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JP3241066B2 - Laser bending method of ceramics - Google Patents
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JP3241066B2 - Laser bending method of ceramics - Google Patents

Laser bending method of ceramics

Info

Publication number
JP3241066B2
JP3241066B2 JP20023191A JP20023191A JP3241066B2 JP 3241066 B2 JP3241066 B2 JP 3241066B2 JP 20023191 A JP20023191 A JP 20023191A JP 20023191 A JP20023191 A JP 20023191A JP 3241066 B2 JP3241066 B2 JP 3241066B2
Authority
JP
Japan
Prior art keywords
ceramics
bending
laser
laser beam
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP20023191A
Other languages
Japanese (ja)
Other versions
JPH0543353A (en
Inventor
武二 新井
浩志 三橋
俊英 加藤
義治 難波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amada Co Ltd
Original Assignee
Amada Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amada Co Ltd filed Critical Amada Co Ltd
Priority to JP20023191A priority Critical patent/JP3241066B2/en
Publication of JPH0543353A publication Critical patent/JPH0543353A/en
Application granted granted Critical
Publication of JP3241066B2 publication Critical patent/JP3241066B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/003Apparatus or processes for treating or working the shaped or preshaped articles the shaping of preshaped articles, e.g. by bending
    • B28B11/005Using heat to allow reshaping, e.g. to soften ceramic articles
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/0036Laser treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、セラミックスの曲げ加
工を行う部分に加熱用ビームを照射し、局部的に曲げ可
能な軟化ゾーンにまで加熱して、曲げ加工を行うレーザ
によるセラミックスの曲げ加工方法に関する。
BACKGROUND OF THE INVENTION This invention, ceramics bending irradiated with the heating beam to the part for, by heating to a locally bendable softening zone, ceramics with a laser to perform the bending bend Related to processing method.

【0002】[0002]

【従来の技術】セラミックスは、各種の無機物を配合成
形して高温で焼結したもので、鉱物微結晶の緻密な集合
体である。例えばアルミナ(Al2 O3 ) を90%以上
を含有するアルミナセラミックスは、機械的・電気特性
・耐熱・耐摩耗性が大きく、熱的特性が良好で、絶縁性
が良好で、特に吸水性がない等の優れた特性を備え、そ
の用途に応じてその材質が選定されるものである。
2. Description of the Related Art Ceramics are obtained by compounding various inorganic substances and sintering them at a high temperature, and are dense aggregates of mineral microcrystals. For example, alumina ceramics containing alumina (Al2 O3) of 90% or more have large mechanical / electrical properties / heat / abrasion resistance, good thermal properties, good insulation, no particular water absorption, etc. And the material is selected according to the application.

【0003】従来、セラミックスは焼結前に型によって
成形するものであって、焼結後の成形ができなかった。
従って、焼結されたセラミックスの板材から、適宜曲げ
加工して形状を変更し得ることは、多種少量生産におい
て特に望ましいことである。
[0003] Conventionally, ceramics are formed by a mold before sintering, and cannot be formed after sintering.
Therefore, it is particularly desirable that the shape can be changed by appropriately bending a sintered ceramic plate material in the production of many kinds and in small quantities.

【発明が解決しようとする課題】ところで、本発明の発
明者等は長年の研究と実験との繰り返しの結果、高エネ
ルギ密度のレーザビームをセラミックスの曲げ加工部分
に照射することにより、局部的に加熱して、所要の形状
の曲げ加工を形成し得ることに着目した。
By the way, as a result of repeating many years of research and experiment, the inventors of the present invention irradiate a laser beam having a high energy density to a bent portion of ceramics to locally form the laser beam. It was noted that heating could form a required shape of bend.

【0004】[0004]

【課題を解決するための手段】前述のごとき従来の問題
に鑑みて、本発明は、セラミックスを加熱して曲げ加工
を行う方法において、セラミックスに対して加熱範囲が
広くなるようにレーザビームを照射して約600℃程度
に予熱した後、上記セラミックスの曲げ加工部分に前記
レーザビームを局部的に集光照射して軟化状態になる軟
化温度に加熱し、この局部的な軟化温度部分に曲げ加工
を行うセラミックスの曲げ加工方法である
Means for Solving the Problems Conventional problems as described above
In view of the above, the present invention is to heat and bend ceramics
The heating range for the ceramics
Approximately 600 ° C by irradiating a laser beam so that it becomes wider
After preheating to
The laser beam is softened to a softened state by local irradiation
Heating to the softening temperature and bending to this local softening temperature part
Is a method of bending ceramics .

【0005】[0005]

【実施例】以下、本発明の実施例を図面に基づいて、詳
細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0006】図1は本発明におけるレーザ曲げ加工装置
の一実施例の概要説明図を示す。図においてレーザ曲げ
加工装置1のレーザ加工部3は、キャレッジベース7、
X軸ガイドレール9、キャレッジ11、Y軸ガイドレー
ル13、キャレッジ15、加工ヘッド部17およびノズ
ル19から構成されている。キャレッジベース7はフレ
ーム21に下向きに固定され、キャレッジベース7に設
けられたX軸ガイドレール9は図面に垂直なX軸方向に
設けられ、キャレッジ11をX軸方向に移動自在であ
る。キャレッジ11に設けられたY軸ガイドレール13
は図面に平行なY軸方向にキャレッジ15を移動自在で
ある。
FIG. 1 is a schematic explanatory view of one embodiment of a laser bending apparatus according to the present invention. In the figure, a laser processing unit 3 of a laser bending apparatus 1 includes a carriage base 7,
It comprises an X-axis guide rail 9, a carriage 11, a Y-axis guide rail 13, a carriage 15, a processing head 17 and a nozzle 19. The carriage base 7 is fixed to the frame 21 downward, and the X-axis guide rail 9 provided on the carriage base 7 is provided in the X-axis direction perpendicular to the drawing, so that the carriage 11 is movable in the X-axis direction. Y-axis guide rail 13 provided on carriage 11
Can move the carriage 15 in the Y-axis direction parallel to the drawing.

【0007】加工ヘッド17は、このキャレッジ15に
下向きに設けられ、その先端に設けられたノズル19を
経て、図示されないレーザ発振機より発振されるレーザ
ビームLBを、テーブル23上の上・下部押え具25,
27の間に保持されるセラミックス29に局部的に照射
し、X,Y軸方向に移動自在である。
The processing head 17 is provided downward on the carriage 15, and holds a laser beam LB oscillated from a laser oscillator (not shown) via a nozzle 19 provided at the tip of the processing head 17. Utensil 25,
Locally irradiates ceramics 29 held between 27, and is movable in X and Y axis directions.

【0008】このように構成されたレーザ曲げ加工装置
1は、レーザ加工部3によるセラミッスク29へのレー
ザビームLBを照射し、本実施例では予熱工程を経た
後、本加熱工程に至るものとする。予熱工程では、レー
ザビームLBがセラミックス29の曲げ加工部分に、局
部的な加熱により割れを生じないように、加熱範囲を広
くして照射し、機械的強度(曲げ強度)が低下して軟化
状態になるいわゆる軟化ゾーン(図2)以下の適宜な予
熱温度約600℃程度に、ゆっくり予熱するものとす
る。この場合、例えばセラミックス29に対するレーザ
ービームLBの焦点位置を変えることによって容易に予
熱を行うことができるものである
The laser bending apparatus 1 configured as described above irradiates the laser beam LB to the ceramic disc 29 by the laser processing section 3, and in this embodiment, goes through a preheating step and then to a main heating step. . In the preheating step, the laser beam LB is irradiated to the bent portion of the ceramics 29 with a wide heating range so as not to cause a crack due to local heating, and the mechanical strength (bending strength) is reduced to a softened state. Slow preheating to a suitable preheating temperature of about 600 ° C. below the so-called softening zone (FIG. 2). In this case, for example, a laser for the ceramics 29
-Easy change by changing the focal position of the beam LB
It can do heat .

【0009】このセラミックス29が充分に予熱された
後、本加熱工程では、セラミックス29に対するレーザ
ビームLBの焦点位置を変えてセラミックス29の曲げ
加工部分に局部的に集光照射し、セラミックス29の加
熱温度を、軟化ゾーンまで到達した状態において塑性変
形を生じせしめ、特別な金型等を使用することなく、
げ加工を行うものである
After the ceramics 29 is sufficiently preheated, in the main heating step, the focal position of the laser beam LB with respect to the ceramics 29 is changed to locally focus and irradiate the bent portion of the ceramics 29 to heat the ceramics 29. When the temperature reaches the softening zone , plastic deformation occurs, and bending can be performed without using a special mold or the like.
This is to carry out the spinning process .

【0010】図2に示すように、各種の材質が異なるセ
ラミックス((A)〜(G))の軟化ゾーンは、約80
0℃ないし1400℃程度の範囲で、曲げ強度が低下し
曲げ加工において割れを生じず、かつ溶融しない温度範
囲である。
As shown in FIG. 2, the softening zone of ceramics ((A) to (G)) of various materials is about 80%.
A temperature range of about 0 ° C. to about 1400 ° C. is a temperature range in which the bending strength is reduced, no crack is generated in the bending process, and no melting occurs.

【0011】しかし、例えばアルミナ系セラミックス
(E)では800℃ないし1400℃の温度範囲での曲
げ強度の低下は少なく、軟化ゾーンを約1600℃程度
とし、約1800℃を超えて、約2300℃付近で収縮
が発生し、溶融(ガラス化)に至るものである。
However, for example, alumina-based ceramics (E) have a small decrease in bending strength in a temperature range of 800 ° C. to 1400 ° C., and have a softening zone of about 1600 ° C., exceeding about 1800 ° C. and about 2300 ° C. Shrinkage occurs in the vicinity, leading to melting (vitrification).

【0012】ところで、図1には曲げ加工部5が設けら
れ、レーザ加工部3により軟化点に達したセラミックス
29を曲げ加工部5の曲げ加工具33が軸体31に軸支
されて、図示されていない駆動力により回動されること
により、セラミックス29の曲げ加工を確実にし、その
曲げ角度の精度を保持することが可能である。
By the way, the processing unit 5 bend provided in Figure 1, the bending tool 33 of the processing unit 5 bending ceramic 29 having reached the softening point by the laser machining unit 3 is rotatably supported on the shaft 31, shown By being rotated by a driving force that is not performed, the bending of the ceramics 29 can be ensured, and the accuracy of the bending angle can be maintained.

【0013】このようにセラミックス29の曲げ加工部
は、局部的に軟化ゾーンまで加熱し塑性変形を生じせ
しめる本加熱工程の前に、予熱工程において予熱するこ
とにより、セラミックス29に発生する恐れのある塑性
変形による割れが有効に防止される。
[0013] the bent portion of this way, ceramics 29
Minute, before the main heating step allowed to rise to plastic deformation was heated locally softened zone, by preheating in a preheating step, cracks due to plastic deformation that may occur in the ceramic 29 is effectively prevented.

【0014】従って、予熱温度は約600℃程度の適宜
な温度を選定し、軟化ゾーンを材質に応じて選定するも
のとする。なお、セラミックス(F)はニユームライト
(商品名)で、セラミックス(G)はマグネシア(M
G)である。また、各種のアルミナ系セラミックスに関
する他の文献(図示省略)によれば、軟化ゾーンとして
1450℃ないし2040℃の範囲内とする各種温度が
指定されている。
Accordingly, an appropriate preheating temperature of about 600 ° C. is selected, and the softening zone is selected according to the material. Note that ceramics (F) is Newum Light (trade name) and ceramics (G) is magnesia (M
G). Further, according to other documents (not shown) concerning various alumina-based ceramics, various temperatures within a range of 1450 ° C. to 2040 ° C. are specified as the softening zone.

【0015】[0015]

【発明の効果】以上のごとき実施例の説明より理解され
るように、本発明においてセラミックス29の曲げ加工
を行うには、先ず加熱範囲が広くなるようにセラミック
ス29に対してレーザービームLBを照射して軟化状態
に達する前の約600℃程度に予熱するものである。そ
して、その後に曲げ加工部分にレーザビームLBを局部
的に集光照射して軟化状態になる軟化温度に加熱し、こ
の局部的な軟化温度部分に曲げ加工を行うものである
The present invention can be understood from the above description of the embodiments.
As described above, in the present invention, the bending of the ceramics 29 is performed.
To do so, first make the heating range wider
Irradiates the laser beam LB to the surface 29 and softens
Before it reaches about 600 ° C. So
Then, the laser beam LB is locally applied to the bent portion.
Heat to the softening temperature at which it softens by
Bending is performed on the local softening temperature portion .

【0016】したがって、本発明によれば、セラミック
ス29に割れを生じることなく所望部分に曲げ加工を行
うことができるものであるが、この際、約600℃程度
までの予熱と軟化温度までの加熱はレーザビームLBの
照射によって行うものであるから、例えばセラミックス
29に対するレーザビームの焦点位置を変えることによ
ってゆっくりとした広い範囲の予熱から曲げ加工部分の
局部的な軟化温度への加熱とを連続的に行うことがで
き、セラミックス29の曲げ加工を効率良く能率的に行
うことができるものである
Thus, according to the present invention,
Bending is performed on the desired part without cracking
At this time, about 600 ° C
Preheating up to the softening temperature and heating up to the softening temperature
Because it is performed by irradiation, for example, ceramics
By changing the focal position of the laser beam with respect to
From a wide range of preheating
Heating to local softening temperature can be performed continuously.
Efficiently and efficiently bends ceramics 29
It is something that can be done .

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明におけるレーザ曲げ加工装置の一実施例
の概要説明図である。
FIG. 1 is a schematic explanatory view of one embodiment of a laser bending apparatus according to the present invention.

【図2】各種のセラミックスの温度変化に対する曲げ強
度の変化状態を示す線図である。
FIG. 2 is a diagram showing a change in bending strength of various ceramics with respect to a temperature change.

【符号の説明】[Explanation of symbols]

1 レーザ曲げ加工装置 3 レーザ加工部 5 曲げ加工部 17 加工ヘッド 29 セラミックス 33 曲げ加工具 LB レーザビーム DESCRIPTION OF SYMBOLS 1 Laser bending apparatus 3 Laser processing part 5 Bending processing part 17 Processing head 29 Ceramics 33 Bending tool LB Laser beam

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平2−247018(JP,A) 特開 昭63−212017(JP,A) 特開 昭63−182279(JP,A) 特開 平2−212381(JP,A) 特開 平3−107434(JP,A) (58)調査した分野(Int.Cl.7,DB名) C04B 41/80 - 41/91 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-247018 (JP, A) JP-A-63-212017 (JP, A) JP-A-63-182279 (JP, A) JP-A-2- 212381 (JP, A) JP-A-3-107434 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C04B 41/80-41/91

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 セラミックスを加熱して曲げ加工を行う
方法において、セラミックス(29)に対して加熱範囲
が広くなるようにレーザビーム(LB)を照射して約6
00℃程度に予熱した後、上記セラミックス(29)の
曲げ加工部分に前記レーザビーム(LB)を局部的に集
光照射して軟化状態になる軟化温度に加熱し、この局部
的な軟化温度部分に曲げ加工を行うことを特徴とするレ
ーザによるセラミックスの曲げ加工方法。
1. A method of bending a ceramic by heating the ceramic.
In the method, heating range for ceramics (29)
Irradiate the laser beam (LB) so that
After preheating to about 00 ° C, the above ceramics (29)
The laser beam (LB) is locally collected at the bent part
Heat to the softening temperature to be softened by light irradiation.
A method for bending ceramics using a laser , wherein bending is performed on a typical softening temperature portion .
JP20023191A 1991-08-09 1991-08-09 Laser bending method of ceramics Expired - Fee Related JP3241066B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20023191A JP3241066B2 (en) 1991-08-09 1991-08-09 Laser bending method of ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20023191A JP3241066B2 (en) 1991-08-09 1991-08-09 Laser bending method of ceramics

Publications (2)

Publication Number Publication Date
JPH0543353A JPH0543353A (en) 1993-02-23
JP3241066B2 true JP3241066B2 (en) 2001-12-25

Family

ID=16420995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20023191A Expired - Fee Related JP3241066B2 (en) 1991-08-09 1991-08-09 Laser bending method of ceramics

Country Status (1)

Country Link
JP (1) JP3241066B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1894891A2 (en) 2006-08-28 2008-03-05 DOWA Electronics Materials Co., Ltd. ITO Powder and method for manufacturing same, coating material for electroconductive ITO film, and transparent electroconductive film

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITFO20020008A1 (en) * 2002-03-26 2002-06-24 Keser S R L METHOD FOR MODELING CERAMIC TILES.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1894891A2 (en) 2006-08-28 2008-03-05 DOWA Electronics Materials Co., Ltd. ITO Powder and method for manufacturing same, coating material for electroconductive ITO film, and transparent electroconductive film

Also Published As

Publication number Publication date
JPH0543353A (en) 1993-02-23

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