JP3220102B2 - Magnetic head device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head device which is provided, for example, in a hard disk device and has a head assembly and a driving member. The present invention relates to a magnetic head device which can be easily manufactured and can reduce a load applied to a head assembly.

[0002]

2. Description of the Related Art For example, a magnetic head device mounted on a hard disk device is configured to include a head assembly and a driving member for fixing and supporting the head assembly. The head assembly includes a slider, a magnetic function portion including a core provided on a side end surface of the slider and a coil wound on the core, and a support member having the slider attached to a tip thereof. The base of the support member is fixedly supported by a driving member.

[0003] A lead wire with a tube extending from the coil of the magnetic function part extends over the support member to the drive member side. The lead wire is, for example, soldered to a wiring from the driving member side, and the coil of the magnetic function unit is electrically connected to an external circuit. The lead wire is fixed on the support member by, for example, a fixing claw. The drive member is configured to rotate, and by rotating, the magnetic function portion of the head assembly facing the disk surface moves from the inner circumference to the outer circumference of the disk.

[0004]

However, the conventional magnetic head device has the following problems. The tube into which the lead wire extending from the magnetic function unit is inserted is extended over the support member to the drive member side,
On the drive member side, the lead wire and the lead wire on the drive member side are joined by soldering. Therefore, it is necessary to solder the lead wires and the like on the drive member side, and the wiring connection work is complicated. It is. Further, on the driving member side, a relay member for soldering the lead wire extended from the magnetic function portion is required, and the structure on the driving member side becomes complicated.

[0005] Since the lead wire extends for a long distance to the drive member side outside the support member, external noise is likely to be superimposed on the lead wire. In recent high-density recording disk devices and the like, since the frequency of the recording / reproducing signal is high, the superposition of external noise on the lead wire tends to deteriorate the accuracy of the recording or reproducing signal.

When the head assembly is completed, the lead wire and the tube are extended long, so that the lead wire is entangled with another lead wire during storage and during the assembling work, resulting in poor working efficiency. There is.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and in particular, it is intended to facilitate the conductive connection between a head assembly and external wiring, and to prevent a long lead wire from extending from the head assembly. It is an object of the present invention to provide a magnetic head device having the above configuration.

[0008]

A magnetic head device according to the present invention.
Is a slider facing the recording medium, and is mounted on the slider.
With a magnetic function part and a slider attached to the tip
And a support member supporting the base of the support member.
And a driving member for moving the ink along the recording medium.
In the magnetic head device, the support member is provided at the base.
An electrode portion is provided on the fixed portion that is
The part facing the fixing part includes an electrode part and this electrode
Flexible pre-formed with leads connected to the part
A printed circuit board is stuck and provided on the support member.
Provided on the electrode portion and the flexible printed circuit board
And the electrode portion is in a direction perpendicular to the surface of the electrode portion.
Conducted without soldering due to face-to-face pressure contact
In this case, the support member and the fixing member are fixed.
It is characterized by the following.

In this case, the fixing portion of the support member
Is electrically connected to the electrode portion and the electrode portion on the insulating layer.
The leads can be patterned.

In the above-mentioned support member, the insulating layer and the lead formed thereon extend toward the front end of the support member, and the front end of the lead and the magnetic function portion are separated from each other. Alternatively, in the support member, the insulating layer and the lead formed thereon extend toward the front end of the support member, and the front end of the lead May be directly connected to the magnetic function unit.

Further, the insulating layer, the electrode portion, and the lead provided on the fixed portion of the support member may be a flexible cable attached to a support member, or the fixed portion of the support member may be a flexible cable. The insulating layer provided in
It may be an insulating thin film directly formed on the support member, and the electrode layer and the lead are pattern-formed on the insulating thin film.

The driving member may include a plurality of the support members.
The flexible printed circuit board is attached to a side surface of the driving member, and a plurality of terminal boards are provided on the flexible printed circuit board.
Is bent and extends to a portion of the support member facing the fixed portion, and an electrode portion provided on each support member,
The electrode portions provided on the respective terminal substrates are pressed into contact with each other.
It can be assumed that.

[0013]

In the above means, an electrode portion and a lead electrically connected to the electrode portion are formed on the base of the support member via an insulating layer in a pattern, and / or a driving member opposed to the base of the support member is formed. A flexible printed circuit board on which an electrode portion and a lead electrically connected to the electrode portion are formed in a pattern is adhered, and the electrode portion on the support member side and the electrode portion on the drive member side are face-to-face bonded, so that both sides are joined. The electrodes are electrically connected to each other.

The insulating layer provided on the base of the support member and the leads formed thereon are preferably formed to extend to the front end of the support member, particularly when the magnetic function part is a thin film element. In this case, the tip of the lead is formed so as to extend to the electrode portion of the thin film element, and the lead and the electrode portion of the thin film element are directly conductively joined, thereby facilitating wiring work. This is preferred. Further, the flexible printed circuit board adhered to the driving member may be formed not only at a position facing the base of the supporting member but also at a side surface of the driving member.

[0015]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a partially exploded perspective view of a magnetic head device according to one embodiment of the present invention, FIG. 2 is a partial cross-sectional view showing a mounting state of a top head assembly and a driving arm, and FIG. 3 shows a state after mounting. It is a partial sectional view.

FIG. 1 shows a magnetic head device of a hard disk device. In the hard disk device, a plurality of disks D are stored, and these disks are driven to rotate. Head assembly 2 on both sides of each disk D
1 are facing each other. In FIG. 1, a plurality of head assemblies 21 are shown.
3 shows the mounting structure of the head assembly 21 facing the upper surface of the uppermost disk.

The head assembly 21 has a slider 22 and a support member 23 for supporting the slider. 1 to 3
In the uppermost head assembly 21 shown in FIG. The slider 22 includes a slider 22a and a core 22b, a coil C is wound around the core 22b, and a magnetic gap G is formed at a joint between the slider 22a and the core 22b.

The support member 23 is composed of a flexure 24 and a load beam 25.
The upper surface a is bonded to the flexure 24. The flexure 24 is fixed to the front end of the load beam 25 by welding or the like. The load beam 25 is a rigid portion having folded portions 25a, 25a formed from an intermediate portion to a front portion, and a rear end portion is a leaf spring function portion 25b and a fixed portion 25c. Fixed part 25c of load beam 25
A mounting member 26 is fixed to the lower surface of the mounting member 26 by means such as welding, and a cylindrical caulking portion 27 is formed at an intermediate portion of the mounting member 26 so as to protrude. The caulking portion 27 protrudes upward in the drawing from a hole formed in the fixing portion 25c of the load beam 25.

A printed circuit board 28 on a film is adhered to the upper surface of the fixing portion 25c of the load beam 25 in the drawing. Four electrode patterns 2 are provided on the surface of the printed circuit board 28.
, Land patterns 28c, 28c located at the edge of the substrate, and lead patterns 28b connecting the respective electrode patterns 28a and land patterns 28c.
28b are formed. Core 2 of the slider 22
The coated copper wire of the coil C wound around 2b is extended as it is to become the lead wires 29. As shown in FIGS. 2 and 3, the lead wires 29, 29.
a, 29a, is guided to the upper surface of the load beam 25, and the tip of the lead wire is connected to the land pattern 28c, 2a.
8c are soldered.

The head assembly 21 in which the slider 22, the flexure 24, the load beam 25, and the mounting member 26 are assembled is managed and stored as a semi-finished product. The wiring process is completed, and the lead wire in the free state as in the related art does not extend from the head assembly 21. Therefore, during management and storage, there is no problem of wire entanglement or disconnection, and no waste of copper wire occurs.

Reference numeral 31 shown in FIG. 1 is a head driving member. The head drive member 31 includes a plurality of drive arms 32, 3
Are extended, and the head assembly 21 is fixed to the tip of each drive arm 32. The head driving member 31 rotates about an axis, thereby causing the slider 2 to move.
2 moves from the inner circumference to the outer circumference of the disk D.

A flexible printed circuit board 33 is adhered to the side surface of the head driving member 31, and a terminal board 34 extended from the flexible printed circuit board 33 is extended to a front end of each drive arm 32. In the uppermost driving arm 32, the terminal substrate 34 extends only on the lower surface, in the lowermost driving arm 32, the terminal substrate 34 extends only on the upper surface, and in the intermediate driving arm 32, the terminal substrate 34 extends on both upper and lower surfaces. Has been extended. The terminal board 34 is adhesively fixed to a portion of the head assembly 21 facing the printed board 28.

The terminal board 34 has an electrode pattern 34 corresponding to the electrode pattern 28a of the head assembly 21 on a one-to-one basis.
are formed, and the electrode patterns 34a, 3a are formed.
The lead patterns 34c extending from 4a extend to the flexible printed circuit board 33 and are connected to other circuits in the disk drive. A through hole 32a is formed at the tip of the drive arm 32, and the terminal board 34
A hole 34b communicating with the through hole 32a is formed.

When the head assembly 21 is mounted on the lower surface of the uppermost drive arm 32, the caulking portion 27 of the mount member 26 is connected to the hole 34b of the terminal board 34 and the drive arm 32 as shown in FIG. It is inserted into the through hole 32a. Then, as shown in FIG. 3, a pressing force F is applied, and the projecting portion of the caulking portion 27 is caulked and fixed to the upper surface of the drive arm 32. At this time, the electrode patterns 28a, 28a on the head assembly 21 side and the electrode patterns 3 on the drive arm 32 side
4a and 34a are face-to-face joined by the pressing force F, and a conduction path from the coil C wound around the core 22b to the flexible printed circuit board 33 is formed.

The electrode patterns 28a and 34a are electrically connected by face-to-face bonding. In order to minimize the electrical resistance of the bonding part, each electrode pattern is preferably formed of a metal film such as gold or silver.

The head assembly 21 is mounted on the upper and lower surfaces of the front end of the intermediate drive arm 32 of the head drive member 31. FIGS. 4 and 5 show the mounting structure in this case. In FIG. 4, the head assembly 21 attached to the lower surface side of the drive arm 32 has the same orientation as that of FIG. 1, the slider 22 attached to the front end of the load beam 25 faces downward, and the slider 22 opposite. The mount member 26a joined to the fixed portion 25c at the base of the load beam 25 faces downward and the printed circuit board 28 faces upward. The head assembly 21 mounted on the upper surface side of the drive arm 32 is turned upside down as shown in FIG. 1, the slider 22 at the front end of the load beam 25 faces upward, and the slider 22 faces the lower surface of the disk. In the head assembly 21 mounted on the upper surface of the drive arm 32,
The mount member 26a joined to the fixed portion 25c at the base of the load beam 25 is facing upward, and the printed circuit board 28 is facing downward.

On the mount members 26a, 26a facing the upper and lower surfaces of the drive arm 32, there are formed cylindrical press-fit portions 27a, 27a having the same external dimensions and the same axial length. As shown in FIG. 4, the press-fitting portions 27a and 27a are press-fitted into the through-hole 32a of the drive arm 32 from both upper and lower directions, and at this time, the tips of the press-fitting portions 27a and 27a do not hit. During this press-fitting operation, the drive arm 32
The electrode patterns 34a, 34a,.
And the respective electrode patterns 28 on the head assembly 21 side
are joined face-to-face.

In the embodiment shown in FIG. 5, the external dimensions of the press-fitting portion 27b extending downward from the mount member 26b of the head assembly 21 above the drive arm 32 are adjusted to the inner peripheral surface of the through hole 32a of the drive arm 32. It is set so that it can be pressed. A press-fit portion 27c extending upward is formed on the mount member 26c of the lower head assembly 21, and the press-fit portion 27c is set to have an outer dimension that can be press-fit into the inner peripheral surface of the press-fit portion 27b. And both press-fit parts 27b and 2
7c are press-fitted in the through hole 32a so as to overlap each other. The electrode patterns 34a, 34a... And the electrode patterns 28a, 28a.

Further, a head assembly 21 is mounted on the upper surface of the lowermost drive arm 32 of the head drive member 31 in the direction opposite to that of FIG. In this case, the caulking unit 27
Is caulked and fixed to the drive arm 32. In the uppermost and lowermost head assemblies 21, the mount member 26 and the drive arm 32 may be fixed by press-fitting instead of swaging.

FIGS. 6 and 7 show a head assembly according to another embodiment of the present invention. Head assembly 2 shown in FIG.
1a, a film-like flexible cable 35 is fixed to the upper surface of the load beam 25 by means such as bonding. At the base on the flexible cable 35, electrode patterns 35c, 35c... Which are face-to-face joined to the drive arm side are formed, and the lead patterns 35a, 35a conducted to the electrode patterns 35c, 35c.
5 toward the front. In the example shown in FIG. 6, a thin film element 41 is provided on the trailing side end surface of the slider 22, and the thin film element 41 forms a magnetic function section for recording and reproduction. In this case, the leading end 35b of the flexible cable 35 can be extended to the trailing end of the slider 22, and the leading end of the flexible cable 35 can be directly joined to the electrode of the thin film element 41.

In FIG. 6, when the slider 22 is of a bulk type having the core 22b and the coil C shown in FIG. 1, the leading end of the flexible cable 35 extends to the leading end of the load beam 25 and extends from the coil C. The lead wire may be soldered to the land at the tip of the flexible cable 35.

In the head assembly 21b shown in FIG. 7, an insulating thin film 36 formed by directly applying an insulating resin is formed on the upper surface of the load beam 25, and the lead patterns 36a, 3a are formed thereon.
6a and the electrode patterns 36c, 36c are formed. Land patterns 36b, 36 are provided at the tip of the insulating thin film 36.
are formed, and the lead wire extending from the coil C of the bulk type slider 22 or the lead wire 2a extending from the electrode when the thin film element 41 is used is soldered to the land pattern.

In the structure shown in FIG. 6, the flexible cable 35 using a resin film as a base material overlaps with the leaf spring function part 25b of the load beam 25. It affects the elastic force of 25b. Therefore, the slider 2
Depending on the setting of the initial pressing force between the disk 2 and the disk, it may be necessary to change the thickness of the load beam 25 from the conventional one. However, in FIG. 7, the insulating resin is directly applied to the load beam 25 to form the insulating thin film 36 without using the film base material. Few.

In each of the above embodiments, the head driving member 31 rotates about the axis, and the slider moves from the inner peripheral side to the outer peripheral side of the disk, but the disk driving member operates linearly. It may be something. In addition, the apparatus may have only one disk. The apparatus is not limited to a hard disk, but may be any apparatus as long as the slider moves along the recording medium, such as a magneto-optical disk apparatus or a mini disk apparatus. Such a model can be implemented.

[0035]

According to the present invention, the conductive connection between the supporting member and the driving member is performed by facing the electrode portions patterned on at least one side, so that the soldering operation on the driving member side is performed as in the conventional case. And wiring work can be simplified. Further, it is not necessary to provide a relay member for soldering a lead wire to the drive member side, and the structure on the drive member side can be simplified.

Further, by forming the leads formed on the base of the support member so as to extend in the direction of the front end of the support member, the load applied to the support member can be reduced as compared with the related art.

Further, since there is no lead wire extending long from the support member to the outside, the wiring path does not become long unlike the related art, and it is hardly affected by external noise. Lines are not entangled or cut. In addition, since there is no unnecessary wiring portion, there is no waste of wiring material.

[Brief description of the drawings]

FIG. 1 is a partially exploded perspective view showing a mounting portion between a head assembly and a drive arm in a hard disk drive as one embodiment of the present invention;

FIG. 2 is an exploded cross-sectional view of a joint between the head assembly and the drive arm of FIG. 1;

FIG. 3 is a sectional view showing a state in which the head assembly is attached to a drive arm in FIG. 1;

FIG. 4 is a cross-sectional view showing a state where a head assembly is attached to both upper and lower surfaces of a drive arm;

FIG. 5 is a cross-sectional view showing another structure when a head assembly is attached to both upper and lower surfaces of a drive arm.

FIG. 6 is a perspective view showing a head assembly according to a second embodiment of the present invention;

FIG. 7 is a perspective view showing a head assembly according to a third embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Head assembly 22 Slider 22a Slider 22b Core 23 Support member 24 Flexure 25 Load beam 25b Leaf spring function part 25c Fixed part 26 Mount member 27 Caulking part 28 Printed circuit board 28a Electrode pattern 31 Head drive member 32 Drive arm 32a Through hole 34 Terminal Substrate 34a Electrode pattern

Claims (7)

(57) [Claims] 1. A slider facing a recording medium, a magnetic function portion provided on the slider, a support member having a slider attached to a leading end, and a slider supporting the base of the support member to mount the slider on the recording medium. in the magnetic head device and the drive member is provided for moving along said support member
An electrode portion is provided on a fixed portion provided at a base portion of the flexible member, and a flexible printed board formed with an electrode portion and a lead connected to the electrode portion is formed on a portion of the driving member facing the fixed portion. It is attached to the support member
The provided electrode portion and the electrode portion provided on the flexible printed circuit board are perpendicular to the surface of the electrode portion.
Pressure contact from different directions to conduct without soldering
The magnetic head device , wherein the support member and the fixing member are fixed in a state where the magnetic head is fixed . In the fixing unit according to claim 2, wherein said supporting member, the magnetic head device according to claim 1, wherein the leads are patterned to be electrically connected to the the electrode portion and the electrode portion on the insulating layer. 3. The support member, wherein the insulating layer and a lead formed thereon extend toward a front end of the support member, and the front end of the lead and the magnetic function unit are separated from each other. 3. The magnetic head device according to claim 2 , wherein the magnetic head device is connected by a lead wire. 4. The support member, wherein the insulating layer and a lead formed thereon extend toward a front end of the support member, and the front end of the lead is directly connected to the magnetic function unit. 3. The magnetic head device according to claim 2, wherein: 5. The magnetic head device according to claim 2 , wherein the insulating layer, the electrode portion, and the lead provided on the fixing portion of the support member are flexible cables attached to the support member. 6. The insulating layer provided on the fixing portion of the support member is an insulating thin film directly formed on the support member, and the electrode layer and the lead are pattern-formed on the insulating thin film. The magnetic head device according to claim 2 . 7. A plurality of supporting members are mounted on the driving member.
Attached, the flexible printed circuit board is attached to the side surface of the drive member, in the flexible printed circuit board
A plurality of terminal boards are provided, and each terminal board is bent and extends to a portion of the support member facing the fixing portion.
And the electrode portion provided on each support member,
Pressed to the electrode parts provided on each terminal board
The magnetic head device according to claim 1 or 2, wherein that.