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JP3282001B2 - Mold heating or cooling device - Google Patents
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JP3282001B2 - Mold heating or cooling device - Google Patents

Mold heating or cooling device

Info

Publication number
JP3282001B2
JP3282001B2 JP21191194A JP21191194A JP3282001B2 JP 3282001 B2 JP3282001 B2 JP 3282001B2 JP 21191194 A JP21191194 A JP 21191194A JP 21191194 A JP21191194 A JP 21191194A JP 3282001 B2 JP3282001 B2 JP 3282001B2
Authority
JP
Japan
Prior art keywords
heat exchange
fluid
cooling
heating
exchange chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP21191194A
Other languages
Japanese (ja)
Other versions
JPH0852741A (en
Inventor
高之 森井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TLV Co Ltd
Original Assignee
TLV Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TLV Co Ltd filed Critical TLV Co Ltd
Priority to JP21191194A priority Critical patent/JP3282001B2/en
Publication of JPH0852741A publication Critical patent/JPH0852741A/en
Application granted granted Critical
Publication of JP3282001B2 publication Critical patent/JP3282001B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は金型を加熱や冷却して樹
脂成形するものに関する。通常、熱可塑性合成樹脂を金
型で成形する場合は、原料の金型への注入から成形、離
型に至るサイクルの間に必要に応じて金型を加熱あるい
は冷却することが行なわれている。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for molding a resin by heating or cooling a mold. Usually, when molding a thermoplastic synthetic resin in a mold, the mold is heated or cooled as necessary during a cycle from injection of the raw material into the mold to molding and release. .

【0002】[0002]

【従来技術】従来の例えば発泡ポリスチレンを用いた発
泡成形の場合、高温の蒸気を供給して加熱発泡融着を行
なった後、蒸気に変えて冷却水を供給すると共に真空ポ
ンプ等の吸引手段で熱交換室を減圧状態として、金型及
び成形体を真空冷却することが一般的に行なわれてい
る。
2. Description of the Related Art In the case of conventional foam molding using expanded polystyrene, for example, high-temperature steam is supplied to perform heat-foaming fusion, then cooling water is supplied in place of steam, and suction means such as a vacuum pump is used. Generally, the mold and the molded body are vacuum-cooled while the heat exchange chamber is in a reduced pressure state.

【0003】[0003]

【本発明が解決しようとする課題】上記従来の金型の加
熱冷却装置では、金型及び成形体の全面を均一に冷却す
ることができず、部分的に冷却ムラを生じる問題があっ
た。これは金型内面の熱交換室の全面に冷却水が行き届
かず、部分的に冷却水の付着しない箇所があるためであ
り、特に、金型の形状が多数の凹凸部を有するような複
雑な形状の場合は冷却水が行き届かない箇所が多く発生
して冷却ムラを生じるのである。
In the conventional heating and cooling apparatus for a mold, there has been a problem that the entire surface of the mold and the formed body cannot be uniformly cooled, and uneven cooling occurs partially. This is because the cooling water does not reach the entire surface of the heat exchange chamber on the inner surface of the mold, and there is a portion where the cooling water does not adhere.Particularly, the shape of the mold has many irregularities. In the case of a non-uniform shape, there are many places where the cooling water cannot reach, and cooling unevenness occurs.

【0004】従って本発明の技術的課題は、冷却水が熱
交換室の全面に行き届くようにすることにより、冷却ム
ラを生じることのない金型の加熱または冷却装置を得る
ことである。
Accordingly, it is an object of the present invention to provide a mold heating or cooling apparatus which does not cause cooling unevenness by making the cooling water reach the entire surface of the heat exchange chamber.

【0005】[0005]

【課題を解決する為の手段】本発明の金型の加熱または
冷却装置の構成は次の通りである。加熱または冷却する
ための熱交換室と成形部とを有する金型と、該熱交換室
へ加熱用流体または冷却用流体を供給する流体管路と、
該流体管路に設けた流体の通過を制御するための弁手段
と、熱交換室内の流体を吸引する吸引手段とから成るも
のにおいて、熱交換室の内部に当該熱交換室の内面形状
に略沿った形状の多孔体を僅かな隙間を介して配置した
ものである。
The structure of the mold heating or cooling device of the present invention is as follows. A mold having a heat exchange chamber for heating or cooling and a molding section, and a fluid conduit for supplying a heating fluid or a cooling fluid to the heat exchange chamber,
A valve means for controlling the passage of a fluid provided in the fluid conduit, and a suction means for sucking the fluid in the heat exchange chamber, wherein the inside of the heat exchange chamber is substantially shaped like an inner surface of the heat exchange chamber. A porous body along the shape is arranged with a slight gap therebetween.

【0006】[0006]

【作用】熱交換室の内面形状に略沿った形状の多孔体を
隙間を介して配置したことにより、冷却用流体管路から
熱交換室へ供給された冷却流体はこの隙間部に至り熱交
換室の全面に行き届くことができる。熱交換室の全面に
至った冷却水は、金型及び成形体を均一に水冷却すると
共に、更に減圧状態のもとで冷却水が蒸発することによ
りその気化熱でもって真空気化冷却を行ない、気化した
蒸気は多孔体を通過して吸引手段に吸引され系外へ排出
される。
The cooling fluid supplied from the cooling fluid pipeline to the heat exchange chamber reaches the heat exchange chamber by arranging the porous body having a shape substantially along the inner surface of the heat exchange chamber through the gap. You can reach the whole area of the room. The cooling water reaching the entire surface of the heat exchange chamber uniformly cools the mold and the molded body with water, and furthermore, the cooling water is evaporated under reduced pressure to perform vacuum vaporization cooling with its heat of vaporization, The vaporized vapor passes through the porous body and is sucked by the suction means and discharged out of the system.

【0007】[0007]

【実施例】図示の実施例を詳細に説明する。図1におい
て、左右一対の金型1,2と、金型1,2内に配置した
多孔体5と、加熱用流体管路25と冷却用流体管路3、
及び、吸引手段4とで金型の加熱または冷却装置を構成
する。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. In FIG. 1, a pair of left and right molds 1 and 2, a porous body 5 disposed in the molds 1 and 2, a heating fluid pipeline 25 and a cooling fluid pipeline 3,
The suction means 4 constitutes a mold heating or cooling device.

【0008】金型1,2は内部に中空部6,7を形成
し、この中空部6,7を熱交換室とする。金型1,2の
中央部を成形部13として、図示しない成形用の原料を
注入してこの成形部13内で成形するものである。熱交
換室6,7の内部に、成形部13の全体と金型1,2の
一部の形状に沿って断面略コ字状の多孔体5を配置す
る。多孔体5と金型1,2の内周面との間には冷却流体
が流下することのできる程度の僅かな隙間8,9を設け
る。多孔体5はセラミックスや金属を用いた多孔体や、
合成樹脂や合成ゴムを用いた多孔体、あるいは高分子膜
等を使用することができる。金型1,2の上端に弁11
を介して冷却用流体管路3を接続する。冷却用流体管路
3から供給された冷却流体が熱交換室6,7内へ注入さ
れると、隙間9,8を流下するものである。
The molds 1 and 2 have hollow portions 6 and 7 formed therein, and the hollow portions 6 and 7 are used as heat exchange chambers. The central part of the molds 1 and 2 is used as a molding part 13, and a molding material (not shown) is injected and molded in the molding part 13. Inside the heat exchange chambers 6 and 7, the porous body 5 having a substantially U-shaped cross section is arranged along the entire shape of the molding section 13 and a part of the molds 1 and 2. Slight gaps 8 and 9 are provided between the porous body 5 and the inner peripheral surfaces of the molds 1 and 2 such that the cooling fluid can flow down. The porous body 5 includes a porous body using ceramics or metal,
A porous body using a synthetic resin or a synthetic rubber, a polymer film, or the like can be used. Valve 11 on top of molds 1 and 2
Is connected to the cooling fluid pipeline 3 via the. When the cooling fluid supplied from the cooling fluid pipe 3 is injected into the heat exchange chambers 6, 7, the cooling fluid flows down the gaps 9, 8.

【0009】成形部13と熱交換室6,7の間に複数の
細孔30を貫通して設ける。細孔30は図2に部分拡大
断面図を示すように、中央に鋼球31をコイルバネ33
により弁座32側へ付勢して配置し、成形部13から熱
交換室7への流体の通過のみを許容する逆止弁とする。
細孔30の径は、後述するように熱交換室6,7を吸引
手段4で吸引するために小さなもので良く、例えば0.
05ミリから0.1ミリ程度とすることができる。この
逆止弁は、加熱用流体管路25から高圧の流体を供給し
た場合に、この加熱用高圧流体が成形部13側へ逃げて
しまうことを防止するものである。
A plurality of pores 30 are provided between the molding section 13 and the heat exchange chambers 6 and 7. As shown in a partially enlarged cross-sectional view of FIG.
The valve is arranged so as to be biased toward the valve seat 32 side, and is a check valve that allows only the passage of the fluid from the molded portion 13 to the heat exchange chamber 7.
The diameter of the pores 30 may be small for sucking the heat exchange chambers 6 and 7 by the suction means 4 as described later.
It can be from about 05 mm to about 0.1 mm. This check valve prevents the high-pressure fluid for heating from escaping to the forming portion 13 when a high-pressure fluid is supplied from the fluid line 25 for heating.

【0010】熱交換室6,7はヘッダ―35,36を介
して加熱用流体管路25に接続する。流体管路25から
供給された加熱流体はヘッダ―35,36から熱交換室
6,7に供給されるものである。加熱用流体管路25に
は供給蒸気圧力を制御する圧力制御弁26と開閉弁27
を取り付ける。
The heat exchange chambers 6 and 7 are connected to the heating fluid line 25 via headers 35 and 36. The heating fluid supplied from the fluid conduit 25 is supplied to the heat exchange chambers 6 and 7 from the headers 35 and 36. A pressure control valve 26 for controlling the supply steam pressure and an on-off valve 27 are provided in the heating fluid line 25.
Attach.

【0011】ヘッダ―35,36の下部に吸引手段4を
接続する。吸引手段4は、エゼクタ14とタンク15と
循環ポンプ16とで構成する。エゼクタ14はノズルを
内蔵した吸引部17とディフュ―ザ18とで構成する。
吸引部17とヘッダ―35,36を管路19で接続す
る。ディフュ―ザ18をタンク15と接続し、タンク1
5の下部と循環ポンプ16の吸込み口を接続すると共
に、吐出口をエゼクタ14の吸引部17に接続する。エ
ゼクタ14はタンク15内の流体を循環ポンプ16で循
環して吸引部17へ通過させることにより内蔵したノズ
ル部で吸引力を生じるものである。
The suction means 4 is connected to the lower part of the headers 35 and 36. The suction means 4 includes an ejector 14, a tank 15, and a circulation pump 16. The ejector 14 includes a suction unit 17 having a built-in nozzle and a diffuser 18.
The suction part 17 and the headers 35 and 36 are connected by the pipe 19. The diffuser 18 is connected to the tank 15 and the tank 1
5 is connected to the suction port of the circulation pump 16 and the discharge port is connected to the suction section 17 of the ejector 14. The ejector 14 generates a suction force at a built-in nozzle portion by circulating a fluid in a tank 15 by a circulation pump 16 and passing the fluid to a suction portion 17.

【0012】タンク15には、図示はしないが内部の液
位を検出するための液位センサ―や、液温を検出する温
度センサ―21を取り付けると共に、上部には冷却流体
補給管20を制御弁22を介して接続する。
Although not shown, a liquid level sensor for detecting the liquid level inside the tank 15 and a temperature sensor 21 for detecting the liquid temperature are mounted on the tank 15, and a cooling fluid supply pipe 20 is controlled at the upper part. Connect via valve 22.

【0013】次に作用を説明する。金型1,2を加熱す
る場合、圧力制御弁26の設定圧力値を所定値に設定し
て開閉弁27を開弁し、加熱用流体管路25から加熱用
の蒸気をヘッダ―35,36を介して熱交換室6,7へ
供給する。供給された蒸気は多孔体5を通過して金型
1,2を加熱し、蒸気は凝縮して復水となる。復水は吸
引手段4のエゼクタ14に弁37とスチ―ムトラップ2
3を介して吸引され、タンク15に至りタンク15内の
液位が高くなると随時系外に排出される。
Next, the operation will be described. When heating the molds 1 and 2, the set pressure value of the pressure control valve 26 is set to a predetermined value, the on-off valve 27 is opened, and the steam for heating is supplied from the heating fluid pipe 25 to the headers 35 and 36. Are supplied to the heat exchange chambers 6 and 7. The supplied steam passes through the porous body 5 and heats the molds 1 and 2, and the steam condenses and becomes condensed. The condensate is supplied to the ejector 14 of the suction means 4 by the valve 37 and the steam trap 2.
3 and is discharged to the outside of the system as needed when the liquid level in the tank 15 reaches the tank 15 and rises.

【0014】加熱温度は、圧力制御弁26の設定圧力
と、吸引手段4の吸引力を通過する水温により調節して
適宜設定することができる。例えば、加熱温度を100
度C以上の比較的高温としたい場合は、圧力制御弁26
の設定圧力を大気圧以上の圧力とし、吸引手段4の吸引
力をその圧力よりも僅かに低いものとすることによりで
きる。100度C以下の比較的低温蒸気で金型1,2を
加熱する場合は、圧力制御弁26の設定圧力を大気圧以
下の真空圧力に設定し、吸引手段4の吸引力を、タンク
15へ冷却水補給管20から冷却水を補給して循環水の
温度を下げることにより高めて、圧力制御弁26の設定
圧力よりも僅かに低くすることにより行うことができ
る。
The heating temperature can be appropriately set by adjusting the set pressure of the pressure control valve 26 and the temperature of the water passing through the suction force of the suction means 4. For example, if the heating temperature is 100
If it is desired to set a relatively high temperature of not less than degree C, the pressure control valve 26
Is set to a pressure equal to or higher than the atmospheric pressure, and the suction force of the suction means 4 is set slightly lower than that pressure. When heating the molds 1 and 2 with relatively low temperature steam of 100 ° C. or less, the set pressure of the pressure control valve 26 is set to a vacuum pressure equal to or less than the atmospheric pressure, and the suction force of the suction means 4 is transferred to the tank 15. This can be achieved by supplying cooling water from the cooling water supply pipe 20 to increase the temperature of the circulating water by lowering the temperature and by slightly lowering the pressure set by the pressure control valve 26.

【0015】次に冷却する場合は、蒸気の供給に変えて
冷却用流体管路3から冷却流体を熱交換室6,7に供給
すると共に、吸引手段4を駆動して熱交換室6,7内を
減圧状態とすることにより、供給された冷却流体は金型
1,2の熱を奪って気化することによって冷却する。こ
の場合、冷却流体は多孔体5が配置されているために金
型1,2と多孔体5との間の隙間8,9に至り、成形部
13の金型1,2部の全体に行き届き、凹凸状の成形部
13を均一に冷却することにより、冷却ムラを生じるこ
とがない。
Next, in the case of cooling, the cooling fluid is supplied to the heat exchange chambers 6 and 7 from the cooling fluid pipe 3 instead of supplying steam, and the suction means 4 is driven to drive the heat exchange chambers 6 and 7. By setting the inside to a reduced pressure state, the supplied cooling fluid cools by removing the heat of the molds 1 and 2 and evaporating them. In this case, the cooling fluid reaches the gaps 8 and 9 between the molds 1 and 2 and the porous body 5 due to the arrangement of the porous bodies 5 and reaches the entire molds 1 and 2 of the forming part 13. By uniformly cooling the uneven portion 13, the cooling unevenness does not occur.

【0016】気化した蒸気と、気化せずに残った冷却流
体の一部は吸引手段4の吸引部17に吸引されタンク1
5に至る。また、成形部13で発生したガスは、任意の
箇所に設置した細孔30とその内部の逆止弁から吸引手
段4で吸引することにより、適宜排除することができ
る。
The vaporized vapor and a part of the cooling fluid remaining without being vaporized are sucked by the suction section 17 of the suction means 4 and are stored in the tank 1.
Reaches 5. Further, the gas generated in the molding part 13 can be appropriately removed by sucking the gas from the fine holes 30 provided at an arbitrary position and the check valve inside the fine holes 30 by the suction means 4.

【0017】[0017]

【発明の効果】本発明によれば、熱交換室の内面形状に
沿った多孔体を隙間を介して配置したことにより、冷却
流体が熱交換室の内面全体に行き届き、従って、多数の
凹凸を有するような複雑な形状の金型及び成形体であっ
ても均一に冷却することができ、冷却ムラを防止するこ
とができる。
According to the present invention, the cooling fluid reaches the entire inner surface of the heat exchange chamber by arranging the porous body along the inner surface shape of the heat exchange chamber through the gap. Even a mold and a molded article having a complicated shape as described above can be uniformly cooled, and uneven cooling can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の金型の加熱または冷却装置の実施例の
構成図である。
FIG. 1 is a configuration diagram of an embodiment of a mold heating or cooling device of the present invention.

【図2】図1における細孔の部分拡大断面図である。FIG. 2 is a partially enlarged sectional view of a pore in FIG.

【符号の説明】[Explanation of symbols]

1,2 金型 3 冷却用流体管路 4 吸引手段 5 多孔体 6,7 熱交換室 8,9 隙間 13 成形部 14 エゼクタ 15 タンク 16 循環ポンプ 17 吸引部 25 加熱用流体管路 1, 2 mold 3 cooling fluid pipe 4 suction means 5 porous body 6, 7 heat exchange chamber 8, 9 gap 13 forming part 14 ejector 15 tank 16 circulation pump 17 suction part 25 heating fluid pipe

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 加熱または冷却するための熱交換室と成
形部とを有する金型と、該熱交換室へ加熱用流体または
冷却用流体を供給する流体管路と、該流体管路に設けた
流体の通過を制御するための弁手段と、熱交換室内の流
体を吸引する吸引手段とから成るものにおいて、熱交換
室の内部に当該熱交換室の内面形状に略沿った形状の多
孔体を僅かな隙間を介して配置したことを特徴とする金
型の加熱または冷却装置。
1. A mold having a heat exchange chamber for heating or cooling and a molding portion, a fluid pipe for supplying a heating fluid or a cooling fluid to the heat exchange chamber, and provided in the fluid pipe. Comprising a valve means for controlling the passage of the fluid, and a suction means for sucking the fluid in the heat exchange chamber, wherein a porous body having a shape substantially along the inner surface shape of the heat exchange chamber is provided inside the heat exchange chamber. A heating or cooling device for a mold, wherein the device is disposed with a slight gap therebetween.
JP21191194A 1994-08-12 1994-08-12 Mold heating or cooling device Expired - Fee Related JP3282001B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21191194A JP3282001B2 (en) 1994-08-12 1994-08-12 Mold heating or cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21191194A JP3282001B2 (en) 1994-08-12 1994-08-12 Mold heating or cooling device

Publications (2)

Publication Number Publication Date
JPH0852741A JPH0852741A (en) 1996-02-27
JP3282001B2 true JP3282001B2 (en) 2002-05-13

Family

ID=16613703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21191194A Expired - Fee Related JP3282001B2 (en) 1994-08-12 1994-08-12 Mold heating or cooling device

Country Status (1)

Country Link
JP (1) JP3282001B2 (en)

Also Published As

Publication number Publication date
JPH0852741A (en) 1996-02-27

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