JP3233884B2 - Enamel wire coating dies - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die for coating an enameled wire.

[0002]

2. Description of the Related Art An enamel wire coating die used for coating an enamel on the surface of a linear conductor is disclosed in Japanese Utility Model Laid-Open No. 4-99630. As shown in FIG. 3, this enamel wire coating die is formed by holding a die chip 3 made of a hard material such as sapphire at the tip of a housing 2, and the die chip 3 is opened rearward. Chip storage unit 50
The die chip 3 is press-fitted therein. In this specification, the front means the sending side of the linear conductor, and the rear means the introducing side of the linear conductor.

[0003]

However, the above-mentioned prior art has the following disadvantages. First, since the die chip 3 is press-fitted into the housing 2 and fixed, the die chip 3 is easily cracked during the press-fitting operation, and the yield in manufacturing is poor. Also, the front end face 2 of the enamel wire coating die
Although the impact force is applied to the die 1 relatively frequently, the die chip 3 is easily detached from the housing 2 by the impact force applied to the front end face 21 in the conventional example fixed by press fitting. Therefore, the enamel wire coating die rises while following the running direction of the linear conductor when it is accidentally dropped on a hard floor surface such as concrete, or when used in a floating state in a vertical coating device and used in a floating state. When hitting the prevention plate, the die chip 3
May be desorbed from In addition, in order to press-fit the die chip 3 into the housing 2 from behind, the housing 2 needs a sufficient insertion space 51 for the die chip 3 to be inserted. 3 cannot be formed behind. For this reason, the vibration or deviation of the linear conductor 6 traveling in the enamel wire coating die is reduced by the die hole 3 of the die chip 3.
Since the restriction is made only by 0, the linear conductor 6 easily runs obliquely in the die hole 30 as shown by a chain line in FIG. 3, resulting in uneven coating film thickness.

An object of the present invention is to solve the above-mentioned drawbacks, and an object of the present invention is to provide an enamel wire coating die having a high production yield and a large holding force for the die chip 3.

[0005]

According to the present invention, the object is to provide a housing 2 having a chip receiving recess 1 opened forward, and a chip receiving device 1 mounted on a support seat 10 of the chip receiving recess 1. This is achieved by providing an enamel wire coating die composed of a die tip 3 fixed in the chip receiving concave portion 1 by caulking the open end portion of the concave portion 1.

The enamel coating die chip 3 is used to control the thickness of the coating on the linear conductor 6 by scraping off excess paint adhering to the linear conductor 6 traveling in a coating tank filled with enamel varnish. And a die hole 30 corresponding to the outer diameter of the coating film.
Are formed by holding the perforated dice chip 3 in the housing 2. The die chip 3 is preferably made of a hard material such as sapphire or a sintered alloy in order to prevent abrasion due to sliding contact with the linear conductor 6. In particular, sapphire may reduce the surface roughness of the wall surface of the die hole 30. Desirable to be able to.

The fixing operation of the die chip 3 is performed by fitting the die chip 3 into the chip receiving recess 1 and caulking the open end of the chip receiving recess 1. In the fixing work of the die chip 3 by caulking, since the load on the die chip 3 is smaller than that of the press-fitting operation, it is possible to prevent the die chip 3 from being damaged during the work. In order to reliably prevent the die chip 3 from being damaged, the caulking operation is preferably performed by rolling caulking. Further, since the fixed die chip 3 is supported on the back surface by the support seat 10 of the chip accommodating recess 1, the die chip 3 does not fall backward even when an impact force is applied to the front end face 21. Since the front surface of the die 3 is protected by the caulking portion 20, there is no possibility that the die chip 3 is damaged by the direct impact force applied to the die chip 3.

Further, when the caulking portion 20 of the die chip 3 is retracted from the front end surface 21 of the housing 2 (claim 2), the caulking portion 20 is recessed from the front end surface 21 of the housing 2. As a result, when the enamel wire coating die is accidentally dropped, the periphery of the caulking portion 20 comes into contact with a hard floor surface or the like, so that an impact force may be transmitted to the caulking portion 20. The die chip 3 is not damaged due to the transmission of the impact force to the die chip 3.

A guide hole 4 formed in the support seat 10 of the chip accommodating concave portion 1 is provided in the approach portion 3 of the die chip 3.
By making the diameter smaller than 1 (claim 3), even if the enamel wire coating die is inclined, the linear shape running in the enamel wire coating die as shown by a chain line in FIG. Since the conductor 6 is supported by two points, the guide hole 4 and the dice hole 30 of the dice chip 3, oblique traveling is prevented.

[0010]

FIG. 2 shows an enamel varnish coating device 7 according to the present invention.
Is shown. The illustrated embodiment is a so-called vertical type coating apparatus for moving the linear conductor 6 in the vertical direction, and the linear conductor 6 traveling in the paint tank is provided with a hole 70 a of the lower holding plate 70.
After being pulled upward from the
a.

The enamel wire coating die A according to this embodiment, which is configured as a floating die, is disposed between the lower holding plate 70 and the rise preventing plate 71,
When vibration occurs in the linear conductor 6 during the coating operation, the linear conductor 6 moves following the vibration to prevent uneven coating of the paint. In FIG. 2, reference numeral 72 denotes an enamel varnish.

As shown in detail in FIG. 1, an enamel wire coating die A includes a housing 2 and a die chip 3 made of sapphire. The die chip 3 is provided with a die hole 30 penetrating the center portion, and an approach portion 31 that gradually expands toward the rear extends from the rear end of the die hole 30. The housing 2 is made of brass or the like in consideration of workability, and includes a chip accommodating concave portion 1, a guide hole 4, and an expanding portion 22, as shown in FIG. Chip receiving recess 1
Is open to the front end, and is formed to have an outer diameter substantially equal to or slightly larger than the outer diameter of the die chip 3 so that the die chip 3 can be fitted. Further, a V-shaped groove 23 is formed at the front end of the housing 2 so as to surround the chip accommodating recess 1 in a circular shape in plan view. The guide hole 4 is bored at the center of the support seat 10 constituting the bottom wall of the chip housing recess 1, and is formed substantially concentric with the die hole 30 of the die chip 3 fixed in the chip housing recess 1. The guide hole 4 has at least the approach portion 3 of the die chip 3.
1 is smaller than the diameter D at the lower end.

FIG. 1 (a) shows an enamel wire coating die A according to the present invention in which a die chip 3 is fixed to the housing 2. The die chip 3 is housed in a chip housing recess 1 of the housing 2, and then the housing 2 is mounted. The tip of 2 is fixed by caulking. In order to prevent an excessive load on the die chip 3 in the caulking process, the caulking operation is desirably performed by rolling caulking. The caulking portion 20 for fixing the die chip 3 by caulking is a housing 2
Is retracted from the front end face 21 of the stiffening member 20, so that no impact force is applied to the swaging portion 20.

That is, in this embodiment, the enamel wire coating die A moves upward following the movement of the linear conductor 6 in the initial stage of operation or the like, and even if it comes into contact with the rise prevention plate 71, the rise prevention plate 71 does not move. First, the front end face 21 of the housing 2 abuts, and the impact force propagates immediately below the front end face as shown by an arrow in FIG. 1A, and there is no propagation of the impact force to the die chip 3. Can be reliably prevented.

In the above description, the case where the dies are configured as floating dies in a vertical enamel varnish coating apparatus is shown. However, the dies can be configured as horizontal enamel wire coating dies. In this case as well, when the housing 2 is accidentally dropped on a concrete floor or the like, the front end surface 21 of the housing 2 abuts on the floor surface, so that damage to the die chip 3 can be prevented.

In the above description, the case where the die hole 30 is circular has been described, but a rectangular hole adapted to a rectangular wire may be used.

[0017]

As is apparent from the above description, according to the present invention, since an excessive load is not applied to the die chip at the time of manufacturing, the die chip is not cracked or chipped. The manufacturing yield can be improved. Further, since the die chip is fixed while being held between the caulking portion and the support seat, the die chip does not fall off.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams showing the present invention, wherein FIG. 1A is a cross-sectional view showing a state in which a die chip is caulked, and FIG. 1B is a cross-sectional view showing a state before caulking.

FIG. 2 is a view showing a coating device for enamel varnish.

FIG. 3 is a diagram showing a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 chip receiving recess 10 support seat 2 housing 20 crimping portion 21 front end face 3 dice chip 30 dice hole 31 approach portion 4 guide hole

Claims (3)

(57) [Claims] A die having a chip receiving recess opened forward, a die mounted on a support seat of the chip receiving recess, and fixed in the chip receiving recess by caulking an open end of the tip receiving recess. Die for enamel wire coating consisting of chips. 2. The enamel wire coating die according to claim 1, wherein the swaged portion of the die chip is recessed from a front end surface of the housing. 3. The die chip has an approach portion extending at a rear end of a die hole and gradually expanding toward the rear, and a support seat of the chip accommodating recess is provided at a position from a rear end of the approach portion. 3. A small-diameter guide hole is opened.
The described enamel wire coating dice.