JP3256873B2 - Light irradiation processing apparatus and method - Google Patents
Light irradiation processing apparatus and methodInfo
- Publication number
- JP3256873B2 JP3256873B2 JP04893597A JP4893597A JP3256873B2 JP 3256873 B2 JP3256873 B2 JP 3256873B2 JP 04893597 A JP04893597 A JP 04893597A JP 4893597 A JP4893597 A JP 4893597A JP 3256873 B2 JP3256873 B2 JP 3256873B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- work
- light distribution
- light irradiation
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 30
- 238000000034 method Methods 0.000 title description 16
- 238000009826 distribution Methods 0.000 claims description 107
- 230000007246 mechanism Effects 0.000 claims description 61
- 230000007723 transport mechanism Effects 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 13
- 238000012546 transfer Methods 0.000 claims description 12
- 238000006116 polymerization reaction Methods 0.000 claims description 9
- 238000012986 modification Methods 0.000 claims description 6
- 230000004048 modification Effects 0.000 claims description 6
- 230000001186 cumulative effect Effects 0.000 claims description 3
- 230000001568 sexual effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 18
- 238000009413 insulation Methods 0.000 description 11
- 238000001723 curing Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000002407 reforming Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000008234 soft water Substances 0.000 description 3
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001595 flow curve Methods 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Control Of Exposure In Printing And Copying (AREA)
Description
【0001】[0001]
【発明の属する技術分野】この発明は、プリント配線基
板のピッチ間の短縮など、各部位の縮小方向に伴うプリ
ント配線基板を適切に処理できる光照射処理装置および
その方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light irradiation processing apparatus and method capable of appropriately processing a printed wiring board in a direction in which each part is reduced, such as a reduction in pitch between printed wiring boards.
【0002】[0002]
【従来の技術】一般に、プリント配線基板(PWB)を
内蔵する通信機器や情報機器などは、薄型、軽量で低消
費電力かつ低電圧駆動の方向にあるため、半導体などの
微小化が進み、部品の実装工程などの影響を受けて、プ
リント配線基板においてもマイクロチップモジュール
(MCM)や、CSP(Chip size/Scal
ePackage)対応が注目されている。プリント配
線基板の形成方法において現在主流とされるものはサブ
トラクティブ法である。2. Description of the Related Art In general, communication devices and information devices incorporating a printed wiring board (PWB) are thin, lightweight, have low power consumption and are driven at a low voltage. Under the influence of the mounting process of the microchip module (MCM) and the CSP (Chip size / Scal) in the printed wiring board.
ePackage) attention is attracting attention. The current mainstream method of forming a printed wiring board is the subtractive method.
【0003】このサブトラクティブ法は、100μmの
ラインアンドスペースピッチ間が、0.65mmまでを
標準化としているが、現実には、ピッチ間は、0.5m
mから0.3mmあるは0.1mmなどの微細化方向に
あり、また、ピッチ間の配線ラインも、75μmから5
0μmあるは20μmなどの微細化方向に向かうよう
に,ますます狭くなる傾向にある。さらに、ラウンドも
ラウンドレスの方向にあり、したがって、前記サブトラ
クティブ法では対応できず、前記微細化方向にあるプリ
ント配線基板の製造を、アディティブ法によるビルドア
ップ構造で製造する製造方法が台頭する一つの方向とし
て発表されている。In this subtractive method, the line-and-space pitch of 100 μm is standardized up to 0.65 mm, but in reality, the pitch is 0.5 m.
m to 0.3 mm or 0.1 mm in the miniaturization direction, and the wiring line between the pitches is 75 μm to 5 mm.
There is a tendency that the width becomes narrower toward a miniaturization direction such as 0 μm or 20 μm. Further, rounds are also in a roundless direction, and therefore cannot be handled by the subtractive method, and a manufacturing method of manufacturing a printed wiring board in the miniaturization direction by a build-up structure by an additive method is emerging. It has been announced as one direction.
【0004】前記プリント配線板(多層を含む)は、表
面または内部にパターン形成した回路が微細化して近接
することになるため、レジストを永久絶縁膜として構成
し、その隣合う回路の絶縁性はもとより積層する場合の
絶縁性や、密着性あるいは、耐破壊電圧、はんだ付け時
の耐熱性などに対応し、かつ、微細化傾向に対応してプ
リント配線板を製造する工程において種々の提案がなさ
れている。そして、使用される感光性部材は、光波長
や、温度などに依存し、光反応が行なわれ、その一例を
次に示す。なお、永久絶縁膜を構成する場合は、感光性
部材の感度は、鈍く、また、レジスト剥離して形成する
感光性部材は感度が鋭く構成されている。[0004] In the printed wiring board (including multilayer), a circuit patterned on the surface or in the inside thereof is miniaturized and comes close to each other. Therefore, a resist is constituted as a permanent insulating film. Originally, various proposals have been made in the process of manufacturing printed wiring boards in order to cope with insulation properties, adhesion properties, breakdown voltage, heat resistance during soldering, etc. when laminating, and to respond to the trend of miniaturization. ing. The photosensitive member used undergoes a photoreaction depending on the light wavelength, temperature, and the like, and an example thereof will be described below. When a permanent insulating film is formed, the sensitivity of the photosensitive member is low, and the sensitivity of the photosensitive member formed by peeling the resist is sharp.
【0005】図13(a)で示すように、その感光性部
材(ここではドライフィルム)重合反応などの光反応が
行われる場合に、特に温度に依存することが知られてい
る。ここでは、25度、50度、75度の値を測定し、
その結果、ほぼ温度の高さに比例して反応し、温度条件
により最終的な硬化率に影響し、硬化時間にあまり影響
しないことが示唆されている。ここで使用された感光性
部材は、ドライフィルムが使用され、そのドライフィル
ムの測定温度による硬化反応の違いを曲線で示してい
る。As shown in FIG. 13 (a), it is known that when a photoreaction such as a polymerization reaction of a photosensitive member (here, a dry film) is carried out, it depends particularly on temperature. Here, the values of 25 degrees, 50 degrees, and 75 degrees are measured,
As a result, it is suggested that the reaction occurs almost in proportion to the height of the temperature, and that the temperature condition affects the final curing rate and does not significantly affect the curing time. As the photosensitive member used here, a dry film is used, and the difference in curing reaction depending on the measured temperature of the dry film is shown by a curve.
【0006】また、図13(b)で示すように、このグ
ラフ図は、感光性部材に照射波長が365nm、照射強
度は5mW/cm2 とし、測定温度はそれぞれ25度、
45度および60度で光照射作業を行ったときの感光性
部材の硬化率α(ΔHj /ΔHtotal )を時間に対して
プロットしたものである。ここで使用された感光性部材
は、レジストフィルムが使用され、そのレジストフィル
ムに光照射した時の熱流曲線と、対応する硬化率曲線を
プロットしたものである。Further, as shown in FIG. 13B, this graph shows that the photosensitive member has an irradiation wavelength of 365 nm, an irradiation intensity of 5 mW / cm 2 , a measurement temperature of 25 ° C.,
7 is a plot of the curing rate α (ΔH j / ΔH total ) of the photosensitive member when light irradiation operation is performed at 45 degrees and 60 degrees with respect to time. As the photosensitive member used here, a resist film is used, and a heat flow curve when the resist film is irradiated with light and a corresponding curing rate curve are plotted.
【0007】さらに、図14で示すように、感光性部材
として写真製版で使用されるジアゾ(diazo)感光
液の吸収曲線により分かるように、ジアゾ感光液の光吸
収率は、ほぼ360nm(mμ)の値のとき、そのピー
ク値を示している。また、図では示していないが、アジ
ド系感光剤では390nmに吸収特性を持ち、重クロム
酸では360nmに吸収特性を持っている。Further, as shown in FIG. 14, as can be seen from the absorption curve of a diazo photosensitive solution used in photolithography as a photosensitive member, the light absorption rate of the diazo photosensitive solution is approximately 360 nm (mμ). Indicates the peak value. Although not shown in the figure, an azide-based photosensitive agent has an absorption characteristic at 390 nm, and dichromic acid has an absorption characteristic at 360 nm.
【0008】なお、前記した例で使用される感光性部材
は、光開始材や感光剤などの部材の成分の種類や、添加
量などにより目的に合わせた光硬化反応ができるように
構成されるため、ワークの種類によっては、紫外線によ
る光反応を示す波長が大きく異なる場合がある。特に、
微細化が進むプリント配線板では、大きなエネルギーを
与えて光反応を行っている。[0008] The photosensitive member used in the above-described example is configured so that a photocuring reaction can be performed according to the purpose depending on the type of the components of the member such as a photoinitiator and a photosensitive agent, and the amount added. Therefore, depending on the type of the work, the wavelength at which the photoreaction due to the ultraviolet light may be greatly different. In particular,
In printed wiring boards that are becoming finer, photoreaction is performed by giving a large amount of energy.
【0009】[0009]
【発明が解決しようとする課題】しかし、従来のプリン
ト配線基板の形成方法の過程では、次のような問題点が
存在していた。However, in the process of the conventional method of forming a printed wiring board, there were the following problems.
【0010】 プリント配線基板を形成する工程で光
照射装置によりワークに光照射作業を行うが、この光照
射作業は、所定波長の紫外線を照射して行われ、大容量
の光源ランプを使用することから、光源ランプから紫外
線以外の光も照射され、光照射時にワークを実質的に加
熱することになると共に、感光性部材が光反応を起こし
たときに発する重合熱によっても加熱されることにな
る。そして、光照射作業が終了してその光照射装置から
搬出されるとき、ワーク自体の温度が室温と大きくかけ
離れていると、ワークの表面に結露する可能性が高い。In the process of forming a printed wiring board, a work is performed by irradiating a work with a light irradiating device. The light irradiating work is performed by irradiating ultraviolet rays having a predetermined wavelength, and a large-capacity light source lamp is used. Therefore, light other than ultraviolet light is also irradiated from the light source lamp, so that the work is substantially heated at the time of light irradiation, and is also heated by polymerization heat generated when the photosensitive member causes a photoreaction. . Then, when the light irradiation operation is completed and the work is taken out of the light irradiation device, if the temperature of the work itself is far from room temperature, dew condensation on the surface of the work is highly likely.
【0011】さらに、ワークの表面に湿気が付着した状
態で積層作業が行われると、本来なら大きな絶縁抵抗の
値を必要とする部位の絶縁抵抗がいちじるしく低下する
ことになる。また、紫外線照射中にワーク自体の温度を
下げるため、空冷手段によりワークに冷却空気を吹き付
ける構成とすると、ワークに塵埃が付着する可能性が高
く、後工程で不具合が生じることになる。さらに、空冷
手段の稼働率が大きいと、作業しているクリーンルーム
内の環境に大きく影響するため、クリーンルームの調整
に支障をきたすことになった。Further, when the laminating operation is performed in a state where moisture adheres to the surface of the work, the insulation resistance of a portion which normally requires a large insulation resistance value is remarkably reduced. In addition, if a configuration is used in which cooling air is blown onto the work by air cooling means to lower the temperature of the work itself during the irradiation of ultraviolet rays, there is a high possibility that dust will adhere to the work, and a problem will occur in a later step. Further, if the operating rate of the air cooling means is large, the environment in the working clean room is greatly affected, which hinders adjustment of the clean room.
【0012】 光照射装置は、ワークに使用されてい
る紫外線硬化型インキの光開始材と、パターニング用写
真製版の光開始材の吸収特性位置が異なるため、その吸
収特性と合わせて感光性部材の重合熱などとの関係か
ら、ワークの搬送速度や、光源ランプの減灯調整あるい
は光源ランプとワークの照射距離を変えても対応するこ
とができず、その感光性部材の種類に対応した光照射装
置を必要としていた。In the light irradiation device, the photo-initiator of the ultraviolet curable ink used for the work and the photo-initiator of the photolithography for patterning have different absorption characteristic positions. Due to the relationship with the heat of polymerization, etc., it is not possible to respond even if the transfer speed of the work, the light reduction adjustment of the light source lamp, or the irradiation distance between the light source lamp and the work is changed, and light irradiation corresponding to the type of the photosensitive member is not possible. Needed equipment.
【0013】また、光照射装置は、ワークが現像液によ
りレジスト除去した後に、そのワークを乾燥する場合
や、ワークの表面のレジストを永久絶縁に改質する場合
など共用して使用される場合があるが、ワークの乾燥作
業と、表面の改質作業では、本来の目的が異なり、特に
微細化方向にあるワークでは光照射装置の共用には限界
があった。そして、ワーク表面の改質作業は、微細化方
向にあるプリント配線基板では使用される感光性部材な
どに対応してワークに照射される紫外線の照射量が大き
く異なる。そのため、光開始材の受ける光および熱エネ
ルギーにより光硬化作用をさらに促進させ、その感光性
部材の必要以上の収縮や変形など劣化して品質低下の方
向に向かわせる可能性が大きく、感光性部材の重合を促
進制御する感光性部材の改質作業を行うことができる構
成が望まれていた。Further, the light irradiation device is commonly used when the work is dried after the work is removed with a developing solution, or when the resist on the surface of the work is modified into permanent insulation. However, the original purpose is different between the work for drying the work and the work for modifying the surface, and there is a limit to the use of the light irradiation device especially for the work in the direction of miniaturization. In the work of modifying the surface of the work, the amount of ultraviolet light applied to the work is greatly different depending on the photosensitive member used in the printed wiring board in the direction of miniaturization. Therefore, the photocuring action is further promoted by the light and heat energy received by the photoinitiator, and there is a great possibility that the photosensitive member is degraded, such as being unnecessarily contracted or deformed, and is directed in a direction of quality deterioration. There has been a demand for a structure capable of performing an operation of modifying a photosensitive member for accelerating and controlling the polymerization.
【0014】 感光性部材の改質作業で紫外線照射さ
れるワークは、搬送機構により搬送経路を移動中に、形
成されているパターン全域に亘って所定量の紫外線照射
を均等にする必要があると共に、搬送機構により搬送さ
れるワークは前面にパターンが形成されているため、そ
の改質作業の前後に行われる作業に容易に接続できるよ
うに、ワークの搬入側および搬出側の構成が簡単で、か
つ、そのパターン部分に接触せずに確実に保持して搬送
する搬送機構が望まれていた。For a work to be irradiated with ultraviolet rays in the work of modifying the photosensitive member, a predetermined amount of ultraviolet rays needs to be evenly distributed over the entire area of the formed pattern while moving along the transport path by the transport mechanism. Since the work transported by the transport mechanism has a pattern formed on the front surface, the configuration of the work loading and unloading sides is simple so that it can be easily connected to work performed before and after the reforming work. In addition, a transport mechanism for securely holding and transporting the pattern portion without contacting the pattern portion has been desired.
【0015】この発明は、前述の問題点を解決すべく創
案されたもので、光照射によるワークと室温などの気温
差による結露を防止し、光照射中に行う冷却手段による
塵埃の付着を防止し、感光性部材の光反応状態が異なっ
ても対応でき、ワークの感光性部材の改質作業に優れ、
かつ、ワークの光照射作業の際のワークの搬送にも優れ
た光照射処理装置およびその方法を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and prevents dew condensation due to a temperature difference between a work and a room due to light irradiation, and prevents dust from adhering to the cooling means during light irradiation. However, even if the photoreaction state of the photosensitive member is different, it can cope with it.
Further, an object of the present invention is to provide a light irradiation processing apparatus and a method thereof which are excellent in transporting a work at the time of light irradiation work on the work.
【0016】[0016]
【課題を解決するための手段】前記の課題を解決するた
め、この発明に係る光照射処理装置は、ワークを搬送経
路に沿って搬送する搬送機構と、前記搬送機構により搬
送される前記ワークの全面に亘って光照射を行う光照射
機構と、前記光照射機構からの照射光の内、前記ワーク
の感光性部材の重合による改質を促進させる所定波長の
光を制御する配光機構とからなり、前記配光機構は、前
記ワークの処理内容に対応してあらかじめ所定波長の光
を反射あるいは吸収して選択的に設定できる配光部を有
する構成とした。In order to solve the above-mentioned problems, a light irradiation processing apparatus according to the present invention includes a transport mechanism for transporting a work along a transport path, and a light- transmitting mechanism for transporting the work by the transport mechanism . A light irradiation mechanism that performs light irradiation over the entire surface, and a light distribution mechanism that controls light of a predetermined wavelength that promotes modification of the work by photosensitive member polymerization among the irradiation light from the light irradiation mechanism. The light distribution mechanism is configured to emit light of a predetermined wavelength in advance in accordance with processing contents of the work.
Light distribution unit that can selectively set by reflecting or absorbing light
Configuration .
【0017】また、前記光照射処理装置において、前記
配光機構は、前記ワークと放電灯の間に所定波長の光が
少なくとも一回以上通過する透光部材に、所定波長の光
を反射あるいは吸収して選択的に設定できる配光部を設
け、前記ワークの感光性部材に対応して、前記配光部の
位置をあらかじめ調整して設定する構成とした。 Further, in the light irradiation processing device, the light distribution mechanism may include a light transmitting member through which light having a predetermined wavelength passes at least once between the workpiece and the discharge lamp.
A light distribution section that can be selectively set by reflecting or absorbing light is provided, and the position of the light distribution section is adjusted and set in advance in accordance with the photosensitive member of the work .
【0018】さらに、前記光照射処理装置において、前
記配光機構は、前記光照射機構の放電灯に光を透過する
透光部材を有し、前記透光部材は、少なくともその一部
に、所定波長の光を反射あるいは吸収する配光部を設
け、前記ワークの全面形に亘って照射される光の積算光
量が均等になるように、前記透光部材の配光部の位置を
移動調整して固定手段により固定することであらかじめ
調整する構成とした。Further, in the light irradiation processing device, the light distribution mechanism has a light transmitting member that transmits light to a discharge lamp of the light irradiation mechanism, and the light transmitting member has at least a part of a predetermined light transmitting member. A light distribution unit that reflects or absorbs light of a wavelength is provided, and the position of the light distribution unit of the light transmitting member is moved and adjusted so that the integrated light amount of light applied over the entire surface of the work becomes uniform. It is configured to be adjusted in advance by fixing with a fixing means.
【0019】そして、前記光照射処理装置において、前
記配光機構は、前記光照射機構の放電灯に沿って設けた
ジャケット管に透光部材を有し、前記透光部材は、少な
くとも前記ジャケット管の一部に、前記放電灯から照射
される所定波長の光を反射あるいは吸収する配光部材を
設け、前記ジャケット管は、その両端を固定手段により
着脱自在に固定し、ワークの全面に亘って照射される積
算光量が均等になるように、そのジャケット管に設けた
配光部材の位置を、あらかじめ調整する構成とした。In the light irradiation processing apparatus, the light distribution mechanism has a light transmitting member on a jacket tube provided along a discharge lamp of the light irradiation mechanism, and the light transmitting member is at least the jacket tube. Is provided with a light distribution member that reflects or absorbs light of a predetermined wavelength emitted from the discharge lamp, and the jacket tube has both ends detachably fixed by fixing means , over the entire surface of the work. as cumulative amount of light applied is equalized, the position of the light distribution member provided on the jacket tube, and configured to advance adjustment.
【0020】また、前記光照射処理装置において、前記
透光部材は、前記光照射機構の放電灯に沿って、回動機
構を介して設けた透光板であって、前記透光板の少なく
とも一部には、所定波長の光を吸収あるいは反射する前
記配光部を設け、前記ワークの全面に亘って照射される
積算光量が均等になるように、その透光板の回転角度を
あらかじめ調整する構成とした。In the light irradiation processing apparatus, the light transmitting member is a light transmitting plate provided via a rotating mechanism along a discharge lamp of the light irradiation mechanism, and at least one of the light transmitting plates is provided. Partly before absorbing or reflecting light of a given wavelength
The serial light distribution portion is provided such that it said entire cumulative amount of light applied over the workpiece is equalized, and configured to precondition the rotation angle of the transparent plate.
【0021】さらに、前記光照射処理装置において、前
記搬送機構は、ワークを直立させてその上端を搬送経路
に沿って支持する上端支持部と、前記ワークの下端を搬
送経路に沿って支持する下端支持部と、前記下端支持部
を所定速度で移動させる移動機構とからなり、前記下端
支持部は、前記ワークの所定位置を挟持する挟持体と、
この挟持体を当接する方向に付勢する弾性部材とを備
え、前記搬送経路の搬入側および搬出側に、前記挟持体
の一部が接触することで前記弾性部材の付勢力に抗して
前記挟持体を離間する方向に作動させる作動部を有する
構成とした。Further, in the light irradiation processing apparatus, the transport mechanism may include an upper end supporting portion for erecting the work and supporting an upper end thereof along a transport path, and a lower end for supporting a lower end of the work along the transport path. A support mechanism, comprising a moving mechanism for moving the lower end support at a predetermined speed, the lower end support is a holding body for holding a predetermined position of the work,
An elastic member that urges the holding body in a contacting direction, and the loading side and the unloading side of the conveyance path, where a part of the holding body comes into contact with the biasing force of the elastic member. It has the structure which has the operation part which operates a holding body in the direction which separates.
【0022】そして、光照射処理方法としては、パター
ニング処理されたワークの全面に亘っての照度分布をあ
らかじめ解析し、そのワークの感光性部材の重合による
改質処理作業で、前記照度分布と合わせて前記ワークの
全面に亘って積算光量が均等になるように、そのワーク
の照度分布をあらかじめ調整するための第1工程と、前
記ワークを搬入口で受け取り所定速度により搬送口まで
搬送する第2工程と、前記第2工程で搬送されるワーク
を前記第1工程で照度分布を調整した状態で光照射する
第3工程とから構成した。As the light irradiation treatment method, a pattern
Oh the illuminance distribution of over the entire surface of the hardening treatment has been work
The work is analyzed in advance , and the work of modifying the work by polymerization of the photosensitive member of the work is performed in accordance with the illuminance distribution .
Make sure that the work
A first step for pre-adjusting the illuminance distribution, before
The light irradiated in serial and a second step of <br/> conveyed to the transfer port by receiving a predetermined speed a work in entrance, and the workpiece being conveyed in the second step to adjust the illuminance distribution at the first step state It consisted of three steps.
【0023】[0023]
【発明の実施の形態】以下、この発明の実施の一形態を
図面に基づいて説明する。図1は光照射装置の側面図、
図2は光照射装置の平面図、図3は光照射装置の搬送機
構の要部を示す側面図、図4は光照射装置の光源部の要
部を示す断面図、図5は光源部の配光機構の使用状態を
示す原理図、図6はワークの搬送機構の要部を示す正面
図、図7はワークの搬送機構の要部を示す平面図、図8
は感光性部材の光開始剤のピーク特性を示すグラフ図、
図9はワークの照度分布を示すグラフ図、図10は改質
作業後のワークの絶縁抵抗値を示すグラフ図、図11、
図12は他の配光機構の使用状態を示す原理図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of the light irradiation device,
2 is a plan view of the light irradiation device, FIG. 3 is a side view showing a main part of a transport mechanism of the light irradiation device, FIG. 4 is a cross-sectional view showing a main part of a light source unit of the light irradiation device, and FIG. FIG. 6 is a principle view showing a use state of the light distribution mechanism, FIG. 6 is a front view showing a main part of the work transfer mechanism, FIG. 7 is a plan view showing a main part of the work transfer mechanism, and FIG.
Is a graph showing the peak characteristics of the photoinitiator of the photosensitive member,
FIG. 9 is a graph showing the illuminance distribution of the work, FIG. 10 is a graph showing the insulation resistance value of the work after the reforming operation, FIG.
FIG. 12 is a principle diagram showing a use state of another light distribution mechanism.
【0024】図1ないし図4で示すように、ワークWの
光照射装置1は、その一端に形成した搬入口1a側から
他端に形成した搬出口1bまでワークWを搬送する搬送
機構2と、前記搬送機構2の搬送経路に沿って所定間隔
で設けた光照射機構3と、前記光照射機構3から照射さ
れる所定波長の光線をワークの感光性部材に応じて配光
する配光機構4と、前記光照射機構3側が一定以上温度
上昇しないように冷却する冷却機構5とから構成されて
いる。As shown in FIGS. 1 to 4, the light irradiating device 1 for the work W includes a transfer mechanism 2 for transferring the work W from a carry-in port 1a formed at one end thereof to a carry-out port 1b formed at the other end. A light irradiating mechanism 3 provided at a predetermined interval along a transport path of the transport mechanism 2, and a light distribution mechanism for distributing a light beam of a predetermined wavelength emitted from the light irradiating mechanism 3 according to a photosensitive member of a work. 4 and a cooling mechanism 5 that cools the light irradiation mechanism 3 so that the temperature does not rise more than a certain level.
【0025】図1および図4で示すように、前記光照射
機構3は、所定波長の光線を照射する光源部3Aと、こ
の光源部3Aからの照射光線を反射する反射鏡3Bと、
前記光源部3Aの電源部などから構成されている。そし
て、前記光源部3Aは、放電灯3aと、この放電灯3a
に沿って離間して設けた透光部としての内側ジャケット
管3bと、この内側ジャケット管3bから離間して同心
円となる位置に設けた透光部材としての外側ジャケット
管3cと、前記両ジャケット管3b、3cを固定するジ
ャケット固定部3eと、前記放電灯3aの両端を支持す
る両端支持部3d、3dとから構成されている。As shown in FIGS. 1 and 4, the light irradiating mechanism 3 includes a light source unit 3A for irradiating a light beam of a predetermined wavelength, a reflecting mirror 3B for reflecting the irradiating light beam from the light source unit 3A,
The light source unit 3A includes a power supply unit and the like. The light source unit 3A includes a discharge lamp 3a and the discharge lamp 3a.
An inner jacket tube 3b as a light-transmitting portion provided apart from the inner jacket tube; an outer jacket tube 3c as a light-transmitting member provided at a position concentric with the inner jacket tube 3b; It comprises a jacket fixing portion 3e for fixing the discharge lamps 3b and 3c, and both end support portions 3d and 3d for supporting both ends of the discharge lamp 3a.
【0026】そして、前記両端支持部3d,3dは、放
電灯3aの封止部を、ステアタイトベースに嵌合してお
り、そのステアタイトベースは、前記冷却機構5の冷却
流路5aが形成されているランプホルダ3fに支持され
ている。また、前記ランプホルダ3fは、前記ジャケッ
ト管3b,3cの両端を嵌合支持する嵌合部を備えてい
る。The support portions 3d, 3d have the sealing portion of the discharge lamp 3a fitted to a steatite base, and the steatite base is formed by a cooling flow path 5a of the cooling mechanism 5. Lamp holder 3f. Further, the lamp holder 3f has a fitting portion for fitting and supporting both ends of the jacket tubes 3b and 3c.
【0027】なお、図4および図5で示すように、前記
ジャケット管3b,3cは、石英などで形成され、少な
くともその一部(図5では半分)に所定波長の光を反射
あるいは吸収して制御する配光部材を、配光部4a,4
bとして設けている。前記配光部4a,4bは、ジャケ
ット管3b,3cの製造時に混入させて設ける構成とす
ることや、ジャケット管3b,3cの製造後に、所定幅
に亘って貼付する構成とすることで設けている(ジャケ
ット管3b,3cの内側または外側に貼付)。そのた
め、ワークWの処理対応(パターニング、表面改質な
ど)に応じて前記配光部4a,4bの設置位置を移動さ
せて放電灯3aから照射される光をワークWの特性や必
要に対応させて制御することで配光機構4としている。It should be noted, Remind as FIGS. 4 and 5, the jacket tube 3b, 3c are formed like quartz, reflects or absorbs light of a predetermined wavelength to at least a portion (half in FIG. 5) The light distribution members to be controlled by the light distribution units 4a and 4
It is provided as b. The light distribution units 4a and 4b are provided by being mixed during the production of the jacket tubes 3b and 3c, or by being adhered over a predetermined width after the production of the jacket tubes 3b and 3c. (Attached to the inside or outside of the jacket tubes 3b, 3c). Therefore, the positions of the light distribution units 4a and 4b are moved in accordance with the processing of the work W ( patterning , surface modification, etc.), and the light emitted from the discharge lamp 3a is made to correspond to the characteristics of the work W and the necessity. The light distribution mechanism 4 is thus controlled.
【0028】前記ジャケット管3b,3cに配光部4
a,4bを形成する場合は、酸化珪素(SiO2 )を主
材料として、酸化アルミ(Al2 O3 )、酸化カルシウ
ム(CaO)、酸化ホウ素(B2 O3 )、酸化ナトリウ
ム(Na2 O)、酸化カリウム(K2 O)など金属酸化
物を添加し、他にも微量な部材と合わせることで構成し
ている。The light distribution section 4 is provided on the jacket tubes 3b and 3c.
When a and 4b are formed, aluminum oxide (Al 2 O 3 ), calcium oxide (CaO), boron oxide (B 2 O 3 ), and sodium oxide (Na 2 O) are used with silicon oxide (SiO 2 ) as a main material. ), A metal oxide such as potassium oxide (K 2 O), and a small amount of other components.
【0029】前記配光部4a,4bの配置位置は、ワー
クの感光性部材の特性に合わせて決められる。これは、
図9で示すように、ワークに使用される感光性部材の光
開始剤により照射される紫外線の波長の中で、その感光
性部材の硬化特性が決められているため、例えば、曲線
Eのチオキサンソンを中心としてその感光性部材が構成
されていれば、紫外線の260nm前後の位置に吸光度
のピークがある。これに対し、曲線Gの4、4′−ビス
(ジメチルアミノ)ベンゾフェノンを中心としてその感
光性部材が構成されていれば、紫外線の370nm前後
を吸光度のピークとしているため、放電灯3aから照射
される光線の内、その感光性部材の特性に合った波長の
紫外線をワークWに照射することになる。The positions of the light distribution sections 4a and 4b are determined according to the characteristics of the photosensitive member of the work. this is,
As shown in FIG. 9, since the curing characteristics of the photosensitive member are determined in the wavelength of the ultraviolet light irradiated by the photoinitiator of the photosensitive member used for the work, for example, the thioxanthone curve E If the photosensitive member is constituted centering on, there is a peak of the absorbance at a position around 260 nm of ultraviolet rays. On the other hand, if the photosensitive member is composed mainly of 4,4'-bis (dimethylamino) benzophenone of the curve G, the ultraviolet light is irradiated from the discharge lamp 3a because the peak of the absorbance is about 370 nm. The work W is irradiated with ultraviolet light having a wavelength suitable for the characteristics of the photosensitive member among the light beams.
【0030】このように、光開始剤の単量体では、20
0nm〜300nmの範囲に感光特性を持つように示さ
れているが、各単量体を複合体として使用することで、
感光特性が300nm〜400nmに変化し吸収領域が
移動するようにして使用される場合もある。Thus, in the photoinitiator monomer, 20
It is shown to have photosensitive characteristics in the range of 0 nm to 300 nm, but by using each monomer as a complex,
In some cases, the photosensitive characteristic is changed to 300 nm to 400 nm and the absorption region is moved.
【0031】さらに、放電灯3aの照射分布を見るとワ
ークWの中心側が強く、ワークWの端部側が弱くなるこ
とが知られているため、ワークWの感光性部材の特性と
合わせて考慮し、その配光部4a,4bの配置位置が決
定される。Further, it is known that the irradiation distribution of the discharge lamp 3a is strong on the center side of the work W and weak on the end side of the work W. Therefore, it is considered in consideration of the characteristics of the photosensitive member of the work W. The arrangement positions of the light distribution units 4a and 4b are determined.
【0032】図5(a)で示すように、ワークWの感光
性部材の光開始特性が広範囲に亘っており、紫外線の必
要波長も広範囲に渡っている場合に好都合である。そし
て、ワークWを光処理する場合に、ある程度の高い温度
が必要な場合や、また、ワークWの寸法が小さな場合に
も有効に使用できる。As shown in FIG. 5A, this is advantageous when the photosensitive member of the work W has a wide range of photo-initiating characteristics and the required wavelength of ultraviolet rays is also wide. In addition, when the work W is subjected to optical processing, it can be effectively used even when a certain high temperature is required or when the size of the work W is small.
【0033】また、図5(b)で示すように、ワークW
の種類が、ある程度光照射強度を弱めて使用する場合
や、所定波長側(例えば365nm前後)にワークの光
開始特性がある場合などでは、外側ジャケット管3c
(内側ジャケット管3b)の配光部4bの位置をワーク
Wと放電灯3aの間に配置させると共に、内側ジャケッ
ト管3b(外側ジャケット管3c)の配光部4aの位置
をワークWとは反対側の放電灯3aの裏側の位置に配置
するように、位置調整する構成として使用すると都合が
良い。Further, as shown in FIG.
The outer jacket tube 3c is used when the light irradiation intensity is reduced to some extent or when the work has a light start characteristic on a predetermined wavelength side (for example, around 365 nm).
The position of the light distribution unit 4b of the (inner jacket tube 3b) is arranged between the work W and the discharge lamp 3a, and the position of the light distribution unit 4a of the inner jacket tube 3b (the outer jacket tube 3c) is opposite to the position of the work W. It is convenient to use it as a configuration for adjusting the position so that it is arranged at a position on the back side of the discharge lamp 3a on the side.
【0034】そして、図5(c)で示すように、放電灯
3aからの所定波長の紫外線を弱めた状態で照射する場
合や、放電灯3aの中心側の光照射を弱める場合には、
両ジャケット管3b,3cの配光部4a,4bの位置を
ワークWと放電灯3aの間に配置させることで、適正に
光処理作業を行うことが可能となる。As shown in FIG. 5 (c), when the ultraviolet light of a predetermined wavelength from the discharge lamp 3a is irradiated in a weakened state, or when the light irradiation on the center side of the discharge lamp 3a is weakened,
By arranging the positions of the light distribution sections 4a, 4b of the jacket tubes 3b, 3c between the workpiece W and the discharge lamp 3a, it is possible to appropriately perform a light processing operation.
【0035】さらに、図5(d)で示すように、放電灯
3aからワークの中央側に照射される所定波長の紫外線
を極力抑えて、ワークの周辺側の照射光をある程度抑え
る場合は、外側ジャケット管3cの配光部4bの一端側
を放電灯3aとワークWの間に配置し、内側ジャケット
管3bの配光部4aの他端側を放電灯3aとワークWの
間に配置する構成とする。そのため、放電灯3aから照
射される中央の光は、配光部4a,4bにより極力抑え
られ、放電灯3aからワークWの端部側に照射される光
は、配光部4aを介するか、または、配光部4bを介し
てある程度抑えた光がワークWに照射されることにな
る。Further, as shown in FIG. 5D, when the ultraviolet light of a predetermined wavelength emitted from the discharge lamp 3a to the center of the work is suppressed as much as possible, and the irradiation light on the periphery of the work is suppressed to some extent, A configuration in which one end of the light distribution unit 4b of the jacket tube 3c is disposed between the discharge lamp 3a and the work W, and the other end of the light distribution unit 4a of the inner jacket tube 3b is disposed between the discharge lamp 3a and the work W. And Therefore, the central light emitted from the discharge lamp 3a is suppressed as much as possible by the light distribution units 4a and 4b, and the light emitted from the discharge lamp 3a to the end of the work W passes through the light distribution unit 4a. Alternatively, the work W is irradiated with light suppressed to some extent via the light distribution unit 4b.
【0036】なお、上記した配光部4a,4bは、ジャ
ケット管3b,3cの石英ガラスに金属酸化物などの配
光部材を混入して一体に形成したものとして説明した
が、両ジャケット管3b、3cの表面に配光部としての
干渉膜を貼付する構成としても構わない。また、ジャケ
ット管3b、3cの両方に設けた構成として説明した
が、ジャケット管3b(3c)のどちらか一方に配光部
4a(4b)を設ける構成としても良い。The light distribution sections 4a and 4b have been described as being integrally formed by mixing a light distribution member such as a metal oxide into the quartz glass of the jacket tubes 3b and 3c. Alternatively, an interference film as a light distribution unit may be attached to the surface of 3c. Further, although the configuration has been described as being provided on both of the jacket tubes 3b and 3c, the light distribution unit 4a (4b) may be provided on one of the jacket tubes 3b (3c).
【0037】また、前記配光機構4として両ジャケット
管3b,3cに配光部4a、4bを設けた構成として説
明したが、前記両ジャケット管3b,3cに設ける代わ
りに、放電灯3aの石英ガラス表面あるいは内面に、配
光部として干渉膜を設ける構成としても良い。さらに、
放電管3aの石英ガラスの一部に金属酸化物を混入する
構成としてもよい。配光機構4の構成を放電灯3aに設
ける場合は、前記ジャケト管3b,3cには、配光部4
a,4bを設けない構成とすることや、前記ジャケト管
3b,3cの一方または両方に配光部4a(4b)を設
ける構成としても良く、放電灯3aあるいは前記ジャケ
ト管3b,3cの一方または両方に配光部4a(4b)
を設けた場合は、各配光部の位置を調整してワークの最
適な光照射を行う構成としても構わない。また、配光部
を2か所以上設ける場合は、各配光部の構成が、波長の
異なる光線を吸収あるいは反射する構成としても構わな
い。Although the light distribution mechanism 4 has been described as having the light distribution portions 4a and 4b provided on both the jacket tubes 3b and 3c, the quartz light of the discharge lamp 3a is used instead of being provided on the both jacket tubes 3b and 3c. A configuration in which an interference film is provided as a light distribution unit on the glass surface or inner surface may be employed. further,
A configuration in which a metal oxide is mixed into a part of the quartz glass of the discharge tube 3a may be adopted. When the structure of the light distribution mechanism 4 is provided in the discharge lamp 3a, the light distribution section 4 is provided in the jacket tubes 3b and 3c.
a, 4b may not be provided, or a light distribution unit 4a (4b) may be provided on one or both of the jacket tubes 3b, 3c. The discharge lamp 3a or one of the jacket tubes 3b, 3c may be provided. Light distribution unit 4a (4b) for both
Is provided, the position of each light distribution unit may be adjusted to perform optimal light irradiation of the work. When two or more light distribution units are provided, each light distribution unit may be configured to absorb or reflect light beams having different wavelengths.
【0038】次に、図3および図6で示すように、ワー
クWを搬送する搬送機構2は、ワークWの上端側を支持
する上端支持部2Aと、ワークWの下端側を支持する下
端支持部2Bと、この下端支持部2Bを駆動させる移動
装置8とから構成されている。Next, as shown in FIGS. 3 and 6, the transport mechanism 2 for transporting the work W includes an upper end support 2A for supporting the upper end of the work W, and a lower end support for supporting the lower end of the work W. It comprises a portion 2B and a moving device 8 for driving the lower end supporting portion 2B.
【0039】前記上端支持部2Aは、ワークWの搬送経
路に沿って所定間隔で連続して設けた左右の支持柱2
a,2aと、前記支持柱2a、2aの下端側に互いに離
間して設けた回転ローラ2b、2bとから構成され、前
記支持柱2a,2aは、取付部2Dに支持されている。
そして、前記回転ローラ2a,2aの離間距離は、ワー
クWの厚みより多少広くなるように形成されている。The upper end support portion 2A is provided with left and right support columns 2 continuously provided at predetermined intervals along the transfer path of the work W.
a, 2a and rotating rollers 2b, 2b spaced apart from each other at the lower ends of the support columns 2a, 2a. The support columns 2a, 2a are supported by a mounting portion 2D.
The separation distance between the rotating rollers 2a, 2a is formed to be slightly larger than the thickness of the work W.
【0040】また、図3および図6で示すように、前記
下端支持部2Bは、ワークWの下端を挟持する一方と他
方の挟持体2c,2dと、この両挟持体2c,2dの上
端側に設けた挟持当接部2g,2gと、前記両挟持体2
c,2dをほぼ中央で軸支すると共に、互いに当接する
方向に付勢させる弾性部材としてのコイルスプリング2
fと、前記一方の挟持体2cの下端側に設けたカム2e
とから構成されている。As shown in FIGS. 3 and 6, the lower end supporting portion 2B is provided with one and the other holding members 2c and 2d for holding the lower end of the work W, and the upper ends of the holding members 2c and 2d. And the two holding members 2g, 2g provided on the
A coil spring 2 serving as an elastic member for supporting the members c and 2d substantially at the center thereof and for urging them in directions in which they contact each other.
f and a cam 2e provided on the lower end side of the one holding body 2c.
It is composed of
【0041】そして、前記移動装置8は、他方の挟持体
2dの下端側に接続した駆動チェーン2hと、この駆動
チェーン2hを駆動させる回動プーリ2Gと、この回動
プーリ2Gを回動させる駆動部2Cとから構成されてい
る。なお、前記挟持体2c,2dは、複数が前記駆動チ
ェーン2hに所定間隔で設けられている。The moving device 8 includes a drive chain 2h connected to the lower end of the other holding member 2d, a rotary pulley 2G for driving the drive chain 2h, and a drive for rotating the rotary pulley 2G. 2C. In addition, a plurality of the holding bodies 2c and 2d are provided at predetermined intervals on the drive chain 2h.
【0042】図7で示すように、前記挟持体2cの下端
に設けたカム2eの同じ高さ位置で、ワークWの搬入口
側1aと搬出口側1bの位置の付近には、作動部として
の凸部2k,2kが支持台2j,2jに設けられてい
る。また、前記ワークWの搬入口1aと搬出口1bの位
置には、補助搬入部2Eおよび補助搬出部2Fが設けら
れている。前記補助搬入部2Eは、光照射処理される前
の工程から搬送されて来るワークWを、光照射装置1側
に受け取るためのものである。また、補助搬出部2F
は、光照射装置1で光照射処理が終了したワークWを次
の工程に送り出すためのものである。As shown in FIG. 7, at the same height position of the cam 2e provided at the lower end of the holding body 2c, near the position of the work entrance side 1a and the work exit side 1b of the work W, an operating portion is provided. Are provided on the support bases 2j, 2j. An auxiliary carry-in section 2E and an auxiliary carry-out section 2F are provided at the positions of the work W entrance 1a and the work exit 1b. The auxiliary carry-in section 2E is for receiving the work W conveyed from the step before the light irradiation processing to the light irradiation device 1 side. In addition, auxiliary discharge section 2F
Is for sending the workpiece W, which has been subjected to the light irradiation processing by the light irradiation device 1, to the next step.
【0043】そのため、補助搬入部2EからワークWが
送られてくると、駆動チェーンに固定されて搬送経路を
移動している挟持体2c,2dの下部に設けたカム2e
が、搬入口側に設けた凸部2kの形状に沿って押動さ
れ、コイルスプリング2fの弾性力に抗してその挟持体
2c,2dの上端側の挟持当接部2g,2gを強制的に
離間させ、ワークWの下端側をその挟持当接部2g,2
gにより挟持すると共に、ワークWの上端側は、回転ロ
ーラ2b,2bの間に支持されることで垂直な状態でワ
ークWを搬送する構成としてる。Therefore, when the work W is sent from the auxiliary carry-in section 2E, the cam 2e provided at the lower part of the holding bodies 2c and 2d fixed on the drive chain and moving on the conveyance path.
Is pressed along the shape of the convex portion 2k provided on the carry-in side, and forcibly presses the holding contact portions 2g, 2g on the upper end sides of the holding members 2c, 2d against the elastic force of the coil spring 2f. , And the lower end side of the work W is held at the holding contact portions 2g, 2g.
g, and the upper end of the work W is supported between the rotating rollers 2b, 2b so that the work W is transported in a vertical state.
【0044】そして、ワークWは光照射処理された後
に、搬出口1b側まで搬送されると、挟持体2cの下部
に設けたカム2eが搬送経路に設けた凸部2kの形状に
沿って押動されることで、挟持体2c,2dのコイルス
プリング2fの弾性力に抗して強制的に、その挟持当接
部2g,2gを離間させる方向に作動させるため、ワー
クWは、挟持体2c,2dから開放される。このとき、
すでにワークWの先端側下部が、補助搬出部2Fのロー
ラ部分に載置され、ワークWの上端部は、回転ローラ2
b,2bに支持された状態で、光照射装置1の搬出口1
bに送り出される。When the workpiece W is conveyed to the carry-out port 1b after the light irradiation processing, the cam 2e provided at the lower portion of the holding body 2c is pushed along the shape of the convex portion 2k provided on the conveyance path. The workpiece W is forcibly actuated in the direction to separate the holding contact portions 2g, 2g against the elastic force of the coil spring 2f of the holding members 2c, 2d by being moved. , 2d. At this time,
The lower end of the front end of the work W is already placed on the roller portion of the auxiliary discharge section 2F, and the upper end of the work W is
b, 2b, the loading / unloading port 1 of the light irradiation device 1
b.
【0045】なお、図1で示すように、光照射装置1の
上部側には、ダウンフロー用の送風器6が設けられてお
り、クリーンルーム内あるいは外部からの空気をフィル
タを介して光照射装置1内に取り込み、送風ファン6a
の駆動により搬送経路上に開口を設けたフローフード6
bに沿って、ワークWの上から下に向かってゆるやかな
風を送っている。そのため、ワークWに塵埃が付着しに
くく、かつ、ワークWの感光性部材の光反応による重合
熱などの加熱の原因をある程度除くこともできる。As shown in FIG. 1, a blower 6 for downflow is provided on the upper side of the light irradiating device 1 so that air from the inside of the clean room or from outside can be filtered through a filter. 1 and blower fan 6a
Hood 6 provided with an opening on the transport path by driving
A gentle wind is sent from top to bottom of the work W along b. Therefore, dust hardly adheres to the work W, and a cause of heating such as polymerization heat due to a photoreaction of the photosensitive member of the work W can be eliminated to some extent.
【0046】つぎに、ワークWの光照射作業の手順を説
明する。図1および図9で示すように、光照射装置1
は、操作パネル11でワークWの感光性部材の光処理の
対応に合わせて光照射強度や、搬送スピード、装置内温
度設定などをあらかじめ決定する。Next, the procedure of the work of irradiating the work W with light will be described. As shown in FIG. 1 and FIG.
Is determined in advance on the operation panel 11 in accordance with the light processing of the photosensitive member of the work W, the light irradiation intensity, the conveying speed, the temperature setting in the apparatus, and the like.
【0047】ワークWが光照射装置1側に送られて来る
と、図1および図3で示すように、ワークWは、補助搬
入部2Eにより受け取られ、搬入口1aの位置で、ワー
クWの上端と下端が搬送機構2の上端支持部2Aと下端
支持部2Bとにより支持され、搬送経路を所定スピード
で搬送されて行く。図6および図7で示すように、ワー
クWが下端支持部2Bに支持される場合は、挟持体2
c,2dが駆動チェーン2hの駆動により、順次移動し
て行き、挟持体2cの下部にあるカム2eが凸部2kの
位置で押動させられ、強制的にコイルスプリング2fの
弾性力に抗してその挟持当接部2g,2gを離間させ、
その間にワークWが挟持される。そして、これらの動作
を、挟持体2c,2dが移動しながら繰り返し行い、ワ
ークWの幅に合わせて複数の挟持体2c,2dによりワ
ークWを支持して搬送する。When the work W is sent to the light irradiation device 1 side, as shown in FIGS. 1 and 3, the work W is received by the auxiliary carry-in section 2E, and is moved to the position of the carry-in entrance 1a. The upper end and the lower end are supported by the upper end support 2A and the lower end support 2B of the transport mechanism 2, and are transported at a predetermined speed on the transport path. As shown in FIGS. 6 and 7, when the work W is supported by the lower end support portion 2B,
c and 2d are sequentially moved by the drive of the drive chain 2h, and the cam 2e at the lower portion of the holding body 2c is pushed at the position of the convex portion 2k, forcibly resisting the elastic force of the coil spring 2f. The gripping contact portions 2g, 2g are separated from each other,
In the meantime, the work W is held. These operations are repeated while the holding bodies 2c and 2d move, and the work W is supported and transported by the plurality of holding bodies 2c and 2d according to the width of the work W.
【0048】そして、図3および図6で示すように、ワ
ークWの上端側は、上部支持部2Aの回転ローラ2b、
2bの間で支持され、搬送経路に沿って案内されて送ら
れる。このとき回転ローラ2b,2bは、ワークWの幅
に対して常に、複数が配置されているため、ワークWを
搬送経路に沿ってスムーズに案内できる。As shown in FIGS. 3 and 6, the upper end side of the work W is connected to the rotating rollers 2b of the upper support 2A.
2b and is guided and sent along the transport path. At this time, since a plurality of rotating rollers 2b, 2b are always arranged with respect to the width of the work W, the work W can be smoothly guided along the transport path.
【0049】ワークWは、垂直状態で搬送機構により所
定スピード(0.5〜5m/min)で搬送されて来る
と、放電灯3aからの照射光をそのワークWの表裏面に
受ける。このとき、搬送経路のワークWの位置は、左右
の放電灯3a、3aから同距離にあるため、ワークWに
照射される光照射量が均等になる。When the workpiece W is transported at a predetermined speed (0.5 to 5 m / min) by the transport mechanism in a vertical state, the irradiation light from the discharge lamp 3a is received on the front and back surfaces of the workpiece W. At this time, since the position of the work W on the transport path is at the same distance from the left and right discharge lamps 3a, 3a, the light irradiation amount applied to the work W becomes uniform.
【0050】この光照射作業は、図9で示すように、曲
線イ、ロは、ワークWをパターニングした際のワークの
各部位に対する光の相対強度をパーセントで示してお
り、ワークWの中央の光照射が強く、ワークWの周辺に
向かうにしたがって光の相対強度が小さくなっているこ
とが分かる。パターニング時のワークWの全面に亘る照
度分布は、光量計により測定することで計測され、その
計測データに基づいてワークの全面に亘って照射される
光の積算光量が、改質作業を行うときに均等になるよう
にあらかじめ配光機構4を設定している。In this light irradiation operation, as shown in FIG. 9, the curves a and b show the relative intensity of light with respect to each part of the work W when the work W is patterned, as a percentage. It can be seen that the light irradiation is strong, and the relative intensity of the light decreases toward the periphery of the work W. Irradiation <br/> distribution over the entire surface of the workpiece W at the time of patterning is measured by measuring the optical power meter, the accumulated amount of light that illuminates the entire surface of the work based on the measurement data, Kai The light distribution mechanism 4 is set in advance so as to be uniform when performing quality work.
【0051】したがって、ワークWの改質作業を行い、
ワークWが耐破壊電圧、耐抵抗、耐熱性、耐密着性を均
等でかつ向上させるために、前記曲線(イ)(ロ)で示
した光の相対強度を示した曲線と反対、つまり、ワーク
Wの中央が弱く、ワークWの周辺の光の相対強度が強く
なるように光照射できるようにする必要がある。図9の
曲線a、b、cで示すように、前記曲線イ、ロで示すワ
ークWに対する光の相対強度を積算したとき均等になる
ように光照射するため、例えば、図5で示すように、配
光機構4の構成を、放電灯3aの中心からの照射光が配
光部4a(4b)を介してワークWに照射される状態で
放電灯3aを点灯させる構成とすることで、改質時にお
ける積算光量の均等化を図っている。Therefore, the work W is reformed,
In order for the work W to uniformly and improve the breakdown voltage, resistance, heat resistance and adhesion resistance, the work W is opposite to the curve showing the relative intensity of light shown in the curves (a) and (b), ie, the work It is necessary to be able to irradiate light so that the center of W is weak and the relative intensity of light around the work W is high. As shown by the curves a, b, and c in FIG. 9, the light irradiation is performed so as to be uniform when the relative intensities of the light with respect to the work W shown by the curves a and b are integrated. For example, as shown in FIG. The structure of the light distribution mechanism 4 is modified by turning on the discharge lamp 3a in a state where the irradiation light from the center of the discharge lamp 3a is irradiated on the work W via the light distribution unit 4a (4b). The aim is to equalize the integrated light quantity during quality.
【0052】そして、ワークWの改質作業で使用される
光の相対強度は、パターニング作業が100%で行われ
ると仮定すると、その値よりも大きな例えば、300%
や、600%〜700%程度の大きな値の光照射が行わ
れる。このように、大きな光の相対強度をワークWに与
えることで、ワークWの耐破壊電圧、耐抵抗、耐熱性、
密着性の向上を行うことが可能となる。Assuming that the patterning operation is performed at 100%, the relative intensity of the light used in the modification operation of the work W is larger than the value, for example, 300%.
Light irradiation with a large value of about 600% to 700% is performed. In this way, by giving a large relative intensity of light to the work W, the breakdown voltage, the resistance, the heat resistance,
Adhesion can be improved.
【0053】図10で示すように、このときの絶縁抵抗
の値を見るとワークの搬送速度により絶縁抵抗の値が異
なるが、1013〜1011Ω以上の値となることが分か
る。このときの条件としては、放電灯3aとしてメタル
ハイドロランプ(250W/cm)を6灯使用し、ワー
クWの感光性部材(レジスト)の厚みを60μmとして
改質作業を行った後、温度85度、湿度85%の条件で
所定時間ワークをさらした後、DC24Vで印加したと
き、1000時間経過した後でも絶縁抵抗の値は、10
11Ω以上であることの結果が得られた。また、このとき
の耐電圧の値も4KVの値となった。前記値は、MIL
(米国軍用)基準である5×108 と比較しても優れた
値といえる。As shown in FIG. 10, the value of the insulation resistance at this time differs depending on the transfer speed of the work, but it can be seen that the value is 10 13 to 10 11 Ω or more. The conditions at this time are as follows. Six metal hydro lamps (250 W / cm) are used as the discharge lamps 3a, the photosensitive member (resist) of the work W is made to have a thickness of 60 μm, and the reforming operation is performed. After exposing the work for a predetermined time under the condition of 85% humidity and applying a voltage of 24 V DC, the value of the insulation resistance is 10 even after 1000 hours have passed.
The result of being 11 Ω or more was obtained. Also, the value of the withstand voltage at this time was 4 KV. The value is MIL
This is an excellent value even when compared to the (US military) standard of 5 × 10 8 .
【0054】なお、ワークWの光照射を行っている際
は、ワークWに悪影響を与えるような熱を除去し、ワー
クWの感光性部材の改質作業に有効である熱を、放電灯
3の冷却機構5や、配光部4a,4bによりより適切に
利用して使用することができる構成としている。When the work W is being irradiated with light, heat which adversely affects the work W is removed, and heat effective for modifying the photosensitive member of the work W is transferred to the discharge lamp 3. The cooling mechanism 5 and the light distribution units 4a and 4b can be used and used more appropriately.
【0055】ワークWの光処理作業が終了し、搬送経路
に沿ってワークWを支持して搬送している下端支持部2
Bは、そのカム2eが、搬出口1b付近に設けた凸部2
kに当接して両挟持体2c,2dが順次離間する方向に
作動するため、ワークWを複数の挟持体2c,2d,2
c,2d…で挟持している先端側の挟持体2c,2d側
から順次ワークWを開放して、ワークWを補助搬出部2
F側に送り出す。このとき、ワークWの上端をガイドし
ている回転ローラ2bもワークWの幅方向に対して複数
個が配置されるように設置しているため、ワークWをF
助搬出部2Fに最小限の振動で送り出すことができる。When the light processing operation of the work W is completed, the lower end supporting portion 2 supporting and transporting the work W along the transport path is provided.
B is a projection 2 provided on the cam 2e near the carry-out port 1b.
Since the two holding members 2c and 2d operate in the direction in which the two holding members 2c and 2d are sequentially separated from each other, the workpiece W is moved into a plurality of holding members 2c, 2d and 2
The workpieces W are sequentially opened from the holding bodies 2c, 2d on the distal end side, which are held by c, 2d,.
Send to F side. At this time, since the plurality of rotating rollers 2b that guide the upper end of the work W are also arranged so as to be arranged in the width direction of the work W, the work W
It can be sent out to the auxiliary discharge section 2F with minimum vibration.
【0056】なお、前記した配光機構の構造は、図11
で示すものであっても良い。すなわち、光照射処理装置
50の配光機構40は、放電灯30と、搬送されるワー
クWの間に回動自在に設けた配光部42を備える構成と
している。前記配光部42は、透光部材としての透光板
41に設けられ、回動部43により無段階で所定角度に
設定できる構成としている。具体的には、サーボモータ
を使用することや、エンコーダを使用して設定角度を調
整している。前記配光部42は、石英ガラスにあらかじ
め所定波長の光を吸収あるいは反射する金属酸化物など
を混入して構成することや、石英ガラスなどの透光板に
光干渉膜を貼付して形成する構成としても良い。なお、
搬送機構2は、上記した構成と同じ構成であるため、説
明を省略する。The structure of the light distribution mechanism described above is shown in FIG.
May be indicated by. That is, the light distribution mechanism 40 of the light irradiation processing device 50 is configured to include the light distribution unit 42 that is rotatably provided between the discharge lamp 30 and the workpiece W to be conveyed. The light distribution unit 42 is provided on a light transmitting plate 41 as a light transmitting member, and is configured to be able to be set to a predetermined angle by a rotating unit 43 in a stepless manner. Specifically, the set angle is adjusted using a servomotor or using an encoder. The light distribution section 42 is formed by mixing a metal oxide or the like that absorbs or reflects light of a predetermined wavelength into quartz glass in advance, or is formed by attaching an optical interference film to a light-transmitting plate such as quartz glass. It is good also as composition. In addition,
Since the transport mechanism 2 has the same configuration as the above-described configuration, description thereof will be omitted.
【0057】そのため、図12で示すように、ワークW
の感光性部材に対応させ、あるいは、積算光量を均等に
するように、配光部42を所定角度に回転させること
で、放電灯30からの中心側の光照射を抑えて、ワーク
Wの周辺側の光照射を向上して行うことができる。Therefore, as shown in FIG.
By rotating the light distribution unit 42 at a predetermined angle so as to correspond to the photosensitive member or to equalize the integrated light amount, the light irradiation on the center side from the discharge lamp 30 is suppressed, The light irradiation on the side can be improved.
【0058】すなわち、図12(b)で示すように、ワ
ークWの表面に中心は弱く、周辺ではある程度強い光を
必要とする場合は、回動部43により透光板41を所定
角度傾斜させた状態で停止させて、放電灯30から光照
射させる構成とすることで、ワークWの積算光量を均等
にしている。また、図12(c)で示すように、ワーク
Wの中心部分を広範囲に光照射が弱くなるように配光部
42を配置するには、その透光体41を、回動部43に
より垂直にした状態で固定し、放電灯31から光照射す
る構成としている。なお、図12(a)で示すように、
ワークWを配光部42を介することなく光照射する場合
は、回動部43により透光板41を水平状態にして放電
灯30から光照射する構成としている。That is, as shown in FIG. 12 (b), when the center of the surface of the workpiece W is weak and a certain amount of strong light is required in the periphery, the light transmitting plate 41 is inclined by the rotating part 43 by a predetermined angle. In this state, the light is emitted from the discharge lamp 30 so that the integrated light amount of the work W is equalized. Further, as shown in FIG. 12C, in order to arrange the light distribution unit 42 so that light irradiation is weakened over a wide area in the center portion of the work W, the light transmitting body 41 is vertically moved by the rotating unit 43. In this state, the light is emitted from the discharge lamp 31. In addition, as shown in FIG.
When the work W is irradiated with light without passing through the light distribution unit 42, the light is irradiated from the discharge lamp 30 by setting the light transmitting plate 41 in a horizontal state by the rotating unit 43.
【0059】なお、前記した光照射処理装置(1、5
0)などで、ワークWの改質作業を行う場合は、ワーク
の搬送経路に沿って設けた複数(図面では3灯づつ)の
放電灯のうち、搬入口に近い放電灯から搬出側に向かう
にしたがって徐々に放電灯の出力を強くする構成として
も構わない。さらに、ワークWの大きさが変わる場合、
そのワークWの中心側に放電灯の中心が配置できるよう
に構成されていると都合が良い。In addition, the light irradiation processing device (1, 5
In the case of performing the reforming work of the work W as in 0), among the plurality of discharge lamps (three in the drawing) provided along the work conveyance path, the discharge lamp is located closer to the carry-in port and goes to the discharge side. , The output of the discharge lamp may be gradually increased. Further, when the size of the work W changes,
It is convenient if the center of the discharge lamp is arranged on the center side of the work W.
【0060】また、前記した配光部の形成位置は、放電
灯のアークリングスより小さな構成としても良く、さら
に、配光部の構成を中心側を濃度が濃く(反射、吸収が
大きい)、周辺に行くにしたがったて徐々に配光部の濃
度が薄くなるように構成しても構わない。The position of the light distribution section may be smaller than the arc rings of the discharge lamp. Further, the light distribution section may have a higher density (higher reflection and absorption) on the center side and a higher density on the periphery. It may be configured such that the density of the light distribution unit gradually decreases as going to (2).
【0061】そして、光照射を行う場合に使用される反
射鏡は、アルミ反射材により形成されても良く、所定波
長の紫外線を反射させるコールドミラーで構成されるこ
とや、反射面に金メッキを施した構成の反射鏡などでも
構わない。また、冷却機構で使用される冷却液は、純
水、軟水あるいは水道水であっても良く。純水、軟水を
使用する場合は、その循環するパイプをさらに、冷却パ
イプで覆い、純水、あるいは軟水が循環しているパイプ
を冷却パイプで冷却する構成とすると都合が良い。The reflecting mirror used when performing light irradiation may be formed of an aluminum reflecting material, may be formed of a cold mirror that reflects ultraviolet light of a predetermined wavelength, or may be formed by applying gold plating to the reflecting surface. A reflector having such a configuration may be used. Further, the cooling liquid used in the cooling mechanism may be pure water, soft water or tap water. In the case of using pure water or soft water, it is convenient to cover the circulating pipe with a cooling pipe and cool the pipe in which pure water or soft water circulates with a cooling pipe.
【0062】さらに、使用される放電灯は、メタルハイ
ドロランプや、水銀灯、キセンノンランプであり、ま
た、その放電灯の冷却手段は、空冷、水冷あるいは間接
水冷などが使用できるものである。Further, the discharge lamp used is a metal hydro lamp, a mercury lamp, or a xenon lamp, and the cooling means of the discharge lamp can use air cooling, water cooling, indirect water cooling, or the like.
【0063】[0063]
【発明の効果】この発明は上記したように構成している
ため、以下の優れた効果を奏する。 ワークを光照射処理する際に、そのワークの感光性
部材の特性、積算光量に応じて配光機構を調整して適切
な光を照射することができるため、ワークの耐破壊電
圧、耐絶縁抵抗、耐温度および感光性部材の密着性を向
上することができる。また、ワークを光照射中に空冷手
段により強制的に冷却する必要もなくなるため、ワーク
に塵埃が付着する原因が減少し、かつ、クリーンルーム
内の空気の調整に対して影響が少ない。Since the present invention is configured as described above, it has the following excellent effects. When a workpiece is irradiated with light, the light distribution mechanism can be adjusted according to the characteristics of the photosensitive member of the workpiece and the integrated light amount to irradiate appropriate light, so the breakdown voltage and insulation resistance of the workpiece , Temperature resistance and adhesion of the photosensitive member can be improved. Further, since the work does not need to be forcibly cooled by the air cooling means during the light irradiation, the cause of the dust adhering to the work is reduced, and the adjustment of the air in the clean room is less affected.
【0064】さらに、光照射処理装置は、ワークの光処
理状態に対応させ、配光機構の位置を調整して所望の波
長の光線をワークに照射できるので、配線ラインやピッ
チ間などが縮小化方向にあるワークに使用される感光性
部材の光開始材に対して適切な処理が可能になる。ま
た、ワークのパターニングや、ワークの改質作業など光
照射の目的が異なる作業であっても適切に行うことがで
きる。Further, the light irradiation processing apparatus can adjust the position of the light distribution mechanism to irradiate a light beam of a desired wavelength to the work in accordance with the light processing state of the work. Proper processing is possible for the photoinitiator of the photosensitive member used for the workpiece in the direction. In addition, it can be appropriately performed even when the purpose of light irradiation is different, such as work patterning and work modification work.
【0065】 放電灯とワークの間に、配光機構の配
光部を少なくとも一度以上所定波長の光が通過するよう
に設けているため、その配光部を移動させてワークに照
射される光の相対強度を調整することで、ワークの感光
性部材を積算光量として均等に光照射させることができ
る。そのため、ワークの絶縁抵抗および耐破壊電圧の値
が向上すると共に、後工程で行われるハンダに対する耐
温度の向上、および積層するときの密着性が向上でき
る。Since the light distribution unit of the light distribution mechanism is provided between the discharge lamp and the work at least once so that light of a predetermined wavelength passes therethrough, the light distribution unit is moved to illuminate the work. By adjusting the relative intensity of light, the photosensitive member of the work can be uniformly irradiated with light as an integrated light amount. Therefore, the values of the insulation resistance and the breakdown voltage of the work can be improved, the temperature resistance to solder performed in a later step can be improved, and the adhesion at the time of lamination can be improved.
【0066】 放電灯に設けた透光部材の少なくとも
一部に所定波長の光を反射あるいは吸収する配光部を設
け、その配光部の位置を、ワークに光照射する積算光量
が均等になるようにあらかじめ位置調整することができ
るため、改質作業が終了したワークは、絶縁抵抗および
耐破壊電圧の値が向上すると共に、後工程で行われるハ
ンダに対する耐温度の向上、および積層するときの密着
性が向上できる。A light distribution unit that reflects or absorbs light of a predetermined wavelength is provided on at least a part of the light transmitting member provided in the discharge lamp, and the position of the light distribution unit is equalized in the integrated light amount that irradiates the work with light. Because the position can be adjusted in advance as described above, the work after the reforming operation has improved insulation resistance and breakdown voltage, and has improved the temperature resistance to solder performed in a later process, and the lamination when laminating. Adhesion can be improved.
【0067】 ワークの改質作業を行う場合、ジャケ
ット管あるいは透光板などの透光部材を使用し、その一
部に配光部を設け、パターニング済のワークの照度分布
と合わせて積算光量が均一となるように、その配光部の
位置を移動調整しているため、ワークの感光性部材を、
永久絶縁膜として使用に耐える構成とすることができ
る。When the work of modifying the work is performed, a light transmitting member such as a jacket tube or a light transmitting plate is used, a light distribution section is provided in a part thereof, and the integrated light amount is adjusted in accordance with the illuminance distribution of the patterned work. Because the position of the light distribution unit is adjusted so as to be uniform, the photosensitive member of the work
A structure that can be used as a permanent insulating film can be employed.
【0068】 ワークに光照射作業を行う場合は、そ
のワークの全面に亘って所定波長の光線を照射する必要
があることから、ワークを上端支持部および下端支持部
により縦方向に支持した状態で搬送経路に沿って搬送で
き、ワークの支持および離脱が容易にできるため、光照
射装置にワークを搬入支持あるいは搬出離脱が容易にで
きる。また、ワークに対する光照射の距離が均等に保て
るため、正確な光照射作業を行うことが可能となる。When performing a light irradiation operation on a work, it is necessary to irradiate a light beam of a predetermined wavelength over the entire surface of the work, so that the work is supported vertically by the upper end support portion and the lower end support portion. Since the workpiece can be transported along the transport path, and the work can be easily supported and separated, the work can be easily loaded into the light irradiation device, supported, and unloaded. In addition, since the light irradiation distance to the work can be kept uniform, accurate light irradiation work can be performed.
【0069】 ワークは搬送機構により所定速度で搬
送されると共に、そのワークの処理状態に対応した光照
射を、配光機構を介して、光照射機構により行うため、
ワークが光照射処装置から搬送機構により次工程に搬送
されるとき、ワークの温度と、室温との差が大きく開く
ことはなく、ワークに湿気を呼び込むことが抑制され、
後工程の処理も適切に行うことが可能となる。The work is conveyed at a predetermined speed by the conveyance mechanism, and light irradiation corresponding to the processing state of the work is performed by the light irradiation mechanism via the light distribution mechanism.
When the work is transferred from the light irradiation device to the next process by the transfer mechanism, the difference between the temperature of the work and the room temperature does not greatly open, and the intrusion of moisture into the work is suppressed,
Post-processing can also be performed appropriately.
【図1】この発明の光照射装置の側面図である。FIG. 1 is a side view of a light irradiation device of the present invention.
【図2】この発明の光照射装置の平面図である。FIG. 2 is a plan view of the light irradiation device of the present invention.
【図3】この発明の光照射装置の搬送機構の要部を示す
側面図である。FIG. 3 is a side view showing a main part of a transport mechanism of the light irradiation device of the present invention.
【図4】この発明の光照射装置の光源部の要部を示す断
面図である。FIG. 4 is a cross-sectional view showing a main part of a light source unit of the light irradiation device of the present invention.
【図5】この発明の光源部の配光機構の使用状態を示す
原理図である。FIG. 5 is a principle diagram showing a use state of the light distribution mechanism of the light source unit of the present invention.
【図6】この発明の搬送機構の要部を示す正面図であ
る。FIG. 6 is a front view showing a main part of the transport mechanism of the present invention.
【図7】この発明のワークの搬送機構の要部を示す平面
図である。FIG. 7 is a plan view showing a main part of a work transfer mechanism of the present invention.
【図8】この発明の感光性部材の光開始剤のピーク特性
を示すグラフ図である。FIG. 8 is a graph showing peak characteristics of a photoinitiator of the photosensitive member of the present invention.
【図9】この発明のワークの照度分布を示すグラフ図で
ある。FIG. 9 is a graph showing the illuminance distribution of the work of the present invention.
【図10】この発明の改質作業後のワークの絶縁抵抗値
を示すグラフ図である。FIG. 10 is a graph showing the insulation resistance value of the work after the reforming work of the present invention.
【図11】この発明の他の配光機構の使用状態を示す原
理図である。FIG. 11 is a principle view showing a use state of another light distribution mechanism of the present invention.
【図12】この発明の他の配光機構の使用状態を示す原
理図である。FIG. 12 is a principle view showing a use state of another light distribution mechanism of the present invention.
【図13】(a)は従来の感光性部材の測定温度による
硬化反応の違いを示すグラフ図、(b)は従来の感光性
部材の熱流曲線および硬化率曲線を示すグラフ図であ
る。13A is a graph showing a difference in curing reaction of a conventional photosensitive member depending on a measurement temperature, and FIG. 13B is a graph showing a heat flow curve and a curing rate curve of the conventional photosensitive member.
【図14】従来の感光性部材(ジアゾ感光液)の光吸収
特性を示すグラフ図である。FIG. 14 is a graph showing light absorption characteristics of a conventional photosensitive member (diazo photosensitive liquid).
1 光照射装置1 1a 搬入口 1b 搬出口 2 搬送機構 2A 上端支持部 2B 下端支持部 2C 駆動部 2D 取付部 2E 補助搬入部 2F 補助搬出部 2G 回動プーリ 2a 支持柱 2b 回転ローラ 2c 挟持体 2d 挟持体 2e カム 2f コイルスプリング 2g 挟持当接部 2h 駆動チェーン 2j 支持台 2k 凸部 3 光照射機構 3A 光源部 3B 反射鏡 3a 放電灯 3b 内側ジャケット管(透光部材) 3c 外側ジャケット管(透光部材) 3d 両端支持部 3e ジャケット固定部 4 配光機構 4a 配光部 4b 配光部 5 冷却機構 5a 冷却流路 8 移動装置 40 配光機構 44 透光板(透光部材) 42 配光部 DESCRIPTION OF SYMBOLS 1 Light irradiation device 1 1a Carry-in port 1b Carry-out port 2 Transport mechanism 2A Upper-end support part 2B Lower-end support part 2C Drive part 2D Attachment part 2E Auxiliary carry-in part 2F Auxiliary carry-out part 2G Rotating pulley 2a Support pillar 2b Rotary roller 2c Holding body 2d Holding member 2e Cam 2f Coil spring 2g Holding contact portion 2h Drive chain 2j Support base 2k Convex portion 3 Light irradiation mechanism 3A Light source unit 3B Reflector mirror 3a Discharge lamp 3b Inner jacket tube (light transmitting member) 3c Outer jacket tube (light transmitting member) 3d Both-ends support part 3e Jacket fixing part 4 Light distribution mechanism 4a Light distribution part 4b Light distribution part 5 Cooling mechanism 5a Cooling flow path 8 Moving device 40 Light distribution mechanism 44 Light transmission plate (light transmission member) 42 Light distribution part
フロントページの続き (56)参考文献 特開 平4−182128(JP,A) 特開 平3−288858(JP,A) 特開 平2−207253(JP,A) 特開 昭62−229142(JP,A) 特開 昭62−187345(JP,A) 特開 昭62−162330(JP,A) 特開 昭61−29124(JP,A) 特開 昭55−60944(JP,A) (58)調査した分野(Int.Cl.7,DB名) G03F 7/20 - 7/24 G03F 9/00 - 9/02 Continuation of the front page (56) References JP-A-4-182128 (JP, A) JP-A-3-288858 (JP, A) JP-A-2-207253 (JP, A) JP-A-62-2229142 (JP) JP-A-62-187345 (JP, A) JP-A-62-162330 (JP, A) JP-A-61-29124 (JP, A) JP-A-55-60944 (JP, A) (58) Field surveyed (Int.Cl. 7 , DB name) G03F 7/ 20-7/24 G03F 9/00-9/02
Claims (7)
構と、前記搬送機構により搬送される前記ワークの全面
に亘って光照射を行う光照射機構と、前記光照射機構か
らの照射光の内、前記ワークの感光性部材の重合による
改質を促進させる所定波長の光を制御する配光機構とか
らなり、 前記配光機構は、前記ワークの処理内容に対応してあら
かじめ所定波長の光を反射あるいは吸収して選択的に設
定できる配光部を有することを特徴とする光照射処理装
置。A transport mechanism for transporting the work along a transport path; and an entire surface of the work transported by the transport mechanism.
A light irradiation mechanism for performing light irradiation over a period of time, and a light distribution for controlling light of a predetermined wavelength that promotes modification by polymerization of a photosensitive member of the work among irradiation light from the light irradiation mechanism. A light distribution unit, wherein the light distribution mechanism has a light distribution unit which can selectively set by reflecting or absorbing light of a predetermined wavelength in advance in accordance with the processing content of the work. .
に所定波長の光が少なくとも一回以上通過する透光部材
に、所定波長の光を反射あるいは吸収して選択的に設定
できる配光部を設け、前記ワークの感光性部材に対応し
て、前記配光部の位置をあらかじめ調整して設定するこ
とを特徴とする請求項1に記載の光照射処理装置。2. The light distribution mechanism according to claim 1, wherein the light of a predetermined wavelength is reflected or absorbed by a light transmitting member through which the light of a predetermined wavelength passes at least once between the workpiece and the discharge lamp.
Possible provided light distribution portion, in correspondence with the photosensitive member of the workpiece, the light irradiation apparatus according to claim 1, characterized in that set in advance adjusting the position of the light distribution portion.
に光を透過する透光部材を有し、前記透光部材は、少な
くともその一部に、所定波長の光を反射あるいは吸収す
る配光部を設け、前記ワークの全面に亘って照射される
光の積算光量が均等になるように、前記透光部材の配光
部の位置を移動調整して固定手段により固定することで
あらかじめ調整する請求項1に記載の光照射処理装置。3. The light distribution mechanism has a light transmitting member that transmits light to a discharge lamp of the light irradiation mechanism, and the light transmitting member reflects or absorbs light of a predetermined wavelength on at least a part thereof. By providing a light distribution unit, and by moving and adjusting the position of the light distribution unit of the light transmitting member and fixing the light distribution unit by a fixing unit so that the integrated light amount of light applied over the entire surface of the work becomes uniform. The light irradiation processing apparatus according to claim 1, wherein the light irradiation processing apparatus is adjusted in advance.
に沿って設けたジャケット管に透光部材を有し、前記透
光部材は、少なくとも前記ジャケット管の一部に、前記
放電灯から照射される所定波長の光を反射あるいは吸収
する配光部材を設け、前記ジャケット管は、その両端を
固定手段により着脱自在に固定し、ワークの全面に亘っ
て照射される積算光量が均等になるように、そのジャケ
ット管に設けた配光部材の位置を、あらかじめ調整する
請求項1に記載の光照射処理装置。4. The light distribution mechanism has a light-transmitting member on a jacket tube provided along the discharge lamp of the light irradiation mechanism, and the light-transmitting member is provided on at least a part of the jacket tube. provided light distribution member for reflecting or absorbing light of a predetermined wavelength emitted from the lamp, the jacket tube, the ends detachably fixed by fixing means, over the entire surface of the workpiece
As cumulative amount of light applied is equalized Te, the light irradiation apparatus according to claim 1 in which the position of the light distribution member provided on the jacket tube, is adjusted beforehand.
に沿って、回動機構を介して設けた透光板であって、前
記透光板の少なくとも一部には、所定波長の光を吸収あ
るいは反射する前記配光部を設け、前記ワークの全面に
亘って照射される積算光量が均等になるように、その透
光板の回転角度をあらかじめ調整する請求項2に記載の
光照射処理装置。5. The light-transmitting member is a light-transmitting plate provided via a rotating mechanism along a discharge lamp of the light irradiation mechanism, and at least a part of the light-transmitting plate has a predetermined wavelength. said light distribution portion that absorbs the light or reflection provided on the entire surface of the workpiece
3. The light irradiation processing apparatus according to claim 2, wherein the rotation angle of the light-transmitting plate is adjusted in advance so that the integrated light amount applied over the entire surface becomes uniform.
上端を搬送経路に沿って支持する上端支持部と、前記ワ
ークの下端を搬送経路に沿って支持する下端支持部と、
前記下端支持部を所定速度で移動させる移動機構とから
なり、前記下端支持部は、前記ワークの所定位置を挟持
する挟持体と、この挟持体を当接する方向に付勢する弾
性部材とを備え、前記搬送経路の搬入側および搬出側
に、前記挟持体の一部が接触することで前記弾性部材の
付勢力に抗して前記挟持体を離間させる方向に作動させ
る作動部を有する請求項1から請求項5までのいずれか
一項に記載の光照射処理装置。6. A transport mechanism, comprising: an upper end supporter for erecting a work and supporting an upper end thereof along a transfer path; a lower end supporter for supporting a lower end of the work along a transfer path;
A moving mechanism for moving the lower end supporting portion at a predetermined speed, the lower end supporting portion includes a holding body for holding a predetermined position of the work, and an elastic member for biasing the holding body in a contacting direction. And an actuating unit that operates on a carry-in side and a carry-out side of the transport path in a direction of separating the holding body against a biasing force of the elastic member by contacting a part of the holding body. The light irradiation processing apparatus according to any one of claims 1 to 5.
っての照度分布をあらかじめ解析し、そのワークの感光
性部材の重合による改質処理作業で、前記照度分布と合
わせて前記ワークの全面に亘って積算光量が均等になる
ように、そのワークの照度分布をあらかじめ調整するた
めの第1工程と、前記ワークを搬入口で受け取り所定速
度により搬送口まで搬送する第2工程と、前記第2工程
で搬送されるワークを前記第1工程で照度分布を調整し
た状態で光照射する第3工程とからなる光照射処理方
法。7. An entire surface of a patterned workpiece.
Pre-analysis of the illuminance distribution of the I, the photosensitive of the work
In modification treatment operations by polymerization of sexual member, as entirely integrated quantity of light over the workpiece is equalized in conjunction with the illuminance distribution, to precondition the illuminance distribution of the workpiece
A first step of order, a second step of conveying to the transfer port by receiving a predetermined speed the workpiece carry-in port, the second step
A third step of irradiating the workpiece conveyed in step (1) with the illuminance distribution adjusted in the first step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04893597A JP3256873B2 (en) | 1997-03-04 | 1997-03-04 | Light irradiation processing apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04893597A JP3256873B2 (en) | 1997-03-04 | 1997-03-04 | Light irradiation processing apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10246965A JPH10246965A (en) | 1998-09-14 |
| JP3256873B2 true JP3256873B2 (en) | 2002-02-18 |
Family
ID=12817128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04893597A Expired - Fee Related JP3256873B2 (en) | 1997-03-04 | 1997-03-04 | Light irradiation processing apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3256873B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015087642A (en) * | 2013-10-31 | 2015-05-07 | 株式会社飯沼ゲージ製作所 | Light alignment device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086495A (en) * | 2001-09-13 | 2003-03-20 | Fuji Electric Co Ltd | Method of forming photoresist pattern |
| WO2010084771A1 (en) * | 2009-01-26 | 2010-07-29 | ハリソン東芝ライティング株式会社 | Metal halide lamp |
-
1997
- 1997-03-04 JP JP04893597A patent/JP3256873B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015087642A (en) * | 2013-10-31 | 2015-05-07 | 株式会社飯沼ゲージ製作所 | Light alignment device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10246965A (en) | 1998-09-14 |
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