JP3287266B2 - Heat pipe type heat sink - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type heat sink for cooling semiconductors.

[0002]

2. Description of the Related Art FIG. 6 shows an example of a conventional heat sink for cooling a semiconductor, in which a fin 2 made of an aluminum mold material is screwed to a portion where the surface temperature of a heat block body 1 supporting a semiconductor becomes the highest. I was wearing it. Reference numeral 3 denotes a heat pipe, one end of which is embedded and fixed in the heat block 1 by soldering, a radiation fin 4 is press-fitted at an extended portion, and a steadying member 9 is attached at an extended end side.

As described above, the heat is mainly radiated by the heat pipe 3 and the heat radiating fins 4, and the heat radiating is actively performed by the aluminum fins 2 particularly in the portion where the temperature becomes high, so that the temperature of the heat block 1 is increased. Was made uniform.

The fins 2 made of aluminum material have a fin height of about 30 to 50 mm, and fins having a height of more than 30 mm cannot be used in view of the heat sink mounting method and mounting space.

[0005]

In the heat sink shown in FIG. 6, an aluminum mold fin is attached to a portion where the surface temperature of the heat block is likely to be highest. May not be enough.

In order to increase the amount of heat dissipated from the aluminum fins, it is necessary to increase the height of the fins. However, such an increase in the fin height increases the size, weight, and cost of the heat sink. Can lead to recruitment. This poses a problem when the heat sink is used in a place where space and weight are limited.

Therefore, the problems to be solved by the present invention (objects)
SUMMARY OF THE INVENTION An object of the present invention is to provide a heat pipe type heat sink having a high heat radiating ability which cannot be realized by the conventional aluminum fins.

[0008]

According to the heat pipe type heat sink provided by the present invention, an aluminum mold fin substitute heat pipe is used in a portion where the surface temperature of the heat block is likely to be highest, and the aluminum mold fin substitute heat pipe is used. The pipe is screwed and fixed to the surface of the heat block to increase the amount of heat radiated by the heat pipe.

In a preferred embodiment, the fin-substitute heat pipe made of aluminum mold material is embedded and fixed in a metal block by soldering, and the metal block is screwed to the surface of the heat block. Thereby, it can be structurally simple and inexpensive.

Further, it is preferable that the fin-substitute heat pipe made of aluminum mold material is press-fitted into a radiating fin provided on the heat pipe on the main body side of the heat block. As a result, the radiation fins can be shared, and the number of components can be reduced.

Further, it is preferable that the joint between the aluminum mold material fin substitute heat pipe and the metal block and the joint between the main body side heat pipe and the heat block are sealed with epoxy resin.

[0012]

FIG. 1 shows a first embodiment of a heat pipe type heat sink according to the present invention. FIG. 2 shows an essential part of the heat pipe type heat sink in an exploded state.
FIG. 3 shows an assembled state of the main part of the heat sink.

In the heat pipe type heat sink of this embodiment, the heat block 1 in which the semiconductor element 5 is mounted on the front side and the main body side heat pipe 3 is mounted on the rear side is made of an aluminum mold material on the upper rear side where the surface temperature is highest. The fin substitute heat pipe 6 is attached.

Thus, the main body side heat pipe 3 is directly fixed to the heat block 1 by solder embedding, while one of the fin substitute heat pipes 6 made of aluminum is fixed to the metal block 6 by solder embedding and fixed. 6 is screw-fixed to the heat block 1 with screws 10.

A fin substitute heat pipe 6 made of an aluminum mold is extended to both sides of the main body side heat pipe 3, and this extended portion is press-fitted and integrated with a radiation fin 4 attached to the main body side heat pipe 3. Are also used as heat radiation fins of the heat pipe 3.

With the above configuration, the heat generated from the semiconductor element 5 is transmitted to the heat block 1 and
The heat transmitted to the front surface and the rear surface of the heat block 1 at the shortest distance is transmitted to the metal block 6 and transmitted to the fin substitute heat pipe 7 made of an aluminum mold material. Then, in the heat pipe 7, the heat is transported to the condensation side, and is radiated by the radiating fins 4.

The heat block 1 and the metal block 6
The body-side heat pipe 3 and the aluminum-shaped fin-substituent heat pipe 7 are made of aluminum for the purpose of weight reduction, and are made of copper because water is used as a coolant. Therefore, a seal 8 made of epoxy resin is applied to a joint between the heat block 1 and the main body side heat pipe 3 and a joint between the metal block 6 and the fin substitute heat pipe 7 made of aluminum mold material. Corrosion by dissimilar metal contact between aluminum and copper due to water infiltration;
I try not to cause electrolytic corrosion.

The upper portion on the back side of the heat block 1 is provided with a step portion having a reduced thickness, and the metal block 6 is screwed to a surface on the step portion. This is a metal block 6
Is mounted compactly so as not to protrude from the surface of the heat block 1, and the epoxy resin seal 8 can be easily filled by the step portion so as not to flow out to the surroundings.

The length of the radiating portion of the aluminum-shaped material fin substitute heat pipe 7 is calculated by calculating the number of radiating fins required according to the required amount of radiating heat by heat calculation, and the optimum number of fins can be attached to the heat pipe radiating portion. Should be adjusted.

Further, the extension position and the number of the fin-substitute heat pipes 7 made of aluminum material can be arbitrarily selected based on the above heat calculation. Hereinafter, modified examples different from the above-described embodiment will be described.

FIG. 4 shows a heat pipe type heat sink according to a second embodiment of the present invention. The same reference numerals are used for the same parts as those in the first embodiment.
See also the above description.

The floor of the first embodiment described above in the second embodiment is that the rising position of the aluminum-shaped material fin substitute heat pipe 7 ′ is determined by the main body side heat pipe 7.
This is a point along the center with respect to.

FIG. 4 shows a third embodiment of a heat pipe type heat sink according to the present invention. The same reference numerals are used for the same parts as those in the first embodiment.
See also the above description.

The third embodiment differs from the first embodiment in that a different number of heat pipes 7 ″, ie, one aluminum mold fin substitute heat pipe 7 ″ are extended to the side of the main body side heat pipe 7. It is.

[0025]

According to the heat pipe type heat sink of the present invention as described above, the heat pipe is used instead of the aluminum fin, so that the heat radiation capacity which cannot be obtained by the conventional aluminum fin is obtained. Obtainable. Therefore, the intended problem (object) of providing a heat pipe type heat sink having a high heat radiation capability which cannot be realized by the conventional aluminum fins can be achieved.

Further, it is sufficient that the width is close to the diameter of the heat pipe, and the mounting area can be small, and the space can be saved. Further, the amount of heat radiation can be controlled by changing the number of heat radiation fins in the heat radiation part of the heat pipe. Furthermore, since the metal block is screwed and fixed, it can be realized with almost no change in the structure and dimensions of the conventional heat sink, and there is no need to change the heat sink mounting method and the mounting position. And so on.

[Brief description of the drawings]

FIG. 1 is a side view showing a first embodiment of a heat pipe type heat sink according to the present invention.

FIG. 2 is an exemplary perspective view showing a main part of the heat pipe type heat sink shown in FIG. 1 in an exploded state;

FIG. 3 is an exemplary perspective view showing a main part of the heat pipe type heat sink shown in FIG. 1 in an assembled state;

FIG. 4 is a perspective view showing a second embodiment of the heat pipe type heat sink according to the present invention in a state where main parts are assembled.

FIG. 5 is a perspective view showing a third embodiment of the heat pipe type heat sink according to the present invention in a state where main parts are assembled.

FIG. 6 is a perspective view showing an example of a conventional heat sink for cooling semiconductors.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 heat block 3 body side heat pipe 4 radiating fin 5 semiconductor element 6 metal block 7, 7 ′, 7 ″ aluminum type fin substitute heat pipe 8 epoxy resin 9 anti-sway fitting 10 screw

──────────────────────────────────────────────────続 き Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/427

Claims (3)

(57) [Claims] 1. A fin-substitute heat pie made of aluminum material.
Embedded in a metal block with solder
A heat pipe type heat sink, in which a heat sink is screwed and fixed to the surface of the heat block where the surface temperature of the heat block where the main body side heat pipe is attached may be the highest . 2. The fin-substitute heat pipe made of aluminum mold material is used as a heat pipe on the main body side of a heat block.
The heat pipe type heat sink according to claim 1, wherein the heat pipe type heat sink is press-fitted into the provided heat radiation fin . 3. A joint between the aluminum-shaped fin-substituent heat pipe and the metal block, and a body-side heat.
The joint between the pipe and the heat block is made of epoxy resin
The heat pipe type heat sink according to claim 1 or 2, which is sealed .