JP3243197B2 - Equipment for manufacturing lead frames for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a lead frame for a semiconductor device formed by attaching a bonding tape with a thermoplastic adhesive for bonding an integrated circuit element or an integrated circuit element mounting substrate.

[0002]

2. Description of the Related Art In semiconductor devices, it is strongly desired to increase the signal processing speed.
During use, the temperature of the semiconductor device itself rises. When the temperature of the semiconductor device rises, the functionality of the semiconductor device is adversely affected, so it is necessary to suppress the temperature rise, and a heat sink made of copper or a copper alloy is installed below the chip mounting portion or the inner lead. . Further, as a semiconductor device, LOC (lead-on-chip) or COL (chip-on-lead) in which a semiconductor element is attached to a lower surface or an upper surface of an inner lead has been proposed. Insulating bonding tape is used for installation of the heat sink and mounting of the semiconductor element. Generally, the insulating bonding tape is punched into a strip shape or a frame shape by a punching die having a punch and a die, and leads are formed. It is attached to a predetermined portion of the lead frame on which the pattern is formed, for example, the inner lead portion, or the element mounting portion and the inner lead portion.

[0003]

However, insulative bonding tapes are usually coated with an adhesive on both sides, or tapes of the adhesive alone are used. However, since they are soft, they have poor punching properties. When punching the bonding tape and pressing and bonding the punched bonding tape pieces at the same location, there is also a need to heat the lead frame to be bonded,
There has been a problem that the temperature of the punching die itself rises, and the thermoplastic resin is further softened to cause defective cutting. Also,
Even if it can be cut, due to the high temperature of the mold, the adhesive adheres to the end face of the insulating bonding tape as if torn, and the punched end face shape deteriorated, resulting in poor adhesion or adhesion to the lead frame. Even if possible, there has been a problem that peeling or the like occurs in the subsequent assembly process of the semiconductor device. The present invention has been made in view of such circumstances, and the mold for cutting the joining tape is not heated by the heat source for heating the lead frame base material, and therefore, the cutting property of the joining tape is good, and as a result, the quality is high. It is an object of the present invention to provide a semiconductor device lead frame manufacturing facility capable of efficiently manufacturing a good semiconductor device lead frame.

[0004]

According to the present invention, there is provided a semiconductor device comprising:
The manufacturing equipment for a lead frame for a semiconductor device described above pastes a bonding tape piece of a predetermined shape having a thermoplastic adhesive applied on at least a back surface thereof to a lead frame base material having a predetermined shape processed by hot pressing. A semiconductor device lead frame manufacturing facility, comprising a first heater block, a preheating station for preheating the leadframe base material, and joining the preheated leadframe base material following the preheating station. A thermocompression station that separates a pre-cut bonding tape piece from the bonding tape at a processing position and presses the pre-cut into a predetermined position of the lead frame base material further heated by a second heater block; A punching process is performed on the joining tape conveyed to the joining position from a direction different from the conveying direction of the frame base material. A joining tape processing station for forming a joining tape piece that is temporarily attached to the joining tape as it is separated by the cuts and after being punched out, a conveying means of the lead frame base material, and a conveying means. A tape feeding means for feeding the joining tape in synchronization.

According to a second aspect of the present invention, in the manufacturing facility for a semiconductor device lead frame, a curing station for curing a heated lead frame base material is provided immediately after the thermocompression bonding station. Have been. According to a third aspect of the present invention, there is provided the semiconductor device lead frame manufacturing facility according to the first or second aspect, wherein a front end of each of the inner leads is connected to the preheating station with a binder from a thin plate material. A first shape processing station for processing the lead frame base material in a state in which the inner lead is connected to the thermocompression bonding station and the inner leads are connected by the bonding tape pieces; A second shaping station is provided for removing the. The semiconductor device lead frame manufacturing equipment according to claim 4 is:
The manufacturing equipment according to any one of claims 1 to 3, wherein the joining tape processing station is provided with cooling means.

In the manufacturing apparatus for a lead frame for a semiconductor device according to the present invention, in the bonding tape processing station, the bonding tape conveyed by the tape feeding means is subjected to a punching process to separate the bonding tape pieces. At the same time, the separated bonding tape pieces are bonded to their original positions. Then, the tape is transported to the bonding position of the thermocompression bonding station by a tape feeding unit, and the bonding tape piece is separated from the bonding tape by another mold and pressed against a predetermined position of the sequentially transported lead frame base material. . The leadframe substrate is preheated by a first heater block by a preheating station,
Further, since the second adhesive is heated by the second heater block of the thermocompression bonding station, the thermoplastic adhesive of the pressed bonding tape piece sufficiently reaches the bonding temperature and is fixed to the lead frame base material.

In particular, in the manufacturing equipment for a lead frame for a semiconductor device according to the present invention, since the curing station is provided immediately after the thermocompression bonding station, the heated lead frame base material is cured and the bonding tape is formed. The fixing of the piece is completed. Here, as specific curing means, there are a case where the lead frame base material is heated and a case where it is cooled as necessary. Note that this cure station can be omitted. In the semiconductor device lead frame manufacturing facility according to the third aspect, processing of the lead frame base material in a state where the tips of the inner leads are connected by a binder (connecting piece) is performed in a first shape processing station, Since the binder is separated at the second shape processing station in a state where the respective inner leads are connected with the bonding tape pieces at the thermocompression bonding station, deformation such as twisting may occur at the tip of the inner lead of the final product. Absent. In the manufacturing equipment for a lead frame for a semiconductor device according to claim 4, since the joining tape processing station is provided with a cooling means, it is possible to prevent a temperature rise of a die or the like for performing a punching process. The heating of the thermoplastic adhesive applied to the adhesive tape can be prevented, and the punching of the joining tape can be stably performed.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. FIG. 1 is a plan view of a semiconductor device lead frame manufacturing facility according to an embodiment of the present invention, FIGS. 2 and 3 are cross-sectional views, and FIG. 4 is a semiconductor device lead frame manufacturing facility. FIG. 5 is a schematic block diagram, FIG. 5 is an explanatory view of a punching step, and FIG. 6 is a plan view of a lead frame base material.

As shown in FIGS. 1 to 4, a semiconductor device lead frame manufacturing facility 1 according to an embodiment of the present invention.
Reference numeral 0 denotes a first shape processing station 12 for performing main shape processing of the lead frame base material 11 and a pre-heating station 14 including a first heater block 13 which can be moved up and down.
A thermocompression station 16 for thermocompression bonding the bonding tape piece 15 to the lead frame base material 11; a bonding tape processing station 18 for punching the bonding tape piece 15 from the bonding tape 17; and a curing station subsequent to the thermocompression station 16 19 and second shape processing station 2
0 and a conveying means 22 for feeding the lead frame base material 21 in which a plurality of lead frame base materials 11 are connected at a pitch.
And a tape feeding means 23 for feeding the joining tape 17 from another direction in synchronization with the conveying means 22. Hereinafter, these will be described in detail.

First, as shown in FIGS. 6A and 6B,
The joining tape piece 1 is attached to the lead frame base material 11 which is processed by the semiconductor device lead frame manufacturing equipment 10.
The lead frame 24 to which the No. 5 is joined will be described.
The lead frame base material 11 is formed by a first shaping station 12 for performing press working or etching work on a predetermined thin strip material, and a plurality of outer leads are provided inside the outer frames 25 and 26 on both sides at a predetermined pitch. 27 and inner leads 28 are formed, and the tips of the respective inner leads 28 are connected by a binder (connecting piece) 29. The first shape processing station 12 may include a surface treatment unit for the lead frame base material 11 and a residual stress removing unit when the lead frame base material 11 is pressed.

The inner leads 2 of the lead frame substrate 11 formed in the first shape processing station 12
Although the post-processing is performed by connecting the tips of the wires 8 with a binder 29 to prevent the inner leads 28 from being bent or twisted, it is necessary to finally separate and remove them. The thermocompression bonding station 1 is attached to the lead frame base material 11 having the binder 29.
6, the bonding tape piece 15 is thermocompression-bonded, and the binder 29 is separated at the second shape processing station 20 to produce the desired lead frame 24. The bonding tape piece 15 is used not only to hold the tip of the inner lead 28 but also to serve as an insulating layer when bonding a semiconductor element or a heat sink. In FIG. 6, reference numeral 30 denotes a pilot hole for positioning, and reference numeral 31 denotes a resin sealing region.

As shown in FIGS. 1 and 2, a preheating station 14 following the first shaping station 12 is used.
Is provided with a first heater block 13 which can be moved up and down and connected to a cylinder (not shown) at the lower part.
The heating is performed to a temperature of 0 to 150 ° C. The transfer means 22 provided at the position of the preheating station 14 has a well-known structure, similar to an ordinary intermittent transfer means of a lead frame member, and has a plurality of lead frame bases from above and below by a first holding member. The material 11 is advanced by a predetermined distance (feed pitch) across the connected lead frame base material 21 connected thereto, and then the first holding member is opened to hold the connection lead frame base material 21 with the second holding member. A pitch feed operation in which only the first holding member is retracted and returns to the original position,
This is performed by a signal from a control device (not shown). As a result, the continuous lead frame base material 11 is
As shown by an arrow a in FIG.
From the thermocompression bonding station 16. In this embodiment, the transport means 22 is provided on the upstream side of the thermocompression bonding station 16, but may be further provided on the downstream side of the thermocompression bonding station 16. Reliable transport is possible.

The bonding tape 17 is formed by applying a thermoplastic adhesive 17b to both surfaces of a polyimide resin sheet 17a which is a thin heat-resistant insulating sheet as shown in FIG. The tape wound in a coil is gradually unwound, and the tape is fed in the direction of the bonding tape processing station 18 and the thermocompression bonding station 16. The tape feeding means 23 moves forward in the feeding direction while holding the joining tape 17 by using third holding means for sandwiching the joining tape 17 from both sides.
While the joining tape 17 is held by the holding means, the third holding means moves backward in the open state. Although the tape feeding means 23 is provided on the downstream side of the thermocompression bonding station 16 in this embodiment, it is also possible to arrange the tape feeding means 23 further on the upstream side of the joining tape processing station 18, whereby A reliable feeding operation of the joining tape 17 can be performed.

As shown in FIG. 1, the bonding tape 17 is positioned at a bonding position 32 of the thermocompression bonding station 16 in plan view.
Are conveyed in a direction perpendicular to the flow direction of the connection lead frame base material 21 with the intersection as an intersection. The bonding tape processing station 18 described above is provided in front of the thermocompression bonding station 16 in the flow direction of the bonding tape 17. In this embodiment, the bonding tape processing station 18 has a small space between the pair of bonding tape pieces 15 to be bonded to the lead frame base material 11 in this embodiment, and therefore, as shown in FIG. There are provided first and second punching means 33 and 34 spaced apart by 17 feed pitches (2 pitches), and the adjacent joining tape pieces 15 are individually punched.

As shown in FIGS. 3 and 5, the first and second punching means 33 and 34 respectively include a punching punch (blade) 35 and a joining tape after guiding the punching punch 35 and punching. A fixed stripper 36 and a knockout 37 for preventing the punch 17 from rising as the punch 35 rises, and a lifting means 38 for the punch 35
And The punching punch 35 is a sharp cutting edge whose cutting edge is adapted to the outer shape of the joining tape piece 15, and the operation thereof is performed by raising and lowering means 38 including a motor and a cylinder as shown in FIG. 5 (B). When the punch 35 is lowered by operating the punch, the joining tape 17 disposed at the lower portion is pushed out to separate the joining tape piece 15 from the main body side of the joining tape 17, and then as shown in FIG. When the punch 35 is lifted, only the cutting tool is raised in a state where the pressed bonding tape piece 15 is held at the cutout position of the bonding tape 17. By this operation, the pressed bonding tape pieces 15 are held by the cutout portions of the bonding tape 17 and are sequentially conveyed, and conveyed to the next thermocompression bonding station 16 in a state where the bonding tape pieces 15 to be paired are arranged. become. When the operating temperature rises, the joining tape processing station 18 melts the thermoplastic resin on the front and back of the joining tape 17, so that the surroundings are cooled by an example of a cooling means so that the temperature always becomes constant (for example, 30 to 40 ° C.). And a cool air of a predetermined temperature is flowing.

As shown in FIGS. 2 and 3, the thermocompression bonding station 16 includes a second heater block 40 which is moved up and down by a lifting means such as a cylinder (not shown). The material 11 is heated to 160 to 180 ° C. Further, a pressing die 42 that moves up and down by an elevating means 41 provided at the top is provided, and the joining tape piece 15 held in the joining tape 17 being conveyed is pushed out, and the heated lead frame base material 11 is removed. Thermocompression bonding is performed on a predetermined portion (the tip of the inner lead 28). The pressing mold 42 has a pressing surface that matches the pair of joining tape pieces 15 or is smaller than the joining tape piece 15 in a minute range. A bonding tape piece 15 extruded in the previous step is fixed to a predetermined position of the lead frame base material 11 by the thermocompression bonding station 16, and a station for separating the bonding tape piece 15 from the bonding tape 17 in this way; Bonding tape piece 15 to lead frame base material 11
By separating from the pressing station,
Since the blade for separating the joining tape piece 15 from the joining tape 17 and the heating of the joining tape 17 at the time of cutting can be prevented, the work can be performed without melting the thermoplastic resin (adhesive) of the joining tape 17.

As shown in FIGS. 1 and 4, a curing station 19 is provided for cooling the lead frame base material 11 heated by the thermocompression bonding station 16 and to which the bonding tape pieces 15 are fixed. The cure station 19 is used for the lead frame base material 11 to be conveyed.
Is surrounded by a hood and hot air (or cold air in some cases) is passed inside. As a result, the lead frame base material 11 is heated to an appropriate temperature, and the adhesive is cured, so that the joining tape pieces 15 are completely fixed and conveyed to the next second shaping station 20. The second shape processing station 20 is provided with a press working device, separates the binder 29 connecting the inner leads 28, and breaks the electrical connection of the tips of the inner leads 28, as shown in FIG. ) Are manufactured.

In the above embodiment, the bonding tape 1
Although the adhesive was applied to both surfaces of No. 7, the present invention can be applied to a case where the adhesive is applied only to the back surface. Also,
In the above embodiment, a pair of joining tape pieces 15
Are close to each other, so that the joining tape processing station 18
In the above, the first and second push-out means 33 and 34 are provided, but when there is one joining tape piece, and when there are a plurality of joining tape pieces and they are separated from each other, one or more It is also possible to process the joining tape piece by a single punching means having a punching punch. In the above-described embodiment, the cure station 19 and the second shape processing station 20 are provided immediately after the thermocompression bonding station 16, but the present invention can be applied to a case where these stations are omitted.

[0019]

According to the semiconductor device lead frame manufacturing facility of the present invention, the joining tape piece is separated from the joining tape by the joining tape processing station provided before the thermocompression bonding station. In addition, it becomes extremely easy to make the temperature of the joining tape and the punching punch at the time of cutting an appropriate temperature, and as a result, the thermocompression bonding of the joining tape piece with high accuracy can be performed. Then, since the joining tape piece forming operation can be performed stably, the number of times of line stop and the like can be reduced, and the production efficiency can be improved. In particular, in the semiconductor device lead frame manufacturing facility according to claim 2, a curing station is provided immediately after the thermocompression bonding station.
The heated lead frame base material is cured, complete bonding of the joining tape pieces is completed, and the production efficiency of the lead frame can be increased. In the manufacturing equipment for a lead frame for a semiconductor device according to claim 3, a lead frame base material in which the tip of each inner lead is connected by a binder is manufactured at a first shape processing station, and each of the inner leads is connected to each other at a thermocompression bonding station. Since the binder is separated at the second shape processing station in a state where the binder is connected with the joining tape pieces, deformation such as twisting does not occur at the tip of the inner lead of the final product, and the quality of the product is small with few defects. A good lead frame can be manufactured. In the manufacturing equipment for a lead frame for a semiconductor device according to claim 4,
Cooling means is provided at the joining tape processing station, so it is possible to prevent the temperature of the joining tape to be subjected to the punching process and the temperature of the die for performing the punching process from rising, thereby enabling high-speed production of joining tape pieces. Becomes

[Brief description of the drawings]

FIG. 1 is a plan view of a facility for manufacturing a lead frame for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is a sectional view of the same.

FIG. 4 is a schematic block diagram of manufacturing equipment for the semiconductor device lead frame.

FIG. 5 is an explanatory diagram of a punching step.

FIG. 6 is a plan view of a lead frame base material.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Manufacturing equipment of the lead frame for semiconductor devices 11 Lead frame base material 12 First shape processing station 13 First heater block 14 Preheating station 15 Bonding tape piece 16 Thermocompression bonding station 17 Bonding tape 17a Polyimide resin sheet 17b Adhesive ( Thermoplastic resin) 18 Bonding tape processing station 19 Cure station 20 Second shape processing station 21 Connected lead frame base material 22 Transport means 23 Tape feeding means 24 Lead frame 25 Outer frame 26 Outer frame 27 Outer lead 28 Inner lead 29 Binder 30 Pilot hole 31 Resin sealing area 32 Joining position 33 First pushing means 34 Second pushing means 35 Pushing punch 36 Fixed stripper 37 Knockout 38 Elevating means 39 constant temperature cover 40 second heater block 41 elevating means 42 pressing die

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Claims (4)

(57) [Claims] 1. Production of a lead frame for a semiconductor device in which a bonding tape piece of a predetermined shape having a thermoplastic adhesive applied on at least the back surface is adhered to a lead frame base material processed in a predetermined shape by hot pressing. Equipment, comprising: a first heater block, a pre-heating station for pre-heating the lead frame base material, and a pre-cut at the joining processing position following the pre-heating station to join the pre-heated lead frame base material. A thermocompression bonding station that separates the bonding tape piece formed with the bonding tape from the bonding tape, and presses the lead frame base material at a predetermined position further heated by the second heater block, and a conveyance direction of the lead frame base material. Performs a punching process on the joining tape conveyed to the joining position from another direction, and is separated by the cut. And after the punching, a joining tape processing station for forming a joining tape piece temporarily attached to the joining tape as it is, a conveying means of the lead frame base material, and the joining tape in synchronization with the conveying means. And a tape feeding means for feeding the semiconductor device. 2. The equipment for manufacturing a lead frame for a semiconductor device according to claim 1, wherein a curing station for curing the heated lead frame base material is provided immediately after said thermocompression bonding station. 3. In front of said preheating station,
A first method for processing the lead frame base material from the thin strip material in a state where the tips of the inner leads are connected by a binder.
A shaping station is provided, and a second shaping station is provided after the thermocompression bonding station to remove the binder of the lead frame base material in which the respective inner leads are connected by the bonding tape pieces. 3. The manufacturing equipment for a lead frame for a semiconductor device according to claim 1, wherein 4. The bonding tape processing station is provided with a cooling means.
The manufacturing equipment of the lead frame for semiconductor devices according to any one of the above.