2 and
When the semiconductor chip 3 comes into contact with the semiconductor chip receiving sheet 8 on the second table 5 side, the external force acting on the semiconductor chip 3 can be reduced. When the semiconductor chip 3 is transferred to the semiconductor chip receiving sheet 8 in the second table 5 while being peeled off from the semiconductor chip 2, it is possible to reliably reduce the occurrence of fatal defects such as chipping and cracks on the semiconductor chip 3, and to reduce the number of semiconductor chips. 3 can be surely reduced from scattering around.

The moving speed of the semiconductor chip receiving sheet 8 on the second table 5 side is controlled by the first table 4.
When the semiconductor chips 3 are transferred to the semiconductor chip receiving sheet 8 on the second table 5 side by increasing the pulling speed of the wafer sheet 2 on the side of the table, the interval between the semiconductor chips 3 is increased. Can be.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing a state in which a wafer sheet is bonded to a frame.

FIG. 2 is a vertical sectional front view of the embodiment device according to the present invention.

FIG. 3 is a plan view of FIG. 2;

FIG. 4 is an enlarged view of a main part of FIG. 1;

[Explanation of symbols]

 Reference Signs List 1 frame 2 wafer sheet 3 semiconductor chip 4 first table 4a one end edge of first table 5 second table 5a one end edge of second table 6 gap 7 take-up roll 8 semiconductor chip receiving sheet 11 electric heater

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tetsuro Oki 100 Tomioka, Kasaoka City, Okayama Prefecture Inside (72) Inventor Takato Odahara 100 Tomioka, Kasaoka City, Okayama Prefecture Inside Wako Electric Corporation (56) References Special JP-A-60-138935 (JP, A) JP-A-2-128445 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/301

Claims (1)

(57) [Claims] 1. A by bonding a plurality of semiconductor chips on an upper surface formed
A second table having an upper surface formed substantially in the same plane as the upper surface of the first table is provided on a side portion of the first table on which a wafer sheet is placed.
It is arranged with a relatively narrow gap between it and one end of the table, and at least
In the first table, one end edge of the first table is formed as an acute edge.
On the other hand, one end of the wafer sheet having a large number of semiconductor chips adhered to the upper surface thereof at a position below one end edge of the first table, and an acute angle in the first table on which the wafer sheet is mounted. A winding roll adapted to be wound downward around one edge of the second table is provided, and a semiconductor chip receiving sheet is provided on the upper surface of the second table through the gap from below the second table. The semiconductor chips are arranged so as to move at an appropriate speed in a direction away from the gap, and further, heating means for heating the first table to an appropriate temperature is provided on the first table. Equipment for peeling.