JP3259497B2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for inspecting and storing semiconductor devices.

[0002]

2. Description of the Related Art In a final manufacturing process of a semiconductor device, the appearance of the semiconductor device sealed in a package is inspected to determine only a good product, and then the semiconductor device is stored in a storage form according to a request of a shipping destination. Contains the device.

FIG. 3 is a perspective view for explaining various storage modes. That is, FIG. 3A shows storage by a tray, in which the semiconductor device 10 is stored in a plurality of recesses provided in a matrix. The storage by the tray has the advantage that a plurality of semiconductor devices 10 can be stacked and stored in a stored state.

FIG. 3 (b) shows storage by tape, in which a semiconductor device is adhered and held on an elongated tape and wound up on a reel in this state and stored. The storage by tape is advantageous in that the semiconductor device 10 can be easily handled at the time of transportation and that the semiconductor device 10 can be easily taken out of a mounting device (a device for mounting the semiconductor device 10 on a substrate or the like). is there.

[0005] Fig. 3 (c) shows storage by a stick.
In this embodiment, the semiconductor device 10 made of P (Dual Inline Package) is housed. The storage by the stick has an advantage that the semiconductor device 10 can be easily loaded into the mounting device and has excellent protection against the lead of the semiconductor device 10. Non-defective semiconductor devices 10 are accommodated in these accommodation modes, respectively, and are responded to the request of the shipping destination.

FIG. 4 is a block diagram illustrating a conventional semiconductor manufacturing apparatus, which shows an apparatus for inspecting a semiconductor device 10 before storage. The semiconductor manufacturing apparatus 1 includes a supply unit 2 for supplying a semiconductor device 10, an inspection unit 3 for inspecting the semiconductor device 10, and a semiconductor device 10 for which inspection has been completed.
And a storage unit 4 for storing the data.

In order to perform an inspection by the semiconductor manufacturing apparatus 1, first, a supply tray 21 in which a plurality of semiconductor devices 10 to be inspected are stored is arranged in the supply unit 2, and the semiconductor device 10 is taken out from the supply tray 21. It is guided to the inspection unit 3 along the transport mechanism 5. Next, the image of the semiconductor device 10 is captured by the image processing device 31 of the inspection unit 3, and the appearance of the semiconductor device 10 is inspected based on the captured image. Next, based on the inspection result, the semiconductor device 1
0 is determined as a non-defective product or a defective product, and if it is determined to be a defective product, the transport direction of the semiconductor device 10 is set to P1 of the transport mechanism 5.
To switch to the defective tray 6. On the other hand, when it is determined that the semiconductor device 10 is non-defective, the semiconductor device 10 is transported as it is and stored in the storage tray 41 a of the storage unit 4. Such inspections are sequentially performed, and the non-defective semiconductor device 10 is eliminated, and only non-defective products are stored in the storage tray 41a.

[0008]

However, in this semiconductor manufacturing apparatus, since a non-defective semiconductor device is stored in a storage tray, when the shipping destination requests storage by tape, for example, It is necessary to use a dedicated device for transferring from the storage tray to the tape. In other words, it is necessary to prepare a device for transfer according to the storage mode, and this transfer takes time, which leads to a reduction in production efficiency of the semiconductor device. If a tape or a stick is provided in the storage section of the semiconductor manufacturing apparatus instead of the storage tray, there is no need for transfer, but even in this case, it is necessary to prepare an apparatus corresponding to each storage mode. Accordingly, it is an object of the present invention to provide a semiconductor manufacturing apparatus and a method for sorting semiconductor devices, which can easily be stored in various storage modes.

[0009]

SUMMARY OF THE INVENTION The present invention is a semiconductor manufacturing apparatus made to solve such a problem . In other words, the semiconductor manufacturing apparatus inspects a semiconductor device, and stores the semiconductor device in a predetermined position based on a result of the inspection. The supply unit supplies the semiconductor device to be inspected, and the supply unit supplies the semiconductor device. Takes in the image of the supplied semiconductor device and performs a prescribed inspection to judge a good or defective product
Inspection unit, and the semiconductor device determined to be non-defective by the inspection unit.
There are a plurality of storage sections with different storage modes for storing.
The storage unit determines the storage format using the video captured by the inspection unit.
Semiconductor that is determined to be non-defective based on the determination.
A semiconductor device for storing a device in any of the plurality of storage portions
It is a body manufacturing device.

Further, according to the method of sorting semiconductor devices, a semiconductor device is inspected, and the semiconductor device is stored in any one of a plurality of storage portions based on the result. The video of the target semiconductor device is captured, the semiconductor device is inspected based on the captured image, and it is determined which of the plurality of storage units the semiconductor device is to be sorted into, and the semiconductor device is determined based on the inspection and determination. This is a method in which it is stored in a predetermined position.

[0011]

The semiconductor manufacturing apparatus of the present invention has passed the inspection section.
Since a plurality of storage units of different types for storing non- defective semiconductor devices are provided, it is possible to perform storage in a storage mode corresponding to the semiconductor device after inspection. In addition, the semiconductor device is inspected based on the captured image of the image processing apparatus, and it is possible to determine in which storage section the non- defective semiconductor device is to be sorted based on the image, and the semiconductor device storage form can be determined. Corresponding individual sorting can be performed continuously .

Further, in the method for sorting semiconductor devices according to the present invention, non-defective products,
By judging both the inspection of a defective product and the sorting into a plurality of storage units, it is possible to continuously process from the inspection process to the storage process.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor manufacturing apparatus and a method for sorting semiconductor devices according to the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view illustrating the present invention, and FIG. 2 is a block diagram illustrating the present invention. First, the semiconductor manufacturing apparatus 1 of the present invention will be described. That is, the semiconductor manufacturing apparatus 1 inspects the appearance of the supplied semiconductor device 10 and the like, discriminates a non-defective product from a defective product, and stores it in a predetermined position. 2 and semiconductor device 1
The inspection unit 3 is configured to perform an inspection of 0, and a plurality of storage units including a tray storage unit 41, a tape storage unit 42, a stick storage unit 43, and the like.

The supply unit 2 has, for example, a tray format (FIG. 3).
(See (a))), and a plurality of semiconductor devices 10 to be inspected are arranged therein. A transport mechanism 5 is provided between the supply unit 2 and the inspection unit 3 and between the inspection unit 3 and each storage unit.
Each of them can be transferred to a predetermined position while holding 0.

Further, as shown in FIG. 2, the inspection section 3 is provided with an image processing device 31. The image of the semiconductor device 10 transferred from the supply portion 2 is read by the image processing device 31.
And processing such as visual inspection. A plurality of storage units including, for example, a tray storage unit 41, a tape storage unit 42, and a stick storage unit 43 are arranged adjacent to the inspection unit 3. The tray storage section 41, the tape storage section 42, and the stick storage section 43 are unitized, and are detachably attached via bolts or the like so that various combinations are possible.

The tray storage section 41 and the tape storage section 4
2 and the stick storage section 43 respectively.
The semiconductor device 10 that has undergone a predetermined inspection in the inspection unit 3 is transferred along the transport mechanism 5 and is out of the tray storage unit 41, the tape storage unit 42, or the stick storage unit 43. It will be stored according to the required form.

As described above, since the semiconductor manufacturing apparatus 1 is provided with a plurality of types of storage sections, it is possible to easily select the storage of the semiconductor device 10 according to the request of the shipping destination. For example, before the inspection, the storage mode required by the shipping destination is specified in advance, and after the semiconductor device 10 is inspected, the semiconductor storage device 41 is stored in any of the tray storage unit 41, the tape storage unit 42, and the stick storage unit 43 based on the specification. The device 10 is housed. Thus, the semiconductor device 10 can be easily stored according to the request of the shipping destination.

Further, the semiconductor device 10 may be sorted to a predetermined position by using the image processing device 31 provided in the inspection unit 3 to perform the storage mode requested by the shipping destination. Hereinafter, a method for sorting semiconductor devices in this example will be described. First, the semiconductor device 10 to be inspected is stored in the supply tray 21, and the supply tray 21 is arranged in the supply unit 2. In this embodiment, a tray is used as a supply form, but a tape (see FIG. 3B).
It may be supplied using another storage form such as a stick or a stick (see FIG. 3C).

Next, the semiconductor device 10 to be inspected is taken out of the supply tray 21 by using the transport mechanism 5 and transported to the inspection unit 3. The inspection unit 3 captures the transferred image of the semiconductor device 10 using the image processing device 31, performs predetermined image processing on the captured image, and performs an appearance inspection of a package, a lead, and the like of the semiconductor device 10. Then, based on the result of the appearance inspection, good or bad of the semiconductor device 10 is determined.

In addition to the appearance inspection, the size of the semiconductor device 10, the serial number attached to the package, the product name, and the like are recognized based on the captured image, and the storage section in which the semiconductor device 10 is stored is determined. Determine. For example, the serial number or product name attached to the package of the semiconductor device 10 is recognized based on the image captured by the image processing device 31, and the form such as the serial number of the semiconductor device 10 is stored. to decide.

That is, it is determined in which form the semiconductor device 10 is to be stored based on the correspondence between the serial number and the storage form required by the shipping destination. Note that the storage mode required by the shipping destination is not limited to the serial number or the product name, but may be determined based on other information such as the number of leads, pitch, and package shape.

Next, the semiconductor device 10 is transferred to a predetermined position based on the inspection result of the semiconductor device 10 and the judgment of the storage mode for storing the same. For example, the semiconductor device 10 in which a defect is found in the appearance inspection and determined to be defective is transferred in the direction of the defective product tray 6 with the transport direction changed at the position P1 of the transport mechanism 5. Further, the semiconductor device 10 which is determined to be non-defective by the appearance inspection and the storage mode is determined to be a tray is transferred in the direction of the storage tray 41 a of the tray storage section 41.
Similarly, the semiconductor device 10 that is determined to be non-defective in the appearance inspection and the storage mode is determined to be a tape is transferred in the direction of the tape storage unit 42 with the transport direction changed at the position P2 of the transport mechanism 5. Further, the semiconductor device 10 determined to be non-defective in the appearance inspection and determined to be in the storage mode of the stick is transferred in the direction of the stick storage section 43 with the transport direction changed at the positions P2 and P3 of the transport mechanism 5. .

In this manner, the semiconductor devices 10 are sequentially taken out of the supply tray 21 and inspected, and the storage locations are sorted based on the inspection results and the determination of the storage mode. When a plurality of supply trays 21 are provided in the supply unit 2, after all the semiconductor devices 10 are supplied from one supply tray 21, the next supply tray 21 is disposed at a predetermined position and the supply tray 21 is supplied. The semiconductor devices 10 are sequentially supplied from the beginning.

The method of sorting the semiconductor devices 10 is particularly effective when a plurality of types of semiconductor devices 10 are stored in the same supply tray 21 by, for example, high-mix low-volume production. That is, a plurality of types of semiconductor devices 1
In a case where the semiconductor device 1 is stored in the supply tray 21 in a state in which the semiconductor device 1
0 is captured, and the type of the semiconductor device 10 is determined based on the captured image. Based on this determination, sorting is performed on whether to transfer to the tray storage unit 41, to the tape storage unit 42, or to the stick storage unit 43. by this,
Even when a plurality of types of semiconductor devices 10 are mixed in the same supply tray 21, accurate sorting can be performed.

Further, in the semiconductor manufacturing apparatus 1 described in the present embodiment, an example has been described in which the tray storage section 41, the tape storage section 42, and the stick storage section 43 are provided as a plurality of different types of storage sections. As an example, a case where a plurality of tray storage units 41 that can store the semiconductor devices 10 having different sizes may be provided.

For example, when a plurality of semiconductor devices 10 having different sizes are stored in the same supply tray 21, based on the image captured by the image processing device 31 of the inspection unit 3,
A predetermined inspection and the size of the semiconductor device 10 are determined.
Then, based on the size of the non-defective semiconductor device 10, the semiconductor device 10 is transferred to the tray storage section 41 having the storage tray 41a corresponding to the size. This makes it easy to sort the semiconductor devices 10 by size.

In the above embodiment, the tray storage section 41, the tape storage section 42, and the stick storage section 43 have been described as examples of storage sections. However, the present invention is not limited to these storage forms, but may be other forms. It is the same as above. Also,
The same applies to any combination of storage units including the tray storage unit 41, the tape storage unit 42, the stick storage unit 43, and the like, and the storage units other than the three storage units.

[0028]

As described above, the semiconductor device of the present invention
According to the manufacturing apparatus, the following effects are obtained. That is, according to the semiconductor manufacturing apparatus, since a plurality of types of storage sections are provided, it is possible to easily select a storage mode according to a request of a shipping destination. Further , since the inspection and the discrimination of the storage mode can be performed based on the image captured by the image processing apparatus , the sorting into various storage modes can be performed continuously, and It is possible to shorten the time from the inspection process to the storage process and improve the production efficiency.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view illustrating the present invention.

FIG. 2 is a block diagram illustrating the present invention.

FIGS. 3A and 3B are perspective views illustrating a storage mode, wherein FIG. 3A shows a tray, FIG. 3B shows a tape, and FIG. 3C shows a stick.

FIG. 4 is a block diagram illustrating a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor manufacturing apparatus 2 Supply part 3 Inspection part 5 Transport mechanism 6 Defective product tray 10 Semiconductor device 21 Supply tray 31 Image processing device 41 Tray storage part 42 Tape storage part 43 Stick storage part

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 H01L 21/66 H01L 21/68

Claims (1)

(57) [Claims] 1. A semiconductor manufacturing apparatus for inspecting a semiconductor device and storing the semiconductor device in a predetermined position based on a result of the inspection, comprising: a supply unit for supplying a semiconductor device to be inspected; takes in an image of a semiconductor device which is supplied from the parts performs a predetermined inspection and houses the inspection unit determines the good products and defective products, a semiconductor device which is determined to be non-defective by the inspection unit,
And a plurality of accommodating portions having different housing forms, determine the storage form using the image captured by the inspection unit
Semiconductor that is determined to be non-defective based on the determination.
A semiconductor manufacturing apparatus, wherein the apparatus is stored in any one of the plurality of storage sections .