JP3230566B2 - Wafer separation and transfer equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for separating and transferring a plurality of stacked wafers such as semiconductor wafers one by one.

[0002]

2. Description of the Related Art In general, a semiconductor wafer or the like is formed by cutting an ingot made of a brittle material such as silicon into a predetermined thickness using, for example, a wire saw. To briefly explain an example of this cutting method, as shown in FIG. 12A, the ingot 100 has a columnar shape, and a support plate 103 including a carbon 101 and an insulating plate 102 is provided on the upper surface thereof.
Is attached and fixed. The ingot 100 is mounted on a processing portion of a wire saw (not shown) on the support plate 103. Then, as shown in FIG. 12B, while the ingot 100 is lowered, the ingot 100 is cut by the wire 104 of the wire saw and the slurry containing abrasive grains, and a large number of wafers 27 are simultaneously formed. .

[0003] As shown in FIG. 13 (a), the wafer 27 is still attached to the support plate 103 even after cutting. Therefore, after the cutting, the wafer 27 is simultaneously peeled off from the support plate 103 by a predetermined peeling means.
As shown in (b), a large number of sheets are stacked. However, in consideration of the workability of the post-process, it is necessary to separate the stacked wafers 27 one by one.
Since 7 is very thin and easily broken, it is a difficult task to separate them one by one.

[0004] For this reason, for example, a separation and transfer apparatus for a wafer as disclosed in Japanese Patent Application Laid-Open No. 5-63058 has been conventionally known. As shown in FIG.
A feeding device 106 for raising the stacked number of wafers 27 in a supported state, a nozzle system 107 for separating the wafer 27 located at the top of the group of wafers from other wafers 27 by jetting a fluid, and transporting the wafer 27; , Top wafer 2
And a stopper 108 that allows only the movement of the wafer 7 and restricts the movement of the other wafer 27. Nozzle system 10
7 is a separation nozzle 109 for separating the uppermost wafer 27 from other wafers 27, and the separated wafer 27
And a transport nozzle 110 for transporting.

When the wafer 27 is separated, the wafer group is raised by the feeding device 106, and the uppermost wafer 27 is arranged to face the nozzle system 107. In this state, a fluid is ejected from the separation nozzle 109 toward the uppermost two wafers 27 to lift the uppermost wafer 27 and to transfer the transfer nozzle 110.
The wafer 27 is conveyed through the upper edge of the stopper 108 by the fluid ejected from the. At this time, since the movement of the wafers 27 other than the uppermost wafer 27 is regulated by the stopper 108, only the uppermost wafer 27 can be separated one by one and transported reliably.

[0006]

However, FIG.
As shown in (b), the ingot 100 is cut by:
The part on the opposite side to the support plate 103 is set as the cutting start position,
This is performed in a direction toward the support plate 103. However, when the cutting process is performed in this manner, for example, as shown in FIG.
Alternatively, on the wire entrance side and the exit side in the wire running direction, the larger the cutting start side or the wire entrance side, the larger the size of the wire 104 of the wire saw is removed. The thickness of the wafer 27 obtained after the cutting process tends to gradually increase from the cutting start side or the wire entrance side to the cutting end side or the wire exit side. Such a difference in the thickness of the wafer 27 is such that it does not matter when the wafer 27 is used alone. However, when a large number of wafers 27 are stacked as shown in FIG. The integration is performed, and the uppermost wafer 27 is inclined with respect to the horizontal plane. Although the difference in the thickness of the wafer 27 is actually very small, it is exaggerated in FIG. 13 for easy understanding.

Therefore, when such a wafer 27 is placed on the feeding device 106 in the above-described conventional separation and transfer device, the uppermost wafer 27 is moved with respect to the upper edge of the stopper 108 as shown in FIG. It may be tilted. In this state, when the separation operation of the wafer 27 is started, not only the uppermost wafer 27 interferes with the stopper 108 and is not smoothly transported, but also the wafer 27 is inclined with respect to the upper edge of the stopper 108. There is also a risk of collision and damage in the state. In addition, the fluid ejected from the separation nozzle 109 causes the upper and lower two wafers 2
7, there is a problem that the separation operation by the separation nozzle 109 cannot be performed reliably.

Further, as shown in FIG. 16, when the wafer 27 is placed on the feeder 106, the uppermost wafer 27 may be inclined so as to be gradually higher in the transfer direction. In such a state, when the separation operation of the wafer 27 is started, as shown by a two-dot chain line in FIG. 16, not only the uppermost wafer 27 but also the wafer 27 located thereunder have the upper edge of the stopper 108 as well. There is also a problem that the wafer 27 may be conveyed through, and it is difficult to separate and transport the wafers 27 one by one.

The present invention has been made by paying attention to such problems existing in the prior art. It is an object of the present invention to provide a wafer separation and transfer apparatus that can separate wafers one by one without being damaged and transfer the wafers in the unloading direction without fail.

[0010]

In order to achieve the above object, according to the first aspect of the present invention, a large number of wafers are supported in a stacked state, and a group of these wafers is raised in a stacked state. Supporting means, separating means for injecting a fluid onto the upper surface of the uppermost wafer raised at a predetermined separation position to separate the uppermost wafer from other wafers, and flowing the separated wafer through a liquid flow A wafer separating means provided with a transfer means for transferring the uppermost wafer in the unloading direction and a stopper for preventing the other wafer from being moved in the unloading direction by utilizing In the transfer device, a tilt adjustment for adjusting the tilt of the wafer group so that the uppermost wafer does not interfere with the stopper and movement of another wafer in the unloading direction can be prevented by the stopper. Means provided, said support means weather
Group C is laminated and supported in the liquid.
Therefore, when the wafer group is lifted,
Liquid is sprayed onto the upper surface of the wafer from the obliquely upper downstream side.
Holding means for preventing the wafer from floating .

In the invention described in claim 2, in claim 1, the stopper has an upper edge for allowing the uppermost wafer to be transferred in the unloading direction, and the inclination adjusting means includes The inclination is adjusted so that the upper wafer is substantially parallel to the upper edge of the stopper.

According to a third aspect of the present invention, in the second aspect, the upper edge of the stopper is provided substantially parallel to a horizontal plane, and the inclination adjusting means is arranged so that the uppermost wafer is substantially parallel to the horizontal plane. The inclination is adjusted so that

According to the fourth aspect of the present invention, the first to third aspects are provided.
In any one of the above, the tilt adjustment means, a support surface for stacking and supporting the wafer group, a tilt mechanism for tilting the support surface to adjust the tilt angle of the support surface with respect to a horizontal plane, The apparatus includes a detecting unit that is arranged to face the upper surface and detects the inclination of the upper surface of the wafer, and a control unit that controls the tilting mechanism based on a detection result by the detecting unit.

According to the fifth aspect of the present invention, the first to third aspects are provided.
In any one of the above, the tilt adjusting means may include a tilting supporter that tiltably supports the stacked wafer group, and a tilting support that is disposed opposite to the upper surface of the uppermost wafer, and contacts the upper surface of the wafer so that the wafer is placed on a horizontal surface. And regulating means for regulating the angle to a predetermined angle.

[0015] According to the invention described in claim 6, in claims 1 to 5,
In any one of the separation means, separation extrusion means for directly moving the wafer in direct contact with the uppermost wafer,
After the wafer has been started by the separation pushing means rotating with respect to the upper surface of the wafer, which by ejecting fluid from obliquely above at a position offset from its center, the wafer is rotated in one direction to separate from the other wafer Means.

[0016]

In the invention described in claim 7 , claims 1 to 6 are provided.
In any one of the above, a shooter for guiding a wafer carried by the carrying means is arranged downstream of the supporting means in the carrying direction, and one wafer to be carried is provided downstream of the shooter in the carrying direction. In this case, a cassette having a plurality of storage shelves for storing each of the storage shelves is arranged.

Accordingly, the first to seventh aspects of the invention have the following effects. According to the invention of claim 1, a large number of wafers are supported in a stacked state by the support means. In this state, the wafer group is raised by the support means, and the uppermost wafer is placed at a predetermined separation position. At this time, the inclination of the wafer group is adjusted by the inclination adjusting means so that the uppermost wafer does not interfere with the stopper and movement of another wafer in the unloading direction can be prevented by the stopper. For this reason, when the fluid is jetted onto the upper surface of the uppermost wafer by the separating means, the uppermost wafer is separated from the other wafers and is smoothly carried in the unloading direction by the liquid flow without interfering with the stopper. The other wafer is reliably prevented from moving in the unloading direction by the stopper. When the wafer group is lifted by the support means,
The liquid is sprayed onto the upper surface of the wafer,
The wafer is prevented from floating in the liquid.

According to the second aspect of the present invention, the inclination is adjusted by the inclination adjusting means so that the uppermost wafer is substantially parallel to the upper edge of the stopper. It is transported smoothly through its upper edge without interfering with the edge.

According to the third aspect of the present invention, the inclination is adjusted by the inclination adjusting means so that the uppermost wafer is substantially parallel to the horizontal plane.
The stopper is transported more smoothly through the upper edge without interfering with the upper edge of the stopper substantially parallel to the horizontal plane.

According to the present invention, when the inclination of the upper surface of the uppermost wafer is detected by the detecting means, the tilting mechanism is controlled based on the detection result, and the inclination angle of the support surface with respect to the horizontal plane is adjusted. Is done. As a result, the inclination of the group of wafers stacked and supported on the support surface is accurately adjusted.

According to the fifth aspect of the present invention, since the wafer group is supported by the tilt support so as to be tiltable, the tilt can be easily changed. Therefore, as the upper surface of the uppermost wafer comes into contact with the regulating means, the inclination of the wafer can be easily changed so as to be at a predetermined angle with respect to the horizontal plane.

According to the sixth aspect of the present invention, when the wafer group is lifted by the support means and the uppermost wafer is placed at a predetermined separating position, the wafer is moved by the separating and pushing means. Thereafter, the fluid is ejected from obliquely above the upper surface of the wafer, whereby the wafer is separated from other wafers while rotating in one direction.

[0024]

According to the seventh aspect of the present invention, one separated wafer is guided and transported along the chute and then individually stored in each storage shelf of the cassette.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) Hereinafter, a first embodiment of the present invention will be described in detail with reference to FIGS.

As shown in FIGS. 1 and 2, the water tank 11 is formed in a box shape having an open upper surface, and a clean water 12 is provided therein.
Is stored. A partition plate 13 serving as a liquid level adjusting means is disposed near one side in the water tank 11, and the partition plate 13 defines an overflow chamber 14 on one side in the water tank 11. The water 12 in the water tank 11 overflows into the overflow chamber 14 through the upper end of the partition plate 13, and the water level 121 in the water tank 11 is kept constant.

A plurality of water supply ports 16 are formed at the bottom of the water tank 11, and the clean water 12 is supplied from the water supply ports 16 into the water tank 11. The water outlet 17 is formed at the bottom of the overflow chamber 14, and the water 12 in the overflow chamber 14 is discharged to the outside through the water outlet 17. In addition,
A drain port 151 and a drain valve 152 are provided at the bottom of the water tank 11.

Each pair (a total of four) of the guide rods 18,
Reference numeral 19 stands upright in the water tank 11 at predetermined intervals. The pair of guide rods 19 located in the unloading direction (the direction toward the overflow chamber 14) of the wafer 27 described later are opposite to the unloading direction such that the upper ends thereof are located slightly below the water level 121. It is formed shorter than the other pair of guide rods 18 located.

The first lifting device 20 is provided with the guide rod 1
A lifting / lowering plate 21, a screw 22, and a servomotor (not shown) for rotating the screw 22 are provided outside the water tank 11 corresponding to the positions 8 and 19. Mounting plate 23 is water tank 1
1 and a pair of suspension rods 24
And is slidably fitted to the guide rod 18 via a bearing 25. First
To the fourth pulse motors 521 to 524
A female screw 54 is screwed to a screw 53 serving as a drive shaft thereof. Motors 521 to 524
Is covered with a cover 55 to prevent water 12 from entering. The elevating body 56 is fixed to the female screw 54, and a spherical bearing 561 is formed on the upper surface thereof. The support base 26 has a spherical body 57 formed on the lower surface thereof and a spherical bearing 56.
By being fitted to the support 1, it is supported at four points on the elevating body 56. Then, each of the pulse motors 521 to 52
The lifting body 56 is moved up and down by the action of the screw 53 by driving the 4. As a result, the support 26 is tilted, and the tilt angle of the support surface 261 formed on the upper surface with respect to the horizontal plane is adjusted. In the first embodiment, the pulse motors 521 to 524, the screw 53, the female screw 54, and the elevating body 56 constitute a tilting mechanism 76 of the support surface 261.

A large number of disk-shaped wafers 27 made of a brittle material such as silicon are supported on the support surface 261 of the support 26 so as to be located between the guide rods 18 and 19 in the water in the water tank 11. It is supported in a stacked state on top. Then, when the servomotor of the first lifting device 20 is driven, the support base 26 is raised and lowered by the operation of the screw 22 via the lifting plate 21, the suspension rod 24 and the mounting plate 23. Then, a large number of wafers 2 are
7 is raised by a predetermined amount along the guide rods 18 and 19, and one wafer 27 located at the uppermost position is arranged near the water level 121 which is the separation position. In the first embodiment, support means is constituted by the guide rods 18, 19, the first lifting / lowering device 20, the suspension rod 24, the mounting plate 23, and the support 26.

First to fourth sensors 281 as detecting means
284 are disposed in the water tank 11 so as to face the upper surface of the uppermost wafer 27, and correspond to the first to fourth pulse motors 521 to 524 on a one-to-one basis. These sensors 281 to 284 are arranged on a horizontal plane.
Then, the uppermost wafer 27 is raised to the vicinity of the water level 121, and the upper surface thereof is at least one of the sensors 281-2.
When a contact is made with the sensor 84, an ON signal is output from the sensors 281 to 284, and the control device 5 serving as control means is output.
8 is input. The control device 58 includes sensors 281 to 28
When the ON signal from 4 is input, the servomotor of the first lifting / lowering device 20 is stopped, and the lifting operation of the support 26 is stopped.

Thereafter, the control device 58 controls all the sensors 2
In order to turn on 81 to 284, pulse motors 521 to 524 corresponding to sensors 281 to 284 not turned on
Are respectively driven to raise the elevating body 56. As a result, the support 26 is tilted, and the tilt of the stacked wafer group is adjusted so that the uppermost wafer 27 is parallel to the horizontal plane. That is, the first to fourth sensors 281 to 281
Reference numeral 284 is for detecting the highest position of the uppermost wafer 27 and detecting the inclination of the upper surface of the wafer 27 with respect to the horizontal plane. The control device 58 controls the detection results of these sensors 281 to 284. Based on this, the first lifting device 20 and the pulse motors 521 to 524 are controlled. In the first embodiment, the support 26, the tilting mechanism 7
6, the sensors 281 to 284 and the control device 58 constitute an inclination adjusting means.

The first to fourth sensors 281 to 284 are
After the adjustment of the inclination of the wafer group is completed, the wafer 27 is raised from the detection position of the wafer 27 to the retreat position by an elevating mechanism (not shown).
It is separated from the uppermost wafer 27.

Next, in the initial stage of the operation of transporting the uppermost wafer 27 raised to the vicinity of the water level 121, the separating and pushing means 29 for temporarily moving the wafer 27 mechanically in the unloading direction will be described with reference to FIGS. This will be described with reference to FIG.

As shown in FIGS. 4 to 6, a support pin 32 is attached to one of the guide rods 18 via a bracket 30, and the one-way clutch 33 is attached to the support pin 32.
A rotary cam 34 having a cylindrical shape is supported through the shaft.
A base end of a support lever 35 is supported on an upper portion of the support pin 32 so as to be rotatable in a horizontal direction. The support lever 35 is urged downward by a spring 37. Support lever 3
5, a support arm 38 is fixed.
A contact 40 made of a thin leaf spring is attached to the tip of the.

As shown in FIG. 7, the upper end surface of the rotary cam 34 is connected to a horizontal first cam surface 341, a horizontal second cam surface 342 lower than the cam surface 341, and the cam surface 342. Six inclined third cam surfaces 343 are formed around the entire circumference. When the operation protrusion 351 formed on the lower surface of the base end of the support lever 35 corresponds to the first cam surface 341, the contact 40 is moved to the uppermost wafer 27.
Above. When the support lever 35 is about 10
When rotated in the counterclockwise direction, the operation protrusion 351 falls into the second cam surface 342, and the contact 40 is held at a position lower than the uppermost wafer 27. Further, when the operation protrusion 351 is lifted by the third cam surface 343, the contact 40 is separated to a position higher than the uppermost wafer 27.

As shown in FIG. 4, the support lever 35 is always at a predetermined angle (approximately 60 degrees in the first embodiment).
Is reciprocated in the range of. That is, when the support lever 35 is rotated to mechanically move the wafer 27 initially, the rotation projection 34 is stopped by the one-way clutch 33 at a predetermined position, and the operation projection 351 is pressed by or against the spring 37. First to third cam surfaces 341 to 34
3 is sequentially moved to mechanically start the wafer 27 by the contact 40. At the time of the rotation operation for returning the support lever 35 to the original position after the start is completed, the operation protrusion 351 of the lever 35
Is locked to a locking surface 344 formed at the boundary between the first cam surface 341 and the third cam surface 343, and the lever 35 is reversely rotated to the retracted position. For this reason, the one-way clutch 3
3, the rotation cam 34 is at a predetermined angle (approximately 6
(0 degree), and is ready for a rotating operation to mechanically start the wafer 27 next.

Since the contact 40 is constituted by a thin leaf spring, when the wafer 27 is started mechanically, it is curved in an arc shape as shown by a two-dot chain line in FIG.
As shown in FIG. 4, a base end of a cylinder 46 is rotatably supported on the other end of the guide rod 18 via a bracket 41. The reciprocating rod 4 of this cylinder 46
The tip of 8 is connected to the support lever 35. Therefore, the support arm 38 is arranged at the position indicated by the solid line in FIG. It is rotated in the direction of rotation. Then, the support arm 38 is rotated in the same direction, and the contact 40
Is moved toward the wafer 27, and the wafer 27 is mechanically started.

As shown in FIGS. 1 and 2, a first water injection nozzle 59 as a pressing means for preventing the wafer 27 from floating is disposed above the space between the guide rods 19. Water is sprayed obliquely upward from the downstream side in the unloading direction to substantially the center of the upper surface of the uppermost wafer 27 to prevent each wafer 27 from floating.

A second water injection nozzle 60 as a rotating means and a transfer means for the wafer 27 is disposed above the space between the guide rods 18 in a state where the injection of the holding water from the first water injection nozzle 59 is interrupted. The second water injection nozzle 6
Due to 0, water is sprayed obliquely upward on the upstream side in the unloading direction onto the upper surface of the wafer 27 at the water level. At this time, FIG.
As shown in FIG. 7, the water from the second water jet nozzle 60 is jetted onto the upper surface of the wafer 27 toward a position deviated laterally from the center of the wafer 27, and the water flow causes the uppermost wafer 2 to flow.
7, a clockwise rotation force and a propulsion force in the unloading direction in FIG. 2 are applied, and the wafer 27 is separated from the second lower wafer 27 and transferred. In this embodiment, the separating and pushing means 29 and the second water jet nozzle 60 as a rotating means are used to separate the uppermost wafer from the separating means 7.
5 are configured.

The partition wall 74 divides the water tank 11 at its center. The shooter 62 is fixed to the upper end of the partition wall 74 so as to be located near the water surface 121 in the water, and descends at a predetermined angle (about 2 degrees with respect to the horizontal plane in the first embodiment) toward the downstream side in the unloading direction. It is inclined. Then, one wafer 27 transferred from the transfer position is guided and guided along the shooter 62 in the unloading direction. Therefore, the shooter 62 also constitutes a transport unit. Then, the water 12 supplied into the water tank 11 from the water supply port 16 on the first elevating device 20 side flows on the shooter 62 in the carry-out direction. This water flow becomes a transfer flow, and the transfer operation of the wafer 27 is promoted.

An edge of the shooter 62 on the upstream side in the unloading direction is formed in an arc shape conforming to the shape of the wafer 27, and an upper edge 621 thereof is flush with the upper end of the guide rod 19 and with respect to a horizontal plane. They are almost parallel. In the present embodiment, the upper edge 621 and the guide rod 19 constitute a stopper 77. This stopper 77 allows only the transfer of the uppermost wafer 27 in the unloading direction and prevents the movement of another wafer 27 in the unloading direction. The chute 62 is conveyed in the unloading direction through the upper edge 621 thereof.

The fifth sensor 63 is arranged at the center of the downstream end of the shooter 62 in the unloading direction. When the start end of the wafer 27 is transferred onto the shooter 62, the fifth sensor 63 controls the control device 58. The detection signal is output to Then, based on the detection signal from the fifth sensor 63, the control device 58 lowers the first elevating device 20 to lower the wafer 27 on the support 26 by a predetermined amount.

The second lifting / lowering device 64 is disposed at a position inclined to the outside of the water tank 11 so as to be located on the downstream side of the chute 62, and is not shown for rotating the lifting / lowering plate 65, the screw 66 and the screw 66. It has a servo motor. The support plate 67 is suspended from the lower surface of the elevating plate 65 via a pair of suspension rods 68 and a mounting plate 69 so as to be placed underwater. The support plate 67 is inclined at a predetermined angle with respect to the horizontal plane so that the upper surface thereof becomes gradually lower in the carry-out direction.

A box-shaped cassette 70 having an open front surface is detachably supported on the support plate 67, and a through hole 71 is formed in the rear surface. The plurality of storage shelves 72 are cassettes 7
0, and are arranged at predetermined intervals in the vertical direction.
The wafers 27 transported from above are stored one by one on the storage shelf 72. And
Each time the wafers 27 are stored one by one on the storage shelf 72 of the cassette 70, a screw 66 based on the rotation of the servomotor is used.
The lowering device 64 is moved downward by the action of, whereby the cassette 70 is lowered by a predetermined amount, and the empty storage shelf 72 is arranged at a height position corresponding to the shooter 62.
Although the storage shelf 72 may be horizontal, the storage shelf 72 is inclined so that the entrance side is high and the inside depth is low so that the stored wafers 27 are prevented from erroneously coming out due to buoyancy or dynamic pressure of water. Is also good.

The pair of sixth sensors 73 are arranged at predetermined intervals on the partition plate 13 in the water tank 11, and are opposed to a storage shelf 72 at a height position for storing the wafer 27. Then, when the wafer 27 transferred from the shooter 62 is stored at a predetermined position on the storage shelf 72, a detection signal is output from these sixth sensors 73 to the control device 58. Based on this detection signal, the control device 58 stops the water injection from the second injection nozzle 60 and
The lifting device 64 is moved down.

Next, the operation of the wafer separating / transporting apparatus configured as described above will be described. Now, as shown in FIG. 12B, an ingot 1 made of a brittle material such as silicon is used.
00 is simultaneously cut into many wafers 27 by the wire 104 of the wire saw. After cutting, the wafer 2
7 is simultaneously peeled off from the support plate 103, and FIG.
As shown in the figure, a large number of sheets are stacked.

In the wafer separating and transferring apparatus according to the first embodiment, prior to the operation of the apparatus, a large number of wafers 27 cut by a wire saw or the like are supported on a support 26 in a stacked state. Then, it is submerged in the liquid 12 in the water tank 11. Further, the empty cassette 70 is supported on the support plate 67 at the raised position, and the lowermost storage shelf 72 is
Faces the shooter 62.

At this time, for example, as shown in FIG.
7 is inclined with respect to the upper edge 621 (in other words, a horizontal plane) of the shooter 62. When the operation of the apparatus is started in such a state, the wafer 27 on the support 26 is raised by the lifting operation of the first lifting / lowering apparatus 20. Then, as shown in FIG. 3B, when the uppermost wafer 27 is raised near the water level 121 and its upper surface contacts at least one of the sensors 281 to 284, the raising operation of the support 26 is stopped. . Subsequently, as shown in FIG. 3C, by driving the pulse motors 521 to 524 corresponding to the sensors 281 to 284 that are not turned on, the support 26 is tilted, and all the sensors 281 to 284 are turned on. In other words, in other words, the inclination of the stacked wafer group is accurately adjusted so that the uppermost wafer 27 is parallel to the horizontal plane. As a result, the uppermost wafer 27
Is arranged parallel to the upper edge 621 of the shooter 62 and at a position near the water level 121 so as not to interfere with the stopper 77. Also, wafers 27 other than the uppermost wafer 27
Is disposed at a position where it is engaged with the stopper 77 so that movement in the unloading direction can be prevented by the stopper 77. At the time of raising and tilting the wafer 27, water is sprayed from the first spray nozzle 59 onto the upper surface of the uppermost wafer 27 to prevent each wafer 27 from floating.

As described above, as the uppermost wafer 27 becomes parallel to the horizontal plane, the first to fourth sensors 28
When 1 to 284 are turned on, the pulse motors 521 to 524
Is stopped, and the sensors 281 to 284 are raised from the detection positions to the retreat positions, and the uppermost wafer 2 is moved.
Separated from 7. Further, while the injection of water from the first water injection nozzle 59 is interrupted, the cylinder 46 of the separating and pushing means 29 is operated in FIG. 4, and the support lever 35 and the support arm 38 are turned counterclockwise around the support pin 32. The wafer 27 at the uppermost portion is rotated by the contact member 40 to give a mechanical starting force, and is unloaded (rightward in FIG. 4).
Moved to

The uppermost wafer 2 provided with the starting force
7, water is injected from the second water injection nozzle 60.
At this time, the water from the spray nozzle 60 is sprayed onto the upper surface of the wafer 27 from a diagonally upper side opposite to the unloading direction toward a position deviated from the center. Accordingly, a rotational force and a propulsive force are applied to the uppermost one wafer 27 by the water flow of the blast water, and the wafer 27 is surely separated from the second and lower wafers 27. Further, separation is promoted by the action of longitudinal waves generated by the ultrasonic oscillator 61 disposed in the water tank 11.

In addition, when the uppermost wafer 27 is separated and starts to move in the transport direction, the jetting water for separation enters between the uppermost wafer 27 and the lower wafer 27. Therefore, the separating operation is further promoted.

The uppermost wafer 27 is connected to the injection nozzle 6
The thrust of the water flow generated with the injection of water from 0;
The water flow from the water supply port 16 flowing over the chute 62 causes the chute 62 to move in the unloading direction indicated by the arrow in FIGS.
Conveyed through. When the start end of the wafer 27 reaches the fifth sensor 63, a detection signal is output from the fifth sensor 63. Based on this detection signal, the first elevating device 20 descends, so that the wafer 27 on the support 26 descends by a predetermined amount.

Further, the wafer 27 is transported from the shooter 62 in the unloading direction by the propulsive force of the water flow or the like, and is stored on one storage shelf 72 in the cassette 70. When the wafer 27 is transferred, the shooter 62 is inclined downward toward the downstream side in the transfer direction, so that the transfer can be performed smoothly. At this time, if the cassette 70 is inclined in the same direction as the shooter 62 or more, the transferred wafer 27 is more smoothly stored in the cassette 70.

When the wafer 27 is stored at a predetermined position on the storage shelf 72, a detection signal is output from the sixth sensor 73. Then, based on this detection signal, the injection of water from the second water injection nozzle 60 is stopped, and the injection of water from the first water injection nozzle 59 for holding is restarted. At the same time, the second elevating device 64 is lowered, the cassette 70 is lowered by a predetermined amount, and the next empty storage shelf 72 is arranged at a height position corresponding to the shooter 62.
Subsequently, the first to fourth sensors 281 to 284 move down from the retracted position to the detection position, and the first lifting / lowering device 20 shifts to a rising operation, and the uppermost wafer 27 is moved to the first to fourth positions.
It is arranged near the water level 121 detected by the sensors 281 to 284.

Thereafter, the inclination adjustment of the wafer 27 described above is performed.
The separation and transfer operations are repeatedly performed, and a large number of wafers 27 on the support 26 are separated one by one from the uppermost one in order and transferred in the unloading direction. To be stored separately.
Then, when all the wafers 27 are stored on the respective storage shelves 72 of the cassette 70, the cassette 70 is moved from the water in the water tank 11 to the water level 121 by the raising operation of the second lifting device 64.
Be raised up. Therefore, the cassette 70 can be removed from the support plate 67, and the plurality of wafers 27 can be easily transferred together with the cassette 70 to the next step or the like.

The above-described storage of the wafers 27 in the cassette 70 may be performed individually while raising the cassette 70. In this case, as compared with the method of storing the wafers 27 while lowering the cassette 70 described above, the vertical movement of the cassette 70 can be reduced, and
Can be quickly carried out. In this case, water may be sprayed on the wafer 27 raised above the water level 121 from a sprayer (not shown).

As described above, in this separation and transfer apparatus, when a large number of wafers 27 are placed on the support 26, the uppermost wafer 27 is inclined with respect to the upper edge 62 of the shooter 62. In this case, prior to the transfer of the uppermost wafer 27, the uppermost wafer 27 is prevented from interfering with the stopper 77, and the movement of another wafer 27 in the unloading direction can be prevented by the stopper 77. Then, the inclination of the wafer group on the support 26 is adjusted. Therefore, the uppermost wafer 27 is separated one by one from the other wafers 27, and is smoothly transported in the unloading direction through the upper edge 621 of the shooter 62 without interfering with the stopper 77. Engagement with 77 prevents movement in the carry-out direction without fail. Therefore, the uppermost wafer 27 does not collide with the upper edge 621 of the shooter 62 and is not damaged.

Also, the uppermost wafer 27 is separated
First, after the starting force is mechanically applied by 9, the separation and transfer are performed in water, so that the starting wafer 27 having a large separation resistance can be reliably started by the frictional force and the surface tension. Further, the wafer 27 is washed by the transfer movement of the wafer 27, the jet water flow, or the like, and the slurry and the like adhered to the wafer 27 at the time of cutting are washed away.
Since the separation of the wafer 27 is performed by the jet water flowing in one direction, the configuration of the apparatus is simple.

In this separation and transfer apparatus, when the wafer 27 is not separated, the jet water flow causes the wafer 27 to be separated.
, The wafer 27 in the water can be prevented from being perturbed and separated one by one. Moreover,
Since the water current presses the wafer 27, the wafer 27 is not likely to be damaged.

The cassette 70 is lowered every time one wafer 27 is stored, and the stored wafer 27 is submerged in water. For this reason, sticking of foreign matter due to drying of the surface of the wafer 27 can be prevented. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. In addition, here, the first
A description will be given mainly of a configuration different from that of the embodiment.

As shown in FIG. 8, in the second embodiment, the structure of the tilting mechanism 76 is different from that in the first embodiment. That is, in the second embodiment, the support 26
Are supported on the mounting plate 23 via the first to fourth fluid bags 781 to 784. Each fluid bag 781-784
A gas such as air and a liquid such as water are supplied through a pipe 79 from a supply device (not shown). The control device 58 controls each of the fluid bags 781 to 78.
The support base 26 is tilted by controlling the supply amount of the fluid into the inside 4, and the tilt angle of the support surface 261 with respect to the horizontal plane is adjusted. Therefore, in the second embodiment, the same operation and effect as those in the first embodiment can be obtained. (Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIGS. Here,
A description will be given mainly of a portion different from the first embodiment.

As shown in FIG. 9, the third embodiment differs from the first embodiment in the configuration of the inclination adjusting means. That is, in the third embodiment, the support 26
Has a box shape with an open lower surface, and is mounted on the mounting plate 23. One fluid bag 80 is arranged between the support base 26 and the mounting plate 23 so that a gas such as air or a liquid such as water is supplied through a pipe 81 from a supply device (not shown). Has become. In the third embodiment, the support base 26 and the fluid bag 80 form a tilt support 82 that tiltably supports the stacked wafer group, and the tilt support 82 and the first to fourth sensors 281 to 281.
284 constitutes a tilt adjusting means. In the third embodiment, the first to fourth sensors 281 to 284
Comes into contact with the upper surface of the uppermost wafer 27 and
Constitutes a restricting means for restricting so that it is parallel to a horizontal plane.

Next, the operation of the third embodiment will be described with reference to FIG. Now, as shown in FIG. 10A, when the operation of the apparatus is started in a state in which a large number of wafers 27 are stacked and supported on the support 26, the first elevating device 20 raises The wafer 27 on the table 26 rises.
Then, as shown in FIG. 10B, the uppermost wafer 2
7 rises to near the water level 121, and when its upper surface contacts at least one of the sensors 281 to 284, the support 2
6 is stopped. Subsequently, as shown in FIG. 10C, all the sensors 2 are controlled by the control device 58.
Until 81 to 284 are turned on, the supply of the fluid to the fluid bag 80 is performed. That is, the wafer 2 on the support 26
7 is tiltably supported by the fluid bag 80, the inclination can be easily changed, and the uppermost wafer 27 comes into contact with the sensors 281 to 284 so as to be parallel to the horizontal plane. Is regulated.
Therefore, as the fluid bag 80 is inflated by the supply of fluid to the fluid bag 80, the upper surface of the uppermost wafer 27 contacts all the sensors 281 to 284, in other words, the uppermost wafer 27 is The inclination of the wafer 27 on the support 26 is easily changed so as to be parallel to the horizontal plane. As a result, the uppermost wafer 27 is parallel to the upper edge 621 of the shooter 62, and the third embodiment has the same operation and effect as the first and second embodiments. (Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. Note that, here, the description will be focused on portions having a configuration different from that of the first embodiment.

As shown in FIG. 11, in the fourth embodiment, the structure of the separating and pushing means 29 is different from that of the first embodiment. That is, the movable mounting plate 95 is
Are supported by a support shaft 96 so as to be able to reciprocate in a vertical plane. The mounting plate 95 is connected to a lower end of a ball screw 84 supported by a mounting case 83 fixed to the water tank 11.
It is connected to the clevis 85 by a connecting pin 86. When the ball screw 84 moves up and down by the servo motor 87 for raising and lowering, the mounting plate 95 moves up and down. In the fourth embodiment, the movable mounting plate 9
5, the ball screw 84, the servomotor 87, and the like constitute an elevating mechanism of the rotor 90.

A rotating shaft 88 is mounted on the mounting plate 95 with a bearing 89.
, And is rotatably supported by the rotor 9.
0 is fitted. Further, a servo motor 91 for a rotor is attached to the mounting plate 95, and a driving pulley 92 is fixed to a rotating shaft thereof, and a driven pulley 93 fixed to the rotating shaft 88 and the driven pulley 92 are provided. Is belt 9
4 is mounted.

Therefore, in the fourth embodiment, the operation of applying a mechanical starting force to the uppermost wafer 27 is firstly performed.
When the lifting / lowering servomotor 87 is activated and the ball screw 84 is lowered, the mounting plate 95 is rotated downward around the support shaft 96, and the rotor 90 is brought into contact with the upper surface of the wafer 27. Next, when the servo motor 91 is started, the drive pulley 9
2. The rotator 90 is rotated via the belt 94, the driven pulley 93, and the rotating shaft 88, and the wafer 27 is moved in the transfer direction. Next, water is sprayed from the second spray nozzle 60 toward the wafer 27, and the wafer 27 is transported in the same manner as in the first embodiment.

In the fourth embodiment, since a starting force is applied to the wafer 27 by the rotor 90, the starting of the wafer 27 can be performed reliably. Further, the tilt of the wafer 27 is adjusted by tilting the support 26 that supports the stacked wafers 27 by the tilting mechanism 76, and the other effects are the same as those of the first embodiment.

The present invention can be embodied with the following modifications, for example. (1) Four sensors 281 to 284 in each of the above embodiments
Was provided, but this should be three sensors.
Accordingly, the number of the pulse motors 521 to 524 of the tilt mechanism 76 in the first and fourth embodiments is reduced to three, and the fluid bags 781 to 78 in the second embodiment are also provided.
Change 4 to 3.

(2) The inclination of the wafer 27 is adjusted so that the uppermost wafer 27 is inclined at a predetermined angle (about 1 to 3 degrees) with respect to a horizontal plane so that the uppermost wafer 27 becomes gradually lower in the unloading direction. To configure. By doing so, the uppermost wafer 27 is transported more smoothly.

(3) The uppermost wafer 27 is completely submerged in water.
Condition, only the top surface is exposed from the water surface, or
In any state where the height of the lower surface of the wafer matches the water surface
Good .

(4) The water discharged from the water discharge port 17 is filtered and supplied again into the water tank 11 through the water supply port 16. (5) Separating and transporting the uppermost wafer 27 without rotating it.

[0074]

[0075]

The present invention is configured as described above, and has the following effects. According to the first aspect of the present invention, the wafers can be separated one by one without being damaged and can be reliably transported in the unloading direction. Also,
C is prevented from floating in the liquid.

According to the second aspect of the present invention, the uppermost wafer is smoothly transferred through the upper edge without interfering with the upper edge of the stopper. According to the third aspect of the present invention, the uppermost wafer is transported more smoothly through the upper edge without interfering with the upper edge of the stopper substantially parallel to the horizontal plane.

According to the fourth aspect of the present invention, the tilting mechanism is controlled in accordance with the tilt of the upper surface of the uppermost wafer, and the tilt angle of the support surface with respect to the horizontal plane is adjusted.
The inclination of the wafer group stacked and supported on the support surface is accurately adjusted.

According to the fifth aspect of the present invention, as the upper surface of the uppermost wafer comes into contact with the regulating means, the inclination of the uppermost wafer is easily changed to a predetermined angle with respect to the horizontal plane. .

According to the sixth aspect of the present invention, the uppermost wafer can be reliably started, and the uppermost wafer can be separated from other wafers one by one while rotating the uppermost wafer. Can be transported.

[0080] According to the invention described in 請 Motomeko 7, it is possible to smoothly guided conveyed along a wafer chute, easily stored and classified one by one the wafer in each storage shelf in the cassette can do.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a first embodiment of a wafer separation and transfer device.

FIG. 2 is a cross-sectional plan view of the separation and transport device.

FIG. 3 is an explanatory view showing an operation at the time of adjusting the inclination of the wafer.

FIG. 4 is a partially cutaway plan view of the separating and pushing means.

FIG. 5 is a partially omitted front view of the separating and pushing means.

FIG. 6 is a sectional view taken along line 6-6 in FIG. 5;

FIG. 7 is an exploded perspective view of a rotating cam and a support lever.

FIG. 8 is a partial cross-sectional view showing a second embodiment of the separation and transport device.

FIG. 9 is a partial cross-sectional view illustrating a third embodiment of the separation and transport device.

FIG. 10 is an explanatory diagram showing an operation at the time of adjusting the inclination of the wafer.

FIG. 11 is a partial perspective view showing a fourth embodiment of the separation and transport device.

12A is a perspective view showing an ingot supported by a support plate, and FIG. 12B is a partial perspective view showing a cutting operation of the ingot.

FIG. 13A is a front view showing a wafer after cutting, and FIG. 13B is a front view showing a state where the wafer is peeled off from a support plate.

FIG. 14 is a front sectional view showing a conventional separation and transport device.

FIG. 15 is a partial cross-sectional view showing a state where a wafer is placed on a feeder in a conventional separation and transfer device.

FIG. 16 is a partial cross-sectional view showing a state where a wafer is placed on a feeding device in a conventional separation and transfer device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Water tank, 12 ... Water, 121 ... Water surface, 18, 19 ... Guide rod which comprises a support means and a stopper, 20 ... 1st raising / lowering apparatus which comprises a support means, 23 ... Mounting plate which comprises a support means, 26 ... A support table which constitutes the support means and the tilt adjustment means, 261: support surface, 27: wafer, 281-2
84... First to fourth sensors constituting detecting means, regulating means and tilt adjusting means, 29.
4. First to fourth pulse motors constituting a tilting mechanism, 53
... Screw constituting a tilting mechanism, 54 ... Female screw constituting a tilting mechanism, 56 ... Elevating body constituting a tilting mechanism, 58 ... Control device as a control means, 59 ... First injection nozzle as a holding means, 60 ... Rotation Means and a second means of transport means
Water injection nozzle, 62: Shooter constituting stopper and transfer means, 621: Upper edge, 64: Second elevating device, 67:
Support plate, 70 cassette, 72 storage shelf, 75 separating means constituted by separation pushing means 29 and second water injection nozzle 60, 76 tilting mechanism constituting tilt adjusting means, 7
7: Stopper, 781-784: Fluid bag forming tilt mechanism, 80: Fluid bag forming tilt support, 8
2. Tilt support.

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-5-63058 (JP, A) JP-A-4-154144 (JP, A) JP-A-2-25028 (JP, A) JP-A-8- 250570 (JP, A) JP-A-57-141331 (JP, A) JP-A-1-139441 (JP, A) JP-A 55-54299 (JP, U) JP-A 59-145034 (JP, U) JP-B-42-21711 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/68 H01L 21/304

Claims (7)

(57) [Claims] 1. A supporting means for supporting a large number of wafers in a stacked state and for raising the group of the wafers in a stacked state, and a fluid for an upper surface of an uppermost wafer arranged at a predetermined separation position. Separation means for injecting the uppermost wafer from other wafers, transporting means for transporting the separated wafer in the unloading direction using a liquid flow, and in the unloading direction of the uppermost wafer. And a stopper for preventing the movement of another wafer in the unloading direction by allowing only the transfer of the other wafer, so that the uppermost wafer does not interfere with the stopper, and as movement in the unloading direction can be blocked by the stopper, the tilt adjustment means for adjusting the inclination of the wafer group provided, said support means contact by stacking supports the wafer group in the liquid
When the wafer group is lifted by the supporting means,
The upper surface of the wafer is inclined from obliquely downstream in the wafer transfer direction.
And eject the liquid to prevent the wafer from lifting.
Separation and transfer device for wafers provided with even means . 2. The stopper according to claim 1, wherein the stopper has an upper edge for allowing the uppermost wafer to be transported in the unloading direction. 2. The wafer separation and transfer apparatus according to claim 1, wherein the inclination is adjusted so as to be parallel. 3. An upper edge of the stopper is provided substantially parallel to a horizontal plane, and the tilt adjusting means adjusts the tilt so that the uppermost wafer is substantially parallel to the horizontal plane. Item 3. A wafer separation and transfer device according to Item 2. 4. The tilt adjusting means includes: a support surface for stacking and supporting a group of wafers; a tilt mechanism for tilting the support surface to adjust a tilt angle of the support surface with respect to a horizontal plane; It is opposed to the upper surface, according to a detection means for detecting the inclination of the upper surface of the wafer, or Re claims 1-3 noise and a control means for controlling the tilting mechanism based on the detection result by the detection means Wafer transfer equipment. 5. The tilt adjusting means includes: a tilt support for tiltably supporting a stacked wafer group; and a tilt support member disposed to face an upper surface of an uppermost wafer, and the upper surface of the wafer is brought into contact with the upper surface of the wafer so that the wafer is in a horizontal plane. 4. A wafer separating and transferring apparatus according to claim 1, further comprising a restricting means for restricting the wafer to a predetermined angle with respect to the wafer. 6. The separation means for separating and moving the wafer by directly contacting the uppermost wafer, and after the wafer is started by the separation and extrusion means , the upper surface of the wafer is positioned at the center thereof. 6. A wafer separating and conveying apparatus according to claim 1, further comprising: a rotating means for injecting a fluid obliquely from above to a position deviated from, and rotating the wafer in one direction to separate the wafer from another wafer. 7. A transport device is provided downstream of the support means in the transport direction.
Shoe for guiding a wafer conveyed by the transfer means
The chute is placed downstream of the chute in the conveyance direction.
To store separated wafers one by one
7. The wafer separation and transfer device according to claim 1 , wherein a cassette having a storage shelf is arranged .