JP3282884B2 - Hot water floor heating system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot water floor heating system for heating a room from the floor.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, a hot water type floor heating apparatus for heating a room from the floor surface has a pipe housing groove 21 formed in a predetermined pattern on an upper surface of a board 20 made of a board or an aluminum plate or the like. A resin pipe 22 is provided in the inside, and an aluminum tape 23 is adhered on the substrate 20.

[0003]

However, in the conventional hot-water floor heating apparatus configured as described above,
If the length is large, transportation and loading are restricted, and if the length is adapted to transportation and loading, there are many pipe connections between hot-water floor heating devices and the workability is extremely poor. was there.

[0004] The present invention has been made in view of the above problems, and has as its object to provide a hot-water floor heating apparatus which can have a large length without being restricted by transportation, carrying-in, and the like.

[0005]

SUMMARY OF THE INVENTION A hot-water floor heating system according to the present invention is provided.
Location is divided into two elongated substrate on one substrate 3 and the other substrate 1, a pipe receiving groove 4 provided in a predetermined pattern on the upper surface of the substrate 3 of the one and the other of the substrate 1 to be bonded to the substrate 3 to the upper surface, a pipe receiving groove 2 in a predetermined pattern contiguous with pi <br/> flop receiving groove 2a of the cross provided with by intersecting the pipe receiving groove 2a that communicates with the pipe receiving groove 4 of the substrate 3 Provided and the intersection of the intersecting pipe storage grooves 2a
The depth of the groove in the part is set to be
The oil pipe 5 is formed so as not to protrude from the upper surface of the substrate 1.
Each pipe of the one substrate 3 and the other substrate 1
The resin pipe 5 is housed in the grooves 4 and 2, and the
The resin pipes cross each other in the pipe storage groove 2a
It is characterized by having been stored .

[0006]

The resin pipe 5 is transported and carried in by intersecting the resin pipe 5 in the pipe storage groove 2a formed in the substrate 1 and intersecting the resin pipe 5 in the pipe storage groove 2 and 4 formed in the substrate 1 and 3. In some cases, the substrate 3 is folded on the substrate 1 and the substrate 3 folded on the substrate 1 is opened at the time of indoor construction, so that a long hot water type floor heating device can be transported and laid on the indoor floor surface without being restricted. obtain.

That is, by crossing the resin pipes 5 in the pipe accommodating grooves 2a formed so as to cross the substrate 1,
When the substrate 3 is folded on the substrate 1, the resin pipe 5 is bent substantially in a U-shape with respect to the plate surfaces of the substrates 1 and 3, and has a large radius of curvature. There is no danger of crushing even if a mechanical external force acts on the surface (see FIG. 2).

By the way, if the pipe accommodating groove 2a communicating from the substrate 1 to the substrate 3 is formed in a straight line, when the substrate 3 is folded on the substrate 1, the resin pipe 5 becomes vertical with respect to the plate surfaces of the substrates 1, 3. It is bent into a U-shape in a state where it overlaps in the direction, has a very small radius of curvature, and is extremely easily crushed and deformed when a mechanical external force acts on the U-shaped bent portion during transportation and carry-in (see FIG. 3).

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing a folded state. In FIG. 1, 1 is a substrate obtained by sticking and laminating a hard foam A on a soft foam B. The upper surface of the rigid foam A constituting the substrate 1 is provided with a substrate 3 described later.
Pipe storage groove 2 communicating with pipe storage groove 4 formed in
a, 2a are drilled in an intersecting manner, and the pipe housing grooves 2a, 2a
The pipe housing groove 2 is formed in a predetermined pattern continuously from the line a.

Reference numeral 3 denotes a short substrate in which a rigid foam A is laminated and adhered on a flexible foam B, and a pipe housing groove 4 is formed in a predetermined pattern on the upper surface of the rigid foam A constituting the substrate 3. The pipe storage groove 4 communicates with the pipe storage grooves 2a and 2a formed so as to cross the substrate 1 described above.

The length of the substrate 1 is set so as not to hinder transportation and loading, and the length of the substrate 3 is appropriately adjusted according to the size of the room. The depth at the intersection of the pipe housing grooves 2a and 2a formed so as to intersect with the substrate 1 is a depth at which the crossed resin pipes 5 do not protrude from the upper surface of the substrate 1.

Reference numeral 5 denotes a resin pipe. The resin pipe 5 intersects inside the pipe accommodating grooves 2a and 2a formed so as to intersect the substrate 1, and forms inside the pipe accommodating grooves 2 and 4 formed in the substrates 1 and 3. It is arranged and stored.

Reference numeral 6 denotes an aluminum tape adhered to the upper surface of the substrate 1 excluding the plate surface C formed by crossing the pipe housing grooves 2a and 2a, and 7 denotes a hole formed by crossing the pipe housing grooves 2a and 2a. The aluminum tape 7 is adhered on the plate surface C of the substrate 1 after the hot water floor heating device is laid on the indoor floor surface. Reference numeral 8 denotes an aluminum tape adhered to the upper surface of the substrate 3. The aluminum tapes 6, 7, 8 are for uniformly dissipating heat from the resin pipe 5 to the room.

When the hot water type floor heating apparatus of the present invention configured as described above is transported and carried in, the substrate 3 is folded over the substrate 1 as shown in FIG. At this time, the resin pipe 5 housed crossing the inside of the pipe housing groove 2a formed in the substrate 1 is bent substantially in a U-shape with respect to the plate surfaces of the substrates 1 and 3 as shown in FIG. The radius of curvature is large, and there is no danger of crushing deformation even when a mechanical external force acts on the U-shaped bent portion during transportation or loading. Thus, FIG.
When the pipe housing groove 2a communicating from the substrate 1 to the substrate 3 is formed in a straight line as shown in (1), when the substrate 3 is folded on the substrate 1, the resin pipe 5 extends in the vertical direction with respect to the plate surfaces of the substrates 1 and 3. It is bent into a U-shape in an overlapping state, and its radius of curvature is extremely small. When a mechanical external force acts on the U-shaped bent portion during transportation or carry-in, it is crushed and deformed very easily.

As described above, in order to carry the hot water floor heating apparatus in a folded state, carry it, carry it in, and lay it on the indoor floor, open the folded board 3 on the board 1 and join the two boards 1 and 3 together. Is hot-melt sealed, and the above-described aluminum tape 7 is attached and laid on the plate surface C of the substrate 1 joined to the substrate 3.

As described above, the hot-water floor heating device is folded and transported and carried in, and the folded substrate 3 is opened on the substrate 1 at the time of construction, and the joining surface of the substrates 1 and 3 is hot-melt-sealed. By attaching the above-mentioned aluminum tape 7 on the plate surface C of the substrate 1 bonded to the base plate 3 and laying the hot-water floor heating device on the indoor floor surface, a long-sized floor heating device can be provided without being restricted by transportation, carrying in, etc. A hot water floor heating device can be laid on the indoor floor.

Although the embodiment in which the substrate obtained by sticking and laminating the hard foam A on the soft foam B is illustrated and described above, the present invention is not limited to this.
One board or a board made of an aluminum plate or the like may be divided, and the number of divisions may be two or more. Further, the substrate is not limited to dividing the length, but may be divided into width dimensions as needed. Furthermore, the pattern of the pipe housing groove formed in the substrate can be appropriately changed as needed.

[0018]

According to the present invention, as described above, a long hot water-type floor heating device can be laid on the indoor floor without being restricted by transportation, carrying in, etc. There is no need for parts for connecting the hot-water floor heating apparatus indoors, so that it is extremely economical, and has excellent advantages such as greatly improving the workability.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing one embodiment of the present invention.

FIG. 2 is a perspective view showing a folded state.

FIG. 3 is a comparison diagram of FIG. 2;

FIG. 4 is a partially cutaway plan view showing a conventional hot-water floor heating device.

[Explanation of symbols]

1 substrate 2
Pipe storage groove 2a Pipe storage groove 3 Substrate 4
Pipe storage groove 5 Resin pipe

Claims (1)

(57) [Claims] A long substrate is composed of one substrate (3) and the other substrate.
(1) is divided into two, a pipe receiving groove (4) provided in a predetermined pattern on the upper surface of said one substrate (3), the upper surface of the other substrate to be bonded to the substrate (3) (1), wherein The pipe storage groove (2a) communicating with the pipe storage groove (4) of the substrate (3) is provided to intersect, and the pipe storage groove (2) is formed in a predetermined pattern continuously with the crossed pipe storage groove (2a). And the intersecting pipe storage grooves (2
The depth of the groove at the intersection of a) is intersected within the groove and collected.
The resin pipe (5) to be stored is from the upper surface of the substrate (1)
The one substrate (3) and the other
Resin in each pipe storage groove (4), (2) of the substrate (1)
The pipe (5) is stored and the crossed pipes are collected.
A hot-water floor heating device characterized in that the resin pipes are housed in the groove (2a) so as to cross each other .