JP3293326B2 - Electronic device cap sealing apparatus and sealing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cap sealing device and a method for sealing and fixing a cap to a box-shaped package on which an electronic device element is mounted to complete an electronic device. A cap sealing device for electronic devices (hereinafter simply referred to as a sealing device) that achieves miniaturization and automation as a device to improve productivity while suppressing sealing defects due to gas expansion inside the package due to It relates to the sealing method.

2. Description of the Related Art In recent years, in the field of electronic equipment, with the demand for miniaturization, high performance, and low cost, for example, a semiconductor chip in which one or more semiconductor chips are mounted in a box-shaped package and the opening thereof is sealed and fixed with a cap 2. Description of the Related Art A sealed electronic device in which a plurality of electronic device elements are packaged like an apparatus has been commercialized.

In the process of sealing an electronic device, a technique of encapsulating a plurality of pieces at a time has been put to practical use in order to increase the productivity. -When using a tin (Au-Sn) alloy, it is necessary to perform the sealing operation in an inert gas atmosphere such as nitrogen (N ₂ ) gas in order to improve the wettability, Easy, difficult to evenly heat each device,
There is a strong demand for a solution to this problem, since sealing failure due to gas expansion inside the package due to heat during sealing is likely to occur.

[0004]

2. Description of the Related Art FIG. 6 showing a case in which an electronic device is a semiconductor device is a view for explaining in principle a conventional cap sealing method. Fig. 6 (2) is a diagram illustrating the state of attachment to the jig, (6-2) is a diagram showing a method of suppressing poor sealing caused by gas expansion inside the package due to heat during sealing, and (6-3) is a diagram illustrating sealing It is a figure explaining the heating process at the time of stop.

FIG. 7 is a diagram illustrating the sealing conditions as solder. In each of the figures, an example is described in which a cap made of a Kovar material having the same size as the package in a plan view is sealed and fixed to a ceramic package with a solder made of a gold-tin (Au-Sn) alloy.

In FIG. 6 (6-1), the semiconductor device 1 is composed of a bottomed box-shaped package 12 made of ceramic on which a semiconductor chip 11 is mounted, and Kovar sealed and fixed to a peripheral wall end surface 12a on the opening side thereof. The cap 13 is sealed and fixed at the peripheral wall end surface 12a on the package opening side.

Among them, a gold (Au) plating layer having a thickness of about several μm is provided as a seal ring on an end surface 12 a of the peripheral wall of the package 12, and one side of the cap 13 (upper surface in the figure).
For example, the thickness corresponding to the thickness
A solder 13a of 10 μm gold-tin (Au-Sn) alloy is applied.

[0008] The above-mentioned gold plating layer is, for example, a tungsten (W) layer and a nickel (Ni) plating layer which are sequentially formed on the peripheral wall end surface 12a of the package 12 so as to improve adhesion to the peripheral wall end surface 12a. Can be raised.

First, a concave hole 21 made of a stainless steel or invar material having substantially the same linear expansion coefficient as that of the cap 13 and capable of positioning the cap 13 around the plate.
a and a plurality of concentric through-holes 21b are formed in the respective concave holes 21a of the first jig 21 in which a plurality of concentric through-holes 21b are formed. The cap 13 that has been handled in step (1) is dropped as shown by arrow A.

The above-described recess 21a can be easily formed by using, for example, a normal electric discharge machining technique. Next, a second jig 22 having a plate-like shape made of the same material as the first jig 21 and having a through-hole 22a equal to the concave hole 21a at each position corresponding to the concave hole 21a is indicated by an arrow. As shown in B, it is positioned on the first jig 21 and overlapped.

Further, when the package 12 which has been handled by a suction head or the like is dropped into each through hole 22a of the second jig 22 in a state of being turned upside down as shown by an arrow C, (6-2)
(A).

In this case, the recess 21 of the first jig 21 described above is used.
The sum “d ₁ + t ₁ ” of the depth d _{1 of a} and the thickness t ₁ of the second jig 22
Is the thickness of the semiconductor device 1 described above, that is, the package 12
Is set to be slightly smaller than the sum “t ₂ + t ₃ ” of the thickness t ₂ of the cap 13 and the thickness t ₃ of the cap 13.
The package back surface 12b in (a) is the front surface of the second jig 22
Projects slightly from 22b.

Therefore, for example, the third method shown in (b) of (6-2)
Clip 13 as a jig, cap 13 and package 12
When installed so as to sandwich the respective exposed surfaces of the hook 23b in contact with the rear surface of the hook 23a _-1 and the package 12 (in the drawing the underside) surface of the cap 13 through the through hole 21b into contact with (in the figure the upper surface) _{- it can} be ₂ and semi-finished semiconductor device before sealing sandwiched by 1 'constitutes a plurality - aligned jig finished body 24.

A coil spring to be engaged with the clip 23
By appropriately designing 23b, the pressing force between the package 12 and the cap 13 is set to a required value (for example, 250 to 500 g).

Therefore, the jig completed body 24 is placed on a conveyor belt 27 which moves in a heating chamber 26 filled with a nitrogen (N ₂ ) gas 25 to be injected, and sealing conditions as a solder 13 a described later are used. (For example, about 5 to 6 minutes at a temperature of 280 to 300 ° C.), the moving speed and the heating temperature of the conveyor belt 27 are set according to the size of the heating chamber 26,
The package 12 and the cap 13 described above are sealed and fixed.

In this case, the heating is performed by the conveyor belt 27.
The heat is radiated and convected by a coil heater 26a provided at the lower part of the heater. After cooling the jig completed body 24,
The clip 23 serving as the third jig is removed, and the first and second jigs 21 and 22 are further separated to take out the required sealed semiconductor device 1.

In the sealing method using the completed jig 24,
There is an advantage that the sealing failure due to the gas expansion inside the package due to the heat at the time of sealing can be suppressed by the clip 23. The horizontal axis X is the heating temperature T (° C.), and the vertical axis Y is the heating time t (second).
In FIG. 7, a hatched area E indicates a quality assurance area of the sealing characteristics by the solder 13a.

In this case, the quality assurance range E is set, for example, to about 2 to 10 seconds when heating at 500 ° C. and to about 300 to 6 hours when heating at about 300 ° C.
This indicates that it is desirable to be within 00 seconds.

Therefore, by setting the size and temperature of the heating chamber 26 and the moving speed of the conveyor belt 27 described with reference to FIG. 6 so as to match the hatched area E, a sealing operation excellent in quality is realized. can do.

[0020]

However, in the sealing method using the completed jig described above, it is costly to manufacture the jig itself. It takes time to construct the completed jig 24. In some cases, stress is applied to the semiconductor device due to deformation. Since the jig completed body 24 is moved by the conveyor, there is a problem that foreign matter and the like easily adhere to the outer surface of the semiconductor device.

Further, in the above-described sealing method using the completed jig, the semi-finished semiconductor device 1 'is heated by heat due to radiation and convection, so that the jig is also heated simultaneously with the semiconductor device 1'. Since the heat capacity of the tool is large, it is necessary to increase the preheating area and the cooling area respectively. However, there is a disadvantage in that productivity cannot be expected due to disadvantages such as an increase in the use amount of the resin.

[0022]

An object of the present invention is to provide a bottomed box-shaped package opening end face on which an electronic device element is mounted,
An electronic device cap sealing device for sealing and fixing a pre-soldered cap by heating in an inert gas atmosphere, comprising a package before sealing placed near a predetermined position where a package holding plate is aligned. A package positioning / holding portion, which is provided with means for collectively positioning and holding the cap at the predetermined position and fixed to the apparatus housing plate, and the package and the cap before sealing in a stacked state are located. A region including at least the predetermined position is individually divided into individual chambers with an inert gas ejection port, and means for collectively pressing or releasing the cap surface in each of the individual chamber regions is provided. At the time of ascending to the position corresponding to each package arrangement position below the cap pressing part and the package positioning holding part to be fixed to the position, A lower heater which can be moved up and down and arranged so as to be able to come into contact with the respective package bottom surfaces, and a pressing means for pressing the cap surface are provided at respective positions corresponding to the respective cap arrangement positions above the cap pressing portion. A vertically movable upper heater disposed with a heating surface formed so as to be able to come into contact with the upper surface of each cap when lowered in a state in which the cap sealing device of the electronic device is provided. Will be resolved.

[0023]

When a cap sealing device is formed such that a heating chamber filled with an inert gas can be separated into individual chambers for each semi-finished semiconductor device, the amount of the inert gas filling the single chamber can be reduced. As a result, the total amount of inert gas used can be reduced.

Further, if a sealing device is provided for each semi-finished semiconductor device by providing a heater that can be heated by contacting the upper and lower surfaces thereof, it is possible to eliminate the necessity of providing the above-described preheating area and cooling area, respectively. The downsizing as the stopping device can be realized.

Therefore, in the present invention, a mechanism for positioning and fixing a handled semi-finished semiconductor device in a region divided into individual chambers so that an inert gas can be injected for each semi-finished semiconductor device, and a cap surface of the semi-finished semiconductor device Is provided with a semiconductor device holding mechanism provided with a mechanism capable of pressing the semiconductor device until cooling is completed and a means capable of heating the semi-finished semiconductor device from above and below.

Therefore, a sealing device which is smaller in size than the conventional one and can shorten the sealing operation time while automatically suppressing sealing defects caused by gas expansion inside the package due to heat at the time of sealing can be provided with less inert gas. , The productivity can be improved.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 showing a sectional side view is a view for explaining the principle of the main part of the sealing device according to the present invention, and (1-1) shows the state before sealing. 2) shows a state at the time of sealing.

FIG. 2 is a view for explaining an example of the configuration of the main part of the sealing device, and FIG. 3 is a view showing an assembled state of the main part of the sealing device.
FIG. 4 is a view for explaining the cap sealing method in steps, and FIG. 5 is a view for explaining the product removal method after the sealing operation in steps.

In the drawings, the case where the present invention is applied to the semiconductor device described with reference to FIG. 6 is used as an example. I omit it.

[0030] In (1-1) of FIG. 1, nitrogen (N ₂ on the side wall surface of the compartment chambers 31 made of a metal such as stainless steel box-shaped having a size corresponding to each of the semi-finished semiconductor device 1 ' )gas
A port 31a for injecting the semi-finished semiconductor device 1 'is provided on the bottom surface of the semi-finished semiconductor device 1'. A hole 31c large enough to penetrate the lower heater 32 embedded in the cartridge heater, which is positioned corresponding to the lower surface of the package, is formed, and the semi-finished semiconductor device 1 'positioned on the stay 31b is further formed on the upper surface. Hole 31 through which the upper heater 33 of the cartridge heater buried type located corresponding to the upper surface of the cap can be penetrated.
d is formed.

In this case, a groove 33b is formed on the heating surface 33a located below the upper heater 33 to avoid contact with a clamper 34 described later. A lever-shaped clamper 34 that can rotate around point P by a mechanism (not shown) is provided between the private chamber 31 and the upper heater 33.
When the clamper 34 rotates in the direction of the arrow F, the tip 34a of the clamper 34 presses the surface of the cap 13 with a predetermined pressing force.

In the private chamber 31, the nitrogen gas 25 injected into the private chamber from the port 31 a flows out from each of the holes 31 c and 31 d as shown by the arrow G.
By continuing the injection of 25, the inside of the private chamber can be easily filled with the gas.

Then, while the nitrogen gas is being injected from the port 31a, the lower heater 32 heated to 400 to 450.degree. C. is raised and brought into contact with the bottom surface of the package 12, so that the package 12, Preheat for seconds.

Next, the clamper 34 is rotated to press the cap surface of the semi-finished semiconductor device 1 'with its tip 34a, and then the upper heater 33 heated to 450 to 500.degree. To the package 12 for about 2 to 10 seconds, as shown in (1-2).
13 can be sealed and fixed.

Since the above-mentioned groove 33b is formed in the heating surface 33a of the upper heater 33, the cap surface can be heated without being restricted by the clamper 34. Therefore, after the lower heater 32 and the upper heater 33 are separated from the semiconductor device 1 and then cooled by, for example, increasing the flow rate of the nitrogen gas 25, the clamper 34 is rotated in the opposite direction (1).
By returning to the state of -1), the required semiconductor device 1 can be configured as in FIG.

In FIG. 2 showing the main part of the sealing device, the semiconductor device holding mechanism 5 is roughly divided into a package positioning holding portion 51 fixed to the upper surface of the sealing device housing plate 4 and the holding portion 51. And a cap pressing portion 61 fixed to the upper surface of the cap.

The inner package positioning / holding portion 51 includes an air cylinder 511 fixed to the upper surface 4a of the sealing device housing plate 4.
A block 512 which can reciprocate in the X direction in the drawing by using a dovetail 4b provided on the surface in engagement with the operation of A rack block 514, which engages with the operation of the fixed air cylinder 513 and protrudes from the step surface 4c and can reciprocate in the Y direction in the drawing using a dovetail 4d as a guide, a side of the rack block 514 on one side in the width direction. The package holding plate 515 is fixed to the stepped surface 4c so as to be close to the main body, and a plurality of pin shafts 516 planted at equal intervals in the X direction in a predetermined area of the upper surface of the package holding plate. The positioning lever 51 mounted on the package fixing plate
7 as a main component.

The positioning lever 517 having a thickness substantially equal to "d ₁ + t ₁ " described with reference to FIG.
Is a pin 52 implanted at a position corresponding to the upper surface of the block 512.
With the rotation in the contact to the drawings the left direction, i.e. the direction X ₁ is adapted to be regulated between 1 and the other end is the tip 6
Is formed on a rectangular hook 517b capable of catching the peripheral wall edge of the package 12 described in
To come into contact at all times the pin 521 by a coil spring 522 which intermediate is urged in the X ₁ direction and 7a.

[0039] Thus, the right positioning lever 517 by a pin 521 to move the block 512 with the block 512 when moving in the right direction of the drawing i.e. X ₂ direction by operation of the air cylinder 511 as described above is against the coil spring 522 The air cylinder 511 operates to block 512
There the lever 517 is rotated to the left, following the above pin 521 by the coil spring 522 when moved in the X ₁ direction.

The package holding plate 515 has a hook claw 523 having substantially the same thickness as that of the positioning lever 517 and corresponding to the rectangular hook 517b of the lever 517 and capable of catching the diagonal peripheral wall edge of the package 12. While being fixed, the rectangular hook 517b of the lever 517 and the hook
At the position corresponding to the center of the package 12 captured and positioned as described above, as shown in FIG. 1A, the lower heater 32 is inserted from the back side as shown in FIG. A step hole 515a through which only the tip part can penetrate is formed.

Therefore, when the lower heater 32 is inserted from the back side of the package 12 with the package 12 captured and positioned on the package holding plate 515, the upper surface of the heater 32 can be brought into contact with the bottom surface of the package 12. .

On the other hand, the cap pressing portion 61 is made of the same material having the same size as the above-described package holding plate 515 in a plan view, and includes at least each package positioning region.
An area 515a indicated by a broken line H is a square hole 611a penetrating in the thickness direction.
A rotatable pinion shaft 612 that penetrates the square hole forming region in the package alignment direction, that is, the X direction in a region away from the package holding position;
A pinion 613 fixed to one end of the pinion shaft 612 protruding from the private chamber forming plate 611; a square hole of the pinion shaft 612;
A cantilever-type clamper 614 fixed to an exposed portion of 611a and a cover 615 are configured as main components.

The single chamber forming plate 611 in this case, having a thickness at least exceeding the height when the package and the cap before sealing are stacked, is provided with a nitrogen gas injection port 611b mounted on the outer wall surface thereof. Air hole 611c leading to
Are embedded with openings to the respective square holes 611a.

The notch 611d in the figure is formed as an escape for avoiding contact with the positioning lever 517 when the forming plate 611 is positioned and held on the package holding plate 515.

The pinion 613 is a rack of the above-described rack block 514 which is disposed so as to be movable close to the holding plate 515 when the single-chamber forming plate 611 is positioned and held on the package holding plate 515. It is formed with a size and a tooth shape that mesh with 514a.

Further, the lever-shaped clamper 614 integrated with the pinion shaft 612 is substantially the same as the cap 13 on the package 12 on which the key-shaped bent tip 614a is positioned when the shaft 612 is rotated substantially 90 degrees. It is formed so that the central area can be pressed.

The cover 615 is provided with the private chamber forming plate 611.
A hole 615a large enough to allow the upper heater 33 described with reference to FIG. 1 to penetrate into a region corresponding to the package 12 positioned and held by the package holding plate 515 via A groove 615b for avoiding contact with the moving clamper 614 is provided continuously.

Then, after mounting the cap pressing portion 61 on the upper surface of the above-mentioned package holding plate 515 as shown by the V mark I and fixing them together with, for example, screws 616 or the like, the required semiconductor device holding mechanism 5 can be mounted. It can be configured as shown in FIG.

In the semiconductor device holding mechanism 5 shown in FIG.
In since the rack blocks 514 and pinion 613 described is engaged, when allowed to move the rack block 514 shown Y ₁ direction by operation of the air cylinder 513 clamper 614
Can be rotated in the direction of arrow J.

When nitrogen gas is injected from the nitrogen gas injection port 611b of the private chamber forming plate 611 of the cap pressing portion 61 constituting the semiconductor device holding mechanism 5, the gas flows through the gas flow hole 611c as described in FIG. The gas flows out through the step hole 515 and the hole 615a of the illustrated cover 615 through the square hole 611a of the private chamber forming plate 611, in other words, the individual chamber of each semiconductor device is filled with the gas. .

Accordingly, while continuously injecting nitrogen gas from the nitrogen gas injection port 611b, the air cylinder described with reference to FIG.
The sealing operation in a nitrogen gas atmosphere can be realized by appropriately performing the operation of 511 and 513 and the vertical movement of each of the upper and lower heaters 32 and 33 described in FIG.

4 and 5, which show FIG. 3 in a cross-sectional view from the direction of arrow K, the sealing method as a semiconductor device and the subsequent removal method will be described in order. In (4-1) of FIG. 4 for explaining the sealing method, a private chamber forming plate 611 having flow holes 611c embedded therein is fixed to the surface of the package holding plate 515, and the rectangular holes 611a forming each private chamber are formed. A fixed hook claw 523, a rectangular hook 517b of a positioning lever, and a clamper 614 are located in the area.

Therefore, the nitrogen gas 25 passing through the flow holes 611c
After the package 12 indicated by a broken line stored in a stocker or the like (not shown) is placed on the surface of the package holding plate 515 by, for example, handling with the suction head 50, while the peripheral wall end face is facing upward, When the positioning lever is rotated by the operation of the air cylinder 511 described in 2 above, the package 12 can be positioned and held between the square hook 517b and the fixed hook claw 523 as shown in the figure.

Next, after the package 12 is preheated for 2 to 5 seconds by contact by raising the lower heater 32 described below with reference to FIG. 1 which is located below the package holding plate 515 and heated to 400 to 450 ° C. As shown in (4-2), the cap 13 indicated by a broken line stored in a stocker or the like (not shown) with the solder forming surface on the lower side is placed on the opening side of the package 12 by handling with the suction head 50, and FIG. The clamper 614 is rotated by the operation of the air cylinder 513 described above, and the tip thereof presses the surface of the cap 13.

Therefore, FIG. 1 being heated to about 450 ° C.
By lowering the upper heater 33 described above and bringing the heating surface 33a into contact with the surface of the cap 13 for about 5 to 6 seconds, the solder of the cap 13 can be melted.

(4-3) shows the state at this time. Then, as shown in (4-4), the upper heater 33 and the lower heater 32 are respectively moved in the separating direction, and then the flow rate of the above-mentioned nitrogen gas 25 is increased by, for example, about 50 to 100% and ejected. By cooling the package and the cap surface, the package 12 and the cap 13 can be sealed and fixed.

In this case, the entire sealing time zone is
4) In the state pressed in and covered with nitrogen gas as an inert gas, sealing failure due to gas expansion inside the package due to heat during sealing is the best condition for solder material. Can be suppressed below.

Thereafter, by rotating the clamper 614 to the initial position, that is, the position indicated by the broken line by the reverse operation of the air cylinder 513, the sealed semiconductor device 1 can be reliably obtained.

5A and 5B for explaining a method of taking out the semiconductor device 1, FIG. 5A shows the case where the nitrogen gas 25 shown in FIG.
In this state, the above-described clamper 614 is rotated in the reverse direction by about 90 degrees by the operation of the air cylinder 513 after the injection of water is stopped.

Therefore, the holding of the semiconductor device 1 by the rectangular hook 517b of the positioning lever is released by the operation of the air cylinder 511, and the state of (5-2) is established. Then, as shown in (5-3), the semiconductor device 1 is gripped on the cap surface by the suction head 50 described in (4-1) of FIG. 4) As a result, (4-
The initial state shown in 1) can be returned.

In the sealing device provided with such a semiconductor device holding mechanism, the heating chamber used in the conventional process is unnecessary, and the package 12 and the cap 13 are heated by the contact of the corresponding heaters 32 and 33. Therefore, there is an advantage that the working time can be reduced by miniaturization and automation of the apparatus.

Further, since the region filled with nitrogen gas as an inert gas is separated into individual chambers for each semiconductor device and the supply thereof is intermittent, there is an advantage that the amount of inert gas used as a device can be reduced. .

[0063]

As described above, according to the present invention, miniaturization and automation of the apparatus are realized while suppressing the sealing failure caused by gas expansion inside the package due to heat at the time of sealing, thereby improving productivity. A cap sealing device for an electronic device and a sealing method thereof can be provided.

In the description of the present invention, a sealing device for sealing a metal cap in a ceramic package as a semiconductor device is taken as an example. However, the present invention is limited to a ceramic package and a metal cap as a semiconductor device. It is apparent that the same effect can be obtained with any electronic device or a combination of a package and a cap made of any material as long as it is sealed with solder.

[Brief description of the drawings]

FIG. 1 is a view for principally explaining a main part of a sealing device according to the present invention.

FIG. 2 illustrates a configuration example of a main part of a sealing device.

FIG. 3 is a diagram showing an assembled state of a main part of the sealing device.

FIG. 4 is a view for explaining a cap sealing method in steps.

FIG. 5 is a diagram for explaining a method of removing a product after a sealing operation in steps.

FIG. 6 is a diagram illustrating the conventional cap sealing method in principle.

FIG. 7 is a diagram illustrating an example of sealing conditions for solder.

[Explanation of symbols]

Reference Signs List 1 semiconductor device (electronic device) 1 'semi-finished semiconductor device 4 sealing device housing plate 4a upper surface 4b, 4d provided 4c stepped surface 5 semiconductor device holding mechanism 12 package 13 cap 25 nitrogen gas (inert gas) 31 chamber with single chamber 31a Inert gas injection port 31b Stay 31c, 31d hole 32 Lower heater 33 Upper heater 33a Heating surface 33b Groove 34 Clamp 34a Tip 50 Suction head 51 Package positioning and holding unit 61 Cap pressing unit 511,513 Air cylinder 512 block 514 Rack block 514a Rack 515 Package holding plate 515a Step hole 516 Pin shaft 517 Positioning lever 517a One end 517b Square hook 521 Pin 522 Coil spring 523 Hook claw 611 Single chamber forming plate 611a Square hole (hole) 611b Inert gas injection port 611c Flow hole 611d Notch 612 Pinion shaft 613 Pinion 614 Clamper 615 Cover 615a Hole 615b Groove 616 Screw

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-208554 (JP, A) JP-A-5-243407 (JP, A) JP-A-62-170639 (JP, U) JP-A-63 153540 (JP, U) (58) Fields studied (Int. Cl. ⁷ , DB name) H01L 21/56 H01L 23/00-23/10 H01L 23/16-23/26

Claims (4)

(57) [Claims] 1. A cap sealing device for an electronic device, wherein a pre-soldered cap is sealed and fixed to an open end surface of a boxed bottomed package on which an electronic device element is mounted by heating in an inert gas atmosphere. Means for positioning and holding the unsealed package and cap placed in the vicinity of the aligned predetermined position of the package holding plate (515) collectively at the predetermined position. (4) Package positioning holder (51) fixed to
An area including at least the predetermined position where the unsealed package and the cap in the stacked state are located is individually provided with an inert gas ejection port, and the cap surface in each of the individual chamber areas is collectively formed. A cap pressing portion (61), which is provided with a pressing or releasing means and is fixed at a position corresponding to the upper surface of the package positioning and holding portion (51), corresponds to each package arrangement position below the package positioning and holding portion (51). A lower heater (32) that can be moved up and down and arranged so as to be able to come into contact with each of the package bottom surfaces when ascending, and a cap corresponding to each of the cap positions above the cap pressing portion (61). The upper and lower sides are arranged with a heating surface formed so as to be able to come into contact with the upper surface of each cap when the cap surface is lowered with the pressing means applied to the surface of the cap. A possible upper heater (33), a cap sealing device for an electronic device characterized in that it comprises at least. 2. The means for positioning and holding the package and cap before sealing according to claim 1 at a predetermined position on the upper surface of the package holding plate, reciprocates in one direction on the device housing plate (4). Get Block (51
2) Pins (521) planted in alignment with the direction of movement of the upper surface
At one end, and rotates about a pin shaft (516) planted in alignment with the moving direction on the upper surface of the package holding plate (515) fixed to the device housing plate (4). The rectangular hook (517b) provided at the other end of the positioning lever (517) and the hook claw (523) fixed at a predetermined position aligned at the same pitch on the package holding plate are pinched at the diagonal edge of the package. A cap sealing device for an electronic device, comprising: 3. A means for individually forming a region including at least a predetermined position where the package and the cap before sealing according to claim 1 are located and individually pressing or releasing the surface of the cap in each of the individual room regions. However, the package is held in a state in which a region including at least the predetermined position and having a thickness exceeding the stack height of the package and the cap before sealing is formed in the hole (611a) penetrating in the thickness direction at each of the predetermined positions. Plate (61) fixed to the plate (515)
1) and a device which is rotatably penetrated through each hole forming area of the private room forming plate (611) in a direction away from the predetermined position in the alignment direction, and protrudes from the private room forming plate (611). Each of the pinion shafts (612) is fixed with a pinion (613) that meshes with a rack (514a) of a rack block (514) that can reciprocate in a direction perpendicular to the alignment direction on the housing plate (4). A lever-shaped clamper (614) fixedly mounted in the hole forming area; and a cap sealing device for an electronic device. 4. A method for sealing a cap of an electronic device by a cap sealing apparatus according to claim 1, wherein the package is filled with an inert gas in a private chamber formed by each hole of the cap pressing portion. A step of placing the unsealed package with the bottom surface facing down near each of a plurality of predetermined positions on the holding plate, and then positioning and holding the placed package by turning a positioning lever by operating an air cylinder. A step of preheating each of the packages by contacting the packages by raising a heated lower heater corresponding to a lower side of each of the packages; A step of pressing the surface of the placed cap by rotating the clamper by actuation of an air cylinder after placing the cap before sealing; a position corresponding to the upper side of each package; Lowering the heated upper heater to form a sealed electronic device by heating the cap by contacting the cap, after separating each heater from the package and the cap, the flow rate of the inert gas And pressing the cap against the cap surface by rotating the clamper in the opposite direction by operating the air cylinder, and further turning the positioning lever in the opposite direction by operating the air cylinder. Releasing the positioning and holding of the electronic device by a motion.