JP3234319B2 - Oxide removal equipment for jet-type solder bath - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for removing oxides from a jet type solder bath.

[0002]

2. Description of the Related Art As disclosed in Japanese Utility Model Publication No. 55-38616 and Japanese Utility Model Publication No. Sho 58-6618, a solder oxide floating on a molten solder surface of a solder bath is moved along the molten solder surface. There is an oxide removing device that scrapes out of the tank by the removing body.

The use of this conventional oxide removing apparatus is limited to a non-jet type solder bath. In other words, in a immersion solder bath where there is no obstacle on the molten solder surface such as a stationary solder bath that moves the work to be soldered up and down, or a vertical solder bath that moves the solder bath itself up and down, The oxide remover may be moved horizontally from one end to the other end of the bath.However, in a jet-type solder bath in which molten solder is jetted from a nozzle, the nozzle protrudes into the movement path of the oxide remover and may be an obstacle. Therefore, the conventional oxide removing apparatus cannot be used in a jet-type solder bath.

[0004]

For this reason, when removing the oxide floating on the molten solder surface of the jet-type solder bath, it is necessary to rely exclusively on manual labor, but it is necessary to stop the apparatus. In addition, it is not preferable in terms of the burden on the worker and safety.

In some cases, an antioxidant is added to the molten solder in the solder bath to suppress the generation of solder oxides. However, there is a problem that the antioxidant has a bad effect on soldering.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to automate the operation of removing a solder oxide in a jet-type solder bath.

[0007]

According to a first aspect of the present invention, there is provided an oxide removing apparatus for removing a solder oxide floating on a molten solder surface of a solder bath with an oxide removing body.
An endless revolving body rotatably provided along an inner wall of a jet-type solder bath having a plurality of jet nozzles, and a melter mounted around the jet nozzle attached to the revolving body to move around the nozzles Moves between the oxide remover around the nozzle to remove solder oxide floating on the solder surface and multiple jet nozzles
A solder that is freely installed and floats on the molten solder surface between the nozzles
An oxide removing device for a jet-type solder bath having a configuration including an inter-nozzle oxide removing body for removing oxide.

According to a second aspect of the present invention, there is provided an oxide removing apparatus for removing a solder oxide floating on a molten solder surface of a solder bath by an oxide remover, the inner wall of a jet type solder bath having a plurality of jet nozzles. An endless revolving body provided rotatably along the nozzle, and a nozzle attached to the revolving body, which moves around the jet nozzle and removes a solder oxide floating on a molten solder surface around the nozzle. A peripheral oxide remover, an inter-nozzle oxide remover movably provided between a plurality of jet nozzles for removing solder oxide floating on a molten solder surface between the nozzles , and provided at an edge of a solder bath No
Oxide that is scraped out of the tank by the oxide remover
An oxide removing device for a jet-type solder bath having an oxide scraping guide plate serving as an opening passage .

[0009]

According to the first aspect of the present invention, the endless revolving body moves the oxide remover around the nozzle around the jet nozzle to remove the solder oxide floating on the molten solder surface around the nozzle. With the oxide remover between nozzles
Oxide floating on the molten solder surface between the jet nozzles
Is removed .

According to a second aspect of the present invention, the oxide remover around the nozzle removes the solder oxide floating on the molten solder surface around the nozzle, and the oxide remover between the nozzles melts the plurality of jet nozzles. The solder oxide floating on the solder surface is removed, and the oxide remover between the nozzles is cleaned with oxide.
Move up to the outer end of the exit guide plate, and
Solder oxide floating on the molten solder surface and around the nozzle
Collected inside the oxide scraping guide plate by the oxide remover
The removed solder oxide is scraped out of the solder bath .

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to an embodiment shown in the drawings.

As shown in FIGS. 1 and 2, inside a jet-type solder bath 11, two nozzles, a primary nozzle and a secondary nozzle (finish nozzle), located below a work (substrate) transfer path 12 are provided. Jet nozzles 13 and 14 are arranged. An inner wall 11a of the jet type solder bath 11 is formed in a shape based on an oblong shape, and a concave groove 15 is provided endlessly along the inner wall 11a, and an endless revolving body is provided inside the concave groove 15. An endless chain 16 is rotatably fitted along the inner wall 11a.

The endless chain 16 meshes with a sprocket 19 which is driven to rotate by a rotating shaft 18 in a sprocket groove 17 provided on one side of the jet type solder bath 11. By rotating the sprocket 19, the endless chain 16 rotates along the inner wall 11a. The chain as the endless revolving body can be replaced with a wire or the like.

A part around the nozzle 16 is provided with an oxide remover 21 around the nozzle. The nozzle peripheral oxide remover 21 moves around the jet nozzles 13 and 14 to remove the solder oxide floating on the molten solder surface A around the nozzles.

Further, an inter-nozzle oxide remover 22 is movably provided between the two jet nozzles 13 and 14. The inter-nozzle oxide remover 22 is attached to a piston rod 24 of an air cylinder 23 disposed on the other side of the jet-type solder bath 11, and solder floating on the molten solder surface B between the jet nozzles 13 and 14. It removes oxides.

As shown in FIGS. 1 and 3, an oxide scraping guide plate 25 is provided at the edge of the solder tank on the side where the air cylinder 23 is located. This is an outlet passage for oxides scraped out. The inter-nozzle oxide remover 22 is rotatably supported at the distal end of the piston rod 24 so that the lower end can escape to the opposite side when engaged with the oxide scraping guide plate 25, and is illustrated by a spring (not shown). 3 is held.

In such a configuration, the oxide removing body 21 around the nozzle is moved around the jet nozzles 13 and 14 by the endless chain 16, and for example, as shown in FIG.
Is rotated from one side of the oxide scraping guide plate 25 to the other side, and the solder oxide floating on the molten solder surface A around the nozzle is collected inside the oxide scraping guide plate 25.

Further, the inter-nozzle oxide remover 22 is moved from the position shown in FIG. 1 to above the outer end of the oxide scraping guide plate 25, and the molten solder surface B between the two jet nozzles 13 and 14 is moved. Solder oxide floating on the surface and the oxide remover around the nozzle
The solder oxide scraped inside the oxide scraping guide plate 25 by 21 is simultaneously scraped out of the jet-type solder bath 11
You.

[0019]

According to the first aspect of the present invention, an oxide remover around a nozzle driven by an endless revolving body ,
Solder acid floating on the molten solder surface between multiple jet nozzles
By the inter-nozzle oxide removal member for removing the product, more
Nozzles also occur in jet-type solder baths with
Solder oxide floating on the molten solder surface around the nozzle and between the nozzles can be automatically removed, eliminating the need to stop the jet-type solder bath for oxide removal and ensuring safety .

According to the invention described in claim 2, it is possible to automatically remove solder oxides floating on molten solder surface between Roh nozzle surrounding and nozzle, Bruno
Remove the oxide removal material between the swarf and the outer edge of the oxide scraping guide plate.
Move and float on the molten solder surface between multiple jet nozzles
Oxidized by solder oxide and oxide remover around nozzle
Solder oxide collected inside the object scraping guide plate
It can be scraped out of the solder bath .

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an apparatus for removing oxides from a jet-type solder bath according to the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view of an oxide scraping section in the oxide removing apparatus of FIG. 1;

[Explanation of symbols]

11 Jet-type solder bath 11a Inner wall 13, 14 Jet nozzle 16 Endless chain as a rotating body 21 Oxide remover around nozzle 22 Oxide remover between nozzles 25 Oxide scraping guide plate

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-52-133054 (JP, A) JP-A-5-269576 (JP, A) JP-A 2-138067 (JP, U) JP-A 62-130576 193962 (JP, U) JP-A 55-49807 (JP, U) JP-A 52-26498 (JP, Y2) (58) Fields investigated (Int. Cl. ⁷ , DB name) B23K 3/06 B23K 1 / 08

Claims (2)

(57) [Claims] 1. An oxide removing device for removing a solder oxide floating on a molten solder surface of a solder bath by an oxide remover, the device being capable of freely rotating along an inner wall of a jet type solder bath having a plurality of jet nozzles. An endless revolving body provided, and a nozzle-surrounding oxide remover attached to the revolving body and moving around the jet nozzle to remove solder oxide floating on the molten solder surface around the nozzle , Movable between multiple jet nozzles
Nozzle to remove solder oxide floating on the molten solder surface
An oxide remover for a jet-type solder bath, comprising: an oxide remover. 2. An oxide removing device for removing a solder oxide floating on a molten solder surface of a solder bath by an oxide remover, wherein the device is rotatable along an inner wall of a jet-type solder bath having a plurality of jet nozzles. An endless revolving body provided, and a nozzle-surrounding oxide remover attached to the revolving body and moving around the jet nozzle to remove solder oxide floating on the molten solder surface around the nozzle, An inter-nozzle oxide remover movably provided between a plurality of jet nozzles for removing solder oxide floating on the molten solder surface between the nozzles, and an inter-nozzle oxide remover provided at the edge of the solder bath
Oxide that is the exit passage for oxide scraped out of the tank
An oxide removing device for a jet-type solder bath, comprising: a scraping guide plate .