JP3255389B2 - Socket for electrical components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for electrical components used for electrically connecting electrical components such as IC chips and chip-on-board modules to a circuit board.
More particularly, the present invention relates to a socket for electric components that can be reduced in weight and thickness.

When an electric component such as an IC chip or a chip-on-board module is mounted on a circuit board, terminals such as leads or pads arranged along the edge of the electric component are directly mounted on the circuit board by soldering or the like. It is common to fix the connection. However, for example, when an electric component is connected to a circuit board for a test, when an electric component is mounted on a circuit board so that components can be easily replaced, or when soldering heat may adversely affect an internal circuit. When mounting such an electrical component on a circuit board, an electrical component socket has conventionally been used. JP-A-64-3977 and JP-A-Hei 2
As disclosed in, for example, US Pat. No. 5,188,882, a conventional general electrical component socket has a multiplicity of leads having a lead portion soldered to a connection circuit of a circuit board and a contact portion contacting a terminal of the electrical component. A socket body having a plurality of contact pins arranged side by side, a pressing cover for pressing an upper surface of an electrical component mounted on a contact portion of the contact pin, and a socket for holding the pressing cover at a position where the pressing cover presses the upper surface of the electrical component. And a locking piece for locking to the main body.

[0003]

In the above-mentioned conventional socket for electric parts, all the terminals of the electric parts and the contact portions of all the contact pins on the socket body are simultaneously pressed by the pressing force of the pressing cover. In order to apply a required contact pressure to the contact portion of each contact pin, a very large pressing force is required, and it becomes difficult to perform operations such as mounting and locking the holding cover. Further, since the electric component is pressed from above by a large force, it causes excessive stress on the electric component and the socket body.

Further, in the above-described conventional socket for electric parts, the socket body has a base plate mounted on a circuit board, and at least a part of the thickness of the base plate is provided between the contact pins and the circuit board. , The mounting height of the contact pins themselves on the circuit board is increased, and the mounting height of the electrical components is increased. Further, since it is impossible to remove the socket body from the circuit board after the contact pins are fixed to the circuit board, it is difficult to reduce the weight. Furthermore, since it has the pressing cover for pressing the upper surface of the electric component, there is a disadvantage that the mounting height and weight when mounted on the circuit board are large.

Accordingly, it is an object of the present invention to easily and detachably mount an electric component without applying excessive stress to an electric component or a circuit board, and to secure a reliable electric connection. It is another object of the present invention to provide an electrical component socket which can be made lighter and thinner when mounted on a circuit board.

[0006]

According to a first aspect of the present invention, an electric component having a plurality of terminals arranged in rows along a plurality of edges is provided on a circuit board. A socket for an electrical component used to electrically connect to a circuit of the electronic component, the support frame surrounding the periphery of the electrical component, a contact portion contacting a terminal of the electrical component, and a circuit of the circuit board. A plurality of contact pins, each having a lead portion to be connected and an arm portion having a spring property, arranged in a row on the support frame corresponding to the row of the terminals, and A pressing position where the edge of the electric component is pressed against the contact portion of the contact pin by a spring force of the arm portion, and the electric component is moved from the contact pin by being supported by the row of contact pins. A plurality of sliders respectively movable between a release position to be released and a contact pin, wherein the support frame is connected to the contact frame after a lead portion of the contact pin is fixed to a circuit of a circuit board by soldering. The support frame is detachably engaged with the support frame so as to be detachable from the pin.

According to a second aspect of the present invention, in the electrical component socket according to the first aspect, a plurality of ribs are provided in a row on the inside and outside of the support frame, respectively. The support frame is detachably engaged between adjacent ribs on the inside and outside of the support frame.

According to a third aspect of the present invention, in the electrical component socket according to the first aspect, an upper lid that covers an upper surface of the electrical component is detachably mounted on the support frame.

According to a fourth aspect of the present invention, there is provided an electrical component socket according to any one of the first to third aspects,
An upper surface of the support frame has the same height as the contact pins or a lower height than the contact pins with respect to the circuit board.

According to a fifth aspect of the present invention, in the electrical component socket according to the first aspect, an upper lid that covers an upper surface of the electrical component is provided integrally with the support frame.

According to a sixth aspect of the present invention, in the electrical component socket according to the first aspect, the row of contact pins is arranged in a rectangular shape, and the row of contact pins is held by the row of contact pins. The slider is characterized in that the end portions are in contact with each other at the pressing position.

According to a seventh aspect of the present invention, in the electrical component socket according to the third or fifth aspect, the upper lid has a rib for regulating an interval between the arm portions of the row of contact pins, An opening for visually confirming the contact portion from above is formed.

According to an eighth aspect of the present invention, in the first aspect of the present invention, each of the sliders is provided with a partition wall for regulating a distance between adjacent contact pins.

According to a ninth aspect of the present invention, in accordance with the eighth aspect, each of the sliders is formed of a material having poor wettability to solder, and at least a part of the partition walls of each of the sliders is a slider partition wall. The sliding pin is formed so as to cover a section located above the soldering section in the sliding area of the contact pin that slides.

According to a tenth aspect of the present invention, in the electrical component socket according to the ninth aspect, a section of the sliding area of the contact pin that slides with the partition wall of the slider is located above a soldering section. Are coated with a substance having poor wettability to solder.

According to an eleventh aspect of the present invention, in the electrical component socket according to the first aspect, the pitch and width of at least a part of the lead portions of the contact pins in the row are larger than the pitch and width of the contact portion. It is characterized by the following.

According to a twelfth aspect of the present invention, there is provided the first aspect of the present invention.
2. The electrical component socket according to claim 1, wherein the contact pins in each row are formed by simultaneous punching and bending of one conductive plate.

[0018]

In the electrical component socket according to the first aspect, after the electrical component is mounted on the contact portion of the contact pin, the slider is moved from each release position to the pressing position, so that a plurality of the electrical components are provided. The edges can be individually pressed against the contact portions of the contact pins by a plurality of sliders. Therefore, it is not necessary for one slider to secure a pressing force enough to bring all the terminals of the electric component and the contact portions of all the contact pins into contact with a required contact pressure. It suffices to secure enough pressing force to bring the contact portions of the contact pins in a row into contact with a required contact pressure. Therefore, since the force required for the operation of moving each slider can be reduced, the work of mounting and removing the electric components is facilitated. Further, since the edge of the electric component is pressed by the slider against the contact portions of the contact pins in the row, even if the spring force of the arm portion of the contact pin varies, the contact portion of the contact pins in the row and the row In this case, the contact pressure with the terminal can be made uniform, and the reliability of conduction can be improved.

Furthermore, the contact pins are detachably engaged with the support frame so that the support frame can be detached from the contact pins after the lead portions of the contact pins are fixed to the circuit on the circuit board by soldering. Therefore, the mounting height of the contact pins themselves on the circuit board is reduced, and the mounting height of the electrical components mounted on the contact pins on the circuit board can be reduced. Furthermore, by attaching the lead portions of the contact pins to the circuit on the circuit board by soldering and then detaching the support frame from the contact pins as necessary, it is possible to realize a light-weight electrical component mounting structure. Moreover, since the contact pins in the row are soldered to the circuit board while being supported by the support frame, it is possible to prevent the workability of soldering and the positional accuracy of each contact pin from being lowered with respect to the circuit board.

In the electrical component socket according to the present invention, the row of contact pins is removably engaged between adjacent ribs on the inner side and the outer side of the support frame. The pins can be kept at predetermined intervals by the inner and outer ribs of the support frame, and can be positioned and fixed in a direction crossing the support frame. Therefore, the contact pins in a row can be soldered on the circuit board with high positional accuracy.

According to the third aspect of the present invention, since the upper cover for covering the upper surface of the electric component is detachably mounted on the support frame, the upper surface of the upper cover has a wide suction surface for the suction-type socket feeder. Can be secured.
Therefore, the automatic supply of the socket onto the circuit board by the socket feeder can be performed simply and quickly. In addition, since the upper lid can be removed from the support frame after the contact pins are soldered on the circuit board, it is possible to mount the electric components on the contact pins without any trouble. Further, since the support frame can be left on the circuit board, the positioning of the electric component and the contact pin by the component feeder can be easily and quickly performed using the support frame.

In the electrical component socket according to the fourth aspect, since the upper surface of the support frame has the same height as the contact pins or a lower height than the contact pins with respect to the circuit board, the support frame is placed on the contact pins. Even if it remains, the final form of the electrical component socket on the circuit board can be made thin.

In the electric component socket according to the fifth aspect, since the upper cover for covering the upper surface of the electric component is provided integrally with the support frame, a wide suction surface for the suction type socket feeder is provided on the upper surface of the upper cover. Can be secured. Therefore, the automatic supply of the socket onto the circuit board by the socket feeder can be performed simply and quickly. In addition, since the upper lid and the support frame can be removed from the contact pins after the contact pins are soldered on the circuit board, the mounting of the electric components on the contact pins can be performed without any trouble. The final form of the electrical component socket can be made thin and lightweight.

In the electrical component socket according to the sixth aspect, the four sliders held by the row of contact pins are formed such that the ends contact each other at the pressing position, so that each slider is released. Excessive movement from the position beyond the pressing position can be prevented.

In the electrical component socket according to the present invention, the contact pins are soldered onto the circuit board in a state where the rows of the contact pins are more reliably positioned by the ribs of the support frame and the ribs of the upper lid. be able to. Also, since the upper lid is formed with an opening for visually recognizing the contact portion of the contact pin from above, when the socket for electric components is mounted on the circuit board by the automatic socket feeder, it is formed on the upper lid. The position of the contact pins and the circuit board can be easily and quickly adjusted while confirming the positions of the contact pins and the circuit board with a CCD camera or the like through the opening.

In the electrical component socket according to the present invention, the distance between the contact pins in each row after being welded to the circuit board can be regulated by the partition wall of the slider. It is possible to prevent the displacement between the pin and the terminal of the electric component.

In the electrical component socket according to the ninth aspect, at least a part of the partition wall of each slider is located above the soldering section in the sliding area of the contact pin that slides on the slider partition wall. Since it is formed so as to cover, it is possible to prevent the molten solder from adhering to the sliding area of the contact pin when the contact pin is soldered on the circuit board.

In the electrical component socket according to the tenth aspect, the section of the sliding area of the contact pin that slides with the slider partition wall, which is located above the soldering section, is made of a material having poor wettability to solder. That is, since the contact pins are covered with a substance to which solder is unlikely to adhere, it is possible to prevent the molten solder from adhering to the sliding area of the contact pins when the contact pins are soldered on the circuit board.

In the electrical component socket according to the eleventh aspect, the pitch and width of at least a part of the lead portions of the contact pins in the row are larger than the pitch and width of the contact portion, respectively. The contact conduction with the terminals of the finely-pitched electric component can be achieved without impairing the fixing strength between the pin and the circuit board.

In the electric component socket according to the twelfth aspect, the contact pins in each row are formed by simultaneous punching and bending of one conductive plate. An electrical component socket whose width can be easily changed partially can be provided. In addition, since the contact pins of each row formed by simultaneous bending of one conductive plate are simultaneously held on the support frame, the contact pins of each row can be completely separated from each other, so that the socket for electrical components is used. Is extremely easy to manufacture.

[0031]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIGS. 1 to 5 show a first embodiment of an electrical component socket according to the present invention. FIG. 1 shows a chip-on-board module mounted on a circuit board using the electrical component socket. FIG. 2 is a sectional view of a main part showing a state, and FIG.
FIG. 2 is a schematic plan view of the socket shown in FIG. FIG.
FIG. 4 is a sectional view of a main part showing a state where the module is released from the socket, and FIG. 4 is a schematic plan view of the socket shown in FIG. FIG. 5 is an enlarged sectional view taken along line XX in FIG.

Referring to these drawings, a chip-on-board module 1 includes a substrate 2 and an IC mounted on the substrate 2.
And a circuit component 3 such as a chip. On the bottom surface of the substrate 2, a plurality of pads 4 forming terminals are arranged in rows at narrow intervals along four edges of the bottom surface. The electrical component socket 10, generally designated 10, is designed to electrically connect the module 1 to the circuit board 5.

The socket 10 has a support frame 11 made of an insulating material such as plastic. Support frame 1
Reference numeral 1 denotes a substantially rectangular shape surrounding the periphery of the substrate 2 of the module 1, and a plurality of contact pins 12 made of metal are supported on the support frame 11 in four rows in a rectangular shape. Each contact pin 12 is a module 1
A contact portion 12a which contacts the conductive pad 6 of the circuit board 5, a lead portion 12b connected to the conductive pattern 6 of the circuit board 5, and an arm portion 12c having resiliency. The four edges of the bottom surface of the substrate 2 of the module 1 can be respectively supported by the contact portions 12a. The lead portion 12b of each contact pin 12 extends along the mounting surface of the circuit board 5, and as shown in FIGS. 1 and 5, the conductor pattern 6 formed on the mounting surface in two sections S1 and S2. The upper part is soldered by reflow. The arm portion 12c of each contact pin 12 is located inside the support frame 11, and has a curved portion that rises upward while curving inward from the intermediate portion of the lead portion 12b into the support frame 11, and an upper end of the curved portion. And a linear portion extending substantially linearly inward from the support frame 11. As can be seen from FIGS. 1 and 2, the module 1 is formed by the tips of the linear portions of the arm portions 12c of the contact pins 12 in four rows.
The space for accommodating is defined. Contact pin 12
Has a protruding portion 12d protruding upward from the lead portion 12b outside the support frame 11. A plurality of ribs 11a and 11b extending in the vertical direction are provided in rows on the inside and outside of the support frame 11, respectively. The curved portion of the arm portion 12c of the row of contact pins 12 and the protruding portion 12d are provided. Each of the ribs 11a and 11b is removably engaged between adjacent ribs 11a and 11b inside and outside the support frame 11, respectively. As can be easily understood from FIG. 1, the support frame 11 can be pulled out from the contact pins 12 soldered to the circuit board 12.

As shown in FIGS. 2 and 4, four corners of the support frame 11 are formed with engagement holes 11c opened on the upper surface thereof. After the contact pins 12 are soldered on the circuit board 5, the module 1 is mounted on the contact portions 12a of the contact pins 12. When the module 1 is mounted by an automatic supply machine, the positioning provided on the automatic supply machine is performed. The module 1 and the contact pins 12 are engaged by engaging the pins with the engagement holes 11 c of the support frame 11.
Can be easily positioned.

The socket 10 further includes four sliders 13 for individually pressing the edges of the upper surface of the substrate 2 of the module 1 against the contact portions 12a of the contact pins 12. The slider 13 includes the lead portions 12 b of the contact pins 12 arranged in a row inside the support frame 11 and the arm portion 1.
2c, and both ends of the slider 13 protrude from both ends of the row of the contact pins 12. The slider 13 has a pressing portion 13a that presses the edge of the substrate 2 of the module 1. More specifically, the pressing portion 13a of the slider 13 includes an upper surface pressing portion for pressing the upper surface of the substrate 2 of the module 1 and an end surface pressing portion for pressing the end surface of the substrate 2 of the module 1. The slider 13 shown in FIG. 1 is at a pressing position where the edge of the module 1 is pressed against the contact portion 12a of the contact pin 12 by the spring force of the arm portion 12c of the contact pin 12, and the slider 13 shown in FIG. It is in a release position where it is released from the contact pin 12. The slider 13 can be moved between the pressing position shown in FIG. 1 and the releasing position shown in FIG. 3 along the upper surface of the lead portion 12b of the contact pin 12 by jigs (not shown) engaged at both ends thereof. it can. When the slider 13 moves from the release position to the pressing position, the arm portion 12c is bent upward by the slider 13 to generate a pressing force. While the slider 13 moves from the release position to the pressing position, the spring force of the arm portion 12c gradually increases due to the upper surface shape of the lead portion 12b, reaches a peak immediately before the slider 13 reaches the pressing position, and thereafter, the slider 13 is pressed. Until the position is reached, the spring force drops slightly below its peak value.

The slider 13 has a plurality of lower partition walls 1 engaged between the lead portions 12b of the contact pins 12 in a row.
3b and an upper partition 13c that is engaged between the arm portions 12c of the contact pins 12 are provided. These partition walls 13b and 13c always keep the row of contact pins 12 at a predetermined interval. Each slider 13 is preferably formed of a material having poor wettability to solder, for example, polyetherimide, polyphenylene sulfide, polyether sulfone, or the like. As can be seen from FIG.
The lower partition 13b extends so as to entirely cover a portion of the sliding section between the lower partition 13b and the contact pin 12 located above the soldering section S1. Therefore, when soldering the contact pins 12 on the circuit board 5, it is possible to prevent the molten solder from adhering to the sliding section between the lower partition 13b and the contact pins 12.

In the socket 10 having the above structure, the module 1 is mounted on the contact portions 12a of the contact pins 12 in each row, and then the sliders 13 are moved from the respective released positions to the pressed positions, whereby the module 1 is mounted.
The four edges of the substrate 2 can be individually pressed against the contact portions 12 a of the contact pins 12 by the four sliders 13. Therefore, it is not necessary for the single slider 13 to secure a pressing force enough to bring all the pads 4 of the module 1 into contact with the contact portions 12a of all the contact pins 12 with a required contact pressure. It suffices to secure a pressing force enough to bring the contact portions 12a of the row of contact pins 12 into contact with a required contact pressure. Therefore,
Since the force required for the operation of moving each slider 13 can be reduced, the work of mounting and removing the module is facilitated. Also, the contact portions 1 of the contact pins 12 in a row
Since the slider 4 presses the edge of the substrate 2 of the module 1 against the slider 2a, for example, the arm 1 of the contact pin 12 is pressed.
Even if the spring force 2c varies, the contact pressure between the contact portions 12a of the contact pins 12 in the row and the pads 4 in the row can be made uniform, and the reliability of conduction can be improved. Furthermore, since the opposing edges of the substrate 2 of the module 1 can be sequentially pressed by the two opposing sliders 13, the substrate 2 is pressed while the upper surface of the substrate 2 of the module 1 is pressed by the slider 13. The slider 13 can be finely moved in the moving direction. Therefore, the contact portion 12a between the pad 4 of the module 1 and the contact pin 12
And a wiping action can be generated between them, and the reliability of the electrical connection can be increased. Further, in the case of the present embodiment, the slider 13 moves from the release position to the pressing position while pushing and expanding between the rib 12b of the contact pin 12 and the arm portion 12c. Is moved upward to generate an increased spring force. Therefore, the contact pin 12 and the slider 13 are moved so that the amount of movement of the slider 13 from the release position to the pressing position is increased.
, The slider 13 can be moved from the release position to the pressing position with a light force while moving the arm portion 12c upward, and the slider 13
Operability is improved.

Further, the support frame 11 is formed such that the lead portions 12b of the contact pins 12 are soldered.
Since the contact pins 12 are engaged with the contact pins 12 on the side opposite to the portion to be soldered to the circuit board 5 so that the contact pins 12 can be detached from the contact pins 12 after being fixed thereon, The mounting height of the contact pin 2 itself is reduced, and the mounting height of the module 1 mounted on the contact pin 12 with respect to the circuit board 5 can be reduced.

Further, the contact pins 12 are connected to the circuit board 5.
After being soldered on the support frame 11, the support frame 11 may be left on the contact pins 12, but it is necessary because the support frame 11 and the contact pins 12 are detachably engaged by the elastic force of both. It is also possible to pull out the support frame 11 from the contact pin 12 according to the above. Accordingly, after the contact pins 12 are soldered on the circuit board 5, the weight of the socket 10 can be further reduced by removing the support frame 11 from the contact pins 12. Preferably, the thickness of the support frame 11 is, as shown in FIG.
Is set to be substantially the same as the height of the contact pin 12 or lower than the height of the contact pin 12. This can prevent the mounting height of the socket 10 from increasing even if the support frame 11 is left on the contact pins 12.

Furthermore, since the contact pins 12 in a row are soldered to the circuit board 5 while being supported by the support frame 11, workability of soldering and positional accuracy of each contact pin 12 with respect to the circuit board 5 are reduced. Can be prevented.

Further, since the row of contact pins 12 is engaged between the ribs 11a and 11b adjacent to each other on the inside and outside of the support frame 11, respectively,
The rows of contact pins 12 can be maintained at predetermined intervals by the ribs 11a and 11b inside and outside the support frame 11, and can be positioned and fixed in a direction crossing the support frame 11. Therefore, the contact pins 12 in a row can be soldered on the circuit board 5 with high positional accuracy.

FIG. 6 shows a second embodiment of the socket for electric parts according to the present invention. In the second embodiment, the section of the sliding area of the contact pin 12 sliding on the lower partition 13b of the slider 13 located above the soldering section S1 is made of a material having poor wettability with respect to the solder, that is, the solder. Is coated with a substance 14 that is difficult to adhere to. Other configurations are the same as those in the first embodiment. Therefore, it is possible to prevent the solder from adhering to the sliding area of the contact pin 12 with respect to the lower partition 13b of the slider 13.

FIGS. 7 and 8 show a third embodiment of the electrical component socket according to the present invention. FIG. 7 is a longitudinal sectional view of a main part showing a stage where soldering of the contact pins to the circuit board is completed. FIG. 8A is a plan view showing a state in which the bottom surface of the upper lid used for the socket faces upward, and FIG. 8B is a side view of the upper lid shown in FIG.

In the third embodiment, an upper cover 15 for covering the upper surface of the module 1 is detachably mounted on the support frame 11. Like the support frame 11 of the first embodiment, engagement holes (not shown) are formed at four corners of the support frame 11 of the third embodiment. Is provided with an engaging pin 15a which removably fits into an engaging hole of the support frame 11. Further, the upper lid 15 has ribs 15b for regulating the interval between the arm portions 12c of the contact pins 12 in a row.
And an opening 15c for visually recognizing the contact portion 12a of the contact pin 12 from above. Other configurations are the same as in the first embodiment.

In the socket 10 of the third embodiment, since the upper cover 15 for covering the upper part of the module mounting area of the contact pins 12 is detachably mounted on the support frame 11, the suction type socket feeder is mounted on the upper surface of the upper cover 15. A wide suction surface can be secured. Therefore, the automatic supply of the socket 10 onto the circuit board 5 by the socket feeder can be performed simply and quickly. In addition, after the contact pins 12 are soldered on the circuit board 5,
5 can be removed from the support frame 11,
Module 1 on contact portion 12a of contact pin 12
Can be mounted without any trouble. Also, since the support frame 11 can be left on the circuit board 5,
Using the support frame 11, the positioning of the module 1 and the contact pins 12 by the component feeder can be easily and quickly performed.

Further, the contact pins 12 in a row are soldered onto the circuit board 5 in a state where the positions of the contact pins 12 are more reliably regulated by the ribs 11a and 11b of the support frame 11 and the rib 15b of the upper lid 15. Can be.
The upper lid 15 has a contact portion 12 a of the contact pin 12.
15c is formed so that the socket 10 can be visually recognized from above. Therefore, when the socket 10 is mounted on the circuit board 5 by an automatic feeder, the contact pins 12 are provided by a CCD camera or the like through the opening 15c of the upper lid 15. The contact pins 12 and the circuit board 5 can be easily and quickly aligned while confirming the position of the circuit board 5.

FIG. 9 shows a fourth embodiment of the electrical component socket according to the present invention. The socket of the fourth embodiment differs from the third embodiment in that an upper cover 15 for covering the upper surface of the module 1 is provided integrally with the support frame 11. In the fourth embodiment, after the contact pins 12 are soldered on the circuit board 5, the support frame 11 is removed from the contact pins 12 together with the upper lid 15.

FIG. 10 shows a fifth embodiment of the present invention in which the sliders 13 held by the contact pins 12 in each row are modified. The support frame is not shown in FIG. 4 in the fifth embodiment.
The two sliders 13 are formed such that the ends contact each other at the pressing position. Therefore, each slider 1
3 can be prevented from moving excessively from the release position beyond the pressing position. The other structure is the same as that of the first embodiment, except that the support frame of the fifth embodiment is formed so as to surround the four sliders 13. The support frame in the fifth embodiment is similar to the first embodiment, after the contact pins 12 are soldered on the circuit board 5 or the contact portions 12a of the contact pins 12 are
After mounting and fixing module 1 on top, contact pin 1
2 can be removed from the contact pin 1
2, it is also possible to leave.

FIGS. 11 to 14 show a sixth embodiment of the electrical component socket according to the present invention suitable for removing the support frame from the contact pins after soldering the contact pins.
It shows an example. FIG. 11 shows a state where the module 1 is mounted on the circuit board 5 via the socket 10 fixed on the circuit board 5, and FIG.
2 is fixed to the circuit board 5 by soldering. FIG. 13 shows the arrangement of the contact pins 12 and the slider 13 when the slider 13 is at the pressing position. FIG. 14 shows the arrangement of the contact pins 12 and the slider 13 when the slider 13 is at the release position. Is shown. FIG. 15 shows a metal plate 16 for manufacturing the contact pins 12 in each row. The contact pins 12 connected to each other at both ends are formed by punching the metal plate 16.

In the sixth embodiment, the contact pins 12 in each row are connected to the inner soldering section S in the same manner as in the first embodiment.
1 and the outer soldering section S2 are soldered on the circuit board 5, respectively, but the pitch and width of the outer soldering section S2 of the lead portion 12b are larger than the pitch and width of the contact portion 12a. Further, as can be seen from FIGS. 11 and 12, the contact pins 12 in each row
It is formed by simultaneous punching and simultaneous bending of one metal plate 16 shown in FIG. Therefore, the arm portion 12c of the contact pin 12 extends continuously from the contact portion 12a. A bent portion 12e projecting upward is formed in the vicinity of the outer soldering section S2 of the lead portion 12b, and a bent portion of the contact pins 12 forming a row is formed on the inner surface of the support frame 11 integrated with the upper lid 15. A rib 11c is formed to engage with the upper side 12e so as to be vertically disengageable. In addition, a wall 15 d sandwiching the bent portion 12 e of the contact pin 12 is formed on the upper lid 15 in cooperation with the support frame 11. Like the slider of the fifth embodiment, the sliders 13 held by the contact pins 12 in each row are formed so as to contact each other at both ends at the pressing position shown in FIG. Since the upper lid 15 of the sixth embodiment is formed integrally with the support frame 11, it is necessary to remove the support frame 11 from the contact pins 12 after the contact pins 12 are soldered on the circuit board 5. The upper lid 15 is attached to the support frame 1 so that the support frame 11 can be left on the contact pins 12.
1 and may be detachably mounted on the support frame 11 or the upper lid may be omitted.

In the socket 10 of the sixth embodiment, the pitch and width of the portion of the outer soldering section S2 of the lead portions 12b of the contact pins 12 in rows are larger than the pitch and width of the contact portion 12a, respectively. The contact conduction between the fine pitched module pads 4 becomes possible without impairing the fixing strength between the contact pins 12 in each row and the circuit board 5.

Further, since the contact pins 12 in each row are formed by simultaneous punching and bending of one metal plate 16, it is easy to obtain the contact pins 12 having partially different pitches and pin widths. Can be. Moreover,
After simultaneously holding the contact pins 12 of each row formed by simultaneous bending of one metal plate 16 on the support frame 11, the contact pins 12 of each row can be completely cut off from each other. Manufacturing becomes extremely easy.

Although the illustrated embodiment has been described above, the present invention is not limited to only the above embodiment.
Various changes can be made in the shape, number, etc. of the components within the scope of the invention described in the claims. Further, the socket of the present invention can be used for electrical connection between a circuit board and other electric components such as a leadless IC package and a leaded IC package.

[0055]

As is apparent from the above description, the electrical component socket according to the present invention allows the electrical component to be easily and detachably mounted without applying excessive stress to the electrical component and the circuit board. As a result, a reliable electric connection can be ensured, and furthermore, the weight and thickness can be reduced when mounted on a circuit board.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part showing a state where a chip-on-board module is mounted on a circuit board using an electrical component socket according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of the socket shown in FIG.

FIG. 3 is a sectional view of a main part showing a state where the module is released from the socket shown in FIG. 1;

FIG. 4 is a schematic plan view of the socket shown in FIG.

FIG. 5 is an enlarged sectional view of a main part of the socket taken along line XX in FIG. 3;

FIG. 6 is a sectional view of a main part of an electrical component socket according to a second embodiment of the present invention.

FIG. 7 is a sectional view of a main part of an electrical component socket showing a third embodiment of the present invention.

8A is a plan view showing a state in which the bottom surface of the upper lid of the socket shown in FIG. 7 is directed upward, and FIG. 8B is a side view of the upper lid.

FIG. 9 is a sectional view of a main part of an electrical component socket showing a fourth embodiment of the present invention.

FIG. 10 is a schematic plan view showing the relationship between a contact pin and a slider in each row of an electrical component socket according to a fifth embodiment of the present invention.

FIG. 11 is a cross-sectional view of a main part showing a state where a module is mounted on a circuit board with an electrical component socket according to a sixth embodiment of the present invention.

FIG. 12 is a cross-sectional view of a main part showing a stage in which contact pins of a socket according to a sixth embodiment are soldered on a circuit board.

FIG. 13 is a plan view showing the relationship between the contact pins in each row and the slider when the slider of the sixth embodiment is at the pressing position.

FIG. 14 is a plan view showing the relationship between the contact pins in each row and the slider when the slider of the sixth embodiment is at the release position.

FIG. 15 is a plan view showing a metal plate for manufacturing a row of contact pins according to a sixth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip-on-board module 2 Module board 4 Pad (terminal) 5 Circuit board 10 Socket for electrical components 11 Support frame 12 Contact pin 13 Slider 14 Non-adhesive substance 15 Top lid 16 Metal plate

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-5766 (JP, A) JP-A-4-256877 (JP, A) JP-A-3-171577 (JP, A) JP-A-2- 27677 (JP, A) JP-A-63-305537 (JP, A) JP-A-3-80987 (JP, U) JP-A-2-148581 (JP, U) JP-A-60-27445 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01R 33/76 H01L 23/32

Claims (12)

(57) [Claims] An electrical component socket used for electrically connecting an electrical component having a plurality of terminals arranged in rows along a plurality of edges to a circuit on a circuit board. A supporting frame surrounding the periphery of the electric component, a contact portion that contacts the terminal of the electric component, a lead portion connected to a circuit of the circuit board, and an arm portion having a spring property; A plurality of contact pins arranged in a row on the support frame corresponding to the rows, respectively; and a plurality of contact pins supported by the row of the contact pins inside the support frame, and an edge of the electric component to the arm section. A plurality of sliders each movable between a pressing position for pressing the contact portion of the contact pin against the contact portion by a spring force and a release position for releasing the electric component from the contact pin. The contact pin is detachably engaged with the support frame so that the support frame can be detached from the contact pin after a lead portion of the contact pin is fixed to a circuit of a circuit board by soldering. A socket for electrical components, characterized in that: 2. A plurality of ribs are provided in a row on the inside and outside of the support frame, respectively, and the contact pins in the row are engaged and disengaged between ribs adjacent on the inside and outside of the support frame, respectively. 2. The electrical component socket according to claim 1, wherein the electrical component socket is engaged. 3. The electrical component socket according to claim 1, wherein an upper lid for covering an upper surface of the electrical component is detachably attached to the support frame. 4. The circuit board according to claim 1, wherein an upper surface of the support frame has the same height as the contact pins or a lower height than the contact pins with respect to the circuit board. The electrical component socket according to any one of the above. 5. The electrical component socket according to claim 1, wherein an upper lid that covers an upper surface of the electrical component is provided integrally with the support frame. 6. The row of contact pins are arranged in a rectangular shape, and the sliders held by the row of contact pins are formed such that ends thereof come into contact at a pressing position. 2. The method according to claim 1, wherein
An electrical component socket as described. 7. The upper lid is provided with a rib for regulating the interval between the arm portions of the contact pins in the row, and an opening for visually recognizing the contact portion of the contact pin from above. The electrical component socket according to claim 3 or 5, wherein: 8. The electrical component socket according to claim 1, wherein a partition wall for regulating a distance between adjacent contact pins is formed on each of the sliders. 9. Each of the sliders is formed of a material having poor wettability with respect to solder, and at least a part of the partition wall of each slider is formed of a sliding area of the contact pin sliding with the slider partition wall. 9. The electrical component socket according to claim 8, wherein the socket is formed so as to cover a section located above the soldering section. 10. A method according to claim 1, wherein a portion of the sliding area of the contact pin sliding with the partition wall of the slider, which is located above the soldering section, is covered with a material having poor wettability to solder. The electrical component socket according to claim 9, wherein: 11. The electrical component socket according to claim 1, wherein the pitch and the width of at least a part of the lead portions of the contact pins in the row are respectively larger than the pitch and the width of the contact portion. 12. The electrical component socket according to claim 1, wherein the contact pins of each row are formed by simultaneous punching and bending of a single conductive plate.