JP3237199B2 - How to attach a magnetic plate to a disk substrate - Google Patents
How to attach a magnetic plate to a disk substrateInfo
- Publication number
- JP3237199B2 JP3237199B2 JP15730592A JP15730592A JP3237199B2 JP 3237199 B2 JP3237199 B2 JP 3237199B2 JP 15730592 A JP15730592 A JP 15730592A JP 15730592 A JP15730592 A JP 15730592A JP 3237199 B2 JP3237199 B2 JP 3237199B2
- Authority
- JP
- Japan
- Prior art keywords
- disk
- disk substrate
- magnetic plate
- substrate
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/567—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using a tamping or a swaging operation, i.e. at least partially deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
- B29C65/568—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using a tamping or a swaging operation, i.e. at least partially deforming the edge or the rim of a first part to be joined to clamp a second part to be joined using a swaging operation, i.e. totally deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
- B29C65/749—Removing scrap
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
- B29C66/135—Single hemmed joints, i.e. one of the parts to be joined being hemmed in the joint area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/61—Joining from or joining on the inside
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
- B29C66/81427—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single ridge, e.g. for making a weakening line; comprising a single tooth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/737—Articles provided with holes, e.g. grids, sieves
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、光ディスクや光磁気デ
ィスク等の如く所望の情報信号が記録される情報信号記
録ディスクを構成するディスク基板に配設される磁性板
の取付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a magnetic plate disposed on a disk substrate of an information signal recording disk on which a desired information signal is recorded, such as an optical disk or a magneto-optical disk.
【0002】[0002]
【従来の技術】従来、光ディスクや光磁気ディスクの如
く所望の情報信号が記録される情報信号記録用のディス
クが提案されている。この種のディスクは、情報信号の
高密度記録が可能であるので、極めて小径のものが提案
されている。例えば、直径を略64mmとなし、楽音信
号で略74分の記録を可能となす光ディスク或いは光磁
気ディスクが提案されている。2. Description of the Related Art Hitherto, there has been proposed an information signal recording disk on which a desired information signal is recorded, such as an optical disk or a magneto-optical disk. This kind of disc is capable of recording information signals at a high density, so that a very small disc has been proposed. For example, there has been proposed an optical disk or a magneto-optical disk having a diameter of about 64 mm and capable of recording about 74 minutes with a tone signal.
【0003】このように小径であって、情報信号の高密
度記録が可能となされた光磁気ディスクは、ディスク回
転駆動装置に装着されて高速で回転操作される。そし
て、高速で回転駆動された状態で、光磁気ディスクの一
主面に形成された信号記録層に設けられた微細な記録ト
ラックに、光学ピックアップ装置から出射される光ビー
ムを照射するとともに、磁界ヘッド等の外部磁界発生装
置から記録すべき情報信号に応じて磁界変調された外部
磁界を印加することによって所望の情報信号の記録が行
われる。A magneto-optical disk having such a small diameter and capable of recording information signals at a high density is mounted on a disk rotation drive and rotated at a high speed. Then, while being rotated at a high speed, a fine recording track provided on a signal recording layer formed on one main surface of the magneto-optical disk is irradiated with a light beam emitted from the optical pickup device, and a magnetic field is emitted. A desired information signal is recorded by applying an external magnetic field modulated from a magnetic field generator such as a head according to the information signal to be recorded.
【0004】このように高速で回転駆動されながら微細
な記録トラックに光ビームを正確に照射するため、光磁
気ディスクは、ディスク回転駆動装置のディスクテーブ
ルに確実に一体化されるとともにディスクテーブルの軸
心に回転中心を高精度に位置決めして装着される必要が
ある。かかる目的を達成するために、従来においては、
光磁気ディスク側に磁性材料からなる金属板を配設し、
これをディスクテーブル側に設けたマグネットで吸引す
ることにより、光磁気ディスクをディスクテーブル上に
チャッキングするようにしたディスク装着方式が提案さ
れている。In order to accurately irradiate a fine recording track with a light beam while being rotated and driven at a high speed, the magneto-optical disk is surely integrated with a disk table of a disk rotation driving device and a shaft of the disk table is rotated. It is necessary to mount the rotation center on the heart with high precision. Conventionally, to achieve this purpose,
A metal plate made of a magnetic material is arranged on the magneto-optical disk side,
A disk mounting method has been proposed in which the magneto-optical disk is chucked on the disk table by attracting the magnetic disk with a magnet provided on the disk table side.
【0005】このマグネットの吸引力を利用したマグネ
ットチャッキング方式に用いられる光磁気ディスクは、
図9に示すように、透明なポリカーボネート樹脂等の合
成樹脂を円盤形状に成形して形成されたディスク基板5
1を備えている。このディスク基板51の一方の主面5
1a側には、所望の情報信号が記録される情報信号記録
層が形成されている。そして、ディスク基板51は、情
報信号記録層が形成される一方の主面51aと対向する
他方の主面51bを情報信号の書込み読出し面となし、
この書込み読出し面側から信号記録層に光ビームを照射
することによって所望の情報信号の記録或いは再生が行
われる。A magneto-optical disk used in a magnet chucking system utilizing the attraction of a magnet is
As shown in FIG. 9, a disk substrate 5 formed by molding a synthetic resin such as a transparent polycarbonate resin into a disk shape.
1 is provided. One main surface 5 of the disk substrate 51
On the side of 1a, an information signal recording layer on which a desired information signal is recorded is formed. The disc substrate 51 has the other main surface 51b opposite to the one main surface 51a on which the information signal recording layer is formed as the information signal write / read surface,
By irradiating the signal recording layer with a light beam from the writing / reading surface side, recording or reproduction of a desired information signal is performed.
【0006】また、ディスク基板51の中央部には、デ
ィスク回転駆動装置側に配設されるセンタリング部材が
係合するセンター孔52が穿設されている。さらに、デ
ィスク基板51の一方の主面51a側の中央部には、金
属材料よりなる円盤状をなす磁性板53がセンター孔5
2を閉塞するように配設されている。かかる磁性板53
は、ディスク基板51の一方の主面51a側にセンター
孔52を囲んで形成された磁性板収納凹部54に嵌合す
るように配設されている。この磁性板収納凹部54に配
設された磁性板53は、磁性板収納凹部54の周縁部が
超音波加工されることにより当該凹部54の内方に向か
って突出される突出部(図示は省略する。)によって、
ディスク基板51に対し収納保持される。Further, a center hole 52 is formed in the center of the disk substrate 51 so that a centering member provided on the disk rotation driving device side can be engaged. Further, a disk-shaped magnetic plate 53 made of a metal material is provided in the center of the center hole 5 in the central portion on one main surface 51a side of the disk substrate 51.
2 is arranged to close. Such a magnetic plate 53
Are arranged on one main surface 51a side of the disk substrate 51 so as to fit into a magnetic plate housing recess 54 formed around the center hole 52. The magnetic plate 53 disposed in the magnetic plate storage recess 54 has a protrusion (not shown) that projects inwardly of the recess 54 by ultrasonically processing the peripheral edge of the magnetic plate storage recess 54. Do.)
It is stored and held in the disk substrate 51.
【0007】ところで、磁性板53のディスク基板51
への取付けは、次のようにして行われている。The disk substrate 51 of the magnetic plate 53
Attachment is performed as follows.
【0008】先ず、図10に示すように、ディスク基板
51をディスク受台55に載置する。ディスク受台55
は、ディスク基板51に設けられた磁性板収納凹部54
の外周に突設される突出部56を内部に収納し、当該デ
ィスク基板51を載置させる突出部嵌合凹部57を有し
ている。この突出部嵌合凹部57の外周縁には、ディス
ク基板51の書込み読出し面51bを支持する円環状を
なす突起として形成されるディスク受け部58が形成さ
れている。このディスク受台55には、突出部嵌合凹部
57の中心部に、ディスク基板51のセンター孔52に
臨んでディスク基板51を位置決めするための嵌合突部
59が設けられている。さらに、ディスク受台55に
は、ディスク基板51をこのディスク受台55に確実に
固定させるための真空エアポンプに接続される吸引孔6
0が設けられている。吸引孔60は、ディスク基板51
の書込み読出し面51bを支持するディスク受け部58
よりその基端部へと連続した貫通孔として設けられてい
る。First, as shown in FIG. 10, a disk substrate 51 is placed on a disk receiving table 55. Disk support 55
Is a magnetic plate storage recess 54 provided on the disk substrate 51.
And a projection fitting recess 57 for receiving the disk substrate 51 therein. A disk receiving portion 58 formed as an annular protrusion for supporting the write / read surface 51b of the disk substrate 51 is formed on the outer peripheral edge of the protrusion fitting concave portion 57. The disk receiving base 55 is provided with a fitting projection 59 for positioning the disk substrate 51 facing the center hole 52 of the disk substrate 51 at the center of the projection fitting recess 57. Further, the disk receiving base 55 has suction holes 6 connected to a vacuum air pump for securely fixing the disk substrate 51 to the disk receiving base 55.
0 is provided. The suction holes 60 are
Receiving portion 58 supporting write / read surface 51b
It is provided as a continuous through hole to the base end.
【0009】このように構成されたディスク受台55の
突出部嵌合凹部57にディスク基板51の突出部56を
嵌合させるとともに、嵌合突部59にセンター孔52を
臨ませる。この結果、嵌合突部59によってディスク基
板51がディスク受台55に対して位置決めされた状態
で載置される。The projection 56 of the disk substrate 51 is fitted into the projection fitting recess 57 of the disk receiving base 55 thus configured, and the center hole 52 is made to face the fitting projection 59. As a result, the disk substrate 51 is placed in a state of being positioned with respect to the disk receiving table 55 by the fitting projection 59.
【0010】次に、真空エアポンプを動作し、吸引孔6
0を介してディスク受け部58に載置されるディスク基
板51を吸引支持する。これにより、ディスク基板51
がディスク受台55に対して確実に固定される。Next, the vacuum air pump is operated, and the suction holes 6
The disk substrate 51 placed on the disk receiving portion 58 is supported by suction through the “0”. Thereby, the disk substrate 51
Are securely fixed to the disk receiving table 55.
【0011】しかる後、ディスク基板51の磁性板収納
凹部54の開口周縁部に円柱状をなすホーン61を当接
させ、図示しない超音波発振器からの超音波振動をこの
ホーン61に伝達する。この結果、磁性板収納凹部54
の開口周縁部が熱変形し、ホーン61の沈み込みによる
加圧で、開口周縁部の樹脂が凹部54の内方に張り出し
て円環状をなす突出部が形成される。これにより、磁性
板53が磁性板収納凹部54内に遊嵌状態で収納支持さ
れることになる。Thereafter, a cylindrical horn 61 is brought into contact with the peripheral edge of the opening of the magnetic plate accommodating recess 54 of the disk substrate 51, and ultrasonic vibration from an ultrasonic oscillator (not shown) is transmitted to the horn 61. As a result, the magnetic plate storage recess 54
Is thermally deformed, and the resin at the periphery of the opening protrudes inwardly of the concave portion 54 due to the pressurization caused by the sinking of the horn 61 to form an annular projection. Thus, the magnetic plate 53 is stored and supported in the magnetic plate storage recess 54 in a loosely fitted state.
【0012】[0012]
【発明が解決しようとする課題】ところが、真空エアポ
ンプを利用してディスク基板51をバキュームする方法
を取っても、ディスク基板51への超音波振動の印加に
よって当該ディスク基板51が振動し位置がずれが生ず
る。スウェージング時にディスク基板51がずれると、
超音波振動がディスク基板51全体に漏れ、当該超音波
振動を所定の位置に集中させることが不可能になり、そ
の周辺にクラックが発生する。クラックは、スウェージ
ング後は直ちに発生しないが、経時変化によって次第に
発生する。However, even if a method of vacuuming the disk substrate 51 using a vacuum air pump is used, the disk substrate 51 vibrates due to the application of ultrasonic vibration to the disk substrate 51, and the position of the disk substrate 51 shifts. Occurs. If the disk substrate 51 shifts during swaging,
The ultrasonic vibration leaks to the entire disk substrate 51, making it impossible to concentrate the ultrasonic vibration at a predetermined position, and cracks are generated around the predetermined position. Cracks do not occur immediately after swaging, but gradually occur over time.
【0013】さらに従来においては、図10に示すよう
に、ディスク基板51の外周縁部にディスク押さえ62
を当接させ、これに一定した外力Fを加えることにより
ディスク基板51を、ディスク受台55に固定すること
も行われている。この方法でもディスク基板51の確実
な固定が難しく、超音波振動の印加によりディスク基板
51の位置がずれ、熱変形される部分にクラックが発生
する。Further, in the prior art, as shown in FIG.
The disk substrate 51 is also fixed to the disk receiving table 55 by applying a constant external force F thereto. Even with this method, it is difficult to securely fix the disk substrate 51, and the position of the disk substrate 51 shifts due to the application of ultrasonic vibration, and cracks occur in portions that are thermally deformed.
【0014】そこで、本発明は、上述の技術的な課題に
鑑みて提案されたものであって、スウェージング時にデ
ィスク基板を確実に保持し、超音波振動を熱変形を受け
る所定の位置へ集中させてスウェージングすることがで
きるディスク基板に対する磁性板の取付け方法を提供す
ることを目的とする。Therefore, the present invention has been proposed in view of the above technical problem, and reliably holds a disk substrate at the time of swaging and concentrates ultrasonic vibrations at a predetermined position where thermal deformation occurs. It is an object of the present invention to provide a method of attaching a magnetic plate to a disk substrate that can be swaged by being swung.
【0015】[0015]
【課題を解決するための手段】上述の目的を達成するた
めに、本発明は、ディスク基板のセンターに設けられる
磁性板収納凹部内に磁性板を配し、このディスク基板を
ディスク載置手段に載置してディスク押さえ手段により
押圧保持せしめた状態で、上記磁性板収納凹部の上部周
縁に超音波発生手段を当接させることによって、上記磁
性板収納凹部の上部周縁より当該凹部の内方に向かって
突出する突出部を形成し、この突出部により上記磁性板
をディスク基板に支持するようにしたものである。According to the present invention, a magnetic plate is provided in a magnetic plate storage recess provided at the center of a disk substrate, and the disk substrate is mounted on a disk mounting means. The ultrasonic generating means is brought into contact with the upper peripheral edge of the magnetic plate storage concave portion in a state where the magnetic disk device is placed and pressed and held by the disk pressing means, so that the upper peripheral edge of the magnetic plate storage concave portion is inward of the concave portion. A protruding portion protruding toward the disk is formed, and the magnetic plate is supported on the disk substrate by the protruding portion.
【0016】また、スウェージングするに際しては、デ
ィスク押さえ手段とディスク載置手段とによってディス
ク基板に形成される情報信号記録層が形成されていない
内周部を保持する。このとき、ディスク押さえ手段とデ
ィスク載置手段に、ディスク基板に形成される情報信号
記録層が形成されていない内周部に当接する環状の突部
を設ける。さらに、ディスク押さえ手段に集塵機構を設
ける。When swaging, the inner peripheral portion of the disk substrate on which the information signal recording layer is not formed is held by the disk pressing means and the disk mounting means. At this time, the disk pressing means and the disk mounting means are provided with annular projections which come into contact with the inner peripheral portion of the disk substrate where the information signal recording layer is not formed. Further, a dust collecting mechanism is provided in the disc holding means.
【0017】[0017]
【作用】本発明方法は、ディスク基板をディスク載置手
段に載置してディスク押さえ手段により押圧保持させた
状態でスウェージングするので、ディスク基板が確実に
ディスク載置手段に固定され、印加させる超音波振動が
突出部が形成される部分に集中する。したがって、ウエ
ルド時間が短縮されるとともに、熱変形される部分にク
ラックが発生することが防止される。According to the method of the present invention, the disk substrate is swaged while being mounted on the disk mounting means and pressed and held by the disk pressing means, so that the disk substrate is securely fixed to the disk mounting means and applied. The ultrasonic vibration is concentrated on the portion where the protrusion is formed. Therefore, the weld time is shortened, and the occurrence of cracks in the thermally deformed portion is prevented.
【0018】ディスク載置手段とディスク押さえ手段
は、情報信号記録層が形成されていないディスク基板の
内周部を保持するので、当該情報信号記録層を傷付ける
こともない。また、ディスク押さえ手段に集塵機構が設
けられることにより、塵埃の無い常にクリーンな状態で
スウェージングが行える。Since the disc mounting means and the disc holding means hold the inner peripheral portion of the disc substrate on which the information signal recording layer is not formed, the information signal recording layer is not damaged. Further, since the disc holding means is provided with the dust collecting mechanism, swaging can be performed in a dust-free and always clean state.
【0019】[0019]
【実施例】以下、本発明を適用した具体的な実施例につ
いて図面を参照しながら詳細に説明する。なお、本実施
例は、本発明を、直径を64mmとなす光磁気ディスク
に適用した例である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is an example in which the present invention is applied to a magneto-optical disk having a diameter of 64 mm.
【0020】先ず、本発明が適用される光磁気ディスク
について説明する。かかる光磁気ディスク1は、図1に
示すように、透過性を有するポリカーボネート樹脂等の
合成樹脂材料を一体成形して形成されるディスク基板2
を備えてなる。このディスク基板2は、直径を略64m
mとなし、厚さを略1.2mmの円盤状に形成されてい
る。First, a magneto-optical disk to which the present invention is applied will be described. As shown in FIG. 1, such a magneto-optical disk 1 has a disk substrate 2 formed by integrally molding a synthetic resin material such as a transparent polycarbonate resin.
Is provided. This disk substrate 2 has a diameter of approximately 64 m.
m and a disk shape with a thickness of about 1.2 mm.
【0021】このディスク基板2を用いて構成された光
磁気ディスク1は、ディスク基板2の一方の主面2a側
に所望の情報信号が記録される情報信号記録層が形成さ
れてなる信号記録部を有してなり、これと反対側の他方
の主面2bを情報信号の書込み読出し面となすととも
に、この書込み読出し面側から信号記録層に光ビームを
照射することによって情報信号の記録再生が行われるよ
うに構成されている。The magneto-optical disk 1 constituted by using the disk substrate 2 has a signal recording section in which an information signal recording layer for recording a desired information signal is formed on one main surface 2a side of the disk substrate 2. The other main surface 2b on the opposite side is used as a writing / reading surface for information signals, and recording / reproducing of information signals is performed by irradiating the signal recording layer with a light beam from the writing / reading surface side. Is configured to be performed.
【0022】この光磁気ディスク1を構成するディスク
基板2の中央部には、図2に示すように、記録再生装置
内に配設されるディスク回転駆動装置を構成するディス
クテーブルの中心部に配設されたセンタリング部材(図
示は省略する。)が係合するセンター孔3が穿設されて
いる。このセンター孔3は、円形の孔としてディスク基
板2を貫通して穿設され、信号記録層に同心円状又は螺
旋状に形成される記録トラックの曲率中心に、このセン
ター孔3の中心を一致させるように形成されている。As shown in FIG. 2, the center of a disk substrate 2 constituting the magneto-optical disk 1 is located at the center of a disk table constituting a disk rotation drive provided in a recording / reproducing apparatus. A center hole 3 into which a provided centering member (not shown) is engaged is formed. The center hole 3 is formed as a circular hole through the disk substrate 2 so that the center of the center hole 3 matches the center of curvature of a recording track formed concentrically or spirally in the signal recording layer. It is formed as follows.
【0023】また、ディスク基板2の他方の主面2b側
の中央部には、センター孔3を囲んで、円環状の突出部
4が一体的に形成されている。この突出部4は、肉厚の
薄いディスク基板2に穿設されるセンター孔3の深さを
深くすることなく、この光磁気ディスク1が装着される
ディスクテーブル側に配設されるセンタリング部材のセ
ンター孔3に対する突出量を大きくなし、光磁気ディス
ク1の回転中心をディスクテーブルの軸心に一致させて
装着させるセンタリング操作を確実に行わせるように機
能するものである。さらに、この突出部4の先端面4a
は、ディスクテーブルへの装着基準面として機能する。An annular protruding portion 4 is formed integrally with the center surface of the disk substrate 2 on the other main surface 2b side so as to surround the center hole 3. The protruding portion 4 is provided with a centering member provided on the disk table side on which the magneto-optical disk 1 is mounted without increasing the depth of the center hole 3 formed in the thin disk substrate 2. The function of ensuring that the centering operation for mounting the magneto-optical disk 1 with the rotation center of the magneto-optical disk 1 aligned with the axis of the disk table is ensured without increasing the amount of protrusion from the center hole 3. Further, the tip surface 4a of the projection 4
Functions as a mounting reference surface for the disk table.
【0024】突出部4は、少なくともディスク基板2の
内周側の信号記録層が形成されない非信号記録領域内に
おいて形成され、ディスク基板2の厚さに略等しい突出
量を持って突出形成されている。したがって、ディスク
基板2の突出部4が形成された部分は、基板本体部に比
し約2倍の厚さとなされている。The protruding portion 4 is formed at least in a non-signal recording area on the inner peripheral side of the disk substrate 2 where no signal recording layer is formed, and is formed so as to have a protruding amount substantially equal to the thickness of the disk substrate 2. I have. Therefore, the portion of the disk substrate 2 where the protruding portion 4 is formed is about twice as thick as the substrate main body.
【0025】そして、ディスク基板2の一方の主面2a
側の中央部には、センター孔3を囲んでマグネット吸引
用の磁性板5が配設される円環状をなす磁性板収納凹部
6が形成されている。この磁性板収納凹部6は、突出部
4の外周径より小径であって、ディスク基板2の厚さに
略等しい深さに形成されてなる。この磁性板収納凹部6
の開口内周径は、センター孔3の開口径より大きくなさ
れている。したがって、磁性板収納凹部6の底部には、
円環状をなす平坦面6aが設けられる。この平坦面6a
が上記磁性板5を載置する載置面となる。Then, one main surface 2a of the disk substrate 2
An annular magnetic plate storage recess 6 is formed in the center on the side where the magnetic plate 5 for magnet attraction is disposed surrounding the center hole 3. The magnetic plate housing recess 6 has a diameter smaller than the outer diameter of the protrusion 4 and is formed at a depth substantially equal to the thickness of the disk substrate 2. This magnetic plate storage recess 6
Is larger than the opening diameter of the center hole 3. Therefore, at the bottom of the magnetic plate storage recess 6,
An annular flat surface 6a is provided. This flat surface 6a
Is a mounting surface on which the magnetic plate 5 is mounted.
【0026】一方、磁性板収納凹部6に収納保持される
磁性板5は、例えばステンレス板等の金属材料を円盤状
に打ち抜き加工することにより形成されるものである。
かかる磁性板5は、磁性板収納凹部6に収納されるに足
る大きさの円盤として形成されるとともに、この磁性板
収納凹部6に収納保持されたときに、その外周面5aが
当該磁性板収納凹部6の内周壁6bと接触しないような
大きさに形成されている。この磁性板5の中心部には、
製造工程上ハンドリングするために使用される小さな円
形の孔7が穿設されている。On the other hand, the magnetic plate 5 housed and held in the magnetic plate housing recess 6 is formed by punching a metal material such as a stainless steel plate into a disk shape.
The magnetic plate 5 is formed as a disk large enough to be stored in the magnetic plate storage recess 6, and when stored in the magnetic plate storage recess 6, its outer peripheral surface 5a is It is formed in such a size that it does not contact the inner peripheral wall 6b of the recess 6. At the center of the magnetic plate 5,
A small circular hole 7 used for handling in the manufacturing process is provided.
【0027】上述のように形成された磁性板5は、次に
述べる超音波発生手段を備えた取付け装置によってディ
スク基板2に対して取付けられる。かかる取付け装置
は、図3に示すように、ディスク基板2を載置するディ
スク載置手段であるディスク基板支持テーブル8と、デ
ィスク基板2に超音波を印加する超音波発生手段である
超音波発生機構部9とから構成されている。The magnetic plate 5 formed as described above is mounted on the disk substrate 2 by a mounting device having the following ultrasonic wave generating means. As shown in FIG. 3, the mounting device includes a disk substrate support table 8 as a disk mounting means for mounting the disk substrate 2 and an ultrasonic wave generating means as an ultrasonic wave generating means for applying ultrasonic waves to the disk substrate 2. And a mechanical unit 9.
【0028】ディスク基板支持テーブル8は、載置され
たディスク基板2を位置決めし得るように構成されてな
るものであって、平板状をなす支持テーブル本体10の
上面側に、該ディスク基板2を位置決め載置させるため
のディスク基板載置テーブル11を備えている。かかる
ディスク基板載置テーブル11は、図4に示すように、
中央部にディスク基板2のセンター孔3が嵌合する突出
部である嵌合突部12を突設するとともに、この嵌合突
部12の外周囲にディスク基板2の突出部4が遊嵌状態
に嵌合する突出部嵌合凹部13を有している。The disk substrate support table 8 is configured so as to be able to position the mounted disk substrate 2, and the disk substrate 2 is placed on the upper surface side of a flat support table body 10. A disk substrate mounting table 11 for positioning and mounting is provided. As shown in FIG. 4, the disk substrate mounting table 11
A fitting projection 12 which is a projection into which the center hole 3 of the disk substrate 2 fits is provided at the center, and the projection 4 of the disk substrate 2 is loosely fitted around the outside of the fitting projection 12. And a projection fitting recess 13 that fits into the projection.
【0029】嵌合突部12は、センター孔3の開口径と
略同じ外径を有する円柱状をなす突起として形成され、
ディスク基板2のセンター孔3より磁性板収納凹部6の
内方側へ臨むようになっている。この嵌合突部12の先
端側の周縁には、傾斜面が設けられ、ディスク基板2の
嵌合突部12への挿入が容易なものとなされている。ま
た、嵌合突部12の高さは、ディスク基板2を載置させ
た状態のときに、その先端面がディスク基板2の磁性板
収納凹部6の底面6aより突出しない程度の高さとなさ
れている。The fitting projection 12 is formed as a columnar projection having an outer diameter substantially equal to the opening diameter of the center hole 3.
The center hole 3 of the disk substrate 2 faces the inside of the magnetic plate storage recess 6. An inclined surface is provided on the peripheral edge on the distal end side of the fitting protrusion 12 so that the disk substrate 2 can be easily inserted into the fitting protrusion 12. The height of the fitting projection 12 is such that the tip end surface does not protrude from the bottom surface 6a of the magnetic plate housing recess 6 of the disk substrate 2 when the disk substrate 2 is placed. I have.
【0030】嵌合突部12の外周囲に設けられる突出部
嵌合凹部13は、ディスク基板2の突出部4を内部に収
容し得るに足る円環状をなす凹みとして形成され、突出
部4を収納したときにその内周壁13aと突出部4の外
周面4bとの間に所定の隙間が開くようになっている。
したがって、ディスク基板2は、センター孔3が嵌合突
部12に嵌合することによってディスク基板載置テーブ
ル11に位置決めされることになる。The protrusion fitting recess 13 provided on the outer periphery of the fitting protrusion 12 is formed as an annular concave enough to accommodate the protrusion 4 of the disk substrate 2 therein. When stored, a predetermined gap is opened between the inner peripheral wall 13a and the outer peripheral surface 4b of the protruding portion 4.
Therefore, the disk substrate 2 is positioned on the disk substrate mounting table 11 by fitting the center hole 3 into the fitting projection 12.
【0031】また、突出部嵌合凹部13の外周囲には、
ディスク基板2の情報信号の書込み読出し面となる主面
2bを支持するためのディスク受け部14が設けられて
いる。ディスク受け部14は、ディスク基板2の情報信
号記録層が形成されていない磁性板収納凹部6の開口周
縁近傍部に円環状をなす突部として形成され、その円環
状をなす平坦面14a上にディスク基板2を面接触状態
で支持するようになっている。さらに、このディスク受
け部14は、ディスク基板2に傷等を付けないようにす
るために、材質の比較的軟らかいシリコンゴム等によっ
て形成されている。なお、図示はしないが、上述のよう
に構成されたディスク基板支持テーブル8には、ディス
ク基板載置テーブル11上に載置したディスク基板2を
確実に固定するために、真空ポンプを用いて真空吸引す
る吸引機構が設けられている。Further, on the outer periphery of the protrusion fitting recess 13,
A disk receiving portion 14 for supporting a main surface 2b of the disk substrate 2 serving as a read / write surface for information signals is provided. The disk receiving portion 14 is formed as an annular protrusion near the opening periphery of the magnetic plate housing concave portion 6 where the information signal recording layer of the disk substrate 2 is not formed, and is formed on the annular flat surface 14a. The disk substrate 2 is supported in a surface contact state. Further, the disk receiving portion 14 is formed of a relatively soft material such as silicon rubber in order to prevent the disk substrate 2 from being damaged. Although not shown, a vacuum pump is used on the disk substrate support table 8 configured as described above using a vacuum pump in order to securely fix the disk substrate 2 mounted on the disk substrate mounting table 11. A suction mechanism for sucking is provided.
【0032】一方、超音波発生機構部9は、図3に示す
ように、主として超音波発振器から発生する電気エネル
ギーを機械振動に変換する超音波振動子15と、この超
音波振動子15の機械振動を増幅するコーン16と、そ
の増幅された機械振動を被加工物に伝播するホーン17
とから構成されている。これら超音波振動子15及びコ
ーン16並びにホーン17は、その順序で縦一列に一体
化されてなり、エアシリンダ18によって、ディスク基
板2に対して上下動するようになされている。このエア
シリンダ18には、圧縮空気が空気圧回路を介して導入
されるようになっている。また、ディスク基板支持テー
ブル8と超音波発振器との間には制御盤が設けられ、デ
ィスク基板2に対するホーン17の加圧力及び振幅量並
びにスウェージング深さが制御されるようになってい
る。この制御盤には空気圧回路が接続され、エアシリン
ダ18に送られる圧縮空気の導入量等が微細に調節され
るようになされている。On the other hand, as shown in FIG. 3, the ultrasonic generating mechanism 9 mainly includes an ultrasonic vibrator 15 for converting electric energy generated from an ultrasonic oscillator into mechanical vibration, and a mechanical device for the ultrasonic vibrator 15. A cone 16 for amplifying the vibration, and a horn 17 for transmitting the amplified mechanical vibration to the workpiece
It is composed of The ultrasonic transducer 15, the cone 16, and the horn 17 are integrated in a vertical line in that order, and are moved up and down with respect to the disk substrate 2 by the air cylinder 18. Compressed air is introduced into the air cylinder 18 via a pneumatic circuit. In addition, a control panel is provided between the disk substrate support table 8 and the ultrasonic oscillator, so that the pressing force and amplitude of the horn 17 on the disk substrate 2 and the swaging depth are controlled. An air pressure circuit is connected to this control panel, and the amount of compressed air to be sent to the air cylinder 18 is finely adjusted.
【0033】そして、超音波発生機構部9には、ホーン
17の下降動作に連動して上下動するディスク押さえ手
段20が設けられている。ディスク押さえ手段20は、
超音波振動子15,コーン16,ホーン17を内包支持
する振動子支持体21の先端にコイルバネ22に支持さ
れることにより、この振動子支持体21に対して上下動
するように取付けられている。かかるディスク押さえ手
段20は、内部にホーン17を収納するに足る大きさの
円筒体として形成され、その先端に円盤状をなすディス
ク押さえ部材23を有している。The ultrasonic wave generating mechanism 9 is provided with a disk pressing means 20 which moves up and down in conjunction with the lowering operation of the horn 17. The disc holding means 20
The ultrasonic transducer 15, the cone 16, and the horn 17 are supported by a coil spring 22 at the distal end of a transducer support 21 that internally supports the ultrasonic transducer 15, and are attached to the transducer support 21 so as to move up and down. . The disc holding means 20 is formed as a cylindrical body large enough to accommodate the horn 17 therein, and has a disc-shaped disc holding member 23 at the tip.
【0034】このディスク押さえ部材23には、ディス
ク基板2をディスク基板載置テーブル11に確実に固定
させるためのディスク押さえ部24が設けられている。
ディスク押さえ部24は、先のディスク受け部14と相
対向する位置、つまりディスク基板2の情報信号記録層
が形成されていない磁性板収納凹部6の開口周縁近傍位
置に円環状をなす突部として形成され、その円環状をな
す平坦面24aで該ディスク基板2を面接触状態で支持
するようになっている。なお、このディスク押さえ部2
4もディスク受け部14と同様に、ディスク基板2への
傷付き防止のためにシリコンゴム等によって形成されて
いる。また、ディスク押さえ部材23には、ホーン17
を臨ませるための円形のホーン導入孔25が設けられて
いる。The disk pressing member 23 is provided with a disk pressing portion 24 for securely fixing the disk substrate 2 to the disk substrate mounting table 11.
The disc holding portion 24 is formed as a ring-shaped projection at a position opposed to the preceding disc receiving portion 14, that is, at a position near the opening edge of the magnetic plate housing recess 6 where the information signal recording layer of the disc substrate 2 is not formed. The disk substrate 2 is supported in a surface contact state by the formed flat surface 24a having an annular shape. In addition, this disc holding part 2
Similarly to the disc receiving portion 14, the disc 4 is made of silicon rubber or the like to prevent the disc substrate 2 from being damaged. Also, the horn 17 is attached to the disc holding member 23.
Is provided with a circular horn introduction hole 25 for facing the horn.
【0035】さらに、ディスク押さえ部24には、この
ディスク押さえ手段20によってディスク基板2を押圧
保持せしめたときに、ディスク押さえ部24で囲まれる
空間部に存在する塵埃を吸引するための集塵機構を構成
する真空エアポンプに接続されたバキュームホース26
が取付けられている。このバキュームホース26が取付
けられる部分には、ディスク押さえ部24の外側から内
側に貫通する吸引孔27が設けられている。したがっ
て、ディスク基板2のスウェージングにディスク押さえ
部24で囲まれる空間部内に存在する塵埃等が上記吸引
孔27を通してバキュームホース26へと導かれる。Further, the disc holding part 24 has a dust collecting mechanism for sucking dust existing in the space surrounded by the disc holding part 24 when the disc substrate 2 is pressed and held by the disc holding means 20. Vacuum hose 26 connected to the vacuum air pump to be constituted
Is installed. At a portion where the vacuum hose 26 is attached, a suction hole 27 penetrating from the outside to the inside of the disc holding portion 24 is provided. Therefore, dust and the like existing in the space surrounded by the disc pressing portion 24 during the swaging of the disc substrate 2 are guided to the vacuum hose 26 through the suction hole 27.
【0036】取付け装置を用いて磁性板5をディスク基
板2に取付けるには、次のようにして行う。先ず、図4
に示すように、ディスク基板2をディスク基板載置テー
ブル11上に載置する。すなわち、ディスク基板載置テ
ーブル11に設けられた嵌合突部12にディスク基板2
のセンター孔3を嵌合させて、当該ディスク基板2の突
出部4を突出部嵌合凹部13内に収納保持させる。これ
により、ディスク基板2のディスク基板載置テーブル1
1に対する装着位置が決まるとともに、ディスク基板2
の書込み読出し面となる主面2bが上記ディスク受け部
14に面接触状態で支持される。The mounting of the magnetic plate 5 to the disk substrate 2 using the mounting device is performed as follows. First, FIG.
The disk substrate 2 is mounted on the disk substrate mounting table 11 as shown in FIG. That is, the disk substrate 2 is inserted into the fitting projection 12 provided on the disk substrate mounting table 11.
The center hole 3 of the disk substrate 2 is fitted and the projection 4 of the disk substrate 2 is stored and held in the projection fitting recess 13. Thereby, the disk substrate mounting table 1 of the disk substrate 2
1 and the disk substrate 2
The main surface 2b serving as a writing / reading surface is supported by the disk receiving portion 14 in a surface contact state.
【0037】しかる後、ディスク基板載置テーブル11
に内蔵される吸引機構を動作させて、ディスク基板2を
真空吸引してディスク基板載置テーブル11上に固定す
る。After that, the disk substrate mounting table 11
By operating a suction mechanism built in the disk substrate 2, the disk substrate 2 is vacuum-suctioned and fixed on the disk substrate mounting table 11.
【0038】次に、ディスク基板2の磁性板収納凹部6
内に磁性板5を投入する。次いで、エアシリンダ18に
よってホーン17を下降させる。すると、図5に示すよ
うに、このホーン17の下降動作に連動してディスク押
さえ手段20が先行して下降し、その先端に設けられる
ディスク押さえ部24がディスク基板2に接触する。こ
のとき、ディスク押さえ部24は、ディスク基板2の情
報信号記録層が形成されていない磁性板収納凹部6の開
口周縁部を支持するので、情報信号記録層を傷付けるこ
とがない。Next, the magnetic plate storage recess 6 of the disk substrate 2
The magnetic plate 5 is put inside. Next, the horn 17 is lowered by the air cylinder 18. Then, as shown in FIG. 5, the disk pressing means 20 descends in advance in conjunction with the lowering operation of the horn 17, and the disk pressing portion 24 provided at the tip thereof contacts the disk substrate 2. At this time, the disc holding portion 24 supports the peripheral edge of the opening of the magnetic plate housing recess 6 where the information signal recording layer of the disc substrate 2 is not formed, so that the information signal recording layer is not damaged.
【0039】さらにホーン17が下降すると、コイルバ
ネ22によってディスク押さえ手段20に加圧力が加え
られる。このときの加圧力によって、ディスク基板2が
ディスク基板載置テーブル11上に押圧保持される。When the horn 17 is further lowered, a pressing force is applied to the disc pressing means 20 by the coil spring 22. The disk substrate 2 is pressed and held on the disk substrate mounting table 11 by the pressing force at this time.
【0040】そして、図6に示すように、ホーン17が
ディスク基板2に接触した時点で、超音波振動を印加す
る。ここで印加する超音波は、ホーン17の軸心方向に
断続的に上下動させることによるいわゆる縦振動であっ
てもよく、或いはホーン17の軸心を中心として時計回
り方向と反時計回り方向にこのホーン17を面内方向で
断続的に動かすことによりなるいわゆるねじり振動であ
ってもよい。Then, as shown in FIG. 6, when the horn 17 comes into contact with the disk substrate 2, ultrasonic vibration is applied. The ultrasonic wave applied here may be so-called longitudinal vibration caused by intermittently moving up and down in the axial direction of the horn 17, or in a clockwise direction and a counterclockwise direction around the axis of the horn 17. A so-called torsional vibration may be achieved by intermittently moving the horn 17 in the in-plane direction.
【0041】この超音波振動を印加している間は、ホー
ン17に一定した加圧力Fを加え、集塵機構の真空エア
ポンプを動作させてバキュームを行う。While the ultrasonic vibration is being applied, a constant pressure F is applied to the horn 17, and the vacuum air pump of the dust collecting mechanism is operated to perform vacuum.
【0042】すると、ホーン17が接触された磁性板収
納凹部6の開口周縁部が摩擦熱によって軟化する。そし
て、ホーン17に加えられる加圧力Fによって、磁性板
収納凹部6の開口周縁部が、図7に示すように、ホーン
17の大きさに対応して凹所を形成するようにして磁性
板収納凹部6の内周側へ張り出す。この結果、ホーン1
7が当接する部分に磁性板収納凹部6の内周側へ張り出
してなる突出部19が形成される。かかる突出部19
は、磁性板収納凹部6内に収納配置された磁性板5の外
周縁部5aを覆う形で円環状に突出形成され、磁性板5
のディスク基板2からの脱落を防止する。Then, the peripheral edge of the opening of the magnetic plate housing recess 6 with which the horn 17 is in contact is softened by frictional heat. The pressing force F applied to the horn 17 causes the peripheral edge of the opening of the magnetic plate housing recess 6 to form a recess corresponding to the size of the horn 17 as shown in FIG. It protrudes toward the inner peripheral side of the recess 6. As a result, horn 1
A projection 19 is formed at a portion where the projection 7 comes into contact with the magnetic plate housing recess 6 so as to protrude toward the inner peripheral side. Such protrusion 19
Are formed to project in an annular shape so as to cover the outer peripheral edge portion 5a of the magnetic plate 5 housed in the magnetic plate housing concave portion 6, and
From the disk substrate 2 is prevented.
【0043】このスウェージング状態においては、ディ
スク基板2がディスク押さえ手段20によってディスク
基板載置テーブル11上に押圧保持された状態とされて
いるので、ホーン17より発生する全ての超音波振動が
このディスク基板2の熱変形を受ける部分に集中する。
したがって、スウェージングが良好に行え、ウエルド時
間の短縮並びに突出部19におけるクラックの発生を防
止することができる。なお、本例では、従来法に比べて
0.1秒程度の短縮を図ることができる。また、バキュ
ームしながらスウェージングを行っているので、常にク
リーンな状態でディスク基板2をスウェージングでき、
塵埃等の付着を未然に回避できる。In the swaging state, since the disk substrate 2 is pressed and held on the disk substrate mounting table 11 by the disk pressing means 20, all the ultrasonic vibrations generated by the horn 17 are generated by this. It concentrates on the portion of the disk substrate 2 that receives the thermal deformation.
Therefore, the swaging can be performed satisfactorily, the weld time can be reduced, and the occurrence of cracks in the projecting portion 19 can be prevented. In this example, the time can be reduced by about 0.1 second as compared with the conventional method. In addition, since swaging is performed while vacuuming, the disk substrate 2 can always be swaged in a clean state,
Adhesion of dust and the like can be avoided.
【0044】そして、スウェージング終了後、ホーン1
7並びにディスク押さえ手段20をディスク基板2に対
して上昇させ、真空吸引を解除してディスク基板2を取
り出す。この結果、図8に示すように、磁性板5がディ
スク基板2に対して遊嵌状態に保持されてなる光磁気デ
ィスク1が作製される。かかる光磁気ディスク1におい
ては、超音波振動をディスク基板2の突出部19が形成
される部分に集中させることができることから、突出部
19の厚みを高精度に制御することができ、これにより
磁性板5とこれを覆って形成される突出部19との間に
一定のクリアランスCが確保される。つまり、磁性板5
を予め設定したクリアランスCを持ってディスク基板2
に対して遊嵌保持させることができることになる。した
がって、合成樹脂からなるディスク基板2と金属材料よ
りなる磁性板5の熱膨張係数の差から生ずる上記ディス
ク基板2の変形を防止することができる。After the completion of the swaging, the horn 1
7 and the disc holding means 20 are raised with respect to the disc substrate 2, the vacuum suction is released, and the disc substrate 2 is taken out. As a result, as shown in FIG. 8, the magneto-optical disk 1 in which the magnetic plate 5 is held in a loosely fitted state with respect to the disk substrate 2 is manufactured. In such a magneto-optical disk 1, since the ultrasonic vibration can be concentrated on the portion of the disk substrate 2 where the projecting portion 19 is formed, the thickness of the projecting portion 19 can be controlled with high precision. A certain clearance C is secured between the plate 5 and the projecting portion 19 formed over the plate 5. That is, the magnetic plate 5
With a preset clearance C
Can be loosely fitted and held. Therefore, it is possible to prevent the disk substrate 2 from being deformed due to a difference in thermal expansion coefficient between the disk substrate 2 made of a synthetic resin and the magnetic plate 5 made of a metal material.
【0045】なお、本実施例では、本発明を光磁気ディ
スクに適用した例を挙げて説明したが、本発明はこの
他、合成樹脂からなるディスク基板を有し、マグネット
チャッキング用の磁性板を有する情報信号記録ディスク
に広く適用できる。In this embodiment, an example in which the present invention is applied to a magneto-optical disk has been described. However, the present invention also has a disk substrate made of a synthetic resin and has a magnetic plate for magnet chucking. Can be widely applied to information signal recording disks having
【0046】[0046]
【発明の効果】上述したように、本発明の方法において
は、ディスク押さえ手段によってディスク基板をディス
ク基板載置テーブル上に押圧保持させた状態でスウェー
ジングを行っているので、超音波振動を印加してもディ
スク基板が位置ずれを起こすことがなく、しかも超音波
振動をディスク基板の熱変形が行われる部分に集中させ
ることができるため、熱変形がされて突出部が形成され
る部分にクラックを発生させることを回避でき、ウエル
ド時間の短縮化も図れる。As described above, in the method of the present invention, since the swaging is performed while the disk substrate is pressed and held on the disk substrate mounting table by the disk pressing means, the ultrasonic vibration is applied. Even if the disk substrate is not displaced, the ultrasonic vibration can be concentrated on the portion of the disk substrate where the thermal deformation is to be performed. Can be avoided, and the weld time can be shortened.
【0047】また、本発明の方法によれば、超音波振動
を熱変形される部分に集中させることができるため、熱
変形によって形成される突出部の厚みを高精度に制御す
ることができ、ディスク基板の磁性板収納凹部内に磁性
板を遊嵌状態で収納保持させることができる。したがっ
て、磁性板がディスク基板の主面に傾斜して固定的に取
付けられてしまうことを防止できる他、合成樹脂からな
るディスク基板と金属材料からなる磁性板との熱膨張係
数の差より生ずるディスク基板の変形を防止できる。こ
れにより、このディスク基板を用いて構成される情報信
号記録ディスクをディスク回転駆動機構のディスクテー
ブルに対して安定して装着させることができる。Further, according to the method of the present invention, since the ultrasonic vibration can be concentrated on the portion to be thermally deformed, the thickness of the protrusion formed by the thermal deformation can be controlled with high accuracy. The magnetic plate can be stored and held in the magnetic plate storage recess of the disk substrate in a loosely fitted state. Therefore, it is possible to prevent the magnetic plate from being fixedly attached to the main surface of the disk substrate while being inclined, and to generate a disk due to a difference in thermal expansion coefficient between the disk substrate made of synthetic resin and the magnetic plate made of metal material. Deformation of the substrate can be prevented. As a result, the information signal recording disk configured using this disk substrate can be stably mounted on the disk table of the disk rotation drive mechanism.
【0048】さらに、本発明の方法においては、ディス
ク基板に形成される情報信号記録層が形成されていない
内周部をディスク載置手段とディスク押さえ手段とで押
圧保持するために、この情報信号記録層を傷付けるよう
なことがない。また、スウェージング時においては、熱
変形が行われる近傍の空間部に存在する塵埃等を集塵機
構によって吸引するようにしているので、常にクリーン
な状態でスウェージングすることができる。したがっ
て、塵埃等の付着のない信頼性の高い情報信号記録ディ
スクを作製することができる。Further, according to the method of the present invention, the information signal recording layer is formed on the disk substrate and the inner peripheral portion thereof is not formed by the disk mounting means and the disk pressing means. There is no damage to the recording layer. Further, at the time of swaging, dust and the like existing in the space near the thermal deformation are sucked by the dust collecting mechanism, so that swaging can be always performed in a clean state. Therefore, a highly reliable information signal recording disk free of dust and the like can be manufactured.
【図1】本発明が適用される光磁気ディスクの分解斜視
図である。FIG. 1 is an exploded perspective view of a magneto-optical disk to which the present invention is applied.
【図2】本発明が適用される光磁気ディスクの分解した
状態を示す断面図である。FIG. 2 is a sectional view showing an exploded state of a magneto-optical disk to which the present invention is applied.
【図3】本発明を適用した磁性板の取付け装置を示す正
面図である。FIG. 3 is a front view showing a magnetic plate mounting device to which the present invention is applied.
【図4】ディスク基板に磁性板を投入した状態を示す断
面図である。FIG. 4 is a cross-sectional view showing a state in which a magnetic plate is loaded on a disk substrate.
【図5】ディスク基板にディスク押さえ部を接触させた
状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state in which a disk pressing portion is brought into contact with a disk substrate.
【図6】ホーンをディスク基板に当接させた状態を示す
断面図である。FIG. 6 is a cross-sectional view showing a state where the horn is in contact with the disk substrate.
【図7】スウェージング状態を示す断面図である。FIG. 7 is a sectional view showing a swaging state.
【図8】スウェージング終了後における光磁気ディスク
の断面図である。FIG. 8 is a sectional view of the magneto-optical disk after swaging is completed.
【図9】バキュームによりディスク基板をディスク基板
載置テーブルに固定した状態を示す断面図である。FIG. 9 is a cross-sectional view showing a state where the disk substrate is fixed to the disk substrate mounting table by vacuum.
【図10】ディスク基板の外周縁部をディスク押さえに
よって押さえ、該ディスク基板をディスク基板載置テー
ブルに固定した状態を示す断面図である。FIG. 10 is a cross-sectional view showing a state where the outer peripheral edge of the disk substrate is pressed by a disk holder and the disk substrate is fixed to a disk substrate mounting table.
1 光磁気ディスク、 2 ディスク基板、 3 セン
ター孔、 5 磁性板、 6 磁性板収納凹部、 8
ディスク基板支持テーブル、 9 超音波発生機構部、
11 ディスク基板載置テーブル、 12 嵌合突
部、 14 ディスク受け部、 15 超音波振動子、
16 コーン、 17 ホーン、 18エアシリン
ダ、 19 突出部、 20 ディスク押さえ手段、
24 ディスク押さえ部、 26 バキュームホースReference Signs List 1 magneto-optical disk, 2 disk substrate, 3 center hole, 5 magnetic plate, 6 magnetic plate storage recess, 8
Disk substrate support table, 9 ultrasonic generating mechanism,
11 disk board mounting table, 12 fitting projection, 14 disk receiving part, 15 ultrasonic transducer,
16 cone, 17 horn, 18 air cylinder, 19 protrusion, 20 disc holding means,
24 Disc holding part, 26 Vacuum hose
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平1−208784(JP,A) 特開 平6−4907(JP,A) 特開 平4−54069(JP,A) 特開 平4−143494(JP,A) ラジオ技術,第45巻第12号(平成3− 12−12)P.152−155 (58)調査した分野(Int.Cl.7,DB名) G11B 23/00 601 G11B 7/26 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-1-208784 (JP, A) JP-A-6-4907 (JP, A) JP-A-4-54069 (JP, A) JP-A-4-208 143494 (JP, A) Radio Technology, Vol. 45, No. 12, Heisei 12-12-12, p. 152-155 (58) Field surveyed (Int.Cl. 7 , DB name) G11B 23/00 601 G11B 7/26
Claims (4)
性板収納凹部内に磁性板を配し、このディスク基板をデ
ィスク載置手段に載置してディスク押さえ手段により押
圧保持せしめた状態で、上記磁性板収納凹部の上部周縁
に超音波発生手段を当接させることによって、上記磁性
板収納凹部の上部周縁より当該凹部の内方に向かって突
出する突出部を形成し、この突出部により上記磁性板を
ディスク基板に支持するようにしたことを特徴とするデ
ィスク基板に対する磁性板の取付け方法。A magnetic plate is disposed in a magnetic plate storage recess provided at the center of a disk substrate, and the disk substrate is mounted on disk mounting means and pressed and held by disk pressing means. by abutting the ultrasound generating means to the upper rim <br/> plate housing recess to form a protrusion protruding inwardly of the recess from the top peripheral edge of the magnetic plate housing recess, the protrusion A method of mounting the magnetic plate on the disk substrate, wherein the magnetic plate is supported by the disk substrate.
段は、ディスク基板に形成される情報信号記録層が形成
されていない内周部を保持することを特徴とする請求項
1記載のディスク基板に対する磁性板の取付け方法。2. The magnetic recording medium according to claim 1, wherein the disc holding means and the disc mounting means hold an inner peripheral portion of the disc substrate on which an information signal recording layer is not formed. How to mount the board.
段には、ディスク基板に形成される情報信号記録層が形
成されていない内周部に当接する環状の突部が設けられ
ていることを特徴とする請求項1記載のディスク基板に
対する磁性板の取付け方法。3. The disk pressing means and the disk mounting means are provided with annular projections which are in contact with an inner peripheral portion of the disk substrate on which the information signal recording layer is not formed. The method for attaching a magnetic plate to a disk substrate according to claim 1.
設けられていることを特徴とする請求項1記載のディス
ク基板に対する磁性板の取付け方法。4. The method for mounting a magnetic plate on a disk substrate according to claim 1, wherein the disk holding means is provided with a dust collecting mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15730592A JP3237199B2 (en) | 1992-05-26 | 1992-05-26 | How to attach a magnetic plate to a disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15730592A JP3237199B2 (en) | 1992-05-26 | 1992-05-26 | How to attach a magnetic plate to a disk substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05325467A JPH05325467A (en) | 1993-12-10 |
| JP3237199B2 true JP3237199B2 (en) | 2001-12-10 |
Family
ID=15646765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15730592A Expired - Fee Related JP3237199B2 (en) | 1992-05-26 | 1992-05-26 | How to attach a magnetic plate to a disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3237199B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7486994B2 (en) * | 2020-03-31 | 2024-05-20 | 日動電工株式会社 | Method for fixing components using ultrasonic swaging horn |
-
1992
- 1992-05-26 JP JP15730592A patent/JP3237199B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| ラジオ技術,第45巻第12号(平成3−12−12)P.152−155 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05325467A (en) | 1993-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5323381A (en) | Disc for recording information signals | |
| KR100268137B1 (en) | Optical disk | |
| KR100352752B1 (en) | Disc-type recording medium assembly device and disc-type recording medium assembly method using the device | |
| US5572509A (en) | Method for mounting magnetic plate to disc substrate | |
| US4866697A (en) | Information memory medium | |
| US4827470A (en) | Information memory medium | |
| US5666347A (en) | Optical disk and disk chucking mechanism | |
| JP3237199B2 (en) | How to attach a magnetic plate to a disk substrate | |
| JPH05325466A (en) | Method and device for attaching magnetic plate to disk substrate | |
| JP3237171B2 (en) | Method of holding magnetic plate to disk substrate | |
| JP3237172B2 (en) | Method of holding magnetic plate to disk substrate | |
| JP3211390B2 (en) | Method of holding magnetic plate to disk substrate | |
| JPH05325468A (en) | Method for attaching magnetic plate to disk substrate | |
| JP3072658B2 (en) | Information signal recording disk | |
| JP2674067B2 (en) | optical disk | |
| JPH1128767A (en) | Ultrasonic welding equipment | |
| JP2959208B2 (en) | Information signal recording disk | |
| JPH0628806A (en) | Method for holding magnetic plate on disk substrate | |
| JP3287004B2 (en) | Disc for recording information signals | |
| JP3298651B2 (en) | Information signal recording disk | |
| JP3019420B2 (en) | Disc chucking mechanism | |
| JP2587580B2 (en) | optical disk | |
| JPH0660433A (en) | Information signal recording disk | |
| JP3008502B2 (en) | Optical disk and optical disk chucking mechanism | |
| JP2002260314A (en) | Optical disk chucking mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20010904 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091005 Year of fee payment: 8 |
|
| LAPS | Cancellation because of no payment of annual fees |