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JP3230157B2 - Beam absorber for laser processing of tubes - Google Patents
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JP3230157B2 - Beam absorber for laser processing of tubes - Google Patents

Beam absorber for laser processing of tubes

Info

Publication number
JP3230157B2
JP3230157B2 JP11211699A JP11211699A JP3230157B2 JP 3230157 B2 JP3230157 B2 JP 3230157B2 JP 11211699 A JP11211699 A JP 11211699A JP 11211699 A JP11211699 A JP 11211699A JP 3230157 B2 JP3230157 B2 JP 3230157B2
Authority
JP
Japan
Prior art keywords
processing
laser
tube
laser processing
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11211699A
Other languages
Japanese (ja)
Other versions
JP2000301375A (en
Inventor
修三 上原
友治 谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okazaki Manufacturing Co Ltd
Original Assignee
Okazaki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okazaki Manufacturing Co Ltd filed Critical Okazaki Manufacturing Co Ltd
Priority to JP11211699A priority Critical patent/JP3230157B2/en
Publication of JP2000301375A publication Critical patent/JP2000301375A/en
Application granted granted Critical
Publication of JP3230157B2 publication Critical patent/JP3230157B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Nonmetallic Welding Materials (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【産業上の利用分野】本発明は,産業用レーザによる管
の加工に関するるものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to processing of a pipe by an industrial laser.

【従来の技術】従来,レーザ加工は板材の溶接,切断,
穿孔などの加工用に開発され,その利用度の高いことか
ら各種金属や非金属の加工機として急速に発展してきた
が,管の加工で,とくに小口径の管をレーザで切断や穿
孔をすれば,管の加工面で垂直に照射されたレーザビー
ムが材料の厚みを通過して,ビームのパワー密度が低下
しない間に反対側の管内壁に到達し,内壁に深い加工傷
を付けてしまうことがあり,そのため管材の加工に多く
は利用されなかった。
2. Description of the Related Art Conventionally, laser processing has been used for welding, cutting,
It was developed for drilling, etc., and has been rapidly developed as a machine for various metals and non-metals due to its high use. However, in the processing of pipes, especially small-diameter pipes can be cut or drilled with a laser. For example, a laser beam emitted perpendicular to the processing surface of the tube passes through the thickness of the material and reaches the inner wall of the tube on the other side while the power density of the beam does not decrease, causing deep processing damage to the inner wall. In many cases, they were not widely used for processing pipe materials.

【発明が解決しようとする課題】そこで本発明は上記従
来の管材の加工面をレーザビームが通過して,ビームの
パワー密度が低下しない間に反対側の管内壁に到達し,
その内壁に加工傷が付くことを避けて,レーザ加工によ
る加工不良を改善し,とくに小口径の管のレーザ加工を
容易にすることの提供を目的とする。
SUMMARY OF THE INVENTION Accordingly, the present invention provides a laser beam passing through a processing surface of the above-mentioned conventional tube, and reaches the opposite inner wall of the tube while the power density of the beam does not decrease.
An object of the present invention is to provide a method for improving machining defects caused by laser machining by avoiding machining scratches on its inner wall, and particularly for facilitating laser machining of small-diameter pipes.

【解決するための手段】上記目的を達成するため,本発
明はビーム吸収材を管の内部に挿入して材料の厚さを通
過したレーザビームを吸収材の内部で熱的に消滅させる
機構であって,レーザビームにより材料内壁に加工傷が
付くことを避けて,管材のレーザ加工を容易にできる様
に構成したことを特徴としている。
In order to achieve the above object, the present invention provides a mechanism for inserting a beam absorbing material into a tube to thermally extinguish a laser beam passing through the thickness of the material inside the absorbing material. In addition, the present invention is characterized in that a laser beam can be easily processed by laser processing on the inner wall of the material by avoiding processing scratches on the inner wall of the material.

【作用】 上記本発明の特徴によれば,管の加工面で垂
直に照射されて材料の厚みを通過して内部にまで達した
パワー密度の高いレーザビームをビーム吸収材で吸収
し,吸収材の内部で消滅させることによって通過ビーム
が材料内壁に及ぼす加熱による加工傷や溶融飛散物の散
乱等を避けることがてきる。
According to the above-mentioned feature of the present invention, a laser beam having a high power density, which is vertically irradiated on a processing surface of a pipe and passes through the thickness of the material to reach the inside, is absorbed by the beam absorbing material. In this case, it is possible to avoid processing flaws caused by heating of the passing beam applied to the inner wall of the material and scattering of the melted scattered material.

【実施例】 以下,本発明について添付した図面の図1
及び図4に基づき具体的に詳述する。レーザ加工機の切
断加工における加工ヘッド部と加工面周辺の構造を図1
に示す。加工ヘッド2は,主にレンズホルダとアシスト
ガス3を吹き付けるためのノズルとで構成されており,
レンズホルダは集光レンズ5の加熱を防止するために水
4で冷却されている。図1において,ノズル高さ9と集
光レンズの焦点距離8との設定に関係するパラメータを
図2に示す。照射レーザビーム6の焦点位置と加工面間
の距離をデフォーカス距離10と呼び,通常のレーザ加
工ではデフォーカス距離10を+側(焦点位置が加工面
より上)に設定することはない。切断加工では溶融飛散
物7を少なくするためにデフォーカス距離10を−側
(焦点位置が加工面より下)に設定し,切断面をビーム
のパワー密度が高い所で通過する様に設定している。従
って管材の加工,とくに小口径管の様に肉厚の薄い場合
には,ビームの焦点位置が材料の厚みの下になり,ビー
ムのパワー密度が低下しない間に管の反対側に到達して
しまい,管の内壁はデフォーカス距離10が+側のとき
と同じパワー密度で加熱されることになる。すなわち図
3に示した管の内壁には加工面と類似した傷が付き,溶
融飛散物7が管の内面に散乱付着して加工不良を生じ
る。しかし,本発明のビーム吸収材12を管の内部に挿
入することによって,図4に示す様に材料の厚みを通過
したレーザビームはすぐにビーム吸収材12に達する。
ビーム吸収材12は主成分が酸化マグネシウムの棒状の
未焼成碍子でありレーザビームの照射によってそれは加
熱するが,未焼成の金属酸化物であるため有害なガス等
を出すことなく,脱水反応と表面の焼結を起こしながら
金属酸化物の焼成熱としてレーザビームを消滅させる。
このビーム吸収材12の棒状の未焼成碍子を被加工管の
管内径の4分の3相当の外径で成型とすることによっ
て,管の内部に挿入する作業が容易に行える。また,レ
ーザ加工時に被加工管を回転させても管内径に対する空
隙率が大きいため,碍子は内部で転がって加工面から碍
子までの距離を一定に保つ。そのためアシストガス3の
流路を妨げることなくレーザ加工の条件も安定した状態
で作業できる。加工後に管の内部よりビーム吸収材12
を取り除くときにも脱水反応と表面の焼結によって,ビ
ーム吸収材12は体積の収縮をしているため,挿入時の
作業と同様に容易に取り除くことができる。
BRIEF DESCRIPTION OF THE DRAWINGS FIG.
This will be described in detail with reference to FIG. Fig. 1 shows the structure around the processing head and the processing surface in the cutting process of the laser processing machine.
Shown in The processing head 2 mainly includes a lens holder and a nozzle for blowing the assist gas 3.
The lens holder is cooled with water 4 to prevent the condenser lens 5 from being heated. In FIG. 1, parameters related to the setting of the nozzle height 9 and the focal length 8 of the condenser lens are shown in FIG. The distance between the focal position of the irradiation laser beam 6 and the processing surface is referred to as a defocus distance 10, and the defocus distance 10 is not set on the + side (the focal position is higher than the processing surface) in normal laser processing. In the cutting process, the defocus distance 10 is set to the minus side (the focal position is lower than the processing surface) in order to reduce the molten splatters 7, and the defocus distance is set so as to pass through the cutting surface at a place where the beam power density is high. I have. Therefore, when processing the tube material, especially in the case of a thin wall such as a small-diameter tube, the focal point of the beam falls below the thickness of the material and reaches the opposite side of the tube while the power density of the beam does not decrease. Consequently, the inner wall of the tube is heated at the same power density as when the defocus distance 10 is on the + side. That is, the inner wall of the tube shown in FIG. 3 has a flaw similar to the processing surface, and the molten scattered substance 7 scatters and adheres to the inner surface of the tube, resulting in processing defects. However, by inserting the beam absorber 12 of the present invention inside the tube, the laser beam that has passed through the thickness of the material as shown in FIG.
The beam absorbing material 12 is a rod-shaped unfired insulator whose main component is magnesium oxide, which is heated by laser beam irradiation. However, since it is an unfired metal oxide, it does not emit harmful gas, etc. While sintering occurs, the laser beam is extinguished as heat for firing the metal oxide.
By shaping the rod-shaped unsintered insulator of the beam absorbing material 12 into an outer diameter corresponding to three-fourths of the inner diameter of the pipe to be processed, the work of inserting the inside of the pipe can be easily performed. Also, even if the pipe to be processed is rotated during laser processing, the porosity relative to the inner diameter of the pipe is large, so that the insulator rolls inside and the distance from the processing surface to the insulator is kept constant. Therefore, the laser processing can be performed in a stable condition without obstructing the flow path of the assist gas 3. After processing, the beam absorber 12
When removing the beam, the beam absorbing material 12 is contracted in volume due to the dehydration reaction and the sintering of the surface, so that the beam absorbing material 12 can be easily removed similarly to the operation at the time of insertion.

【発明の効果】本発明は前述の構成及び作用よりなっ
て,請求項に記載したビーム吸収材を装荷したレーザ加
工法によれば,レーザビームをビーム吸収材の内部で熱
的に消滅させることによって,通過したビームが材料内
壁に及ぼす加熱による加工傷や溶融飛散物の散乱等を避
けてレーザ加工の不良を改善し,とくに加工傷の著しい
小口径の管の加工を容易にできる。
According to the laser processing method of the present invention having the above construction and operation, the laser beam is thermally extinguished inside the beam absorbing material. Thereby, it is possible to avoid processing flaws caused by heating of the passed beam on the inner wall of the material and scattering of molten scattered substances, thereby improving the defect of laser processing, and in particular, facilitating processing of small-diameter pipes with remarkable processing flaws.

【図面の簡単な説明】[Brief description of the drawings]

【図1】レーザ加工機の概略構造図を示す。FIG. 1 shows a schematic structural diagram of a laser beam machine.

【図2】加工時パラメータの状態を示す。FIG. 2 shows the state of parameters during processing.

【図3】本発明の装荷前の動作概略図を示す。FIG. 3 shows an operation schematic diagram before loading according to the present invention.

【図4】本発明の装荷時の動作概略図を示す。FIG. 4 is a schematic diagram showing the operation of the present invention when loading.

【符号の説明】[Explanation of symbols]

1 切断面 2 加工ヘッド 3 アシストガス 4 冷却水 5 集光レンズ 6 レーザビーム 7 溶融飛散物 8 集光レンズの焦点距離(f) 9 ノズル高さ(g) 10 デフォーカス距離(fd) 11 管材 12 ビーム吸収材 DESCRIPTION OF SYMBOLS 1 Cutting surface 2 Processing head 3 Assist gas 4 Cooling water 5 Condensing lens 6 Laser beam 7 Melted and scattered object 8 Focal length of a condensing lens (f) 9 Nozzle height (g) 10 Defocus distance (fd) 11 Tube material 12 Beam absorber

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−9590(JP,A) 特開 平5−205678(JP,A) 特開 昭56−1289(JP,A) 特開 平1−228695(JP,A) 実開 昭60−46983(JP,U) 実開 平1−177088(JP,U) (58)調査した分野(Int.Cl.7,DB名) B23K 26/00 - 26/18 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-57-9590 (JP, A) JP-A-5-205678 (JP, A) JP-A-56-1289 (JP, A) JP-A-1 228695 (JP, A) Japanese Utility Model 60-46983 (JP, U) Japanese Utility Model Hei 1-177088 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) B23K 26/00-26 / 18

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 産業用レーザによる切断、穿孔などの加
工において管の内部に挿入して材料の厚みを通過したレ
ーザ・ビームによる材料内壁の加工傷を避けて、加工を
容易にするためにレーザ・ビームを吸収消滅させるビー
ム吸収材であつて、ビーム吸収材には管内径の4分の3
相当の外径を有する主成分が酸化マグネシウムの未焼成
の状態の碍子を用いた管のレーザ加工に供するビーム吸
収材。
1. A laser for machining, such as cutting or drilling with an industrial laser, for facilitating machining by avoiding scratches on the inner wall of the material due to a laser beam inserted into the inside of the tube and passing through the thickness of the material. .A beam absorbing material that absorbs and annihilates the beam, and the beam absorbing material includes three quarters of the inner diameter of the tube.
A beam absorber used for laser processing of a tube using an unsintered insulator of magnesium oxide whose main component has a considerable outer diameter.
JP11211699A 1999-04-20 1999-04-20 Beam absorber for laser processing of tubes Expired - Fee Related JP3230157B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11211699A JP3230157B2 (en) 1999-04-20 1999-04-20 Beam absorber for laser processing of tubes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11211699A JP3230157B2 (en) 1999-04-20 1999-04-20 Beam absorber for laser processing of tubes

Publications (2)

Publication Number Publication Date
JP2000301375A JP2000301375A (en) 2000-10-31
JP3230157B2 true JP3230157B2 (en) 2001-11-19

Family

ID=14578584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11211699A Expired - Fee Related JP3230157B2 (en) 1999-04-20 1999-04-20 Beam absorber for laser processing of tubes

Country Status (1)

Country Link
JP (1) JP3230157B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6371512B1 (en) 1998-08-03 2002-04-16 Toyota Jidosha Kabushiki Kaisha Airbag apparatus for head-protecting
JP2007075858A (en) * 2005-09-14 2007-03-29 Mkv Platech Co Ltd Manufacturing method of perforated tube
JP4945362B2 (en) * 2007-07-30 2012-06-06 本田技研工業株式会社 Drilling method and apparatus therefor
US9268091B2 (en) 2010-02-18 2016-02-23 Corning Cable Systems Llc Methods for laser processing arrayed optical fibers along with splicing connectors

Also Published As

Publication number Publication date
JP2000301375A (en) 2000-10-31

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