JP3266376B2 - Optical package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for converting an optical signal into an electric signal.
Alternatively, the present invention relates to an improved optical package for connecting an optical integrated circuit that converts an electric signal to an optical signal and an optical fiber.

[0002]

2. Description of the Related Art A conventional optical package has a V-shaped groove 103 for mounting an optical fiber and a terminal pin 104 connected to an optical integrated circuit, as shown in a schematic perspective view of FIG. The package includes a mounting body 101 and a lid 102 for covering the upper surface of the mounting body 101. An optical integrated circuit is mounted in the mounting body 101, an optical fiber is mounted in the V-shaped groove 103, and then mounted with an adhesive or the like. A structure in which the body 101 and the lid 102 are integrated and an optical fiber is simultaneously fixed in the V-shaped groove 103 (see Japanese Utility Model Laid-Open No. 61-176512), or as shown in a schematic perspective view of FIG. A configuration in which a hole 105 is provided on the bottom surface of the mounting body 101, an optical integrated circuit A is installed on the bottom surface of the mounting body 101, and an optical fiber B is inserted into the hole 105 and fixed with an adhesive (Japanese Utility Model Application Laid-Open No. 61-144658). See).

[0003]

However, in the conventional structure shown in FIGS. 4 and 5, a step of processing the V-shaped groove 103 or the hole 105 in a part of the mounting body 101 is required. In order to make a low-loss connection between B and the optical integrated circuit A, it is necessary to form a plurality of V-grooves 103 or holes 105 uniformly and precisely, which requires a great deal of time and labor during processing, and Each of a plurality of optical fibers B is V
There is also a problem that it takes a lot of time and effort to install and fix at a target position in the groove 103 or the hole 105.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-described problems, and provides an optical package comprising a package for mounting an optical integrated circuit and a lid for covering the package. The body is composed of a substrate and a frame on the substrate, a part of the frame is formed of an optical waveguide, an antireflection film is provided on the inner surface of the frame, and the outside of the frame is inclined. Features.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show an embodiment of the present invention. In the drawings, the same members are denoted by the same reference numerals. FIG. 1 is a schematic perspective view showing the basic structure of the first embodiment of the present invention. The optical package includes a package 1 for mounting the optical integrated circuit A and a lid 2 covering the top of the package 1. The mounting body 1 mounts a plate-shaped substrate 3, terminal pins 4 for connecting an optical integrated circuit A provided on or inside the substrate 3 to the outside, and an optical integrated circuit A provided on the substrate 3. 5 to do, and frame 5
The optical waveguide 6 is interposed between the optical fiber B and the optical integrated circuit A as a part of the optical waveguide B.

In order to manufacture an optical package using the mounting body 1 and the lid 2, the optical integrated circuit A is installed inside the frame 5, and the optical fiber B is transmitted through the optical waveguide 6 to transmit an optical signal. After setting the optical integrated circuit A, the optical fiber B, or the optical waveguide 6 so as to provide a low-loss connection and adjusting the optical axis, the optical integrated circuit A is installed. And the optical fiber B are fixed with an adhesive or soldering, and the mounting body 1 and the lid 2 are integrated with an adhesive or the like. The optical waveguide 6 may be selected and installed or processed in advance with a connection having a lower loss than the optical integrated circuit A and the optical fiber B to be used.
After the optical fiber B is installed, the optical fiber B may be installed or processed so as to have a low-loss connection.

When the optical waveguide 6 is formed in a part of the frame portion 5 as described above, it is not necessary to form the groove uniformly and precisely as in the case of processing a V-groove or a hole. When the material is fitted into the frame portion 5, the optical waveguide 6 has a shape that can be easily fitted, and the groove has a processing accuracy enough to fix the optical waveguide 6 and be airtight with an adhesive. When a part of the optical waveguide 6 is formed into an optical waveguide 6 by processing or the like, since the formation of a groove is not required at all, the production becomes very easy. Further, when installing the optical fibers B, it is not necessary to place them one by one, and the optical waveguide 6 and the optical fibers B,
Further, by determining the correlation with the optical waveguide 6 in advance, low-loss connection and high-precision optical axis adjustment can be achieved simply by directly installing the optical fiber array in which the optical fibers B are put together on the substrate 3. It is very easy to install the optical fiber B while maintaining the optical fiber B.

In the above-described embodiment, the lid 2 is configured to cover the upper surface of the mounting body 1. However, the same applies to the configuration of the mounting body 1 or the configuration that covers other side surfaces as necessary. It is. The optical waveguide 6 may be of any size, number, and location as long as it can be interposed between the optical integrated circuit A to be connected and the plurality of optical fibers B during optical transmission. When the surface-emitting type optical integrated circuit A is used, the optical waveguide 6 may be formed on the bottom surface of the mounting body 1 or the lid 2. The mounting body 1 may be made of a material such as quartz glass, silicon, or ceramics. The optical waveguide 6 may be made of the same material as the core of the optical fiber B to be used, or may be more refracted than the material of the mounting body 1. The optical waveguide 6 may be formed from a material having a high rate. In order to configure the optical waveguide 6, a groove is provided in the frame portion 5, and the optical waveguide 6 is fitted and adhered.
Alternatively, a part of the frame 5 may be formed as the optical waveguide 6 by doping or etching. Further, the optical waveguide 6
Assuming that an enlarged waveguide of a tapered type, a multi-core type, a distributed coupling type, or the like is used and both ends have an optimum coupling diameter of both the optical integrated circuit A and the optical fiber B, the tolerance in the direction perpendicular to the optical axis is Characteristics can be improved,
For example, in a Ti-diffused LiNbO ₃ waveguide or a glass waveguide, a substance that increases the refractive index doped in the core and is diffused by external heat may be used to enlarge the core.

[0009]

FIG. 2 is a schematic sectional view showing the structure of a first embodiment of the present invention.
The frame portion 5, the optical waveguide 6 formed in a part of the frame portion 5, the electrode 7 connected to the terminal pin 4 and bonded to the optical integrated circuit A, and the inner surface of the frame portion 5 including at least the optical waveguide 6. It is composed of an antireflection film 8.

As described above, by coating the anti-reflection film 8 effective for the wavelength of the optical integrated circuit A, leaked light or the like generated during optical transmission is repeatedly reflected in the package to become scattered light, This can prevent the characteristics of the device from being adversely affected as a noise component of the signal. Also, the anti-reflection film 8 is formed on the back surface of the lid 2.
Is applied, the reflection of light can be more reliably prevented.

[0012] Further, the outside of the frame portion 5 is inclined to connect and fix the optical fiber array C to the frame portion 5, so that the connection surface D of the optical fiber array C is inclined with respect to the optical axis direction. Because of the configuration having an angle, the influence of the reflected return light on the connection surface D can be reduced.

[0013]

FIG. 3 is a schematic perspective view showing a second embodiment of the present invention. The lid 2 has a shape having a concave portion corresponding to the outside of the frame 5 of the mounting body 1. The optical fiber array C is integrated with a part of the portion to be the frame portion of No. 2. By thus forming the lid 2 into a shape having a concave portion and integrating the optical fiber array C, the joint surface between the optical fiber array C and the optical waveguide 6 can be protected,
In addition, the position where the optical fiber array C is installed can be accurately determined.

[0015]

[0016]

[0017]

[0018]

[0019]

As described above, according to the optical package of the present invention, in an optical package including a mounting body on which an optical integrated circuit is mounted and a lid covering the mounting body, the mounting body is formed on a substrate and on the substrate. The frame part is constituted by an optical waveguide, and an antireflection film is provided on the inner surface of the frame part, and the outside of the frame part is inclined. In addition, it is possible to provide an optical package in which installation of an optical fiber can be extremely easily performed while maintaining low-loss connection and high-precision optical axis adjustment.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a first embodiment of an optical package of the present invention.

FIG. 2 is a schematic sectional view showing a first embodiment of the optical package of the present invention.

FIG. 3 is a schematic sectional view showing a second embodiment of the optical package of the present invention.

FIG. 4 is a schematic perspective view showing a conventional optical package.

FIG. 5 is a schematic perspective view showing a conventional optical package.

[Explanation of symbols]

 1, 101: mounting body 2, 102: lid body 3: substrate 4, 104: terminal pin 5: frame part 6: optical waveguide 7: electrode 8: antireflection film 103: V groove 105: hole A: optical integrated circuit a : Light emitting or receiving part B: Optical fiber C: Optical fiber array D: Connection surface

Continuation of front page (56) References JP-A-4-43692 (JP, A) JP-A-4-365005 (JP, A) JP-A-3-106091 (JP, A) JP-A-4-354385 (JP) JP-A-55-2296 (JP, A) JP-A-62-227092 (JP, A) JP-A-3-237408 (JP, A) JP-A-4-168404 (JP, A) 64-20750 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) G02B 6/42

Claims (1)

(57) [Claims] 1. An optical package comprising a package on which an optical integrated circuit is mounted, and a lid covering the package, wherein the package comprises a substrate and a frame on the substrate, and a part of the frame is formed. with more structure in the optical waveguide path, light package, characterized by comprising an anti-reflection film on the inner surface of the frame portion, and is inclined to the outside of the frame portion.