JP3280353B2 - Test stage unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test stage unit and, more particularly, to a technique which is effective when applied to handling of a socket to which a semiconductor integrated circuit device is mounted while being fixed to the test stage unit.

[0002]

2. Description of the Related Art There is a burn-in process as an inspection process for removing a semiconductor integrated circuit device which causes a failure depending on time and stress due to inherent defects and manufacturing variations. In the burn-in step, the semiconductor integrated circuit device is operated for a certain period of time under a heating condition of, for example, about 125 ° C. while applying a rating or a voltage higher than the rating by 10 to 20% to perform screening. An apparatus that performs the burn-in process is a burn-in apparatus.

In the burn-in process, a simple test is performed on a completed semiconductor integrated circuit device using a test stage unit, which is an insertion / extraction device having a built-in tester, and the semiconductor integrated circuit device that passes this test is screened by a burn-in device. Thus, there is a tendency to increase the efficiency of burn-in inspection.

A socket is fixed to the test stage unit, and a test signal is sent from a tester in a state where the semiconductor integrated circuit device is mounted on the socket.

Here, the socket is attached to the stage body of the test stage unit in any of the following three types.

A first mounting mode is a mode in which a screw hole is formed in a socket and the socket is screwed to a stage body. In the second mounting mode, a probe provided on the stage body is used as a through-hole pin (a probe having a fine hole formed in a length direction from one end), and a lead mounted on a socket is passed through the through-hole pin. This is a mode of fitting with a hole pin. In the third mounting mode, a dedicated board is manufactured and fixed to the stage body, and the lead of the socket is soldered to the board.

[0007]

As described above, in the test stage unit, since the semiconductor integrated circuit device is mounted via the socket, the socket is a consumable to which the semiconductor integrated circuit device can be inserted and removed. Therefore, since the frequency of replacement of the socket is increased, it is required that the socket can be easily attached and detached.

In addition, since it is necessary to electrically connect the tester and the semiconductor integrated circuit device, the lead of the socket must be able to reliably contact the probe of the stage body.
Therefore, it is required that the socket be attached to the stage body with high accuracy.

Here, in the first mounting mode, since the socket is screwed to the stage main body, the screw must be tightened or removed every time the socket is attached and detached, and the attaching and detaching work is troublesome.

In the second mounting mode, since the lead of the socket is fitted to the through-hole pin, the lead can be fitted to the through-hole pin even if the positional relationship between them is slightly deviated. Without any damage.

In the third mounting mode, since the leads are soldered to the board, not only the mounting work is troublesome, but also the socket may be shifted with respect to the board during the soldering process. Therefore, it is difficult to attach with high accuracy. Further, since the socket must be detached by melting the solder or integrally with the substrate, the detaching operation is troublesome.

Accordingly, an object of the present invention is to provide a test stage unit capable of easily performing a socket replacement operation.

Another object of the present invention is to provide a test stage unit capable of attaching a socket to a stage main body with high accuracy.

It is another object of the present invention to provide a test stage unit which can be mounted on a stage body without damaging socket leads.

[0015]

In order to solve the above-mentioned problems, a test stage unit according to the present invention comprises a stage main body having a plurality of probes electrically connected to a tester, A socket guide that fits a socket to which an integrated circuit device can be attached and contacts a plurality of leads attached to the socket with a probe corresponding to the lead, and a socket guide that is arranged at a position sandwiching the probe and facing the probe. It is formed to be bent so that it can approach and separate from each other in the socket guide,
At the approach position, sandwich the socket fitted to the socket guide and press and fix this socket in the direction of the probe,
It has a pair of leaf springs for releasing the fixing of the socket at the separation position, and a leaf spring moving means for moving the pair of leaf springs toward and away from each other.

According to the invention, since the socket is fixed and released by operating the leaf spring moving means, it is not necessary to attach and detach the socket using a dedicated tool.
The socket can be easily replaced.

Further, the socket is positioned by the socket guide, and the socket is sandwiched and fixed by the leaf spring from both sides. At this time, the leaf spring is further bent and deformed in the direction of the probe, and the socket is pressed in the direction of the probe. Therefore, the socket can be attached to the stage body with high accuracy.

Further, since the socket is positioned by the socket guide and the lead comes into contact with the probe, the lead does not break when the socket is mounted on the stage body.

[0019]

Embodiments of the present invention will be described below more specifically with reference to the drawings. Here, the same reference numerals are given to the same members in the attached drawings,
In addition, duplicate description is omitted. The embodiments of the present invention are particularly useful forms in which the present invention is implemented, and the present invention is not limited to the embodiments.

FIG. 1 is a perspective view showing a test stage unit according to an embodiment of the present invention together with a socket.
1 is a perspective view showing the test stage unit of FIG. 1 in a state where a socket is mounted, FIG. 3 is an exploded perspective view showing the test stage unit of FIG. 1, and FIG. 4 is a test stage of FIG. FIG. 5 is a plan view showing the internal structure of the unit, FIG. 5 is a cross-sectional view taken along the line V-V of FIG. 4, FIG. 6 is a plan view showing the internal structure of the test stage unit of FIG.
FIG. 7 is a sectional view taken along line VII-VII in FIG.

Test stage unit 1 of the present embodiment
Reference numeral 0 indicates that a simple electrical test is performed on a completed semiconductor integrated circuit device (not shown) prior to inspection by a burn-in device. As shown in FIGS. 1 and 2, such a test stage unit 10 is provided with a socket 11 on which a semiconductor integrated circuit device to be tested can be mounted, and a lever (leaf spring moving means) 12 opened outward. By closing, the socket 11 is fixed. Then, a test signal is sent from the tester to the semiconductor integrated circuit device while being mounted on the socket 11.

However, the present invention is not limited to the test stage unit 10 used in the burn-in process, but can be applied to various test stage units to which a socket for mounting a semiconductor integrated circuit device is attached.

As shown in detail in FIG.
A plurality of probes 14 that are electrically connected to a tester (not shown) are attached to 3 via a contact base 15.

A socket 11 on which a semiconductor integrated circuit device is mounted is fitted and positioned on the stage main body 13.
A socket guide 16 for bringing the plurality of leads 19 attached to the socket into contact with the probe 14 corresponding to the leads 19 is fixed. The socket guide 16 has a pair of leaf springs 17 for fixing the socket 11.
Are formed so as to be bent toward the probe 14 arranged at a position sandwiching the leaf spring 17 so that they can approach and separate from each other. The socket guide 16 includes a leaf spring 1.
A regulating groove 18 is formed to regulate the sides of the plate 7 and guide the leaf springs 17 toward and away from each other.

When the leaf spring 17 moves to the approaching position along the regulating groove 18, the socket 11 which is positioned by the socket guide 16 and in which the lead 19 and the corresponding probe 14 are in contact is sandwiched by the leaf spring 17. Fixed. When the leaf spring 17 moves to the separated position along the regulating groove 18, the fixing of the socket 11 is released.

The above-described lever 12 is attached to move such a leaf spring 17 toward and away from it. Therefore, by closing the lever 12, the leaf springs 17 approach each other to fix the socket 11. Conversely, when the lever 12 is opened, the leaf springs 17 separate from each other, and the fixing of the socket 11 is released.

As shown, the lever 12 is rotatably mounted on a pivot 20 of the socket guide 16, and the lever 12 is rotated by a predetermined distance from the pivot 20. A protrusion 21 that rotates while being held is formed.

A first spring 17 extends in the direction of movement of the leaf spring 17 and engages with a pivot 20 of the lever 12.
And a second guide groove 23 extending in a direction orthogonal to the moving direction of the leaf spring 17 and engaging with the projection 21 of the lever 12.

Therefore, when the lever 12 is rotated in the closing direction, the projection 21 moves in the second guide groove 23 while rotating in the direction of the socket 11. At the same time, the first guide groove 22 moves while being restricted by the pivot 20. As a result, the leaf springs 17 move in directions approaching each other while being guided by the regulating grooves 18. When the lever 12 is rotated in the opening direction, the operation reverse to that described above is reproduced, and the leaf springs 17 move in directions away from each other.

The mechanism for moving the leaf spring 17 is not limited to the one shown in the present embodiment. For example, a mechanism for moving the leaf spring 17 toward or away from the leaf spring 17 by sliding the lever 12 may be used. , Various mechanisms can be adopted.

In order to prevent the leaf spring 17 from coming off from the regulating groove 18 and the lever 12 from coming off from the rotation fulcrum 20, a cover 24 is screwed to the socket guide 16 leaving a space for fitting the socket 11. ing.

According to such a test stage unit 10, as shown in FIGS. 4 and 5, the leaf springs 17 are separated from each other by the lever 12, and the socket 11 is fitted to the socket guide 16. Let it. As a result, the socket 11 is positioned by the socket guide 16, and the lead 19 contacts the corresponding probe 14. The probe 14 is displaced in the length direction against the resilience of a spring (not shown) provided inside by the contact operation between the lead 19 and the probe 14.

Then, the lever 12 is turned to rotate the leaf spring 17.
6 and 7, the socket guide 1 is elastically deformed by the leaf spring 17 as shown in FIGS.
6 is sandwiched and fixed from both sides, and the leaf spring 17 is further bent and deformed toward the probe 14 (FIG. 5 showing the leaf spring 17 when the socket 11 is not sandwiched). 7 and FIG. 7 showing the leaf spring 17 when the socket 11 is sandwiched) (see the difference in the bending angle). Therefore, when the socket 11 is pressed in the direction of the probe 14, the lead 19 of the socket 11 Is contacted.

Further, the lever 12 is rotated to move the leaf spring 17.
When the is moved to the separated position, the state returns to the state shown in FIGS. 4 and 5, and the fixing of the socket 11 is released.

As described above, according to the present embodiment, the socket 11 is fixed and released by operating the lever 12, so that the socket 11 can be easily replaced.

According to the present embodiment, the socket 1
1 is positioned by the socket guide 16 and the socket 11 is sandwiched and fixed by the leaf spring 17 from both sides. At this time, the leaf spring 17 is further bent and deformed toward the probe 14 so that the socket 11 moves in the direction of the probe 14. Since the lead 19 contacts the probe 14 in a pressed state, the socket 11 can be attached to the stage body 13 with high accuracy.

Further, according to the present embodiment, since the socket 11 is positioned by the socket guide 16 and the lead 19 contacts the probe 14, there is no need to use a through-hole pin as the probe 14, and the socket 11
The lead 19 is not damaged when the lead 19 is attached to the stage body 13.

Since the leaf spring 17 is bent toward the probe 14, the socket 11 sandwiched between the leaf springs 17 is securely fixed to the stage body 13 while being pressed in the direction of the probe 14. Will be.

[0039]

As apparent from the above description, the following effects can be obtained according to the present invention.

(1) Since the socket is fixed and released by operating the leaf spring moving means, there is no need to attach and detach the socket using a dedicated tool, and the socket can be easily replaced. .

(2) The socket is positioned by the socket guide, and the socket is sandwiched and fixed by the leaf spring from both sides. At this time, the leaf spring is further bent and deformed toward the probe, and the socket is moved in the direction of the probe. Since the lead contacts the probe in a pressed state, the socket can be attached to the stage body with high accuracy.

(3) Since the socket is positioned on the socket guide and the lead comes into contact with the probe, the lead does not break when the socket is mounted on the stage body.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a test stage unit according to an embodiment of the present invention together with a socket.

FIG. 2 is a perspective view showing the test stage unit of FIG. 1 in a state where a socket is mounted.

FIG. 3 is an exploded perspective view sectional view showing the test stage unit of FIG. 1;

FIG. 4 is a plan view showing the internal structure of the test stage unit of FIG. 1 in a state where the fixing of the socket is released.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a plan view showing an internal structure of the test stage unit of FIG. 1 in a state where the socket is fixed.

FIG. 7 is a sectional view taken along the line VII-VII of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Test stage unit 11 Socket 12 Lever (leaf spring moving means) 13 Stage main body 14 Probe 15 Contact base 16 Socket guide 17 Leaf spring 18 Restriction groove 19 Lead 20 Rotation fulcrum 21 Protrusion part 22 First guide groove 23 Second Guide groove 24 Cover

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 H01R 33/74

Claims (2)

(57) [Claims] 1. A stage body having a plurality of probes electrically connected to a tester, and a socket fixed to the stage body and mountable with a semiconductor integrated circuit device is fitted and attached to the socket. A socket guide for bringing a plurality of leads into contact with the probe corresponding to the leads; and a socket guide disposed at a position sandwiching the probe and formed to be bent toward the probe so as to be capable of approaching and separating from each other in the socket guide. , With the socket fitted to the socket guide in the approach position
It has a pair of leaf springs for pressing and fixing the socket in the direction of the probe and releasing the fixing of the socket at the separated position, and leaf spring moving means for bringing the pair of leaf springs closer to and away from each other. Test stage unit. 2. The socket guide has a regulating groove for regulating a side of the leaf spring and guiding the leaf spring in a direction of approaching and moving away from each other. And a projection that is rotatably attached to the rotation fulcrum and that rotates while maintaining a fixed distance from the rotation fulcrum by the rotation of the leaf spring moving means. A first guide groove extending in the direction of movement of the spring and engaging with the rotation fulcrum, and a second guide groove extending in the direction perpendicular to the direction of movement of the leaf spring and engaging with the projection are formed. The test stage unit according to claim 1, wherein