JP3259355B2 - IC device electrical characteristics measurement device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for testing and measuring the electrical characteristics of an IC device (integrated circuit element), and more particularly to an improvement of a head for the measurement.

[0002]

2. Description of the Related Art In general, an apparatus for testing and measuring the electrical characteristics of an IC device is roughly classified into an IC handler constituting a transfer system of the device and an IC tester constituting a test / measurement system. Can be. The IC handler has a loader section and an unloader section, and a large number of devices housed in a jig such as a magazine are installed in the loader section, and the devices are separated and transported one by one from the magazine. A mechanism is provided to perform test / measurement by connecting to the magazine, and to classify the data by quality in the unloader unit based on the test / measurement results and store it in a magazine.
On the other hand, the IC tester has a tester main body having a signal processing unit, and a contact mechanism for contacting the IC device with the tester main body is mounted. When the device is connected to the contact mechanism, Then, the electric signal from this device is taken into the tester body,
By performing the signal processing, it is configured to determine whether the operation is performed as specified.

Here, the contact mechanism has a structure including at least an IC socket for contacting a device and a socket board on which the IC socket is mounted. Particularly in recent years, a large number of devices of different types having different dimensions and shapes of packages, the number of pins, and the like, and devices of the same type and different types having the same type but different functions and characteristics have been used. Therefore, when testing and measuring devices of different types and types, in order to share the tester main body, this contact mechanism is detachable from the tester main body and this contact mechanism is replaceable. ing. Further, in order to increase the efficiency and speed of the test and measurement, a configuration in which a large number of devices can be simultaneously contacted with a contact mechanism has been used.

[0004] From the above demands, as the contact mechanism, in addition to the above-described IC socket and socket board,
By using an interface board, a plurality of socket boards are configured as a contact unit mounted on the interface board, and the contact unit is connected to the tester main body via connection pins in the contact unit, thereby connecting the contact unit to the tester main body. It is configured to be electrically connected to. The connection between the socket board and the interface board uses a coaxial cable, and both ends of the coaxial cable are connected to the socket board and the interface board by soldering means.

[0005]

By the way, in the above-mentioned prior art, the entire contact unit must be replaced every time the type of device to be tested / measured is different. Therefore, it is necessary to prepare as many contact units as the types and types of devices to be tested and measured.
In order to cope with the diversification of device types, several hundreds or more contact units may need to be replaced and used, which is expensive in terms of cost, and poses a major problem in terms of storage space and the like.

When the number of devices to be tested and measured at the same time is increased, such as 16, 32, and 64, the number of wires between the socket board and the interface board increases in accordance with the number. Therefore, there is also a manufacturing problem that the soldering work of such a large number of wirings is extremely troublesome. In particular, in the case of a multi-pin device, soldering is required at many locations as the number of devices increases, and since this soldering operation is difficult to automate due to its structure, it must be performed manually. This significantly increases the manufacturing cost of the contact unit.

Therefore, the present applicant has constructed a contact mechanism to be mounted on a test head by three members: an interface board, a relay board, and a socket board provided with an IC socket, which are detachable from each other. And an electrode pin which is detachably connected to the electrodes of the interface board and the socket board, and which is detachable from the electrodes. by this,
The interface board, the relay board, and the IC socket can be recombined independently, so that when testing and measuring various types of devices, the number of parts to be replaced can be reduced, and the interface can be reduced. Since the connection between the board and the socket board does not need to be made by using soldering means, there are advantages that the manufacture of the contact mechanism is facilitated and the manufacture thereof can be automated. However, such a configuration is not without problems.

In particular, in recent years, while the number of pins of IC devices has become more prominent, the relay board requires a certain thickness in terms of strength and the like, and furthermore, facilitates attachment and detachment. In view of the above, each of the relay boards must be arranged at a certain interval from each other, so that a sufficient space for arranging the relay boards may not be secured in some cases. In addition, the relay board must be replaced every time the type of device to be tested / measured is changed.Therefore, it must be attached and detached at a certain frequency.If the wiring pattern on the board is exposed to the outside, There is a possibility that the wiring pattern may be damaged during attachment or detachment.

The present invention has been made in view of the above points, and tests and measures a wide variety of IC devices without the need for soldering and with a reduced number of contact units. In order to enable the relay board unit to be detachably connected between the socket board and the interface board, a large number of relay board units can be arranged in a narrow space. It is an object of the present invention to provide an IC device electrical characteristic test and measurement apparatus in which a wiring pattern of a circuit board constituting the above is not damaged.

[0010]

In order to achieve the above-mentioned object, the present invention provides a contact mechanism comprising a socket board to which an IC socket is connected, an interface board detachably connected to an IC tester main body, and A relay board unit detachably connected to the socket board and the interface board and electrically connecting the two boards to each other, the relay board unit includes two circuit boards and ends of the two circuit boards . A plurality of wiring patterns are formed on opposing surfaces of the two circuit boards, respectively, and on the end face of the spacer facing the socket board and the interface board,
A predetermined number of connector pins electrically connected to each of these boards are provided in a plurality of rows.
The connecting portion of the one in which as its characterized in that a configuration in which an electrode portion for electrically connecting between the wiring patterns and the respective connector pins.

[0011]

As described above, by dividing the contact mechanism into three members and making the relay board unit interposed between the socket board and the interface board separable from each board, for example, When testing and measuring devices of the same type and different types, only the interface board may be replaced while leaving the socket board intact. Further, when handling devices having different sizes and shapes, some devices can share an interface board. In this case, it is only necessary to replace the socket board while leaving the interface board as it is. Thus, even if the types of devices to be tested and measured increase, it is not always necessary to prepare the number of contact mechanisms corresponding to the types, and the number of components can be reduced. Also, since the connection between the socket board and the interface board can be performed by using a relay board unit and connecting the relay board unit in a plug-in manner, there is no need for soldering. It is easy to manufacture and can be automated.

In addition, since the two circuit boards are used in combination, the strength is good even when the thickness of each circuit board is reduced, and the distance between the two circuit boards joined to each other can be extremely reduced. Therefore, a large number of relay board units can be arranged between the socket board and the interface board, so that even if the number of pins of the device to be tested / measured is increased, it can be sufficiently dealt with. Furthermore, since the wiring patterns are formed on the opposing surfaces of the circuit boards to be joined to each other, when the relay board unit is attached / detached, the wiring patterns are touched by hands, and stains or scratches are caused. There is no danger of sticking.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, FIG. 1 shows an entire configuration of a test and measurement apparatus for an IC device. In the figure, 1 is an IC handler,
Reference numeral 2 denotes an IC tester, and a handler 1 includes a loader unit 3 and an unloader unit 4;
And a transport path 5 that leads to The transport path 5 includes an inclined chute 5a on the loader side, a vertical chute 5b, and an inclined chute 5c on the unloader side. The transition from the inclined chute 5a to the vertical chute 5b and the transition from the vertical chute 5b to the inclined chute 5c. The parts include the direction change parts 6a,
6b is provided. The test head 2a of the tester 2
Is disposed at a position facing the vertical chute 5b, and a contact mechanism 10 described later is detachably mounted. And device D is clamped to this vertical chute 5b,
A mechanism (not shown) for bringing the test head 2a into and out of contact with the contact mechanism 10 is provided. Further, a classification mechanism 7 for classifying the devices D based on the test and measurement results is provided at an intermediate position of the inclined chute 5c on the unloader section side.

As is well known, the devices D are housed in a row in a magazine in the loader unit 3, and by tilting the magazine, the devices D are discharged from the magazine by their own weight and separated one by one. When it reaches the vertical chute 5b from the inclined chute 5a via the direction changing portion 6a, it is positioned at a predetermined position, is connected to the contact mechanism 10 of the test head 2a of the tester 2, and has its electric The test and measurement of the characteristic are performed. Then, when the test / measurement is completed, it separates from the contact mechanism 10, descends again along the vertical chute 5b, and moves from the direction changing section 6b to the inclined chute 5c on the unloader section side. By inclining the magazine provided in the unloader section 4 after being classified, the magazine is stored in the magazine on the unloader side.

The test / measurement of the IC device D is performed as described above. In order to perform the test / measurement efficiently and at high speed, a large number of devices D are simultaneously connected to the test head.
It can be mounted on 2a. Therefore,
The test head 2a is provided with a plurality of IC sockets arranged vertically and horizontally. For example, 32 units having four rows of IC sockets in the vertical direction and 8 rows in the horizontal direction, and 64 units having 8 rows and 8 rows have been developed.

FIG. 2 shows the structure of the test head 2a. FIG. 1 shows the one provided with four-stage IC sockets. As is clear from the figure, a contact mechanism 10 is detachably connected to the test head 2a. The contact mechanism 10 is composed of three independent members that can be attached to and detached from each other, and includes an interface board 11, a plurality of relay board units 12, and a socket board 13 from the test head 2a side. The interface board 11 has a predetermined wiring pattern formed on a front surface thereof, and has a rear surface provided with a pin connection portion connected to a number of connector pins (not shown) provided on the test head 2a side. I have. An IC socket 14 is mounted on the socket board 13.
The lead pins of the device D are inserted / removed or approach / separate.

The relay board unit 12 is for electrically connecting the interface board 11 and the socket board 13 described above. As shown in FIGS. 3 and 4, a pair of circuit boards 15 are provided. And a pair of upper and lower spacers 16 interposed therebetween, and a number of connector pins 17 provided on the spacer 16. The circuit board 15 has a wiring pattern 18 formed on one side thereof.
Through holes 20 are formed in the terminal portions 19 at both ends of the
The connecting pin 21 is inserted through the through hole 20 so as to pass therethrough. On the other hand, the spacer 16 is formed of an electrically insulating member, and the connector pins 17 provided thereon are provided in two rows. And this relay board unit 12
Are assembled in such a manner that the wiring patterns 18 provided on the pair of circuit boards 15 face each other, and the spacers 16 are interposed therebetween.

The connector pins 17 are detachably connected to terminals (not shown) provided on the interface board 11 and the socket board 13. The connector pins 17 are mounted on the spacer 16. The holding pipe 23 is inserted into the recess 22 and is fixed to the recess 22.
Here, as shown in FIG. 5, the connector pin 17 includes a large diameter portion 17a and a small diameter portion 17b. The large diameter portion 17a is in sliding contact with the inner wall of the concave portion 22, and the small diameter portion 17b is a holding pipe. 23 protrudes from the end. A spring 24 is provided in the recess 22.
Of the connector pin 17 due to the biasing force of
7b is held in a state where the tip of the projection 7b protrudes from the holding pipe 23 by a predetermined length. Pin insertion holes 25 for inserting the connecting pins 21 are formed on both left and right sides of the spacer 16, and a conductive member is applied to the inner surface of the recess 22 from the inner wall of the pin insertion hole 25. Accordingly, the wiring pattern 18, which is electrically connected to the connector pin 17 through a conductive member formed in the concave portion 22 from the terminal 19 and the connecting pin 21 and the pin insertion holes 25, communicates
An electrode portion is constituted by the connecting pin 21 and the pin insertion hole 25.
You .

The present embodiment is configured as described above. The IC device electrical characteristic measuring apparatus is assembled from a state in which one type of device D is tested and measured. The change in setup when testing and measuring devices different from each other will be described.

In order to carry out this setup change, first, the type of the contact mechanism 10 already mounted on the test head 2a is confirmed.
For example, testing and testing devices of the same type
If measurement is to be performed, only the interface board 13 is replaced. Accordingly, first, the socket board 13 is removed integrally with the relay board unit 12 or both are separately removed.
Then, replace it with an interface board that is suitable for performing the new test and measurement.
12 and the socket board 13 are mounted. This completes the setup change for testing and measuring different types of devices.

On the other hand, when the size and shape of the device are different and the IC socket 14 mounted on the socket board 13 must be changed, but it is not necessary to change the interface board 13, only the socket board 13 is removed. , Just replace it with a new one. At this time, if the number of pins of the device is different, it is necessary to replace the relay board unit 12 together with the socket board 13.

As described above, the entire contact mechanism 10 must be replaced only when testing and measuring devices of different types and different types. It is possible to reduce the number of members required for the operation. Also, if the wiring pattern of the interface board 13 can be shared by as many types of devices as possible, it is often unnecessary to replace the interface board even if the dimensions and shape of the devices are different. Therefore, the members can be shared.

As described above, the relay board unit 12 is attached and detached for the purpose of device type and the like. The circuit board 15 constituting the relay board unit 12
Since the inner surfaces 18 are formed opposite to each other, the hand or the like does not directly touch the wiring pattern 18 at the time of attachment / detachment, and therefore, there is no possibility that the wiring pattern 18 is stained or damaged.

Further, even if the thickness of the circuit board 15 is reduced, sufficient strength can be maintained, and the interval between the circuit boards 15 to be joined to each other only needs to be kept in a non-contact state. Therefore, both can be brought very close to each other. As a result,
It becomes a state connectable to an extremely large number of electrodes. For example, in recent years, SOP type devices, SOJ type devices, and the like, in which a large number of lead pins are provided at extremely short pitch intervals, have come to be used. As described above, when measuring a multi-pin device D, as shown in FIG.
(And the interface board 11), the electrodes 26 are arranged in two rows for each of the lead pins arranged on the left and right sides of one device D, that is, four rows in total.
By connecting the connector pins 17 provided on the relay board unit 12 to each of these, the wiring pattern 18 on the circuit board 15 can be formed with a margin.

In the above-described embodiment, the connecting pins 21 are provided on the circuit board 15. However, with such a configuration, when the circuit board 15 and the spacer 16 are assembled, the positions of the connecting pins 21 can be reduced. The alignment can be performed accurately. However, other than this, for example, it is also possible to provide an electrode that is phase-joined on the circuit board side and the spacer side, respectively, and to electrically connect both electrodes by means such as bump bonding. Although the spacer is configured as a pair of upper and lower parts sandwiched between circuit boards, as shown in FIG. 7, if a frame-shaped spacer 30 is used, the wiring pattern 18 on the circuit board 15 can be reduced. The formed portion is isolated from the outside, so that it is possible to prevent a foreign matter such as dust from adhering to the wiring pattern 18 and prevent a short circuit accident or the like from occurring. Further, it is not always necessary to provide all of the wiring patterns 18 on the inner surface side of the circuit board 15; for example, the ground wire may be formed on the outer surface of the circuit board 15. The allowance of the wiring pattern 18 formed on the inner surface side is further increased. further,
Although the electrode pins are configured to be elastically supported by the spacer, the electrode pins may be configured to be fixedly attached to the spacer.

[0026]

As described above, according to the present invention, a relay board unit which is detachably connected to a socket board and an interface board and electrically connects between both boards is provided on opposite surfaces. Each circuit board is provided with a pair of circuit boards on which a wiring pattern is formed. The two circuit boards are joined via a spacer, and connector pins which are detachably connected to the socket board and the interface board are provided on the spacer. With the configuration, the socket board and the interface board can be plugged in and connected,
Since there is no need for soldering, it is easy to manufacture the contact mechanism and it is possible to automate it.Also, since two relay boards are combined, there is a certain degree of strength even if each relay board is thinned, In addition, since the interval between the two interconnected boards can be made extremely small, a large number of interconnected boards can be arranged between the socket board and the interface board. Since the wiring patterns are formed on the opposing surfaces of the circuit board, there is no risk that the wiring patterns will be touched by hands when the relay board unit is attached or detached, It works.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing the entire configuration of an electrical characteristic test apparatus for an IC device.

FIG. 2 is a side view showing components of the contact mechanism according to the first embodiment of the present invention in a separated state.

FIG. 3 is an exploded perspective view of the relay board unit.

FIG. 4 is a front view of the relay board unit.

FIG. 5 is an enlarged sectional view of a main part of FIG. 4;

FIG. 6 is an exploded perspective view showing an example of a connection mode of the relay board unit to the socket board.

FIG. 7 is an exploded perspective view of a relay board unit according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC handler 2 IC tester 2a Test head 10 Contact mechanism 11 Interface board 12 Relay board unit 13 Socket board 14 IC socket 15 Circuit board 16, 30 Spacer 17 Contact pin

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 H01L 21/66

Claims (4)

(57) [Claims] A contact mechanism for contacting an IC device connected to an IC tester main body;
An apparatus for simultaneously contacting the C device with the IC tester and measuring its electrical characteristics, wherein the contact mechanism is detachably connected to a socket board to which an IC socket is connected and the IC tester main body. An interface board, and a relay board unit detachably connected to the socket board and the interface board to electrically connect the two boards. The relay board unit includes two circuit boards, A spacer fixed between the ends of the two circuit boards in a connected state, a plurality of wiring patterns formed on opposing surfaces of the two circuit boards, and an end face of the spacer facing the socket board and the interface board; A predetermined number of connector pins electrically connected to each of these boards. The provided a plurality of rows and electrical characteristics of the IC device is characterized in that a configuration in which the connection portion between the circuit board and the spacer, providing an electrode portion for electrically connecting between the wiring patterns and the respective connector pins measuring device. 2. A connection pin is provided on one side of the circuit board and the spacer, and a pin insertion hole is provided on the other side. 2. The IC according to claim 1, wherein said connection pins are detachably connected, and said connection pins and said pin insertion holes are used as said electrode portions to electrically connect said wiring pattern and said connector pins.
A device for measuring the electrical characteristics of devices. 3. The apparatus according to claim 1, wherein the spacer is connected to upper and lower sides of the circuit board. 4. The apparatus according to claim 1, wherein the spacer is formed in a frame shape, and the connector pins are provided on upper and lower portions of the spacer.