JP3272178B2 - Method and apparatus for arranging small metal spheres - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro chip for arranging bumps themselves on a chip in advance when bonding an IC chip used for an IC package to a bump of a TAB tape or a so-called flip chip. The present invention relates to a method and an apparatus for arranging metal balls.

[0002]

2. Description of the Related Art In the process of manufacturing a semiconductor device, in order to connect an electrode portion (electrode pad) of an IC chip or the like to a lead or the like, both are bump-bonded via a bump made of a minute metal ball. At the time of this bump bonding, in order to fix and arrange the minute metal spheres at predetermined positions, the minute metal spheres are individually captured and arranged at target positions on the IC chip. Alternatively, according to another method for arranging and fixing the minute metal spheres, the minute metal spheres are once attracted to an array substrate having a large number of holes corresponding to the electrode pad positions of the IC chip or the LSI chip, In this method, the minute metal spheres are collectively fixed from the array substrate to each electrode pad.

In recent years, the density of recent semiconductor devices has been increasing due to demands for miniaturization and higher performance.
For this reason, the electrode pad pitch has been reduced, and the fine metal spheres themselves used for the bump bonding have also been reduced. Accordingly, in the arrangement substrate of the above-described example, the pitch of the perforations has been miniaturized.

[0004]

However, in this type of manufacturing process or apparatus, as bumps, that is, fine metal spheres are miniaturized, the amount of fine metal spheres that can be processed at one time must be limited. . In other words, there is a limit to the number of pieces that can be adsorbed on the array substrate at a time and then fixed to the electrode pads having a fine pitch, and therefore, there has been a problem particularly in terms of mass productivity.

The present invention has been made in view of the above circumstances, and has as its object to provide a method and an apparatus for arranging small metal spheres which can guarantee proper alignment of such small metal spheres and greatly improve mass productivity. I do.

[0006]

According to the present invention, there is provided a method for arranging fine metal spheres, comprising the steps of: forming a flow of a carrier fluid along a predetermined flow path;
Forming a jet of the carrier fluid containing the fine metal spheres, rectifying the jet of the carrier fluid at a predetermined position in the flow path, and applying the rectified jet to the array substrate at right angles. And uniformly colliding, the step of reducing the flow velocity of the jet flow, and vacuum suction through the arrangement holes of the arrangement substrate,
Adsorbing the fine metal spheres on the arrangement holes.

[0007] The arrangement apparatus for micro metal spheres according to the present invention comprises: a carrier flow forming / controlling means for forming a carrier fluid flow along a predetermined flow path and controlling the flow state; And a micro-metal sphere supply means for supplying a micro-metal sphere to form a jet of a carrier fluid containing the micro-metal sphere, and being arranged at a predetermined position in the flow path to rectify the jet of the carrier fluid. A rectifying means configured to obtain the rectifying means, an arrangement substrate disposed at a position close to the downstream side of the rectification means, and having a number of arrangement holes opened in the flow path, and a vacuum through the arrangement holes of the arrangement substrate. And a vacuum suction means adapted to suction, wherein the jet of the carrier fluid having passed through the rectification means collides with the array substrate at right angles and uniformly.

Further, in the arrangement apparatus of the present invention, the rectifying means is configured to be movable in a direction perpendicular to the flow path. Alternatively, in the arrangement device for micro metal spheres according to the present invention, the arrangement substrate is configured to be movable in parallel with the rectification means.

Further, in the arrangement apparatus of the present invention, a plurality of the rectifying means are provided. Still further, in the arrangement apparatus of the present invention, a plurality of arrangement substrates are provided.

[0010]

According to the present invention, the flow of the carrier fluid along the predetermined flow path is formed by the carrier flow forming / controlling means, and the fine metal spheres are supplied into the carrier fluid by the fine metal sphere supply means. The jet of the carrier fluid containing the fine metal spheres
A collision is made at right angles to the array substrate, and the flow velocity is rapidly reduced. At the so-called stagnation point or branch point where the flow velocity is reduced, the fine metal spheres in the carrier fluid are sucked into the arrayed holes of the arrayed substrate by the suction of the vacuum suction means. In this case, when the jet of the carrier fluid collides with the array substrate, the rectifying means rectifies the jet to cause the carrier fluid including the fine metal spheres to collide with the array substrate at right angles and uniformly, thereby In the vicinity of the stagnation point, fine metal spheres can be stably and accurately adsorbed.

In the above case, the rectifying means can be moved in the direction perpendicular to the flow path of the carrier fluid, so that the rectified carrier fluid can collide at an optimum position with respect to the arrayed substrates. In addition, by allowing the array substrate to move in parallel with the rectifying means, an optimum positional relationship between the two can be obtained in this case as well. In any case, the fine metal spheres can be stably and accurately adsorbed.

In addition, a plurality of rectifying means or array substrates may be provided, respectively, so that the amount of fine metal spheres that can be processed collectively can be increased, thereby increasing production efficiency.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method and an apparatus for arranging fine metal spheres according to the present invention will be described below with reference to FIGS.

FIG. 1 shows an example of the overall configuration of the arrangement device according to the present embodiment. In FIG. 1, the arrangement apparatus for micro metal spheres forms a flow of a carrier fluid (arrow F) along a flow path as shown in the figure, and forms and controls a flow state of the carrier fluid. A control means 10; a micro-metal sphere supply means 20 for supplying the micro-metal sphere 1 to the carrier fluid and forming a jet of a carrier fluid including the micro-metal sphere 1;
Rectifying means 30 arranged at a predetermined position in the flow path and configured to rectify the jet of the carrier fluid; and a plurality of rectifying means 30 disposed at a position close to the downstream side of the rectifying means 30 and opening into the flow path. Array substrate 40 having an array of holes, and array substrate 4
Vacuum suction means 50 for performing vacuum suction through the array holes of 0,
It has. Below the arrangement substrate 40, an arrangement confirmation means 60 for confirming the arrangement state of the minute metal spheres 1 on the arrangement substrate 40 is arranged.

The transport flow forming / controlling means 10 generates a flow of the transport fluid by a rotating fan or the like, circulates the transport fluid along the flow path, and sets / maintains a predetermined flow rate and pressure. A gas or a liquid can be used as a carrier fluid serving as a medium of the minute metal spheres 1,
In this embodiment, an inert gas such as air or argon is preferably selected.

The minute metal sphere supply means 20 is provided in a venturi section 21 set in the flow path of the carrier fluid, and utilizes the negative pressure generated in the venturi section 21 to make the minute metal sphere 1
Is supplied into the flow path. The large number of minute metal spheres 1 accommodated in the accommodating portion 22a of the solid separation device 22 of the minute metal sphere supply means 20 float in a state of being separated from each other by ultrasonically vibrating the accommodating portion 22a.
The bellows 2 is provided between the venturi section 21 and the accommodation section 22a.
3 sealed. In addition, the venturi section 21
A mesh (mesh) 24 having an opening corresponding to the size of the small metal sphere to be taken out is attached to the supply port for supplying the small metal spheres 1 individually separated through the mesh 24. The accommodation section 22a communicates with the outside (atmospheric pressure) via the ventilation hole 22b.

The jet of the carrier fluid supplied with the fine metal spheres 1 by the fine metal sphere supply means 20 is then rectified by the rectifying means 30.
Flows into. The rectifying means 30 regulates the flow state of the carrier fluid and causes it to flow out to the array substrate 40. In the present embodiment, for example, as shown in FIG. The carrier fluid is circulated in each passage 31. One or a plurality of parallel passages 31 are provided, and the size (cross-sectional area) and the like are appropriately set in relation to the array substrate 40. The rectification means 30
The driving mechanisms 32 and 33 are connected to each other. The drive mechanism 32 moves the rectifying means 30 perpendicularly to the flow direction (arrow H).
The driving mechanism 33 is configured to move the rectifying means 30 in the vertical direction (arrow V).

The array substrate 40 is fixed and supported on a gantry 41 so as to be orthogonal to the jet of the carrier fluid. The gantry 41 is
As shown in FIG. 3, a vacuum suction hole or tube 42 is provided, and the arrangement holes 40a of the supported arrangement substrate 40 and the vacuum suction holes 42 communicate with each other. The gantry 41, and thus the array substrate 40, is configured to be freely movable in a direction perpendicular to the jet by a driving mechanism (not shown).

The vacuum suction means 50 includes a vacuum device 51. The vacuum device 51 includes a closed space 53 defined below a partition plate 52 that supports the gantry 41.
Is connected to Then, the inside of the closed space 53 is maintained in a vacuum state by the vacuum of the vacuum device 51. The partition plate 52 has an opening 53 a substantially corresponding to the gantry 41.

The arrangement confirmation means 60 has an optical system 61 disposed below the arrangement substrate 40, and a display device 62 for displaying image information obtained by the optical system 61. The optical system 61 images the arrangement state of the minute metal spheres 1 on the arrangement substrate 40 by photographing means such as a CCD camera. Therefore, members such as the arrangement substrate 40 and the gantry 41 are formed of a transparent or translucent material. .

Next, a description will be given of a method of arranging minute metal spheres using the apparatus of the present invention configured as described above. The transport flow forming / control means 10 forms the flow of the transport fluid along a predetermined flow path as shown in FIG. In this case, especially the flow rate, pressure, etc. of the carrier fluid are stably maintained in the optimum state. Next, when ultrasonic vibration is applied to a large number of small metal spheres 1 accommodated in the accommodation section 22a of the solid separation device 22, the minute metal spheres 1 floating in a state of being separated from each other in the accommodation section 22a become It is sucked by the negative pressure of 21 and supplied into the flow path. The minute metal spheres 1 are separated from each other by ultrasonic vibration. In the present embodiment, further, the fine metal spheres 1 are completely separated by passing through the mesh body 24 when being sucked upward against the gravity, and at the same time as desired. Small metal spheres having different dimensions can also be removed.

Next, the jet of the carrier fluid containing the fine metal spheres 1 supplied by the fine metal sphere supply means 20 flows into the straightening means 30. As described above, the rectifying means 30 regulates the flow state of the carrier fluid and causes it to flow out to the array substrate 40. The carrier fluid collides with the array substrate 40 at right angles and uniformly by flowing through the rectification means 30. Then, due to this collision, the flow velocity of the carrier fluid is rapidly reduced, and a stagnation point P is generated as shown in FIG.

On the other hand, vacuum suction is performed from the array holes 40a of the array substrate 40 by the vacuum suction means 50. The velocity of the minute metal sphere 1 that has reached the stagnation point P is almost zero, so that it is easily and reliably adsorbed to the arrangement holes 40a. In this case, if the rectification means 30 has a plurality of parallel passages 31, the stagnation point P is set corresponding to each of the parallel passages 31, so that a large number of the minute metal spheres 1 are adsorbed with extremely high efficiency. Can be done. In addition, since the carrier fluid is caused to collide with the array substrate 40 at right angles and uniformly for each of the parallel passages 31, the fine metal spheres 1 can be stably and accurately adsorbed.

Further, when the carrier fluid that has passed through the rectifying means 30 collides with the array substrate 40, the rectifying means 30 is appropriately moved in a direction perpendicular to the flow path of the carrier fluid, that is, in a horizontal direction, so that the fluid is rectified. The transported fluid can collide with the arrangement substrate 40 at an optimal position. By setting the stagnation point P over a wide range of the array substrate 40, the fine metal spheres 1 can be reliably and efficiently adsorbed. In this case, the arrangement substrate 40 may be appropriately moved in parallel, so that an optimal positional relationship between the rectifying means 30 and the arrangement substrate 40 can be secured.

The adsorption state of the minute metal spheres 1 on the arrangement substrate 40 is confirmed by image display by the arrangement confirmation means 60, and it is possible to easily and surely judge whether or not the adsorption state is appropriate. In addition, the inspection result based on the image information is fed back to the driving mechanisms 32 and 33 of the rectifying means 30 or the driving mechanism of the array substrate 40, so that the process of attracting the minute metal spheres 1 can be made more efficient.

Here, a liquid can be used as a carrier fluid serving as a medium for the fine metal spheres 1. FIG. 4 to FIG.
An example of the configuration of the device in this case is shown. This liquid contains
A material having a relatively small viscosity is selected and may have volatility. For example, a liquid such as acetone can be used. Note that the use of a volatile liquid is advantageous in the drying step after adsorption.

In FIG. 4, reference numeral 100 denotes a liquid tank filled with a liquid 101, and reference numeral 102 denotes a stirrer for stirring the liquid 101 in the liquid tank 100 to generate a constant convection. Liquid 1
A number of minute metal spheres 1 are mixed in 01. Liquid 1
A mesh (lattice-like body) 103 may be provided at a position near the stirrer 102 in the convection flow path 01. Reference numeral 104 denotes an array substrate, and 105 denotes a plurality of array substrates 104.
Is a suction tube that communicates with the arrangement holes 104a (see FIGS. 5 and 6) of the arrangement substrate 104, and the suction tube 106 is a drain device 10 for the liquid 101.
7 and connected to the suction pump 108. The drain device 107 is provided with the liquid 101 sucked from the array hole 104a.
Can be stored.

The minute metal spheres 1 convection in the liquid tank 100 are:
When passing or approaching near the array substrate 104,
Vacuum of the suction pump 108 causes suction at the array hole 104a via the suction tube 106 (FIG. 6). In this case, by providing the mesh 103 as described above, the minute metal spheres 1 passing therethrough can be completely separated individually, whereby the minute metal spheres 1 can be appropriately adsorbed in the arrangement holes 104a. . Even when the liquid 101 is used as the carrier fluid as in this example, a large number of minute metal spheres 1 can be efficiently adsorbed by the plurality of arrayed substrates 104, and high production efficiency can be secured.

[0029]

As described above, according to the present invention, it is possible to adsorb a large amount of such fine metal spheres collectively and accurately at a time and arrange them at desired positions on the substrate, thereby improving production efficiency. It can be significantly improved. Further, even when the miniaturization is advanced, it is possible to effectively cope with this, and it has advantages such as achieving an excellent mass production effect while guaranteeing high accuracy.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of the overall configuration of an embodiment of a device for arranging small metal spheres according to the present invention.

FIG. 2 is a partial perspective view of a rectifying unit according to the arrangement device for micro metal spheres according to the present invention.

FIG. 3 is a partial cross-sectional view showing a structure around a rectifying means and an operation thereof in the arrangement apparatus for micro metal spheres according to the present invention.

FIG. 4 is a view showing a modified example of the arrangement device for fine metal spheres according to the present invention.

FIG. 5 is a view showing an arrangement substrate according to the modification of the arrangement device for micro metal spheres according to the present invention.

FIG. 6 is a partial cross-sectional view showing a state of adsorbing minute metal spheres in the above modified example of the arrangement apparatus for minute metal spheres according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Micro metal sphere 10 Conveyance flow formation and control means 20 Micro metal sphere supply means 21 Venturi part 22 Solid separation device 22a Housing part 23 Bellows 24 Net-like body 30 Rectification means 31 Parallel passage 40 Array substrate 41 Mount 42 Vacuum suction hole 50 Vacuum suction Means 51 Vacuum device 52 Separator plate 53 Closed space 60 Array checking means 61 Optical system 62 Display device 100 Liquid tank 101 Liquid 102 Stirrer 103 Mesh 104 Array substrate 106 Suction tube 107 Drain device

Claims (6)

(57) [Claims] 1. A step of forming a flow of a carrier fluid along a predetermined flow path, and a step of supplying fine metal spheres to the carrier fluid and forming a jet of the carrier fluid containing the fine metal spheres Rectifying the jet of the carrier fluid at a predetermined position in the flow path; and causing the rectified jet to collide with the array substrate at right angles and uniformly to reduce the flow velocity of the jet. Vacuum-suctioning through the arrangement holes of the arrangement substrate, and adsorbing the minute metal spheres in the arrangement holes. 2. A transport flow forming / controlling means for forming a flow of a transport fluid along a predetermined flow path and controlling a flow state thereof, and supplying fine metal spheres to the transport fluid. Micro metal sphere supply means for forming a jet of a carrier fluid containing the micro metal spheres; rectifying means arranged at a predetermined position in the flow path and configured to rectify the jet of the carrier fluid; An array substrate having a number of array holes that are arranged at a position close to the downstream side of the rectifying unit and open in the flow path; and a vacuum suction unit configured to perform vacuum suction through the array holes of the array substrate. Wherein the jet of the carrier fluid having passed through the flow straightening means is made to collide with the array substrate at right angles and uniformly. 3. The arrangement of minute metal spheres according to claim 2, wherein the rectifying means is configured to be movable in a direction orthogonal to the flow path. apparatus. 4. The arrangement device for micro metal spheres according to claim 2, wherein the arrangement substrate is configured to be movable in parallel with the rectification means. . 5. The arrangement device for micro metal spheres according to claim 2, wherein a plurality of said rectification means are provided. 6. The arrangement apparatus for micro metal spheres according to claim 2, wherein the arrangement apparatus includes a plurality of arrangement substrates.