JP3227954B2 - Lead forming method for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to hermetically sealing a semiconductor device.
Package and multiple external devices provided on the bottom of the package
The present invention relates to a lead forming method for a semiconductor device including leads .

[0002]

2. Description of the Related Art Generally, laser diodes and photo diodes are used.
A hermetic seal type semiconductor device such as that found in a diode or the like has a structure as shown in FIG. In the configuration of the semiconductor device 1 shown in the figure, a semiconductor element is hermetically sealed inside a cylindrical package 2 by embedding glass. A plurality of external leads 3 extend from the cylindrical bottom surface 2a of the package 2 to obtain electrical connection with the outside.

In this type of semiconductor device 1, ease of handling in parts transportation and transfer, ease of die bonding and wire bonding, and plating treatment (gold plating) on the surface of the external lead 3 are performed. For example, as shown in FIG. 6, the leading ends of the external leads 3 are handled in a state in which they abut against each other until the product is shipped.

On the other hand, when electrical characteristics are checked after the assembly is completed, or when the semiconductor device 1 is mounted on a printed circuit board or the like, the external leads 3 whose tips are in contact with each other are replaced by some means. Accordingly, it is necessary to form the external lead 3 into a shape as shown in FIG.

[0005]

However, in the prior art, when forming the external leads 3, a worker picks the external leads 3 one by one with tweezers or the like and semi-forcedly forms the external leads 3. This causes damage to the plated surface of the lead 3 and causes a problem of plating peeling.
In addition, since the operation relies on the scale of the operator, the shape of the external lead 3 after molding varies, and defects such as bending of the lead have occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and a method of forming a lead of a semiconductor device capable of always forming an external lead into a uniform shape without damaging a plating surface of the external lead. It is intended to provide.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and a plurality of external leads are provided on a bottom surface of a package so as to be arranged on a circumference. What is claimed is: 1. A lead forming method used for forming a lead of a semiconductor device in which distal ends of external leads are in contact with each other, wherein the semiconductor device is held in an upright state by a chuck portion and bases of the plurality of external leads are provided. The plurality of radially arranged claws are advanced into the gaps formed on the sides in a non-contact state with the external leads to change the relative positions of the chuck portion and the claws in the rising direction of the semiconductor device. The leading ends of the external leads are slightly pushed and spread in a direction away from each other, and a tapered portion having a substantially pointed tip with respect to the leading ends of the plurality of external leads in the spread state. By inserting a forming head having a groove for leading expanding from the upright direction of the semiconductor device in is for forming a plurality of external leads in a parallel state.

[0008]

In the method of forming a lead of a semiconductor device according to the present invention, the semiconductor device held upright by the chuck portion is radially arranged in a gap formed on the base side of the external lead. the external lead and Hise' the claw portion of the
In this state, the relative position of the chuck portion and the claw portion in the upright direction of the semiconductor device is changed .
When the external leads and claws come into contact with each other,
Push the leads slightly apart in the direction away from each other.
It is. Furthermore, a plurality of external resources in the expanded state are provided.
Tapered tip with a sharp point
Semi-conducting head with concave groove for lead expansion
By inserting from the standing direction of the body device, the corresponding
While the external leads are engaged in the concave grooves, a plurality of external leads are
It is expanded and molded in parallel.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an overall view showing one embodiment of a lead molding machine according to the present invention. The lead molding machine 10 of the present embodiment mainly includes a pedestal 11 on which a semiconductor device is set and a molding head 12 for molding external leads.
And a support mechanism for supporting the molding head 12.

FIGS. 2A and 2B are views for explaining the configuration of the pedestal 11 described above. FIG. 2A is a plan view, and FIG. 2B is a front view. As shown in the figure, a thin disk 13 is rotatably provided above the pedestal 11. A plurality of guide holes 14 having a constant inclination (for example, 45 °) with respect to the center of the disk 13 are formed on the same circumference in accordance with the number of external leads of a semiconductor device (not shown). They are provided at regular intervals. A pair of operation levers 15 are attached to the outer periphery of the disk 13.

On the other hand, the spacer 1
A plurality of claw portions 17 are radially arranged via 6.
A protruding pin 18 is fixed to each claw portion 17 by a screw pair, and these protruding pins 18 are engaged with the guide holes 14 of the disk 13 described above. Here, each claw portion 17 is supported by a support plate 20 attached to an upper end of a column 19.
Above, it is incorporated movably along the radial direction of the disc 13 by a not-shown projecting guide interposed in the gap between the claws 17. Further, the tip side of each claw portion 17 is formed in a tapered shape as shown in FIG. In addition, as can be seen from FIG.
On the bottom surface of the cage 2, a plurality of leads 3 are arranged on a circumference.
And the tips of the leads 3 abut each other.
State.

Further, on the lower surface side of the support plate 20, a chuck portion 21 is provided. As shown in FIG. 3, the chuck portion 21 holds the semiconductor device 1 in an upright state via the peripheral portion of the package 2 and includes a pair of open / close chucks 22 corresponding to the package shape. A peripheral groove 23 is formed in each of the opposing inner peripheral portions of each opening / closing chuck 22, and the flange portion 2 b of the package 2 is fitted into the peripheral groove 23. The lever receiving portion 2 is provided at one end of the chuck portion 21.
4 (FIG. 2) is provided, and the opening / closing chuck 22 is configured to open and close when the lever receiving portion 24 is pressed by an operation lever 25 described later. Incidentally, the small projection 4 indicating the polarity of the semiconductor device 1 is sandwiched between the two opening and closing chucks 22 in a state where the opening and closing chucks 22 are closed, whereby the semiconductor device 1 in the rotational direction is rotated.
Is determined.

In addition, the pedestal 11 has a chuck portion 21 in the upright direction (vertical direction in the figure) of the semiconductor device 1.
A variable mechanism that makes the relative position between the hook and the claw portion 17 variable is configured as follows. That is, the chuck portion 21
The movable block 26 is attached to the upper end of the movable block 26 with screws, and the movable block 26 itself is slidably fitted to the outer cylinder 27. Further, a coil spring 28 is incorporated in the movable block 26, and the coil spring 28
The chuck portion 21 is urged upward together with the movable block 26 by the elastic force of. Further, the movable block 26
, A roller 29 is rotatably provided, and the operation lever 25 is in contact with the roller 29. One end of the operation lever 25 is pivotally connected to a distal end of the connecting member 30 via a support shaft 31. The base side of the connecting member 30 is
It is attached to the upper end of the support arm 32 via a pivot 33.

In the variable mechanism having the above configuration, when the operating lever 25 in contact with the roller 29 is pressed down against the urging force of the coil spring 28, the movable block 26 slides downward while being guided by the outer cylinder 27, As a result, the distance between the chuck portion 21 and the claw portion 17 increases, and the relative positions of the semiconductor device 1 in the rising direction change. In the configuration of the pedestal 11, the support 19,
The outer cylinder 27 and the support arm 32 are fixed on a base plate 34.

Next, the forming head 12 and its supporting mechanism will be described. First, as shown in FIG.
2 is attached to the lower end of the rod 35, and the rod 35 itself is slidably engaged with a guide block 37 fixed to the main arm 36. In addition, an engagement pin 38 protrudes from the upper end of the rod 35. On the other hand, one end of a head lever 39 is pivotally supported at the upper end of the main arm 36, and a grip 40 for lever operation is provided at the other end of the head lever 39. Further, a guide hole 41 is provided in the middle of the head lever 39, and the engaging pin 38 of the rod 35 is engaged with the guide hole 41. Here, the head lever 39 is constantly urged upward by the elastic force of the coil spring 42. The movable range of the head lever 39 is regulated by the stopper 43. In such a supporting mechanism, the rod 35 moves up and down while being guided by the guide block 37 by moving the head lever 39 in the direction of the arrow in FIG. It moves in the direction, that is, in the vertical direction in the figure.

The tip of the molding head 12 is shown in FIG.
As shown in (a) and (b), the taper is almost pointed
The tapered tapered portion (circumferential portion) is formed with a groove 12a for lead expansion that can be engaged with the external lead 3 of the semiconductor device 1. Here, the forming head 12
Are formed by the number of the external leads 3 in the semiconductor device 1, and the external leads 3 are engaged with the concave grooves 12a one by one when the leads are expanded.

Next, a procedure for molding external leads of a semiconductor device using the lead molding machine having the above configuration will be described. First, by operating the operation lever 25 in the R direction (FIG. 2) with the support shaft 31 of the connecting member 30 as a fulcrum, the lever receiving portion 24 of the chuck portion 21 is pressed, and the pair of open / close chucks 22 is opened. Next, a plurality of external leads 3
Semiconductor device 1 in which the tip portions of the semiconductor devices are in contact with each other
Is inserted into the chuck portion 21 with the package 2 facing downward, and the operation lever 25 is returned to the original position in this state. As a result, the flange portion 2a of the package 2 and the peripheral groove 23 of the opening / closing chuck 22 are fitted, and the semiconductor device 1 is gripped by the chuck portion 21 upright through the peripheral edge of the package 2.

Subsequently, the disc 1 is operated by operating the operation lever 15.
Rotate 3 clockwise. Thereby, each claw part 1
The projecting pin 18 provided on 7 is displaced along the guide hole 14 of the disk 13. At this time, the position of each protruding pin 18 is determined by the difference between the distance L1 from the center of the disk 13 to one end of the guide hole 14 and the distance L2 to the other end of the guide hole 14 (the center of the disk 13). Part). With the displacement of the protruding pin 18, each claw 17 also moves toward the center of the disk 13, thereby being formed on the base of the external lead 3 of the semiconductor device 1 as shown in FIG. In the gap,
The tips of the claws 17 advance.

Next, the operation lever 25 abutting on the roller 29 of the movable block 26 is pushed down, and the movable block 26 fitted to the outer cylinder 27 is slid downward against the urging force of the coil spring 28. Thereby, the chuck 2
1 moves downward together with the movable block 26, so that the chuck portion 21 and the claw portion 1 in the upright direction of the semiconductor device 1 are moved.
7, the claw portion 1 with respect to the semiconductor device 1 is changed.
The position 7 moves to the tip side of the external lead 3. here,
Since the gap between the external leads 3 becomes smaller as approaching the tip of the lead, when the position of the claw 17 moves toward the tip of the external lead 3, the claw 17 and the external lead 3 come into contact with each other, and The tip is in a somewhat expanded state.

Subsequently, the grip lever 40 is grasped and the head lever 39 is pulled down. As a result, the rod 35 moves downward in conjunction with the movement of the lever, and the forming head 12 at the tip of the rod advances below the disk 13. At this time, the distal end of the molding head 12 has a claw 17 with respect to the semiconductor device 1 held in the upright state by the chuck 21.
Is inserted between the external leads 3 which are pushed out. At this point, the operation lever 15 is operated to return the disk 13 counterclockwise, and the claw portion 17 is retracted from the external lead 3. When the molding head 12 is inserted between the external leads 3 in this manner, as shown in FIG. 5, the external leads 3 of the semiconductor device 1 are respectively engaged with the respective grooves 12a of the molding head 12, whereby the external leads 3 The whole is a molding head 12
It spreads out evenly as you move. When the molding head 12 descends to the lowest position, the semiconductor device 1
Are formed in a parallel state (see FIG. 7).

Finally, the head lever 39 is pushed back according to the urging force of the coil spring 42, and the forming head 12 is retracted upward together with the rod 35. Subsequently, the open / close chuck 22 is opened by operating the operation lever 25 in the R direction (FIG. 2), and the semiconductor device 1 with the lead formed thereon is taken out from the chuck portion 21.

As described above, the lead molding machine 10 of this embodiment is
The lead forming method using, holding the semiconductor device 1 in the upright position, the claw portions 7 of each radial array in a gap which is formed in the base side of the external lead 3 equivalents by the chuck portion 21
The external lead 3 is advanced in a non-contact state, and from this state, the operation lever 25 is operated to change the relative position between the chuck portion 21 and the claw portion 17 in the rising direction of the semiconductor device 1, so that each of the external leads 3 Who separate the tips of
In a slightly expanded direction. Furthermore, the spread
To the tips of the plurality of external leads 3 in the closed state.
By inserting the forming head 12 from the standing direction of the
And a concave groove 12a formed at the tip of the molding head 12.
External leads 3 of the semiconductor device 1 are respectively engaged with
Move each external lead 3 according to the movement of the molding head 12.
Spreads uniformly and finally all external leads 3 are in parallel
Mold into Adopt such a lead forming method
Can damage the plated surface of the external leads 3
The external leads 3 of the semiconductor device 1 are always in a uniform shape.
Can be molded into

[0023]

As described above, according to the present invention,
Multiple external leads arranged circumferentially on the bottom of the package
Semiconductor device in which the tips of the diodes are in contact with each other
Of upon lead forming shape, without damaging the plated surface of the external lead, since it is possible to mold the external leads of the semiconductor device at all times uniform shape, appearance defects such as bending plating peeling or lead of the external lead Generation can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is an overall view showing one embodiment of a lead forming machine according to the present invention.

FIG. 2 is a diagram illustrating a configuration of a pedestal of a lead molding machine according to an embodiment.

FIG. 3 is a diagram illustrating a configuration of a chuck unit.

FIG. 4 is a view for explaining a tip shape of a forming head.

FIG. 5 is a diagram illustrating an operation during lead molding.

FIG. 6 is a diagram showing a structure of a semiconductor device before lead molding.

FIG. 7 is a diagram showing a structure of a semiconductor device after lead molding.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Lead molding machine 11 Pedestal 12 Forming head 17 Claw part 21 Chuck part 25 Operation lever 26 Movable block 27 Outer cylinder 28 Coil spring 29 Roller

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/50 H05K 13/04

Claims (1)

(57) [Claims] 1. A plurality of external leads are provided on a bottom surface of a package.
The tip of each external lead arranged in a circle
Semiconductor device leads whose parts abut each other
A lead forming method used for forming, wherein the semiconductor device is held in an upright state by a chuck portion.
Moni, wherein said chuck portion in the upright direction of the plurality of claw portions each radially arranged in the gap formed in the base side of the external rie de is advanced in a non-contact state with the external leads of the semiconductor device pawl By changing the relative positions of the external leads, the distal ends of the plurality of external leads are slightly pushed and spread in a direction away from each other, and the distal ends of the plurality of external leads in the expanded state are substantially sharpened. A plurality of external leads formed in a parallel state by inserting a forming head having a groove for expanding a lead in a tapered portion having a tapered shape from an upright direction of the semiconductor device. Lead molding method.