JP3230673B2 - High frequency circulator and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circulator for use in a high frequency band, especially a frequency band of a millimeter wave or higher, and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a non-reciprocal circuit device used in a high frequency band, there is a microstrip type circulator formed in a layer. FIGS. 8 and 9 show plan views and cross-sectional views of conventional high-frequency microstrip circulators (Japanese Patent Application Nos. 10-237427 and 11-003464). In FIG. 8, a disc-shaped ferrite 22 is incorporated in the center of the insulating layer 21. The GND layer 24 is formed on one surface of the insulating layer 21 in which the ferrite 22 is incorporated, and the SIG circuit 23 is formed on the other surface. The SIG circuit 23 has a circular portion on the ferrite 22 and three line portions formed radially from the circular portion. This line portion forms a microstrip line type signal transmission path, and the circular portion forms a non-reciprocal circuit due to the magnetism of the ferrite 22. In order to obtain irreversible characteristics, a magnetic field is generated in the ferrite 22. FIG. 9 shows the GND layer 24 and the SIG
An example is shown in which the space between the circuits 23 is composed of only a single-layer ferrite 22. In this high frequency microstrip circulator, the ferrite 22 has a thickness of 0.1 m.
A m-shaped plate is used.

[0003]

This high-frequency microstrip circulator transmits a signal in a high frequency band. Therefore, the distance between the SIG circuit forming the microstrip line and GND is relatively low. It must be narrower than that used in the band.
Therefore, it is necessary to reduce the thickness of the ferrite plate between the SIG circuit and GND. The thickness of the ferrite plate is 0.
If it is about 1 mm, the strength of the ferrite plate becomes weak, and cracks often occur in the ferrite plate in the process of manufacturing a circulator and in the process of assembling an MIC (microwave integrated circuit) module on which the circulator is mounted. As described above, the conventional circulator is frequently cracked or chipped.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a high-frequency circulator having a strength that does not cause cracking or chipping in a circulator manufacturing process and an MIC module mounting process in which the circulator is mounted, and a method of manufacturing the same.

[0005]

In order to solve the above-mentioned problems, a high-frequency circulator according to the present invention comprises a disk-shaped circulator.
And ferrite, a disc-shaped ferrite and an insulating layer formed so as to surround the, GND which is a disc-shaped ferrite and the insulating layer formed on one surface of the layer to be formed (ground) layer, formed on the other surface Circle formed on the disk-shaped ferrite
S having a shape portion and a line portion extending radially from the circular portion
A circulator laminate comprising an IG (signal) circuit ;
A high-frequency circulator having an insulating substrate formed by laminating a circulator laminate with a GND layer as a lowermost layer;
The circulator laminate of the insulating substrate is provided.
Electrical connection between the opposite side of the
SIG via connected to the circulator product of the insulating substrate
Adjacent to the SIG via on the surface opposite to the surface on which the layer body is provided
GND point that electrically connects the two points to be connected to the GND layer
And an input / output terminal section having

Thus, the stress applied to the high-frequency circulator by external force can be absorbed by the insulating substrate. For this reason, the stress applied to the disc-shaped ferrite disposed on the insulating substrate can be reduced.

Further, the high- frequency circulator according to the present invention includes a SIG circuit for forming a transmission path of a high-frequency signal and a G
ND terminal and two GN terminals
D terminal and two GNDs on both sides adjacent to the SIG terminal
An external device provided with the terminal
And the SIG terminal, and the two GND vias
Wire bond each end and two GND terminals
Electrically connected by connecting with each other.

Thus, the high-frequency circulator and the external circuit can be easily connected. That is, the high-frequency circulator and the external circuit are electrically connected by wire bonding between the end of the SIG via and the SIG circuit terminal of the external circuit and between the end of the GND via and the GND terminal of the external circuit. And a transmission path of a coplanar signal can be formed.

In addition, S which forms a transmission path of a high-frequency signal
SIG terminal connected to each of IG circuit and GND
And two GND terminals, SIG via and two
Provided with circulator laminate of insulating substrate of GND via
Placement similar to the placement pattern on the opposite side of the given surface
The external device provided in the pattern, the end of the SIG via
SIG terminal, and two GND via ends and two
And GND connection are arranged facing each other and bump connection
It may be connected between the high frequency circulator and an external circuit by electrically connected Rukoto by.

In this case, bump connection is used.
Than when connecting by wire bonding, etc.
It is possible to reduce the electric loss of the connection part.

[0011] A high frequency circulator according to another embodiment of the present invention.
The ferrite surrounds the disc-shaped ferrite.
The insulating layer formed as above, the disk-shaped ferrite and the insulating layer
Formed on one surface of the layer formed by
C) layer and the disk-shaped ferrite formed on the other surface.
The circular part formed above and the line extending radially from the circular part
And a SIG (signal) circuit having a road section.
The circulator stack and the circulator stack make up the GND layer.
An insulating substrate laminated and formed as a lower layer;
2 adjacent to the end of the line portion on the surface where the SIG circuit is formed
And a GND via that electrically connects the two points to the GND layer
A high-frequency circulator having a high-frequency signal
Of the SIG circuit and GND forming the transmission path of
SIG terminal and two GND terminals connected to
The end of the line part of the SIG circuit and the two GND vias
On the surface of the insulating substrate on which the circulator laminate is provided
External devices provided with the same layout pattern as the
And the end of the SIG circuit and the SIG terminal, and two
Pair of GND vias and two GND terminals
Electrical connection by placing
It is characterized by being continued.

Furthermore, by providing an adhesive layer interposed between the ferrite and the GND layer, the strength of the lower surface of the ferrite can be increased. For this reason, when stress due to external force is applied to the high-frequency circulator,
The deformation of the ferrite portion can be suppressed, and the stress applied to the ferrite can be further reduced.

The adhesive layer may have any shape as long as it covers the entire lower surface of the ferrite, but if the adhesive layer has a disk shape slightly larger than the diameter of the disk ferrite,
The effect of reducing the stress applied to the ferrite by the adhesive layer is sufficiently obtained.

Further, when the adhesive layer is made of a conductive material, it is not necessary to consider the adhesive layer when determining the distance between the GND layer and the SIG circuit, and the design becomes easy. That is,
Since the adhesive layer fulfills the function of GND, the distance between GND and the SIG circuit is determined only by the disc-shaped ferrite and the insulating layer excluding the adhesive layer.

When the adhesive layer is made of an insulating material, a short circuit between the SIG circuit and the GND layer can be prevented. That is, even if a conductor enters the gap between the insulating layer and the disc-shaped ferrite in the manufacturing process, the SIG circuit and the GN
Since the adhesive layer between the D layer and the conductive layer prevents the intrusion of the conductive material, the electrical connection between the two can be prevented. However, in this case, when determining the distance between the GND and the SIG circuit, it is necessary to consider the thickness, shape, and dielectric constant of the adhesive layer.

Further, by forming the disc-shaped ferrite from hard magnetic ferrite, a magnetic field can be applied to the ferrite into a permanent magnet after the manufacturing process of the high-frequency circulator is completed. Therefore, there is no need to provide an external magnetic field generating mechanism to obtain irreversible characteristics, and the configuration can be simplified.

Further, when the disk-shaped ferrite is made of soft magnetic ferrite, processing of the ferrite becomes easy. That is, since internal stress is generated when the ferrite has a magnetic field, it is difficult to process the ferrite into a thin plate of several tens of μm. Therefore, if the ferrite is made of a soft magnetic ferrite, it can be easily processed without a magnetic field. However, in this case, it is necessary to provide a magnetic field generating mechanism such as a permanent magnet on the upper surface of the ferrite.

Further, after the circulator laminate is formed on the insulating substrate, the insulating substrate may be warped due to thermal deformation of the material constituting each layer. In this case, such a warp can be reduced by forming a reinforcing insulating layer on the surface of the insulating substrate opposite to the surface on which the circulator laminate is stacked.

The manufacturing method of high frequency circulator according to the present invention, a disc-shaped ferrite, and a disc-shaped ferrite insulating is formed to surround the layer, disc-shaped ferrite with one layer insulating layer and to form A GND layer formed on the surface;
Formed on the disk-shaped ferrite formed on the other side
With a circular section and a line section extending radially from the circular section.
In the method for manufacturing a high-frequency circulator having a circulator laminate including a SIG circuit, a step of laminating the circulator laminate on an insulating substrate with a GND layer as a lowermost layer ;
Connect the surface opposite the provided surface to the line portion of the SIG circuit.
SIG vias for air connection and circulating on insulating substrate
In the SIG via on the surface opposite to the surface on which the
GN for electrically connecting two adjacent points to the GND layer
Forming a D via .

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. As shown in FIG. 1, the high-frequency circulator according to the present invention includes a GND layer 4-1, an adhesive layer 5, a ferrite 2, a ferrite 2 on an insulating substrate 1 having a thickness that does not cause cracking or chipping in an assembling process. The insulating layer 6-1 and the SIG circuit 3-1 are formed.

The disk-shaped ferrite 2 is disposed at the center of the adhesive layer 5, and an insulating layer 6-1 is formed around the center. The SIG circuit 3-1 has a circular portion on the ferrite 2 and three line portions extending radially from the circular portion. The circular portion forms a non-reciprocal circuit due to the magnetism of the ferrite 2, and the line portion forms a microstrip line type signal transmission path. An end of the line portion serves as an input / output unit with an external device. GND vias 4-2 that electrically connect two points sandwiching the line portion on the surface where the line portion is formed and the GND layer are arranged at each end of the line portion. Each via is exposed on this line forming surface.

With this configuration, even if the thickness of the ferrite 2 and the insulating layer 6-1 is about 0.05 mm, it is possible to prevent the ferrite 2 from cracking or chipping due to the strength of the insulating substrate 1.

In the configuration in which the insulating substrate 1 is arranged below the GND layer 4-1, since the GND layer 4-1 is not exposed to the outside, there is a problem how to take out the GND. However, in the present embodiment, by arranging the GND via 4-2 as described above, the external device and the GND layer 4-1 are easily electrically connected to the GND layer 4-1 through the GND via 4-2 by wire bonding or the like. be able to.

As shown in FIG. 2, a SIG via 3-2 for electrically connecting the surface of the insulating substrate 1 opposite to the surface on which the circulator laminate 7 is provided with the SIG circuit 3-1; And two points sandwiching the SIG via 3-2 on the surface opposite to the surface on which the circulator laminate 7 is provided.
By providing the GND via 4-2 for electrically connecting the layer 4-1 to the layer 4-1, the high-frequency circulator can be electrically connected to an external device.

The high-frequency circulator according to the present embodiment has a layered structure such as a microstrip type signal transmission path, and performs signal processing such as amplification of a high-frequency signal.
Used by being incorporated into an IC module.

Therefore, the circulator I / O terminal 8 comprising the SIG circuit 3-1 and the GND via 4-2 of the circulator of FIG.
FIG. 3 shows a specific example of electrical connection with the wire bonding 10. In this example, in order to perform connection with the circulator of FIG. 1, M having an input / output terminal unit 9 having the same structure as the input / output terminal unit 8 of the circulator of FIG.
An IC module was used. However, in this case, the SIG circuit 3
It is necessary to form an Au film by plating or the like at the wire bonding portion between the -1 and the GND via 4-2 . 3,
The end of the line section of the SIG circuit 3-1 and the SIG circuit terminal of the MIC module and the end of the GND via 4-2 and the GND terminal of the MIC module are electrically connected by wire bonding 10 or the like. By doing
A coplanar signal transmission path is formed between the high frequency circulator and the MIC module.

Further, as shown in FIG. 4, to form a GND bumps 12 on GND vias 4-2, to form a SIG bump 11 and the circulator output terminal 8 to the end of SIG circuit 3 -1, MIC GND terminal 4-3 on module
And an MIC module input / output terminal section 9 having a SIG terminal 3-3 and a high frequency circulator
It is also possible to arrange the C module so as to face it and electrically connect via a bump. Also in this case, a coplanar signal transmission path is formed between the high-frequency circulator and the MIC module. As described above, by electrically connecting via the bumps, the area of the bonding surface can be increased as compared with the case where the connection is performed by the wire bonding 10, and the electrical loss of the connection portion can be reduced.

Similarly, the SIG bump 11 is formed on the SIG via 3-2 and the GND bump 12 is formed on the GND via 4-2 of the circulator for high frequency shown in FIG. FIG. 5 is a schematic diagram of a specific example electrically connected. In this configuration, the surface on which the SIG circuit 3-1 is formed faces the outside in a state where the high frequency circulator is mounted on the MIC module. Therefore, the SIG circuit 3-1 can be finely adjusted after the high frequency circulator is mounted on the MIC module.

In the structure of this embodiment, alumina, glass ceramic or AlN is used as the insulating substrate 1. As the ground layer 4-1, a Cu film, a Cr film, Cu
/ Cr film or the like is formed by plating or the like.

The adhesive layer 5 is necessary for fixing the ferrite 2 formed as a separate member. Therefore, the adhesive layer 5 may be formed on the entire surface of the ground layer 4 as shown in FIG. 1 or may be formed in a circular shape having a size slightly larger than the diameter of the disk-shaped ferrite 2 as shown in FIG. No problem. In any case, the strength of the lower surface of the ferrite 2 can be increased by forming the adhesive layer 5. For this reason, when the stress due to the external force is applied to the high frequency circulator, the deformation of the ferrite 2 can be suppressed by the adhesive layer 5. Thus, the stress applied to the ferrite 2 can be reduced by the adhesive layer 5.

The material used for the adhesive layer 5 may be an insulating material or a conductive material. When a conductive material is used as the material of the adhesive layer 5, since the adhesive layer 5 performs the function of GND, the distance between the GND and the SIG circuit 3-1 is limited to the disc-shaped ferrite 2 excluding the adhesive layer 5 or the like. Insulating layer 6-1
Only determined. Therefore, it is not necessary to consider the thickness of the adhesive layer 5 when determining the distance between the GND layer 4-1 and the SIG circuit 3.

The material used for the adhesive layer 5 may be an insulating material or a conductive material. When a conductive material is used as the material of the adhesive layer 5, since the adhesive layer 5 performs the function of GND, the distance between the GND and the SIG circuit 3-1 is limited to the disc-shaped ferrite 2 excluding the adhesive layer 5 or the like. Insulating layer 6-1
Only determined. Therefore, when determining the distance between the GND layer 4-1 and SIG circuit 3 -1, it is not necessary to consider the thickness of the adhesive layer 5.

The disk-shaped ferrite 2 may be a soft magnetic ferrite or a hard magnetic ferrite. When a soft magnetic ferrite is used as the ferrite 2, it is necessary to arrange a permanent magnet above the circulator in order to operate as a circulator. On the other hand, when a hard magnetic ferrite is used as the ferrite 2, the permanent magnet itself is unnecessary, since the permanent magnet itself can be used.

In the high-frequency circulator according to the present embodiment, when an insulating substrate having a thickness of about 0.5 mm is used, the insulating substrate 1 does not warp even if the circulator laminate 7 is formed on one surface. . However, if the thickness of the insulating substrate 1 is about 0.2 mm or less, warpage occurs to such an extent that it can be visually confirmed. In this case, the warpage can be reduced by forming the reinforcing insulating layer 6-2 on the surface of the insulating substrate 1 opposite to the surface on which the circulator laminate 7 is formed, as shown in FIG.

Next, a method of manufacturing the high-frequency circulator according to the present embodiment will be described.

First, the GND layer 4-1 is formed on the insulating substrate 1 by plating or the like. Next, the adhesive layer 5 is connected to the GND layer 4-
1, and a disk-shaped ferrite 2 is bonded and arranged. Next, an insulating layer 6-1 having a thickness equal to or greater than the thickness of the ferrite 2
To form At this time, the insulating layer 6-1 and the adhesive layer 5
Patterning is performed using a mask or the like so that holes for forming the GND via 4-2 and the SIG via 3-2 are formed. Alternatively, holes may be formed by punching after forming the adhesive layer 5 and the insulating layer 6-1. Next, the insulating layer 6-1 is processed so that the upper surface of the ferrite 2 and the upper surface of the insulating layer 6-1 form the same plane. The SIG circuit 3-1 is formed on the plane formed by the ferrite 2 and the insulating layer 6-1 in such a manner that the circular conductor is disposed on the disk-shaped ferrite 2. On this occasion,
A via is formed by filling a hole formed for the via with a conductive material.

The GND via 4-2 and the SI
When the G via 3-2 is formed, the insulating substrate 1 in which a via hole (via hole) is formed in advance may be used. The via hole can be easily formed by the ceramic green sheet method.

As the ferrite 2, a preliminarily processed disk having a thickness of several tens μm is used. When a hard magnetic ferrite is used as the ferrite 2, an internal stress is generated in the material due to magnetism when the ferrite 2 is magnetized. For this reason, when the ferrite 2 is cut thin, the ferrite 2 is broken by internal stress. Therefore, in this case, the ferrite 2 is cut to a thickness of several tens of μm in a demagnetized state, and is magnetized after all the manufacturing steps are completed. When a soft magnetic ferrite is used as the ferrite 2, it can be easily processed without magnetism.

An example of a circulator manufactured according to the present embodiment will be described below.

Table 1 shows combinations of the configurations of the various circulators produced. The circles indicate that the following configurations are employed in the circulators indicated by the respective numbers.

[0041]

[Table 1] Structural condition 1: The adhesive layer 5 was formed on the entire surface of the GND layer 4. Structural condition 2: The adhesive layer 5 was formed in a circular shape slightly larger than the diameter of the ferrite 2. Configuration Condition 3: The input / output terminal 7 was formed on the surface on which the SIG circuit 3-1 was formed. Configuration condition 4: The input / output terminal portion 7 was formed on the surface of the insulating substrate 1 opposite to the surface on which the circulator was formed. Structural condition 5: The adhesive layer 5 was made of an insulating material. Structural condition 6: The adhesive layer 5 was made of a conductive material. Constitution condition 7: Ferrite 2 was composed of soft magnetic ferrite. Constituent condition 8: Ferrite 2 was composed of hard magnetic ferrite. Structural condition 9: The reinforcing insulating layer 6-2 was formed.

The ferrite 2 had a diameter of 0.6 mm and a thickness of 0.05 mm. The diameter of the circular conductor portion of the SIG circuit 3 is 0.56 mm, and the width of the microstrip line is 0.5 mm.
13 mm. Ni-Zn ferrite was used as the soft magnetic ferrite. Sr-based ferrite was used as the hard magnetic ferrite.

The circulators No. 1 and No. 2
Is formed on the entire surface of the GND layer 4, the input / output terminal portion 7 is formed on the surface on which the SIG circuit 3-1 is formed, and the adhesive layer 5 is made of an insulating material and a conductive material. is there.
In the circulators Nos. 3 and 4, the input / output terminal portions 7 were formed on the surface of the insulating substrate 1 opposite to the surface on which the circulators were formed, and the material of the adhesive layer 5 was changed similarly to the circulators Nos. 1 and 2. Things. In the circulators of Nos. 5 to 8, the adhesive layer 5 is formed in a circular shape slightly larger than the diameter of the ferrite 2, and like the circulators of Nos. 1 to 4, the surface on which the input / output terminal portion 7 is formed and the shape of the adhesive layer 5 are formed. Is changed respectively.

The circulators Nos. 1 to 8 use hard magnetic ferrites as the ferrites 2, whereas the circulators No. 9 use soft magnetic ferrites and are placed above the ferrites 2 to obtain irreversible characteristics. It has permanent magnets. The configuration of the adhesive layer 5 of the circulator of No. 9 and the surface on which the input / output terminals are formed are denoted by No. 1
Circulator.

In order to confirm the irreversible circuit characteristics of the circulators of the respective numbers, the measurement was performed in a state where a terminating resistor was attached to one microstrip line end of three microstrip lines for each number of the circulators, and used as an isolator. .

As a result, in the case of the circulator No. 9 using soft magnetic ferrite, characteristics as an isolator were obtained in a frequency range of 40 to 50 GHz. In the case of circulators Nos. 1 to 8 using hard magnetic ferrite, characteristics as an isolator were obtained in a frequency range of 70 GHz to 80 GHz.

In the circulators of numbers 1 to 9,
If the thickness of the insulating layer 6-1 is further reduced, warpage may occur in the insulating substrate 1. However, in the circulator of No. 10, the warpage does not occur as a result of forming the reinforcing insulating layer 6-2. Was.

In any case, the circulators Nos. 1 to 10 are manufactured in the same manner as the circulators on which the circulators are mounted.
There were no cracks or chips on the substrate during the IC module assembly process.

When the high frequency circulator and the MIC are connected by bumps, the loss is 0.2% less than when both are connected by wire bonding 10.
dB decreased.

[0050]

The high-frequency circulator according to the present invention can prevent the circulator from cracking or chipping during the circulator manufacturing process and the assembly process of the MIC module on which the circulator is mounted. Therefore, the occurrence rate of defects as components can be reduced. For this reason, the present invention can enhance the reliability of the high-frequency circulator and the production line for industrial products including the high-frequency circulator.

[Brief description of the drawings]

FIG. 1 is a schematic view of a high-frequency circulator according to an embodiment of the present invention, where (a) is a plan view and (b) is a cross-sectional view.

FIGS. 2A and 2B are schematic views of a high-frequency circulator according to a modification of the embodiment according to the present invention, in which FIG. 2A is a plan view, FIG. 2B is a cross-sectional view, and FIG.

FIG. 3 is a schematic diagram showing a state where the high-frequency circulator of FIG. 1 and the MIC module are connected by wire bonding.

FIGS. 4A and 4B are schematic diagrams showing a state in which the high-frequency circulator of FIG. 1 and the MIC module are connected by bumps, wherein FIG. 4A is a plan view and FIG.

5A and 5B are schematic diagrams showing a state in which the high-frequency circulator of FIG. 2 and the MIC module are connected by bumps, wherein FIG. 5A is a plan view and FIG. 5B is a cross-sectional view.

FIG. 6 is a schematic diagram of a high-frequency circulator according to another modification of the embodiment according to the present invention.

FIG. 7 is a schematic diagram of a high-frequency circulator according to another modification of the embodiment according to the present invention.

8A and 8B are schematic views of a conventional high-frequency circulator, where FIG. 8A is a plan view and FIG. 8B is a cross-sectional view.

FIG. 9 is a schematic view of another conventional high-frequency circulator.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating board 2, 22 Ferrite 3-1 and 23-1 SIG circuit 3-2 SIG via 3-3 SIG terminal 4-1 and 24-1 GND layer 4-2 GND via 4-3 GND terminal 5 Adhesive layer 6 DESCRIPTION OF SYMBOLS 1, 21 Insulating layer 6-2 Reinforcement insulating layer 7 Circulator laminated body 8 Circulator input / output terminal part 9 MIC module input / output terminal part 10 Wire bonding 11 SIG bump 12 GND bump

Continuation of the front page (56) References JP-A-59-8403 (JP, A) JP-A-6-268414 (JP, A) JP-A-9-64606 (JP, A) JP-A-1-129501 (JP) JP-A-2-241680 (JP, A) JP-A-9-214209 (JP, A) JP-A-61-288486 (JP, A) JP-A-10-294607 (JP, A) JP-A-8-51306 (JP, A) JP-A-4-336702 (JP, A) JP-A 57-64902 (JP, U) JP-A 50-146436 (JP, A) U) Shokai Sho 56-174203 (JP, U) Shokai Sho 57-171301 (JP, U) Shokai 6-15308 (JP, U) Shokai Sho 59-69505 (JP, U) Shoko 42 −9847 (JP, Y1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01P 1/387 H01P 11/00

Claims (12)

(57) [Claims] 1. A disk-shaped ferrite , an insulating layer formed so as to surround the disk-shaped ferrite, and a GN formed on one surface of a layer formed by the disk-shaped ferrite and the insulating layer.
D (ground) layer and the disk formed on the other surface
From the circular part formed on the ferrite
A high-frequency circulator comprising: a circulator laminate including a SIG (signal) circuit having a radially extending line portion ; and an insulating substrate formed by laminating the circulator laminate with the GND layer as a lowermost layer.
A surface of the insulating substrate on which the circulator laminate is provided.
And the line portion of the SIG circuit is electrically connected.
A continuous SIG via and the circular substrate of the insulating substrate.
The SIG via on the surface opposite to the surface on which the
A) electrically connecting two points adjacent to each other to the GND layer
A high frequency circulator having an input / output terminal portion having a GND via . 2. An SIG circuit for forming a transmission path for a high-frequency signal.
SIG terminals and two connected to each of the road and GND
And two GND terminals on both sides adjacent to the SIG terminal.
An external device provided so that the two GND terminals are located
And the end of the SIG via and the SIG terminal
And the ends of the two GND vias and the two GND ends
Connected to each other by wire bonding.
The high circumference according to claim 1, wherein the high circumference is electrically connected by:
Wave circulator. 3. An SIG circuit for forming a transmission path of a high-frequency signal.
SIG terminals and two connected to each of the road and GND
GND terminal on one side, the SIG via and two front
The circulator product of the insulating substrate of the GND via
With the arrangement pattern on the surface opposite to the surface on which the layer body was provided
An external device provided in a similar arrangement pattern;
A G via end and the SIG terminal, and two
The end of the GND via and the two GND terminals
Electrically by placing them facing each other and connecting them with bumps
The high frequency circulator according to claim 1, which is connected.
Ta. 4. A disk-shaped ferrite and said disk-shaped ferrite
An insulating layer formed so as to surround the
Formed on one surface of the layer formed by the gate and the insulating layer
D (ground) layer and the disk formed on the other surface
From the circular part formed on the ferrite
An SIG (signal) circuit having a radially extending line portion;
Circulator laminate comprising the circulator product
A layer body is formed by laminating the GND layer as a lowermost layer.
An insulating substrate and the SIG circuit of the insulating layer are formed.
Two points adjacent to the end of the line section on the
High circumference having a GND via for electrically connecting the D layer
A wave circulator, comprising: a SIG circuit forming a transmission path of a high-frequency signal; and a GND.
SIG terminal and two GND terminals connected to each
And the other end of the line portion of the SIG circuit and 2
The circular of the insulating substrate of the two GND vias
Pattern similar to that on the surface on which the
An external device provided in an arrangement pattern and the SIG circuit
And the SIG terminal, and the two GNDs
The end of the via and the two GND terminals are opposed to each other.
And electrically connected by bump connection
High frequency circulator. 5. The high frequency circulator according to claim 1, further comprising an adhesive layer interposed between said ferrite and said GND layer. 6. The high frequency circulator according to claim 5, wherein said adhesive layer has a disk shape slightly larger than a diameter of said disk ferrite. 7. The adhesive layer according to claim 5, wherein the adhesive layer is made of a conductive material.
Or a high-frequency circulator according to 6 . 8. The adhesive layer according to claim 5, wherein said adhesive layer is made of an insulating material.
Or a high-frequency circulator according to 6 . 9. The high-frequency circulator according to claim 1, wherein said disk-shaped ferrite is made of a hard magnetic ferrite. 10. The high-frequency circulator according to claim 1, wherein said disc-shaped ferrite is made of soft magnetic ferrite. 11. The high-frequency circulator according to claim 1, further comprising a reinforcing insulating layer on a surface of the insulating substrate opposite to a surface on which the circulator laminate is stacked. 12. A disk-shaped ferrite , an insulating layer formed so as to surround the disk-shaped ferrite, and a G layer formed on one surface of a layer formed by the disk-shaped ferrite and the insulating layer.
An ND layer and the disk-shaped ferrite formed on the other surface.
And a radial portion extending from the circular portion
The method of manufacturing a high-frequency circulator having a circulator laminate comprising a SIG circuit having a building line portion, the circulator laminate, a step of laminating the GND layer on an insulating substrate as a lowermost layer, the insulation
Opposite to the surface of the substrate on which the circulator laminate is provided
Electrical connection between the side surface and the line section of the SIG circuit
SIG via and the circulator of the insulating substrate
The SIG via on a surface opposite to the surface on which the laminate is provided
Electrically connects two points adjacent to each other to the GND layer.
Forming a high-frequency circulator.