JP3296497B2 - Electronic component manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a reaction chamber in which electronic parts such as semiconductors and liquid crystal displays are manufactured, the suction side of the reaction chamber is connected to a gas supply system, and the discharge port of the reaction chamber. The present invention relates to an electronic component manufacturing apparatus that includes a vacuum pump connected to the reaction chamber, and drives the vacuum pump to reduce the pressure in the reaction chamber.

[0002]

2. Description of the Related Art An apparatus for manufacturing an electronic component such as a semiconductor or a liquid crystal display as described above is generally constructed as shown in FIG. That is, in the figure, reference numeral 20 indicates a gas supply system, and the pressure in the reaction chamber 21 is reduced by a vacuum pump 22.
The discharge gas is appropriately discharged through an exhaust gas collecting pipe 23. And the above-mentioned vacuum pump 22
Is designed on condition that the pump discharge pressure does not exceed atmospheric pressure (760 torr).

[0003]

As described above, the conventional vacuum pump has various problems because the operating pressure range is limited to the atmospheric pressure or less. For example, if the discharge pressure greatly exceeds the atmospheric pressure, the pump will not operate or malfunction. For this reason, the diameter of the discharge-side pipes 23 and 24 must be large and the length must be restricted so that the discharge pressure of the pump does not exceed the atmospheric pressure. For example, 100
In the case of a vacuum pump having a pumping speed of about 0 to 10000 l / min, the aforementioned discharge side pipe diameter (inner diameter) is 40 to 5
The pipe length was about 5 m at around 0 mm. On the other hand, electronic component manufacturing is generally performed in a clean room, and a manufacturing apparatus is often installed in the clean room.

[0004] Since the clean room is expensive, it is a very important requirement that the manufacturing apparatus be compact and the layout can be easily made. However, when a vacuum pump is attached to the manufacturing apparatus, in order to effectively obtain a large pumping speed, the manufacturing apparatus and the suction port of the vacuum pump are installed as close as possible to each other and connected by a pipe as thick as possible. It is desirable that the discharge side piping of the pump be a thick pipe so that the discharge side pressure does not exceed the atmospheric pressure. Therefore, the installation work and the layout of the manufacturing apparatus are very difficult, and the installation work period is long and the cost is high.

When it is necessary to further pressurize the gas exhausted by the vacuum pump and send it to the reaction chamber 26, a separate compressor 25 is provided downstream of the vacuum pump as shown in FIGS. It is necessary to increase the pressure and to increase the pressure, which complicates the gas exhaust and pumping equipment.

Therefore, the present invention provides an electronic component manufacturing apparatus which is not restricted by the pipe diameter and layout of the discharge piping system of a vacuum pump and does not require a separate compressor even when the exhaust gas is further pressurized. It is intended to be.

[0007]

According to the present invention, there is provided a reaction chamber in which electronic parts such as semiconductors and liquid crystal displays are manufactured, the suction side of the reaction chamber is connected to a gas supply system, and the reaction chamber is connected to a gas supply system. A vacuum pump to which a discharge port of a chamber is connected, and an electronic component manufacturing apparatus in which the reaction chamber is depressurized when the vacuum pump is driven, wherein the vacuum pump operates even at a discharge pressure of atmospheric pressure or higher. It is a positive displacement pump having multiple stages of internal compression, and the discharge side piping of the vacuum pump is connected to another reaction chamber. According to the present invention, there is provided a reaction chamber in which electronic components such as a semiconductor and a liquid crystal display are manufactured, the suction port side of the reaction chamber is connected to a gas supply system, and the discharge port of the reaction chamber is connected. An electronic component manufacturing apparatus comprising a vacuum pump, wherein when the vacuum pump is driven, the reaction chamber is in a reduced pressure state. The vacuum pump has a single-stage or multi-stage internal compression that operates even when the discharge pressure is higher than the atmospheric pressure. A pump, and a discharge-side pipe of the vacuum pump is connected to a suction port side of the reaction chamber. In carrying out the present invention, a single-stage or multi-stage screw vacuum pump is preferable as the vacuum pump.

[0008]

According to the present invention, since the suction port of the vacuum pump is connected to the reaction chamber where the electronic components are manufactured as described above, when the pump is started, the gas in the chamber is sucked, and the gas is discharged to the discharge pipe. Discharged. Therefore, the reaction chamber is in a reduced pressure state. At this time, since the vacuum pump is a positive displacement pump having a single-stage or multi-stage internal compression, the discharge pressure operates even at a pressure higher than the atmospheric pressure, and the chamber is maintained in a reduced pressure state without being affected by the discharge pipe diameter and length. Is done. For this reason, the discharge side of the vacuum pump can be pressurized and sent to the reaction chamber or another reaction chamber, and it is not necessary to provide a separate compressor, so that it can be made compact and the whole equipment can be simplified.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is implemented with a single-stage screw vacuum pump will be described below.

In FIG. 1, a male rotor and a female rotor (not shown) are rotatably supported by bearings 5a and 5b, respectively, in a space formed by a main casing 1 and a discharge casing 2 of the screw pump P. Shaft seal 6a,
6b seals the bearings 5a and 5b from the lubricating oil. One of the male rotors is rotated at a high speed by a driving machine L mounted on the shaft end of the male rotor, and the female rotor is rotated by the timing gear 10 while keeping a small gap from the male rotor.

In the embodiment shown in FIG. 2, the rotor 7 is driven by a driving machine L via a speed increasing gear 11.

Accordingly, the gas sucked from the suction port 8a is sucked into the tooth space formed by the main casing 1 and the two rotors through the suction port 8b, and undergoes a compression process to be discharged through the discharge port 9b through the discharge port 9b. Is discharged from. In addition,
Reference numeral 3 in the figure is a gear cover, and reference numeral 4 is a cover.

According to the present embodiment, the operating range is wide so that the suction pressure can be increased from the vacuum pressure to the discharge pressure not lower than the atmospheric pressure, for example, not lower than 1500 Torr. The piping length can be relatively long. Further, when it is necessary to pressurize the gas and send it to another reaction chamber 26, a conventional vacuum pump and compressor are arranged in series (FIGS. 8 and 9) as shown in FIGS. Only one pump can be used.

In the case of a pump having internal compression, the power required for the compression work varies depending on the pump suction pressure and discharge pressure. That is, the pump power increases as the suction pressure increases, and the pump power increases as the discharge pressure increases even at the same suction pressure.

In the embodiment of FIG. 3, when the pressure in the reaction chamber is high immediately after the start of evacuation from the reaction chamber, the pump suction pressure may be high and the pump power may be excessive. In this case, a throttle mechanism 32 is added in the middle of the pipe on the pump suction side as shown in FIG.
It can also be implemented to lower the pump suction pressure to prevent overload. Further, an inverter power supply may be used for the pump drive motor instead of the throttle mechanism, and the pump rotation speed may be reduced to the extent that the pump is not overloaded. Further, when the temperature of the gas in the reaction chamber 21 is high, a gas cooler 30 using a throttle mechanism can be provided as shown in FIG. Reference numeral 31 denotes an open / close gate valve.

[0016]

As described above, according to the present invention, the following excellent effects can be obtained. (A) Since the vacuum pump is a positive displacement pump having internal compression, the pump suction pressure is reduced from a vacuum pressure of about 10 Torr or less to the discharge pressure of 1000T which is higher than the atmospheric pressure.
Since it can be about orr or more, the size of the pipe on the discharge side of the pump can be reduced to about 1/3 of the normal size. (B) Because the pipe diameter may be around 10 mm,
Piping layout is possible with simple jigs and tools, installation and piping work is very easy, and the whole apparatus is compact. (C) Since the discharge side of the vacuum pump can be pressurized,
As in the conventional case, a pump for pressure feeding is not required, and the discharge side of the vacuum pump can be directly led to the reaction chamber or another reaction chamber. (D) The installation work period can be shortened, and the entire apparatus is simple and inexpensive.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a vacuum pump according to the present invention.

FIG. 2 is a sectional view showing a main part of another embodiment of the vacuum pump of the present invention.

FIG. 3 is a schematic diagram showing one embodiment of the present invention.

FIG. 4 is a schematic view showing another embodiment of the present invention.

FIG. 5 is a schematic view showing a main part of the embodiment of the present invention.

FIG. 6 is a schematic diagram showing another main part of the embodiment of the present invention.

FIG. 7 is a schematic diagram showing a conventional example.

FIG. 8 is a schematic view showing another conventional example.

FIG. 9 is a schematic view showing another conventional example.

[Explanation of symbols]

 P: pump 8a: suction port 9a: discharge port 21, 26: reaction chamber 24: discharge pipe

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) F04B 37/16 H01L 21/02

Claims (2)

(57) [Claims] 1. A vacuum having a reaction chamber in which electronic components such as semiconductors and liquid crystal displays are manufactured, a suction port side of the reaction chamber is connected to a gas supply system, and a discharge port of the reaction chamber is connected. An electronic component manufacturing apparatus comprising a pump, wherein when the vacuum pump is driven, the reaction chamber becomes in a reduced pressure state. An electronic component manufacturing apparatus, wherein a discharge-side pipe of the vacuum pump is connected to another reaction chamber. 2. A vacuum having a reaction chamber in which electronic components such as a semiconductor and a liquid crystal display are manufactured, wherein a suction port side of the reaction chamber is connected to a gas supply system, and a discharge port of the reaction chamber is connected. An electronic component manufacturing apparatus comprising a pump, wherein when the vacuum pump is driven, the reaction chamber becomes in a reduced pressure state. An electronic component manufacturing apparatus, wherein a discharge side pipe of the vacuum pump is connected to a suction port side of the reaction chamber.