JP3255387B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket suitable for mounting an IC chip on an electronic circuit board.

[0002]

2. Description of the Related Art In general, a packaged IC chip in which integrated circuit components are mounted on a substrate is directly mounted on an electronic circuit substrate by soldering or the like. Conventionally, IC sockets have been used for mounting an IC chip that has a possibility or an IC chip that may have a bad influence on an integrated circuit in the chip due to heat at the time of soldering. 2. Description of the Related Art A conventional IC socket includes a resin socket body for accommodating an IC chip, and a pressing cover attachable to the socket body. A large number of electrodes (not shown) are formed on each side of the lower surface of the substrate of the IC chip, and a large number of contact pins are formed on each side of the socket body corresponding to this electrode arrangement by insert molding or the like. The sequence is fixed. One end of each contact pin protrudes outward from the socket body, and can be surface-mounted on an electronic circuit board. The other end of each contact pin is located inside the socket body, and when the holding cover is mounted on the socket body, the IC chip mounted in the socket body is pressed against the elasticity of the contact pin. By pressing from above, the electrodes of the IC chip and the contact pins are electrically connected at a desired contact pressure.

[0003]

In the above-described conventional IC socket, the electrodes on each side of the IC chip must be simultaneously pressed against the contact pins when the holding cover is mounted. In order to obtain a desired contact pressure with the pin, a very large pressing force is required, and it has been difficult to mount and fix the IC chip using the pressing cover. Further, since the IC chip is pressed with a large force from above, unnecessary stress is applied to the IC chip and the socket body.

Further, since the IC chip is merely pressed from above, a so-called wiping action cannot be generated between the electrode of the IC chip and the contact pin, and it is difficult to ensure the reliability of the electrical connection. Met.

Accordingly, it is an object of the present invention to be able to easily attach / detach an IC chip without applying unnecessary stress to the IC chip and the like, and to surely realize electrical connection with electrodes of the IC chip. It is to provide an IC socket that can be used.

[0006]

In order to solve the above-mentioned problems, the invention according to claim 1 is directed to a socket body having a substantially rectangular shape and corresponding to an electrode arrangement on each side of a lower surface of an IC chip. A plurality of contact pins arranged and fixed on each side of the IC chip and having one end supporting the lower surface of the IC chip in contact with the electrode of the IC chip and the other end projecting outside the socket body; Press the edges individually to
An IC socket having a plurality of sliders for pressing an electrode of a C-chip against a contact pin for each side,
Each slider has one end for pressing the IC chip and the other end opposite to the IC chip. Each slider has a plurality of arm insertion holes opened to the other end, and each contact pin has a slider. The arm which is inserted into the arm insertion hole and holds the slider, and which guides the slider movably along the upper surface of the contact pin while applying spring pressure to the slider, is integrally formed. A concave portion is formed on the upper surface near the one end portion for lowering the slider that has reached the vicinity of the IC chip, and each arm is provided with a spring pressure applied to the slider as the slider approaches the concave portion of the contact pin. The contact pins extend obliquely downward from above the vicinity of the other end of the contact pin toward one end of the contact pin. .

[0007] The invention according to claim 2 is the invention according to claim 1.
In the C socket, a notch is formed at one end of the slider so as to contact the side surface and the upper surface of the IC chip.

[0008] The invention according to claim 3 is the invention according to claim 1.
In the C socket, the slider has an upper wall covering the upper surface of the arm and a lower wall covering the lower surface of the arm, and the upper wall of the slider extends to the other end of the slider longer than the lower wall of the slider. The arm insertion hole of the slider is open at the end face of the lower wall of the slider, and the lower surface of the upper wall of the slider is formed with an arm guide groove continuous with each arm insertion hole. .

According to a fourth aspect of the present invention, there is provided the method according to the first aspect.
In the C socket, a sliding contact portion that slides on the upper surface of the contact pin is formed on the lower surface of one end of the slider, and the slider is formed so that only the sliding contact portion slides on the upper surface of the contact pin. Features.

According to a fifth aspect of the present invention, there is provided the method according to the first aspect.
The C socket is characterized in that guide ribs are formed on the lower surface of the slider so as to slidably engage with contact pins adjacent to each other.

[0011]

In the IC socket according to the first aspect, after the IC chip is placed on one end of the contact pin and then a plurality of sliders held by the arm integrated with the contact pin are individually slid, When the slider descends along the concave portion on the upper surface of the contact pin due to the spring pressure, each side of the IC chip is individually pressed, and the pressing force brings the electrode of the IC chip into pressure contact with the contact pin for each side. In this case, it is necessary to secure a desired contact pressure between the electrode of the IC chip and the contact pin. However, since each slider can individually press the electrode of the IC chip to the contact pin for each side. ,
The pressing force by each slider can be reduced.
Therefore, the slide operation of each slider can be easily performed with a small force. In addition, the pressing force applied to the IC chip is reduced, and the IC chip pressing position by the slider and the IC chip supporting position by the contact pin are substantially opposed to each other. Therefore, it is possible to prevent unnecessary stress from being applied to the IC chip.

Further, since each slider can be individually slid to sequentially press each side of the IC chip, a wiping action can be produced at the contact portion between the electrode of the IC chip and the contact pin. Therefore,
The reliability of the electrical connection can be improved.

Further, since the slider is held by the arm so as to cover the upper surface of the arm on each side of the socket body, the slider serves as a contact pin or an upper protective cover of the arm. Further, since the slider can be easily slid by directly operating the slider from above the arm, a jig or an operating mechanism for externally sliding the slider is not required. Therefore, the configuration of the IC socket can be simplified, and the operability can be improved while maintaining the weight and thickness of the IC socket.

Moreover, the arm extends obliquely with respect to the upper surface of the contact pin so that the spring pressure pressing the slider increases as the slider approaches the concave portion on the upper surface of the contact pin. The slider can be pressed against the upper surface of the IC chip by a spring pressure, and when the slider is slid against the spring pressure of the arm, the slider can reach the upper surface of the IC chip with a minimum operating force. Therefore, the slider is extremely excellent in operability.

In the IC socket according to the second aspect,
When the slider is slid and one side of the IC chip is pressed, the notch of the slider can press the side and top surfaces of the IC chip, so two opposing sides of the IC chip are sequentially pressed with the two sliders. By doing
A more effective wiping action can be produced at the contact portion between the electrode of the IC chip and the contact pin.

In the IC socket according to the third aspect,
Since the upper portion of the slider that covers the upper surface of the arm extends longer than the lower portion of the slider, the upper portion of the arm can be widely protected. Further, since each arm insertion hole of the slider is formed short so as to open to the end face of the lower wall portion shorter than the upper wall portion of the slider, the slider can be easily formed. Furthermore, since the arm guide groove continuous with each arm insertion hole is formed on the lower surface of the upper part of the slider, the slider can be stably held on the arm even when the slider is slid, and the arms adjacent to each other The separation can be stably maintained by the groove.

In the IC socket according to the fourth aspect,
When the slider is slid, only the sliding contact portion on the lower surface of one end of the slider can be slid on the upper surface of the contact pin, so that the sliding resistance of the slider can be reduced and the sliding operation can be facilitated.

In the IC socket according to the fifth aspect,
The slider can be slid to the IC chip pressing position while keeping the contact pins adjacent to each other at a fixed interval by the guide ribs of the slider, so that the contact failure between the electrode of the IC chip and the contact pin due to the displacement of the contact pin is reliably prevented. Therefore, the reliability of the electrical contact between the electrode and the contact pin can be further improved.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of an IC chip. Referring to FIG. 1, an IC chip 1 is provided on an upper surface of a rectangular multilayer substrate 2 formed of a glass epoxy resin or the like by an LSI.
And the like (not shown) are mounted and protected with resin to form a module. A plurality of electrode films 4 are arranged on the lower surface of the substrate 2 along each side of the substrate 2. The IC socket according to the present invention is used for detachably mounting such an IC chip 1 on an electronic circuit board.

2 to 6 show an embodiment of the present invention. FIG. 2 is a plan view of an IC socket on which an IC chip 1 is mounted, and FIG. 3 is an enlarged view of a main part of FIG. 4 is IC
Perspective view of the main part of the slider used for the tip, viewed from below,
FIGS. 5A to 5D are a front view, a bottom view, a side view, and a cross-sectional view taken along line XX of FIG. FIGS. 6A and 6B are cross-sectional views for explaining the operation of the IC socket.

Referring first to FIGS. 2 and 3, an IC socket indicated generally by reference numeral 10 has a substantially rectangular socket body 11 made of plastic. At the center of the socket body 11, a substantially rectangular opening 11a smaller than the outer dimensions of the IC chip 1 is provided.
On the upper surface of the socket body 11, the IC chip 1 is engaged with each of the four corners of the IC chip 1 and
A corner engaging piece 11b for positioning at 1 is formed so as to protrude. In order to enable a wiping operation to be described later, each corner engaging piece 11b positions the IC chip 1 to such an extent that the IC chip 1 can slightly move. In addition, 4 of the socket body 11
Positioning holes 11c for positioning the socket main body 11 on the electronic circuit board 5 (see FIG. 6), and temporarily fixing or fixing the socket main body 11 are formed in the corner portions.

A plurality of contact pins 20 made of metal are fixedly arranged on each side of the socket body 11 corresponding to the arrangement of the electrodes 4 along each side of the substrate 2 of the IC chip 1. Each contact pin 20 is an electrode 4 of the IC chip 1
End 20a supporting the lower surface of IC chip 1 by contacting
And the other end 20 b protruding outside the socket body 11. As shown in FIG. 6A, the other end 20 b of the contact pin 20 forms a connection terminal that can be surface-mounted on the electronic circuit board 5 outside the socket body 11, and is formed on the electronic circuit board 5. It can be soldered on the conductor pattern (not shown). Each contact pin 20 has a slit 1 opening on the upper surface of the socket body 11.
Each of the contact pins 20 is implanted on the upper surface of the socket body 11 by press-fitting the protrusion 20c into the slit 11d. On one end side of each contact pin 20, an engaging portion 20d that engages with a guide groove 11e formed on the upper surface of the socket body 11 is formed to protrude downward, and this engaging portion 20d is formed in the guide groove 11e. By the engagement, one end 20 a of the contact pin 20 is positioned on the socket body 11.

As shown in FIG. 1, the IC socket 10 further presses each side of the substrate 2 of the IC chip 1 individually to press the electrodes 4 of the IC chip 1 against the contact pins 20 for each side. Here, four sliders 30 are provided. The slider 30 is made of plastic. FIG. 4-
Referring to FIG. 6, each slider 30 has one end 30a for pressing the substrate 2 of the IC chip 1 and the other end 3a on the opposite side.
0b. At one end 30a of each slider 30, a cutout portion 30c that contacts the side surface and the upper surface of the IC chip 1 is formed. Further, each slider 30 is formed with a plurality of arm insertion holes 30d which are open toward the other end 30b.

On the other hand, each contact pin 20 is integrally formed with an arm 21 inserted into an arm insertion hole 30d of the slider 30. This arm 21 is a slider 3
0 while pressing the slider 30 from the retracted position (FIG. 6A) where the slider 30 is separated from the IC chip 1 while applying spring pressure to the slider 30 (the pressing position (FIG. 6A)). The guide is movably guided along the upper surface of the contact pin 20 up to FIG. Contact pin 20 and this contact pin 20
Can be easily formed by punching a metal plate.

As shown in FIGS. 6A and 6B, an IC is provided on the upper surface near one end 20a of each contact pin 20.
The slider 30 reaching the vicinity of the chip 1 is moved to the arm 21.
A concave portion 20e to be lowered under the spring pressure is formed. Each arm 21 has one end 20a of the contact pin 20 from above near the other end of the contact pin 20 so that the spring pressure applied to the slider 30 increases as the slider 30 approaches the recess 20e on the upper surface of the contact pin 20. It extends inclining downward toward. In order to give the arm 21 a spring property, the base side of the arm 21 is bent in an arc shape.

As shown in FIG. 6A, the slider 30 has an upper wall portion 30e covering the upper surface of the arm 21 and a lower wall portion 30f covering the lower surface of the arm 21. 30e extends to the other end 30b side of the slider 30 longer than the lower wall portion 30f. The arm insertion hole 30d of the slider 30 is open at the end face of the lower wall portion 30f. Further, an arm guide groove 30g continuous with each arm insertion hole 30d is formed on the lower surface of the upper wall portion 30e of the slider 30. Further, in this embodiment,
As can be seen from FIGS. 5A and 5D, the upper meat portion 30
f, the opening of the arm insertion hole 30d is 5
They are in communication with each other. With such a shape, the strength of the slider 30 can be secured, and the strength of a core (not shown) that forms the arm insertion hole 30d when the slider 30 is formed can be secured.

Further, the lower surface of one end 30a of the slider 30 is provided with a sliding contact portion 3 which is in sliding contact with the upper surface of the contact pin 20.
0h is formed so as to protrude.
Only 0h is formed so as to slide on the upper surface of the contact pin 20. 4 and FIGS. 6A and 6B.
As shown in the figure, a guide rib 30i is formed on the lower surface of the slider 30 so as to slidably engage between the contact pins 20 adjacent to each other.

In the IC socket 10 having the above structure, after the substrate 2 of the IC chip 1 is mounted on one end 20a of the contact pin 20, a plurality of sliders held by an arm 21 integrated with the contact pin 20 are provided. When the sliders 30 are individually slid, the sliders 30 individually press each side of the substrate 2 of the IC chip 1 when descending along the concave portion 20 e on the upper surface of the contact pin 20 by the spring pressure of the arm 21. The electrode 4 of the IC chip 1 is pressed against one end 20a of the contact pin 20 for each side. In this case, it is necessary to secure a desired contact pressure between the electrode 4 of the IC chip 1 and the contact pin 20,
The electrodes 30 of the IC chip 1 can be individually pressed against the contact pins 20 for each side by the respective sliders 30, so that the pressing force by the respective sliders 30 can be reduced. Therefore, the sliding operation of each slider 30 can be easily performed with a light force. Further, since the pressing force applied to the IC chip 1 is also reduced, the IC chip 1
Unnecessary stress is applied to the socket body 11 and the socket body 11. In particular, since the IC chip pressing position by the slider 30 and the IC chip supporting position by the contact pins 20 are substantially opposed to each other and only the compressive stress in the thickness direction is substantially generated in the IC chip 1, the IC chip 1 Unnecessary stress can be prevented from being applied to the internal circuit.

Further, since each slider 30 can be individually slid to sequentially press each side of the substrate 2 of the IC chip 1, the IC chip 1 is pressed while the IC chip 1 is pressed by the slider 30. The slider 30 can be moved in the sliding direction within a clearance between the chip 1 and the socket body 11. Therefore, a wiping action can be generated at the contact portion between the electrode 4 of the IC chip 1 and the contact pin 20, and the reliability of the electrical connection can be improved.

Further, the slider 30 is connected to the socket body 1.
1 to cover the upper surface of the arm 20 on each side of the arm 2
The slider 30 serves as an upper protective cover for the contact pin 20 and the arm 21 because it is held at 1. Further, since the slider 30 can be easily slid by directly operating the slider 30 from above the arm 21, a jig or the like for sliding the slider 30 can be omitted, and the structure of the IC socket 10 can be simplified. At the same time, it is possible to reduce the size and weight, especially the thickness.

Here, the arm 21 and the slider 30
More specifically, when the slider 30 held by the arm 21 is in the retracted position, as shown in FIG. 6A, the slider 30 receives the spring pressure of the arm 21 and at the position of the contact portion 30h, as shown in FIG. It is in pressure contact with the upper surface of the contact pin 20. At this time, the spring pressure of the arm 21 acts on the slider 30 with the upper wall near the base of the arm 21 as a fulcrum and the lower surface of the tip of the arm 21 as a power point.

Next, the slider 30 is moved from the retracted position to the IC.
When pushed in the direction of the chip 1, the slider 30 moves along the upper surface of the contact pin 20 while elastically deforming the downwardly inclined arm 21 upward. Therefore, as the contact portion 30h of the slider 30 approaches the concave portion 20e on the upper surface of the contact pin 20, the spring pressure of the arm 21 increases. FIG. 7 shows the movement of the arm 2 according to the movement of the slider 30.
1 shows how the spring pressure changes. As shown in the figure, when the slider 30 reaches the recess 20e on the upper surface of the contact pin 20 and starts to descend, the arm 21
Spring pressure starts to decrease from the peak value. However, FIG.
As shown in (b), the slider 30 slightly descends so that the one end 20a of the slider 30 comes into contact with the upper surface of the substrate 2 of the IC chip 1, so that the spring pressure of the arm 21 is slightly lower than the peak value. Is constant.

As described above, the spring pressure of the arm 21 increases as the slider approaches the concave portion on the upper surface of the contact pin. Therefore, when the slider 30 is slid against the spring pressure of the arm 21, the slider 30 is minimized. With this operation force, the upper surface of the substrate 2 of the IC chip 1 can be reached.

Further, in the IC socket 10 having the above configuration, the slider 30 is slid to slide the IC chip 1.
When pressing one side of the substrate 2 of the IC chip 1, the notch 30 c of the slider 30 can press the side and top of the substrate 2 of the IC chip 1. By pressing sequentially with the two sliders 30, a more effective wiping action can be generated at the contact portion between the electrode 4 of the IC chip 1 and the contact pin 20.

Since the upper portion 30e of the slider 30 covering the upper surface of the arm 21 extends longer than the lower portion 30f of the slider 21, the upper portion of the arm 21 can be widely protected. Further, since each arm insertion hole 30d of the slider 30 is formed to be short so as to open to an end surface of the lower wall portion 30f shorter than the upper wall portion 30e of the slider 30, the slider 30 is formed, particularly the arm insertion hole 30d is formed. Becomes easier. Furthermore, the upper part 3 of the slider 30
Since the arm guide groove 30g continuous with each arm insertion hole 30d is formed on the lower surface of the slider 30e, the slider 30
, The slider 30 can be stably held on the arm 21 and the arms 21 adjacent to each other can be stably kept separated by the arm guide groove 30g.

When the slider 30 is slid, a sliding contact portion 30h on the lower surface of one end 30a of the slider 30 is provided.
Since only the contact pin 20 can be slid on the upper surface of the contact pin 20, the sliding resistance of the slider 30 can be reduced to facilitate the sliding operation.

Further, contact pins 2 adjacent to each other
Since the slider 30 can be slid to the pressed position of the IC chip 1 while maintaining the constant 0 by the guide rib 30i of the slider 30, the contact pin 2
Poor contact between the electrode 4 of the IC chip 1 and the contact pin 20 due to a displacement of 0 can be reliably prevented, and the reliability of electrical contact between the electrode 4 and the contact pin 20 can be further increased.

FIG. 8 shows another embodiment of the present invention in which the slider 30 is modified. In the figure, the same components as those in the above embodiment are denoted by the same reference numerals. In this embodiment, the upper portion 30e of the slider 30 extends longer than the slider 30 of the above embodiment. On the upper surface of the other end 30b of the slider 30, a protruding portion 30j having an uneven surface is formed. Therefore, when the slider 30 is slid, the fingertip or the like is brought into contact with the protruding portion 30j to thereby make the slider 3
0 can be pushed more easily.

FIG. 9 shows another embodiment of the present invention in which the mounting structure of the contact pin 20 is modified. In the figure, the same components as those in the above embodiment are denoted by the same reference numerals. In this embodiment, guide ribs 11f sandwiching the other end 20b of each contact pin 20 protrude from the outer surface of the socket body 11. Therefore, the other end 20b of each contact pin 20 can be maintained at a predetermined pitch.

Although the illustrated embodiment has been described above, the present invention is not limited only to the above embodiment, and various changes may be made to the components within the scope of the invention described in the claims. be able to. For example, two projections may be provided on the contact pin, and the contact pin may be implanted in the socket main body such that both projections sandwich the meat portion of the socket main body.

[0042]

As is apparent from the above description, according to the present invention, the IC chip can be easily attached and detached without applying unnecessary stress to the IC chip and the socket body. It is possible to provide an IC socket that can reliably realize an electrical connection with a chip electrode.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an IC chip.

FIG. 2 is a plan view of an IC socket on which the IC chip 1 is mounted.

FIG. 3 is an enlarged view of a main part of FIG. 1;

FIG. 4 is a perspective view of a main part of a slider used for the IC socket of FIG. 1 as viewed from below.

5A is a front view of a main part of a slider used for the IC socket of FIG. 1, FIG. 5B is a bottom view of a main part of the slider,
(C) is a side view of the slider, and (d) is a cross-sectional view of the slider taken along line XX in (a) of FIG.

FIGS. 6A and 6B are cross-sectional views for explaining the operation of the IC socket.

FIG. 7 is a graph schematically showing a change in spring pressure of an arm when a slider of an IC socket is moved.

FIG. 8 is a sectional view of a main part of an IC socket showing another embodiment of the present invention in which a slider is modified.

FIG. 9 is a cross-sectional view of a main part of an IC socket showing another embodiment of the present invention in which a mounting structure of a contact pin is changed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Substrate 4 Electrode 10 IC socket 11 Socket main body 20 Contact pin 20a One end of contact pin 20b The other end of contact pin 20e Concave part 30 Slider 30a One end of slider 30b Other end of slider 30c Cutout part 30d Arm insertion Hole 30e Upper part 30f Lower part 30g Arm guide groove 30h Contact part 30i Guide rib

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01R 33/76 H01L 23/32 H01R 33/97

Claims (5)

(57) [Claims] An IC chip which is arranged and fixed on each side of a socket body corresponding to a substantially rectangular socket body and an electrode arrangement on each side of a lower surface of the IC chip, and which contacts an electrode of the IC chip. A plurality of contact pins having one end supporting the lower surface of the IC chip and the other end projecting outside the socket body, and individually pressing each side of the IC chip to press the electrode of the IC chip against the contact pin for each side. Each slider has one end for pressing the IC chip and the other end on the opposite side, and each slider has a plurality of arm insertion holes opened on the other end side. Each of the contact pins is inserted into an arm insertion hole of the slider to hold the slider, and the slider can be moved along the upper surface of the contact pin while applying spring pressure to the slider. An arm for guiding the contact is integrally formed, and a concave portion for lowering the slider reaching the vicinity of the IC chip is formed on the upper surface near the one end of each contact pin. An IC socket characterized by being inclined downward from above near the other end of the contact pin toward one end of the contact pin so that the spring pressure applied to the slider increases as approaching the recess. 2. The IC socket according to claim 1, wherein a notch is formed at one end of the slider so as to contact the side surface and the upper surface of the IC chip. 3. The slider has an upper wall covering the upper surface of the arm and a lower wall covering the lower surface of the arm, and the upper wall of the slider is longer than the lower wall of the slider at the other end of the slider. Extending, the arm insertion hole of the slider is open at the end face of the lower wall of the slider, and the lower surface of the upper wall of the slider is formed with an arm guide groove continuous with each arm insertion hole. The IC socket according to claim 1, wherein 4. A slider is formed such that a sliding contact portion that slides on an upper surface of a contact pin protrudes from a lower surface of one end of the slider, and the slider is formed such that only the sliding contact portion slides on an upper surface of the contact pin. The IC socket according to claim 1, wherein: 5. The IC according to claim 1, wherein a guide rib slidably engaging between contact pins adjacent to each other protrudes from a lower surface of the slider.
socket.