JP3296705B2 - Generating device for standard data for component recognition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition standard data generating apparatus for generating standard data used for component recognition based on a component image.

[0002]

2. Description of the Related Art As electronic products become smaller and lighter, there is a demand for an electronic component automatic mounting apparatus for automatically mounting chip-shaped electronic components on a printed circuit board, which is required to have a higher density. In order to realize the mounting accuracy that satisfies the demand, it is indispensable to recognize the position of the electronic component using the image processing technology.

In order to recognize the position of an electronic component using image processing technology, standard data such as the shape and size of the component registered in advance is used. For electronic components in which position recognition is performed based on the lead image, information on the outermost dimensions, mold size, lead direction,
Information about the number, width, length, pitch, and the like are used. In an electronic component in which position recognition is performed based on a corner image, information on a corner shape and a corner size of the electronic component and the like are used as standard data.

[0004] Such standard data is manually input by a person in charge with reference to dimensions and the like described in catalogs and the like of each electronic component, so that the registration procedure is troublesome.
Therefore, the present applicant has developed a technique for automatically generating standard data based on a part image.

The electronic components mounted by the automatic electronic component mounting apparatus include components having different shapes and sizes, such as micro-square chips, semi-fixed volumes, and ICs. However, since the imaging conditions such as the resolution are fixed, the input component image is not always an image for generating suitable standard data for all electronic components. For this reason, depending on the shape, size, and type of the electronic component, accurate standard data may not be generated.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for generating standard data for component recognition which can generate accurate standard data.

[0007]

According to a first aspect of the present invention, there is provided a component recognition standard data generating apparatus for generating standard data used for component recognition based on a component image. A component image inputting means for inputting a component image and having a function of changing an imaging condition, wherein the input component image is a component image suitable for measuring standard data of the component. Determining means for determining whether or not the input component image is not a component image suitable for measuring the standard data of the component, a component image suitable for measuring the standard data of the component is obtained After adjusting the imaging conditions of the component image input means as described above, control means for re-inputting the component image by the component image input means, and the input component image,
If the component image is suitable for measuring the standard data of the component, a standard data measuring unit for measuring the standard data based on the component image is provided. The imaging condition is one or an arbitrary combination arbitrarily selected from the imaging position, the imaging rotation angle position, the resolution, and the illumination method.

A second component recognition standard data generating apparatus according to the present invention inputs a component image in the component recognition standard data generating apparatus that generates standard data used for component recognition based on a component image. A component image input unit having a function of changing an imaging condition, an image processing device for performing image processing, and a host device for controlling the component image input unit. Means for determining whether the input component image is a component image suitable for measuring standard data of the component,
If the input component image is not a component image suitable for measuring the standard data of the component, the host-side device obtains the component image such that a component image suitable for measuring the standard data of the component is obtained. Means for adjusting the imaging conditions of the input means and re-inputting the component image, and, if the input component image is a component image suitable for measuring standard data of the component, based on the component image. And means for measuring standard data.

In the device for generating standard data for component recognition according to the present invention, when the input component image is not a component image suitable for measuring the standard data of the component, the standard data of the component is measured. After the imaging conditions of the component image input unit are adjusted so that a suitable component image is obtained, the component image is input again by the component image input unit. Therefore, since the standard data can be measured based on the component image suitable for measuring the standard data, accurate standard data can be obtained. As a result, in the position recognition of the component, the recognition accuracy is improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to an electronic component automatic mounting system will be described below with reference to the drawings.

FIG. 1 shows the overall configuration of an electronic component automatic mounting system.

The electronic component automatic mounting system includes a host computer 1 for controlling the entire system, an electronic component mounting device 2 for mounting electronic components on a printed circuit board, and measurement of standard data used for position recognition of electronic components and component position recognition. The image processing apparatus 3 is provided. The host computer (host-side device) 1 includes a database 4 in which standard data is stored. A monitor 5 and a user interface 6 are connected to the image processing device 3.

The electronic component mounting device 2 includes a suction nozzle for sucking and holding the electronic component, and a component holding / mounting device 21 for holding the electronic component and mounting the electronic component on a printed circuit board, and the electronic component sucked by the suction nozzle. The CCD
A component image input device 22 that captures an image with a camera and inputs a component image is provided. In this embodiment, the component holding / mounting device 21 and the component image input device 22 constitute a component image input unit according to claim 1 of the present invention.

The image processing device 3 includes a component image input device 22
The electronic component image obtained by
The image is taken into an image memory as a 12-pixel, 8-bit, 256-gradation grayscale image, and the position of an electronic component is recognized and standard data is measured by image processing. The monitor 5 displays component images,
The processing result and the like are displayed.

The image processing apparatus 3 includes a position recognition unit 31 and a standard data measurement unit 32. The position recognizing unit 31 detects the position of the center of gravity, the inclination angle, and the like of the electronic component based on the electronic component image and standard data such as the type, size, and shape of the electronic component supplied from the host computer 1. The standard data measurement unit 32 obtains standard data such as the type, size, and shape of the electronic component based on the electronic component image.

The user interface 6 corrects the standard data obtained by the standard data measuring means 32 as necessary. The host computer 1 controls each device, registers standard data in the database 4,
Update and read.

FIG. 2 shows a schematic configuration of the component image input device 22. The light irradiation method by the component image input device 22 includes a transmission method and a reflection method. Further, the component image input device 22 has a function of changing the imaging position and the resolution. The component image input device 22 includes a CCD camera 101, a transmission light source 102, a reflection light source 103, and a diffusion plate 104.

In the case of the transmission system, the light emitted from the transmission light source 102 is directly radiated to the diffusion plate 104 on the back of the electronic component 100, and the reflected light is transmitted to the CCD camera 10.
Incident on 1. Thus, a silhouette image of the electronic component 100 is obtained.

In the case of the reflection type, the light emitted from the reflection light source 103 is directly applied to the front surface of the electronic component 100, and the reflected light enters the CCD camera 101. For this reason, an image in which bright portions such as electrodes and other portions can be clearly distinguished is obtained.

Therefore, the transmission method is suitable for measuring standard data based on the outer shape of the electronic component, such as the size and shape of the mold, and the reflection method is used for measuring standard data based on the electrodes. Is suitable.

The resolution is adjusted by moving the CCD camera 101 in the direction of the optical axis in the z-axis. When generating standard data of a relatively small electronic component, a large image is obtained by increasing the resolution, and the standard data is measured based on the obtained image. Thereby, the measurement accuracy of the standard data is improved.

When measuring standard data based on a local portion of an electronic component, the CCD camera 101 is moved in parallel on an xy plane orthogonal to the z axis.
By moving the CCD camera 101 in the z-axis, which is the optical axis direction, an enlarged image of a local portion of the electronic component is obtained,
Standard data is measured based on the obtained enlarged image.
Thereby, the measurement accuracy of the standard data is improved.

The resolution may be adjusted by fixing the CCD camera and moving other optical systems and illumination systems.

FIG. 3 shows the operation of the component holding means 21. The component holding / mounting device 21 includes a suction nozzle 111,
A vacuum pump (not shown) for attracting the electronic component 100 to the suction nozzle 111, a mechanism (not shown) for rotating the suction nozzle 111, and the like are provided.

At the time of standard data measurement, as shown in FIG. 3A, the electronic component 100 is sucked to the suction nozzle 111 by a vacuum pump. Next, as shown in FIG. 3B, while the electronic component 100 is held by the suction nozzle 111, the electronic component 10 is
0 is imaged. Then, the suction posture, the size, and the like of the electronic component 100 are sequentially measured by the standard data measurement unit 32.

In each processing step, as shown in FIG. 3C, position correction by rotation of the suction nozzle 111 and the like is performed as necessary, and an electronic component image is captured again to measure standard data. A suitable image is obtained. For example, when it is difficult to measure standard data from an electronic component image in a tilted posture, an image in which the electronic component is not tilted is obtained by correcting the tilt angle by rotating the suction nozzle 111 or the like, and based on the obtained image. By measuring standard data, it is possible to reduce the load of measurement processing and improve measurement accuracy.

At the time of mounting the components, as shown in FIG.
00 is adsorbed. Next, as shown in FIG. 3B, the electronic component 100 is imaged by the CCD camera 101 while the electronic component 100 is held by the suction nozzle 111. Then, the position recognition means 31 recognizes the center of gravity position, the inclination angle, and the like of the electronic component 100 using the standard data of the electronic component. After the position correction amount is calculated and the position correction is performed by rotating the suction nozzle 111 or the like, the electronic component 100 is mounted on the printed circuit board.

FIGS. 4 and 5 show examples of standard data. As shown in FIG. 4, in an electronic component in which position recognition is performed based on a lead image, the type of the electronic component, the size of the outermost shape (the outermost length X, the outermost width Y), and the size of the mold (the mold length) X, mold width Y), lead direction, number of leads, lead length L, lead width D, lead pitch P
Are used as standard data.

As shown in FIG. 5, in an electronic component in which position recognition is performed based on an image of a corner, the type, the corner size, the shape of the corner and the like of the electronic component are used as standard data as standard data. FIG. 5A shows an R-chamfered corner, FIG. 5B shows a C-chamfered corner, and FIG.
(C) shows other corners (defective corners).

FIG. 6 shows a processing procedure for generating standard data. First, the image processing device 3 performs coarse detection of the size of the electronic component image with respect to the input electronic component image (step 1), and determines whether the size of the electronic component image is appropriate (step 1). 2).

If the size of the electronic component image is not appropriate, the host computer 1 controls the component image input device 22 to change the resolution. Then, the image is again captured by the component image input device 22 (step 3).
Then, the process returns to step 1.

If it is determined in step 2 that the size of the electronic component image is appropriate, the image processing device 3
Detects the mold or the outermost shape and detects the suction posture of the electronic component (step 4).

Then, it is determined whether or not the suction posture is appropriate (step 5). If the suction posture is not appropriate, the host computer 1 rotates the suction nozzle of the component holding / mounting device 21 so that the suction posture of the electronic component becomes an appropriate posture. Then, the image is taken in again by the component image input device 22 (step 6). Then, the process returns to step 4.

If it is determined in step 5 that the suction posture is appropriate, the image processing device 3 measures the size of the electronic component (step 7). In addition, the image processing apparatus 3 performs local shape recognition and local size measurement processing (local recognition measurement processing) according to the type of electronic component.
(Step 8) or measurement processing based on the electrodes (Step 9) is performed.

The host computer 1 registers the standard data of the electronic component measured in steps 7, 8, and 9 in the database 4 (step 10).

The processing of steps 1 to 6 in FIG. 6 will be specifically described with reference to FIG. 7 using a square chip component as an example.

In the coarse detection of the size of the electronic component image in step 1, as shown in FIG. 7A, for example, the size of the circumscribed rectangle of the electronic component image is obtained. FIG.
As shown in (a), when the circumscribed rectangle of the electronic component image is smaller than the entire screen size (step 2), a command or the like for increasing the resolution is notified to the host computer 1. The host computer 1 controls the component image input device 22 to increase the resolution. And
The electronic component image is captured again (step 3). The magnification of the resolution is calculated based on the size of the circumscribed rectangle.

As a result, a high-resolution electronic component image is obtained as shown in FIG. The mold is detected from the obtained high-resolution electronic component image, and the suction posture of the electronic component is detected from the inclination angle (step 4). If the electronic component suction posture is not appropriate (NO in step 5), the tilt angle of the mold is sent to the host computer 1. The host computer 1 rotates the suction nozzle of the component holding / mounting device 21 such that the suction posture of the electronic component becomes an appropriate posture. Then, the electronic component image is captured again (step 6).

As a result, as shown in FIG. 7C, a high-resolution electronic component image with an appropriate suction attitude is obtained. Then, based on the obtained electronic component images, steps 7 to 9 are performed.
The standard data measurement process is performed. As described above, since the measurement processing of the standard data of the electronic component is performed based on the electronic component image having both the appropriate size and the suction posture, the processing load is reduced and the accurate standard data can be obtained. Become like

FIG. 8 shows the procedure of the local recognition measurement processing in step 8 of FIG. In the local recognition measurement processing, for example, like an electronic component (see FIG. 5) in which position recognition is performed based on an image of a corner, the shape of the corner (local shape) and the corner size (local size) Is performed on electronic components used as standard data.

First, the image processing device 3 determines whether or not to continue the local recognition measurement process (step 81). If the electronic component uses local information as standard data and all the local information required for the standard data has not been measured, YES is determined in step 81. When the electronic component does not use local information as standard data, or when the electronic component uses local information as standard data, and all the local information required for the standard data is measured. If so, the determination at step 81 is NO.

If "NO" in the step 81, the process proceeds to a step 9 in FIG. If “YES” in the step 81, the host computer 1 operates the component image input device 22 to obtain an enlarged image of a local portion such as a corner portion of the electronic component.
Control. In other words, the CCD camera is moved on the xy plane in FIG.
The CCD camera is moved in the z-axis direction in FIG. 2 to obtain an enlarged image. Then, an electronic component image is captured by the component image input device 22 (step 82).

The image processing device 3 performs local shape recognition and local size measurement based on the captured image (step 83). Then, the process returns to step 81.

FIG. 9 shows the procedure of the measurement process based on the electrodes in step 9 of FIG. In the measurement processing based on the electrodes, electronic components in which information about electrodes such as lead length, lead width, and lead pitch are used as standard data, such as electronic components in which position recognition is performed based on a lead image (see FIG. 4). Is performed on

First, the image processing device 3 determines whether or not to continue the measurement process based on the electrodes (step 91). If the electronic component uses the information on the electrodes as the standard data and all the information on the electrodes necessary for the standard data has not been measured, the result of step 91 is YES. If the electronic component does not use information about the electrodes as standard data, or if the electronic component uses information about the electrodes as standard data, and all the information about the electrodes required for the standard data is measured. In this case, the determination in step 91 is NO.

If "NO" in the step 91, the process proceeds to a step 10 in FIG. If “YES” in the step 91, the image processing device 3 determines whether or not it is necessary to switch the illumination method (step 92). As a lighting method, a transmission method is usually selected. When the transmission method is selected, it is determined that the illumination method needs to be switched to the reflection method.

If it is determined that the illumination system needs to be switched to the reflection system, the host computer 1 controls the component image input device 22 to switch the illumination system to the reflection system (step 93). Then, an electronic component image is taken in by the component image input device 22, and the process proceeds to step 94. If it is determined in step 92 that there is no need to switch the illumination method, the process proceeds to step 94 without performing step 93.

In step 94, the image processing device 3 determines whether or not it is necessary to change the resolution and the imaging position based on the currently captured electronic component image. When it is determined that the resolution and the imaging position need to be changed, the host computer 1 controls the component image input device 22 so as to obtain an enlarged image of the electrode (step 95). Then, the electronic component image is taken in by the component image input device 22, and the process proceeds to step 96. If it is determined in step 94 that the resolution and the imaging position do not need to be changed, the process proceeds to step 96 without performing step 95.

In step 96, the image processing device 3 measures information about the electrodes such as the lead length, the lead width, and the lead pitch based on the currently captured image. Then, the process proceeds to step 10.

After the standard data of the electronic component is registered in the database 4 as described above, the electronic component automatic mounting system is operated. Electronic components to be mounted on the board are imaged and stored in an image memory. On the other hand, standard data of the electronic component is read from the database 4 from the host computer 1 and transferred to the image processing device 3. The position recognition means 31 in the image processing device 3 performs position recognition of the electronic component based on the electronic component image stored in the image memory and the standard data for the electronic component, and the recognition result is stored in the host computer 1. Sent to After the position correction is performed, the electronic component is mounted on the printed circuit board.

In the position recognition, if an error occurs due to an error in the measurement result of the standard data, a process of generating the standard data is performed again or a correction is made by the user interface.

[0052]

According to the present invention, accurate standard data can be generated.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an overall configuration of an electronic component automatic mounting system.

FIG. 2 is a perspective view illustrating a schematic configuration of a component image input device.

FIG. 3 is an explanatory diagram showing an operation of the component holding / mounting device.

FIG. 4 is a schematic diagram showing an example of standard data.

FIG. 5 is a schematic diagram showing an example of standard data.

FIG. 6 is a flowchart illustrating a processing procedure when generating standard data.

FIG. 7 is an explanatory diagram for specifically explaining the processing of steps 1 to 6 in FIG. 6;

FIG. 8 is a flowchart showing the procedure of a local recognition measurement process in step 8 of FIG. 6;

FIG. 9 is a flowchart showing a procedure of a measurement process based on the electrodes in step 9 of FIG. 6;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 host computer 2 electronic component mounting device 3 image processing device 4 database 21 component holding / mounting device 22 component image input device 31 position recognition means 32 standard data measurement means

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) G06T ⁷ /00-7/60 G01B 11/24 G06T 1/00

Claims (3)

(57) [Claims] An apparatus for generating standard data for component recognition that generates standard data used for component recognition based on a component image, the device having a function of inputting a component image and capable of changing an imaging condition. A component image input means having the component image determination means for determining whether or not the input component image is a component image suitable for measuring standard data of the component; If the component image is not suitable for measuring the data, after adjusting the imaging conditions of the component image input means so that a component image suitable for measuring the standard data of the component is obtained, the component image is input to the component image. Control means for re-inputting by means, and if the input component image is a component image suitable for measuring standard data of the component, based on the component image And a standard data measuring means for measuring standard data. 2. An apparatus for generating standard data for component recognition, which generates standard data used for component recognition based on a component image, wherein a function for inputting a component image and changing an imaging condition is provided. A component image input device, an image processing device that performs image processing, and a host device that controls the component image input device. The image processing device converts the input component image into standard data of the component. Means for determining whether or not the component image is suitable for measurement; when the input component image is not a component image suitable for measuring the standard data of the component, the host-side device uses the standard data of the component; Means for adjusting the imaging conditions of the component image input means so as to obtain a component image suitable for measuring the component image and for re-inputting the component image, and the input portion Images, when a component image suitable to measure standard data of the component,
An apparatus for generating standard data for component recognition, comprising means for measuring standard data based on the component image. 3. The component recognition apparatus according to claim 1, wherein the imaging condition is one or an arbitrary combination selected from an imaging position, an imaging rotation angle position, a resolution, and an illumination method. Standard data generator.