JP3279143B2 - Packaging equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging device for electronic components used for packaging various electronic components.

[0002]

2. Description of the Related Art In recent years, packaging for electronic parts has been required to not only protect during transportation, but also to automatically accommodate large-sized irregular parts such as transformers and to automatically take out and supply them.

[0003] A conventional electronic component packaging apparatus will be described below. FIG. 19 is an exploded perspective view of a conventional electronic component packaging apparatus, FIG. 20 is a perspective view of the electronic component packaging apparatus, and FIG.
FIG. 4 is a perspective view showing a mode of the electronic component packaging apparatus when electronic components are automatically taken out and supplied. 19 to FIG.
Denotes an electronic component such as a transformer, and 2 denotes a buffer tray which is formed of a synthetic resin such as styrene foam and has a recess 3 for accommodating the electronic component 1. 4 is an outer cardboard box, 5 is a flap of the outer cardboard box 4, 6 is a reference point of the buffer tray 2, 7
Is the position of the electronic component 1. The electronic components 1 are housed in the recesses 3 of the buffer tray 2, respectively, and the buffer tray 2 is placed in an outer cardboard box 4, and the flap 5 is closed and packed.

[0004] Referring to FIG. 21, the automatic removal and supply of electronic components of the electronic component packaging apparatus will be described.

[0005] When automatically taking out and supplying the electronic component 1 by a robot, first, an operator takes out the buffer tray 2 from the outer cardboard box 4 and supplies the buffer tray 2 to the robot.
The positioning of the position 7 between the robot and the electronic component 1 is defined by coordinates (X1, Y1) from the reference point 6 of the buffer tray 2, and the robot chucks the electronic component 1 and supplies it based on the coordinates.

[0006]

However, in the above-mentioned conventional configuration, there is a gap between the outer cardboard box 4 and the buffer tray 2 so that the electronic component 1 cannot be accurately positioned.
It is necessary for an operator to take out the buffer tray 2 from the outer cardboard box 4 and supply it to the robot, which is inefficient in work efficiency. When the electronic component 1 is heavy with a transformer or the like, the strength of the buffer tray 2 is required and the packaging cost is reduced. As the cost increases, the burden on the worker increases. Buffer tray 2 that is also stored
Further, there is a problem that the buffer trays 2 cannot be stacked and supplied to the robot because a part of the electronic component 1 is exposed.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and accurately determines the position of an electronic component with respect to an outer box, copes with automatic removal and supply in a state where the electronic component is placed in the outer box. To automatically supply robots, reduce the burden on workers and increase work efficiency, and respond to the weight of electronic components to be stored. The present invention provides a packaging device for electronic parts.

[0008]

SUMMARY OF THE INVENTION In order to solve this problem, an electronic component packaging apparatus according to the present invention comprises a tray-shaped outer box formed of corrugated cardboard having four side walls and a bottom wall. The outer panel, the upper panel, and the inner panel, which are continuous, are bent into a U-shape to form a cylinder with the panel and the bottom wall,
Also the Goana fitted inside plate of two pairs of opposing side walls provided with a hole in the outer plate of the two pairs of side walls you opposing provided, corresponding to the fitting hole on the outer surface of the synthetic resin buffer tray for interior Protrusions are provided and fitted into the fitting holes .
When the buffer tray is provided with a recess for storing electronic components
In both cases, the hole and the fitting hole and the mating hole provided in the outer box are provided.
Protrusions provided on the synthetic resin buffer tray are provided two by two,
So that the two fitting holes correspond between the two holes
Each was placed and provided on a synthetic resin buffer tray
Two projections are arranged to correspond to the depressions
And, it has a structure in which the two protrusions are fitted into the two fitting holes .

[0009]

With this structure, the side wall of the outer box is formed in a cylindrical shape to improve the strength, the outer box can be stacked on the upper side plate, and the holding jig is inserted into the hole of the outer plate on the opposing side wall. By lifting the boxes, the outer boxes can be stacked and unloaded by the robot. In addition, the protrusion on the outer surface of the buffer tray is fitted into the fitting hole of the inner plate on the side wall, so that the position of the electronic components stored in the buffer tray can be accurately determined with respect to the outer box. Supply becomes possible, and the burden on the worker can be reduced and the working efficiency can be increased. Also, the weight of the electronic component can be supported by the outer box, and it is not necessary to increase the strength of the buffer tray.

[0010]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an electronic component packaging apparatus according to a first embodiment of the present invention, and FIGS. 2A to 2D are four views of an outer box of the electronic component packaging apparatus. 3 is a sectional view taken along line YY 'of the buffer tray. 1 to 3, reference numeral 11 denotes a tray-shaped outer box made of cardboard, 1
2 is a buffer tray made of synthetic resin such as polypropylene,
Reference numeral 13 denotes an electronic component such as a transformer, and the buffer tray 12 is housed in the outer box 11 and stores the electronic component 13.

The structure of the outer box 11 and the buffer tray 12 will be described in detail. 1 and 2, reference numeral 14 denotes a side wall of the outer box 11, and 15 denotes a bottom wall. Side wall 14 is bottom wall 15
And an upper side plate 17 and an inner plate 18 which are bent into a U-shape to form a cylindrical side wall 14 with a bottom wall 15. Reference numeral 19 denotes a hole, and one or more pairs are provided in the outer plate 16 of the side wall 14 facing the hole. 2
Reference numerals 0 are provided in the inner plates 18 of the two sets of side walls 14 facing each other in the fitting holes, respectively, in one or more pairs.

As shown in FIGS. 1 and 3, the buffer tray 1
Reference numeral 2 denotes a sheet made of a synthetic resin such as polypropylene or polystyrene formed by heating and vacuum forming. Reference numeral 21 denotes a recess for accommodating the electronic component 13. Reference numeral 22 denotes a protrusion provided on the outer surface 23 of the buffer tray 12 at a position corresponding to the fitting hole 20 of the outer box 11.

FIG. 4 is a perspective view showing a state in which the buffer tray 12 is housed in the outer box 11. The protrusion 22 of the buffer tray 12 and the fitting hole 20 of the outer box 11 are fitted by a fitting portion 24. A buffer tray 12 is housed in an outer box 11 to accommodate electronic components 13.

The automatic removal and supply of the electronic components 13 of the packaging device for electronic components configured as described above will be described with reference to FIGS.

As shown in FIG. 4, the protrusions 22 of the buffer tray 12 in the X-axis direction and the Y-axis direction are fitted in the fitting holes 20 of the outer box 11, and the buffer tray 12 is housed in the outer box 11. The electronic component 13 can be accurately positioned with respect to the outer case 11. The position 25 of the electronic component 13 with respect to the outer case 11 can be determined as a (X2, Y2) coordinate from the reference point 26 of the outer case 11, and the robot can chuck the electronic component 13 based on the coordinates and take out and supply. it can.

FIG. 5 is a plan view showing the stacking of the outer boxes 11 by the robot. As shown in FIG. 5A, the side wall 14 of the outer box 11 is formed in a cylindrical shape, and the outer box 11 is stacked on the upper side plate 17 thereof. Opposite side wall 1 of outer box 11 at the lower stage
The holding jig 28 is inserted into the hole 19 provided in the outer plate 16
As shown by arrows from both sides and lift it up from the conveyor 27. Next, the outer box 1 lifted as shown in FIG.
1, the outer box 11 is newly supplied by the conveyor 27, the holding jig 28 is lowered, and the outer box 11 is piled up as shown in FIG. Remove from 11. The loading and unloading of the outer box 11 may be performed in the reverse of the above stacking.

As described above, according to the present embodiment, the side wall 14 of the outer box 11 is connected to the bottom wall 15 by the outer plate 16 and the upper side plate 17.
By bending the three panels of the inner plate 18 into a U-shape to form a cylindrical shape, the strength of the side wall 14 can be improved, and the outer box 11 can be stacked on the upper side plate 17. Further, by providing the hole 19 of the outer plate 16 of the opposing side wall 14, the holding jig 28 can be inserted into the hole 19 and the outer box 11 can be lifted.
1 can be stacked and unloaded. By fitting the protrusions 22 on the outer surface 23 of the buffer tray 12 into the fitting holes 20 of the inner plate 18 of the side wall 14 of the outer box 11, the position of the electronic components 13 stored in the buffer tray 12 is moved to the outer box 11. In contrast, the robot can be accurately determined, and can be automatically stored and automatically taken out and supplied by the robot, so that the burden on the worker can be reduced and the working efficiency can be improved. In addition, the outer case 11 can support the weight of the electronic component 13, so that the strength of the buffer tray 12 does not need to be increased.

(Embodiment 2) A second embodiment of the present invention will be described below with reference to the drawings. FIG. 6 is an exploded perspective view of an electronic component packaging apparatus according to a second embodiment of the present invention,
FIGS. 7A to 7D show the outer box 4 of the electronic component packaging apparatus.
FIG. 6 and 7, reference numeral 11 denotes an outer box;
Is a buffer tray, 13 is an electronic component, 14 is a side wall, 15 is a bottom wall, and 16 is an outer plate of the side wall 14, which is the same as those in FIGS. 1 and 2 is that the hole 30 is provided so as to be continuous from the outer plate 16 of the side wall 14 to the bottom wall 15.

The stacking of the outer boxes 11 by the robot of the electronic component packaging apparatus configured as described above will be described with reference to FIG.

FIG. 8 is a plan view showing the stacking of the outer boxes 11 by the robot. 31 is a holding jig, 32 is a holding portion of the holding jig 31, 33 is a stopper of the holding portion 32,
The holding unit 32 rotates upward as shown in FIG.

As shown in FIG. 8A, the holding portion 32 of the holding jig 31 is inserted into the hole 30 of the outer case 11, and the outer case 11 is moved to the conveyor 27.
When lifted from the outer wall 16, the hole 30
The holding jig 31 can be inserted into the hole 30 without opening and closing in the horizontal direction. Then, the outer box 11 is newly supplied by the conveyer 27 under the outer box 11 lifted as shown in FIG. 8B, the holding jig 31 is lowered, and the outer boxes 11 are stacked as shown in FIG. 8C. If the holding jig 31 is lowered, the holding portion 32 rotates in the direction of the arrow, and the holding jig can be removed from the outer box 11 without opening and closing in the horizontal direction.

As described above, the hole 30 is provided so as to continue from the outer plate 16 of the side wall 14 of the outer box 11 to the bottom wall 15 so that the holding jig 31 can be used to lift the outer box 11 from the conveyor 27. 31 can be inserted into the hole 30 only by the vertical movement without opening and closing in the horizontal direction, so that the mechanism for stacking the outer boxes 11 of the robot can be simplified, the cost of the robot equipment can be reduced, and the work efficiency can be improved.

(Embodiment 3) A third embodiment of the present invention will be described below with reference to the drawings. FIG. 9 is an exploded perspective view of a packaging device for electronic components according to a third embodiment of the present invention,
FIGS. 10A to 10D are outer boxes 1 of the electronic component packaging apparatus.
11 is an enlarged view of a projection 34 provided on the side wall 14 of the outer box 11, and FIG. 12 is a perspective view showing the stacking of the outer box 11. 9 and 10, reference numeral 11 denotes an outer box;
Is a buffer tray, 13 is an electronic component, 14 is a side wall, 15 is a bottom wall, and 17 is an upper side plate of the side wall 14 and has the same configuration as that of FIGS. 1 and FIG. 2 is different from the configuration of FIG. 1 and FIG.
4 and a point where an engagement hole 35 corresponding to the projection 34 is provided on the bottom wall 15.

When the outer boxes 11 are stacked by the above-described structure, the triangular projections 34 provided on the upper side plate 17 of the side wall 14 of the outer box 11 and the bottom plate 15 of the outer box 11 mounted thereon as shown in FIG. The provided engagement holes 35 can be engaged,
The displacement of the stacked outer boxes 11 in the X-axis direction and the Y-axis direction can be prevented, and the triangular projections 34 serve as a guide when the outer boxes 11 are overlapped, so that the outer boxes 11 can be accurately stacked.

(Embodiment 4) A fourth embodiment of the present invention will be described below with reference to the drawings. FIG. 13 is a perspective view in which outer boxes 11 of an electronic component packaging apparatus according to a fourth embodiment of the present invention are stacked, FIG. 14 is a completed perspective view of the electronic component packaging apparatus, and FIG. 15 is an electronic component packaging apparatus. It is a development view of the cardboard case. 13 and FIG.
Is an outer box, 13 is an electronic component, 14 is a side wall, 17 is a side wall 14
The upper side plate 34 is a triangular projection provided on the upper side plate 17 and has the same configuration as that of FIG.
1 is stacked in three stages.

The difference from FIG. 12 is that the outer case 11
1 is wound around a corrugated cardboard case 36. FIG.
This will be described in detail with reference to FIGS. FIG. 15 is a development view of the cardboard case 36. 37 is a hooking line inserted according to the dimensions of FIG. 13, 38 is a top surface portion serving as a lid of the outer box 11,
Reference numeral 39 denotes a side wall 14 of the outer box 11 shown in FIG.
Are the engagement holes corresponding to the triangular protrusions 34 provided on the upper side plate 17 of FIG. The corrugated cardboard case 36 is wound around the outer box 11 stacked in three stages as shown in FIG. 14, and the engaging portion 40 engages the engaging hole 39 with the projection 34 of the outer box 11, and is packed.

With the above-described structure, as shown in FIG. 14, the stacked outer boxes 11 are wound around the cardboard case 36, and the engaging portions 40 engage the engaging holes 39 with the projections 34 of the outer box 11. Outer box 1 for cardboard case 36 during transportation
1 can be prevented from shifting in the X-axis direction and the Y-axis direction, and the stored electronic components 13 can be prevented from being damaged, and the performance and reliability of the electronic component packaging apparatus can be improved.

(Embodiment 5) Hereinafter, a fifth embodiment of the present invention will be described with reference to the drawings. FIG. 16 is an exploded perspective view of a packaging device for electronic components according to a fifth embodiment of the present invention, and FIG. 17 is a perspective view of the packaging device for electronic components. 16 and 17, reference numeral 12 denotes a buffer tray, reference numeral 13 denotes an electronic component, reference numeral 21 denotes a concave portion of the buffer tray 12, and reference numeral 22 denotes a projection, which are the same as those in FIGS.

The difference from FIGS. 1 and 4 is that the outer case 41 is formed of a synthetic resin, which will be described in detail with reference to FIGS. 41 is an outer box formed by blow molding or the like of a synthetic resin such as polypropylene, 42 is a side wall, 43 is a bottom wall, and the side wall 42 is composed of an outer side surface 44, an upper side surface 45, and an inner side surface 46. 47 are provided as one or more pairs on the outer side surface 44 of the side wall 42 facing the recess. 48 is an inner surface 4 of two sets of side walls 42 which are opposed by fitting grooves.
6 is provided with one or more pairs.

With the above configuration, the same effect as that of the first embodiment can be obtained, and the strength and durability of the outer box can be greatly improved by molding the outer box 41 with a synthetic resin such as polypropylene. It can handle heavy electronic components 13 and can be made returnable as a returnable box.

FIG. 18 shows an example of a development view of the outer box 11 having the structure of the second embodiment.

[0033]

(1) An outer plate connecting the side wall of the outer box to the bottom wall,
By forming the three panels of the upper side plate and the inner side plate into a U-shape and forming a cylindrical shape, the strength of the side wall can be improved, and the outer box can be stacked on the upper side plate.
By providing holes in the outer side plates of the opposing side walls, the outer boxes can be stacked and unloaded by the robot.

(2) The position of the electronic components housed in the buffer tray is accurately determined with respect to the outer box by fitting the projection on the outer surface of the buffer tray into the fitting hole of the inner plate on the side wall of the outer box. This enables automatic storage and automatic removal and supply by the robot, thereby reducing the burden on the worker and improving the work efficiency. In addition, the weight of the electronic component can be supported by the outer box, and it is not necessary to increase the strength of the buffer tray.

(3) By providing a hole so as to be continuous from the outer plate on the side wall of the outer box to the bottom wall, when lifting the outer box with a robot, the holding jig can be opened and closed only horizontally without opening and closing horizontally. Since it can be inserted into the hole, the mechanism for stacking the outer boxes of the robot can be simplified, the cost of the robot equipment can be reduced, and the work efficiency can be improved.

(4) Triangular protrusions are provided on the upper side plate of the side wall, and engaging holes corresponding to the protrusions are provided on the bottom wall, so that the stacked outer boxes can be shifted in the X-axis direction and the Y-axis direction. And the triangular projections serve as a guide when the outer boxes are overlapped, and the outer boxes can be accurately stacked.

(5) By winding the cardboard case around the outer box and engaging the engaging hole with the projection (E) of the outer box at the engaging portion, the X of the outer box with respect to the cardboard case during transportation can be obtained. The displacement in the axial direction and the Y-axis direction can be prevented, the damage of the stored electronic components can be prevented, and the performance and reliability of the electronic component packaging device can be improved.

(6) By molding the outer box with a synthetic resin, the strength and durability of the outer box can be greatly improved, the heavier electronic component 13 can be handled, and the returnable box can be used.

As described above, a great effect is produced, a high-level packaging of electronic components can be realized, and a low-cost, high-performance electronic component capable of responding to market needs for automatic storage and automatic supply of electronic components. It can provide packaging equipment for industrial use and has great industrial value.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an electronic component packaging apparatus according to a first embodiment of the present invention.

2A is a top view showing four sides of an outer box of the electronic component packaging apparatus, FIG. 2B is a side view thereof, FIG. 2C is a front view thereof, and FIG.

FIG. 3 is a Y-Y 'of a buffer tray of the electronic component packaging apparatus.
Cross section in

FIG. 4 is a perspective view showing a state in which a buffer tray is installed in an outer box of the electronic component packaging apparatus.

5A is a plan view showing a state in which the holding jig of the robot according to the first embodiment is inserted into an outer box. FIG. 5B is a diagram illustrating a state in which the outer box is lifted by the holding jig of the robot according to the first embodiment. (C) A plan view showing a state in which the holding jig of the robot according to the first embodiment is lowered and the outer boxes are stacked.

FIG. 6 is an exploded perspective view of an electronic component packaging apparatus according to a second embodiment of the present invention.

7A is a top view showing four sides of an outer box of the electronic component packaging apparatus, FIG. 7B is a side view thereof, FIG. 7C is a front view thereof, and FIG.

FIG. 8A is a plan view showing a state in which the holding jig of the robot according to the second embodiment is inserted into an outer box. FIG. (C) A plan view showing a state in which the holding jig of the robot according to the third embodiment is lowered and outer boxes are stacked.

FIG. 9 is an exploded perspective view of an electronic component packaging apparatus according to a third embodiment of the present invention.

10A is a top view showing four sides of an outer box of the electronic component packaging apparatus, FIG. 10B is a side view thereof, FIG. 10C is a front view thereof, and FIG. 10D is a bottom view thereof.

FIG. 11 is an enlarged view of a projection provided on a side wall of an outer box of the electronic component packaging apparatus.

FIG. 12 is a perspective view showing stacking of outer boxes of the electronic component packaging apparatus.

FIG. 13 is a perspective view in which outer boxes of an electronic component packaging apparatus according to a fourth embodiment of the present invention are stacked.

FIG. 14 is a completed perspective view of the electronic component packaging apparatus.

FIG. 15 is an exploded view of a cardboard case of the electronic component packaging apparatus.

FIG. 16 is an exploded perspective view of an electronic component packaging apparatus according to a fifth embodiment of the present invention.

FIG. 17 is a perspective view of the electronic component packaging apparatus.

FIG. 18 is a development view of an outer box having a structure according to the second embodiment of the present invention.

FIG. 19 is an exploded perspective view of a conventional electronic component packaging apparatus.

FIG. 20 is a perspective view of the electronic component packaging apparatus.

FIG. 21 is a perspective view showing a form of the electronic component packaging apparatus when electronic components are automatically taken out and supplied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Outer box 12 Buffer tray 13 Electronic component 14 Side wall 15 Bottom wall 16 Outer plate 17 Upper side plate 18 Inner plate 19 Hole 20 Fitting hole 22 Projection 23 Outer side surface 30 Hole 34 Projection 35 Engagement hole 36 Cardboard case 38 Top surface section 39 Mating hole 41 Outer box 42 Side wall 43 Bottom wall 44 Outer surface 45 Upper side surface 46 Inner surface 47 Depression 48 Fitting groove

──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model Hei 7-11591 (JP, U) Registered utility model 3010338 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B65D 85 / 86 B65D 5/497

Claims (4)

(57) [Claims] 1. A plastic resin buffer tray is provided inside an outer box.
Regarding a packaging device for protecting and storing contents, four side walls and a bottom wall
The tray-like outer side wall made of cardboard made of
Three panels: an outer panel, an upper panel, and an inner panel connected to the wall
Bends into a U-shape and forms a tubular shape with the panel and bottom wall
And if holes are provided in the outer plates of the two sets of opposing side walls,
Fitting holes are provided in the inner plates of the two sets of side walls facing each other
Facing the fitting hole on the outer surface of the synthetic resin buffer tray
Projections, which fit into the fitting holes, and are made of synthetic resin
If the opposing tray is provided with a recess for storing electronic components
In addition, the hole and the fitting hole provided in the outer box and the composite
Two protrusions are provided on the resin buffer tray, and two protrusions are provided.
Between the two holes so that the two fitting holes correspond to each other.
2 placed on the synthetic resin buffer tray
Arranging the protrusions so as to correspond to the recesses,
The two projections are fitted into the two fitting holes.
Electronic parts packaging apparatus. 2. A packaging device in which a buffer tray made of synthetic resin is housed in an outer box to protect and store contents therein, and a tray-shaped outer side wall formed of cardboard having four side walls and a bottom wall is connected to the bottom wall. The outer panel, the upper side panel, and the inner panel are bent in a U-shape to form a cylindrical shape with the panel and the bottom wall, and at least one pair of holes are formed in the outer panel of at least one pair of opposed side walls. At least one pair of fitting holes is provided on the inner plates of the two sets of side walls facing each other, and a projection facing the fitting hole is provided on the outer surface of the interior synthetic resin buffer tray, and the fitting hole is fitted. At the top of the four side walls of the outer box
At least one triangular protrusion is provided on the upper side plate,
An electronic component packaging apparatus having a configuration in which an engagement hole corresponding to the projection is provided on a wall . 3. The method according to claim 1, wherein the package is pre-deployed in accordance with the outer box of the packaging device.
The outer box of the cardboard case
Triangular projections on the upper side plate at the upper end of the four side walls
Corresponding engagement holes are provided to engage the protrusions and the outer box
The packaging device for an electronic component according to claim 1 , wherein the packaging device is wound around the electronic component. 4. The method of claim 1, wherein at least one pair of opposing side walls of the outer box is provided.
2. An outer plate having at least one pair of holes connected to a bottom wall portion.
Electronic device packaging device as described in the above .