JP3300440B2 - Silica molding - Google Patents
Silica moldingInfo
- Publication number
- JP3300440B2 JP3300440B2 JP32935492A JP32935492A JP3300440B2 JP 3300440 B2 JP3300440 B2 JP 3300440B2 JP 32935492 A JP32935492 A JP 32935492A JP 32935492 A JP32935492 A JP 32935492A JP 3300440 B2 JP3300440 B2 JP 3300440B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat medium
- silica molded
- molded body
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 121
- 239000000377 silicon dioxide Substances 0.000 title claims description 60
- 238000000465 moulding Methods 0.000 title claims description 6
- 239000000126 substance Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims 1
- 238000003795 desorption Methods 0.000 description 22
- 239000002184 metal Substances 0.000 description 15
- 238000001179 sorption measurement Methods 0.000 description 13
- 239000011247 coating layer Substances 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000002336 sorption--desorption measurement Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、物質の吸脱着に用いる
シリカ成形体に関するものであり、特に熱交換可能なシ
リカ成形体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silica molded article used for adsorption and desorption of a substance, and more particularly to a heat-exchangeable silica molded article.
【０００２】[0002]
【従来の技術】従来、シリカ成形体を用いて物質の吸脱
着を行う工程において、系の加熱又は冷却といった温度
調節を必要とする場合には、エアーを熱媒体とする温度
調節が、簡単な温度調節方法として採用されていた。ま
た、水やオイル等の液体の熱媒体を使用する場合には、
熱交換用の金属パイプの中に熱媒体を通し、その周りに
シリカ成形体を設置する方法が採られていた。この場合
のシリカ成形体の設置方法は、シリカ成形体を金属パイ
プに直接接着する方法や、シリカ成形体を金属パイプに
ただ近接する方法などがあった。2. Description of the Related Art Conventionally, when temperature control such as heating or cooling of a system is required in a process of adsorbing and desorbing a substance using a silica molded body, temperature control using air as a heat medium is simple. It was adopted as a temperature control method. When using a liquid heat medium such as water or oil,
A method has been adopted in which a heat medium is passed through a metal pipe for heat exchange, and a silica molded body is placed around the heat medium. In this case, the method of installing the silica molded body includes a method of directly bonding the silica molded body to the metal pipe and a method of simply bringing the silica molded body close to the metal pipe.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記エ
アーを熱媒体とした温度調節においては、気体を熱媒体
として利用しているため熱容量が小さく大風量を必要と
し、熱交換の効率がよくないという問題があった。However, in the temperature control using air as a heat medium, the use of gas as a heat medium requires a small heat capacity and a large air volume, resulting in poor heat exchange efficiency. There was a problem.
【０００４】また、上記液体を熱媒体とした温度調節に
おいては、金属パイプの周囲にシリカ成形体を設置する
手間が必要となるうえ、金属パイプとシリカ成形体の双
方を介して熱交換を行うため、熱交換の効率が悪いとい
った問題もあった。更に、金属パイプの周りに設置した
シリカ成形体が、金属の熱膨張による歪ではがれ落ちる
といった欠点も有していた。[0004] In the temperature control using the liquid as a heat medium, it is necessary to install a silica molded body around a metal pipe, and heat is exchanged through both the metal pipe and the silica molded body. Therefore, there is a problem that the efficiency of heat exchange is low. Further, there is a disadvantage that the silica molded body installed around the metal pipe is peeled off by the strain due to the thermal expansion of the metal.
【０００５】本発明は、上記課題を解決し、物質の吸脱
着時の温度調節を効率よく簡単に行えるシリカ成形体を
提供することを目的とする。[0005] An object of the present invention is to solve the above-mentioned problems and to provide a silica molded article capable of efficiently and easily controlling the temperature during adsorption and desorption of a substance.
【０００６】[0006]
【課題を解決するための手段】本発明のシリカ成形体
は、物質の吸脱着に用いられるシリカ成形体において、
熱媒体を通すための熱媒体用貫通穴と、その壁面にて物
質の吸脱着を行うための吸脱着用貫通穴とを有し、該両
貫通穴を近接して配置したことにより、上記熱媒体用貫
通穴と上記吸脱着用貫通穴との間での熱交換を可能と
し、さらに、上記熱媒体用貫通穴の壁面をコーティング
を施し、壁面に熱媒体が浸透しないようにしたことを要
旨とする。The silica molded article of the present invention is a silica molded article used for adsorbing and desorbing substances.
It has a through hole for a heat medium for passing a heat medium, and a through hole for absorption and desorption for absorbing and desorbing a substance on the wall surface thereof. Enables heat exchange between the through hole for medium and the through hole for absorption and desorption , and further coats the wall surface of the through hole for heat medium
The main point is that the heat medium is prevented from penetrating into the wall surface .
【０００７】[0007]
【作用】本発明のシリカ成形体によれば、シリカ成形体
に開けられた熱媒体用貫通穴及び吸脱着用貫通穴に液体
又はガス体を直接通して吸脱着を行う際、吸脱着系で発
生する熱を熱媒体が熱交換することにより温度調節を行
うことができる。According to the silica molded article of the present invention, when a liquid or a gaseous substance is directly passed through the through hole for a heat medium and the through hole for adsorption and desorption in the silica molded article to perform adsorption and desorption, the adsorption and desorption system is used. The temperature can be adjusted by exchanging the generated heat with the heat medium.
【０００８】また、熱媒体用貫通穴と吸脱着用貫通穴と
の隔壁を薄くして両者が近接した構造のため、吸脱着用
貫通穴で発生した熱を熱媒体用貫通穴内の熱媒体が効率
よく熱交換することができる。更に、熱媒体を通すため
にシリカ成形体を金属パイプの周りに設置したものと比
べ、設置する手間が不要となるので簡単に系の温度調節
が行うことができ、しかも熱交換がシリカ成形体のみを
介して行われるため熱交換の効率もよい。そのうえ、金
属パイプの周りにシリカ成形体を設置した場合には、金
属の熱膨張による歪でシリカ成形体がはがれ落ちる欠点
を有していたが、本発明のシリカ成形体はこのような心
配がない。加えて、熱媒体用貫通穴の壁面はコーティン
グされているため、熱媒体がシリカ成形体内部に浸透し
て吸脱着系に侵入することが無い。 Further, since the partition wall between the through hole for the heat medium and the through hole for adsorption and desorption is made thinner and both are close to each other, the heat generated in the through hole for the heat medium is generated by the heat medium in the through hole for the adsorption and desorption. Heat exchange can be performed efficiently. Furthermore, compared to the case where a silica molded body is provided around a metal pipe to allow a heat medium to pass through, the time required for installation is not required, so that the temperature of the system can be easily adjusted, and heat exchange is performed with the silica molded body. Since the heat exchange is performed only through the heat exchanger, the heat exchange efficiency is high. In addition, when a silica molded body is provided around a metal pipe, the silica molded body has a disadvantage that the silica molded body is peeled off due to distortion due to thermal expansion of the metal, but the silica molded body of the present invention has such a concern. Absent. In addition, the wall of the through hole for heat medium is coated
Heat medium penetrates into the silica molding
And does not enter the adsorption / desorption system.
【０００９】[0009]
【実施例】以下本発明を、実施例により更に具体的に説
明するが、本発明はその要旨を超えない限り、以下の実
施例の記述内容に限定されるものではない。 ［実施例１］図１に、本発明の一実施例であるシリカ成
形体１の斜視図を示す。シリカ成形体１は円柱型をして
おり、円柱の軸方向に沿って複数の熱媒体用貫通穴３と
吸脱着用貫通穴５とを有したハニカム構造となってい
る。EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited to the following Examples unless it exceeds the gist thereof. [Embodiment 1] FIG. 1 is a perspective view of a silica molded body 1 according to an embodiment of the present invention. The silica molded body 1 has a cylindrical shape, and has a honeycomb structure having a plurality of through holes 3 for a heat medium and through holes 5 for absorbing and desorbing along the axial direction of the cylinder.
【００１０】図２に、図１のＡ−Ａ線断面図を示す。熱
媒体用貫通穴３は、その壁面が熱媒体に対して非浸透性
の膜からなるコーティング層７で覆われているが、吸脱
着用貫通穴５は、コーティング層７で覆われていない。
また熱媒体用貫通穴３と吸脱着用貫通穴５は、図２に示
したように交互に形成されている。FIG. 2 is a sectional view taken along line AA of FIG. The through hole 3 for the heat medium has its wall surface covered with a coating layer 7 made of a film that is impermeable to the heat medium, but the through hole 5 for absorbing and desorbing is not covered with the coating layer 7.
The through holes 3 for the heat medium and the through holes 5 for attaching and detaching are alternately formed as shown in FIG.
【００１１】シリカ成形体１の製造方法を以下に示す。
まず、粒度１ｍｍ〜２μｍ、細孔径１〜１０ｎｍのシリ
カゲルと無機系ゾルのバインダーを混合し、型にいれて
約３００℃でプレスし、ハニカム構造に成形した。次
に、貫通穴の開口部を一つおきに目張りをし、目張りさ
れていない貫通穴にのみ釉薬を通して塗布した。その後
目張りを取り除き、焼成することにより壁面に非浸透性
の膜を生成させ、コーティング層７とした。コーティン
グ層７で覆われた貫通穴が熱媒体用貫通穴３、覆われて
いない貫通穴が吸脱着用貫通穴５となり、本発明のシリ
カ成形体１が得られた。A method for producing the silica molded body 1 will be described below.
First, silica gel having a particle size of 1 mm to 2 μm and a pore size of 1 to 10 nm and an inorganic sol binder were mixed, placed in a mold and pressed at about 300 ° C. to form a honeycomb structure. Next, every other opening of the through-hole was laid, and glaze was applied only to the un-through-hole. Thereafter, the seam was removed, and baking was performed to form a non-permeable membrane on the wall surface. The through-holes covered with the coating layer 7 became the through-holes 3 for the heat medium, and the uncovered through-holes became the through-holes 5 for absorbing and desorbing. Thus, the silica molded article 1 of the present invention was obtained.
【００１２】本実施例のシリカ成形体１を用いたとこ
ろ、熱媒体用貫通穴３内の熱媒体はシリカ成形体１の吸
脱着熱を効率よく熱交換し、系の温度調節を効率よく制
御することができた。以上述べた本実施例は、以下の効
果を有する。 熱媒体用貫通穴３と吸脱着用貫通穴５との隔壁を非
常に薄くしてもハニカム構造により強度が保持でき、そ
の結果両貫通穴３、５を近接させることができるため、
熱交換率がよい。 微細な口径の熱媒体用貫通穴３及び吸脱着用貫通穴
５を持つシリカ成形体１を得ることができるため、熱交
換を行う面積が増大し熱交換率が一層向上する。 液体の熱媒体を通す金属パイプの周りにシリカ成形
体を設置する手間が不要となり、簡単に系の温度調整を
行うことができる。しかも、熱交換が金属パイプを介さ
ずシリカ成形体のみを介して行われるため、熱交換率が
よい。また、金属の熱膨張による歪で設置したシリカ成
形体がはがれ落ちる欠点を有していたが、本実施例のシ
リカ成形体１はこのような心配もない。 熱媒体用貫通穴３の壁面はコーティング層７で覆わ
れているため、熱媒体がシリカ成形体１内部に浸透して
吸脱着系に侵入することが無い。 ［実施例２］図３に、本考案の一実施例であるシリカ成
形体１１の斜視図を示す。シリカ成形体１１は、シリカ
成形体部品１３（図４参照）を６枚、段ボール状に積層
したものである。シリカ成形体部品１３は、複数の波山
１５を有し、実施例１と同じ組成の材料を同じ条件でプ
レスして成形された。このシリカ成形体部品１３の表面
１７に非浸透性の膜でコーティングを施したもの３枚
と、裏面１９に非浸透性の膜でコーティングを施したも
の３枚とを用意する。コーテイングは、実施例１と同様
の方法により行った。When the silica molded body 1 of this embodiment is used, the heat medium in the through hole 3 for a heat medium efficiently exchanges heat of adsorption and desorption of the silica molded body 1 and efficiently controls the temperature control of the system. We were able to. The embodiment described above has the following effects. Even if the partition wall between the heat medium through-hole 3 and the through-hole for absorption and desorption is very thin, the honeycomb structure can maintain the strength, and as a result, both the through-holes 3 and 5 can be brought close to each other.
Good heat exchange rate. Since it is possible to obtain the silica molded body 1 having the heat medium through-holes 3 and the through-holes 5 for adsorption and desorption having a fine diameter, the area for performing heat exchange is increased, and the heat exchange rate is further improved. It is not necessary to install a silica molded body around a metal pipe through which a liquid heat medium passes, and the temperature of the system can be easily adjusted. In addition, since heat exchange is performed only through the silica molded body without passing through the metal pipe, the heat exchange rate is good. In addition, although the silica molded body set due to the strain due to the thermal expansion of the metal has a disadvantage of peeling off, the silica molded body 1 of the present embodiment does not have such a concern. Since the wall surface of the heat medium through-hole 3 is covered with the coating layer 7, the heat medium does not penetrate into the silica molded body 1 and enter the adsorption / desorption system. [Embodiment 2] FIG. 3 is a perspective view of a silica molded body 11 according to an embodiment of the present invention. The silica molded body 11 is obtained by laminating six silica molded body parts 13 (see FIG. 4) in a cardboard shape. The silica molded part 13 has a plurality of wave peaks 15 and was formed by pressing a material having the same composition as in Example 1 under the same conditions. Three pieces of the silica molded component 13 having a surface 17 coated with a non-permeable membrane and three pieces having a back face 19 coated with a non-permeable membrane are prepared. The coating was performed in the same manner as in Example 1.
【００１３】この表面１７にコーティングを施したシリ
カ成形体部品１３と、裏面１９にコーティングを施した
シリカ成形体部品１３とを、１枚おきに、その波山１５
の方向が互い違いになるように重ねて接着し、シリカ成
形体１１とした。図５に図３のＢ−Ｂ線断面図を示す。
コーティング層２１に覆われていない二つの波山１５
と、コーティング層２１に覆われていない裏面１９とに
囲まれた部分が、吸脱着用貫通穴２３である。また、図
６に図３のＣ−Ｃ線断面図を示す。コーティング層２１
に覆われた二つの波山１５と、コーティング層２１に覆
われた裏面１９とに囲まれた部分が、熱媒体用貫通穴２
５である。図５，６から明らかなように、吸脱着用貫通
穴２３の存在する層と、熱媒体用貫通穴２５の存在する
層が、交互に積み重なっている。The silica molding parts 13 having the front surface 17 coated and the silica molding parts 13 having the back surface 19 coated are alternately provided on the wave peak 15.
Were laminated and bonded so that the directions of the layers were alternately formed, and a silica molded body 11 was obtained. FIG. 5 is a sectional view taken along line BB of FIG.
Two wave mountains 15 not covered by the coating layer 21
And a portion surrounded by the back surface 19 that is not covered with the coating layer 21 is a through hole 23 for attaching and detaching. FIG. 6 is a sectional view taken along line CC of FIG. Coating layer 21
The portion surrounded by the two crests 15 covered with the coating layer 21 and the back surface 19 covered with the coating layer 21 is the through hole 2 for the heat medium.
5 As is clear from FIGS. 5 and 6, the layer in which the through-holes 23 for absorption and desorption exist and the layer in which the through-holes 25 for the heat medium are alternately stacked.
【００１４】本実施例のシリカ成形体１１を用いたとこ
ろ、熱媒体用貫通穴２５内の熱媒体はシリカ成形体１１
の吸脱着熱を効率よく熱交換し、系の温度調節を効率よ
く制御することができた。以上述べた本実施例は、実施
例１の効果において、本実施例は段ボール構造により
熱媒体用貫通穴２５と吸脱着用貫通穴２３との隔壁を非
常に薄くしても強度が保持できる点を除き、実施例１と
同様の効果を有する。When the silica molded body 11 of this embodiment is used, the heat medium in the heat medium through-hole 25 is
The heat of adsorption and desorption was efficiently exchanged, and the temperature control of the system could be controlled efficiently. The present embodiment described above is different from the effect of the first embodiment in that the strength of the present embodiment can be maintained even when the partition wall between the heat medium through-hole 25 and the through-hole 23 for absorption and desorption is made extremely thin by the cardboard structure. Except for the above, the same effect as in the first embodiment is obtained.
【００１５】また、本実施例のシリカ成形体１１を、熱
交換型換気扇のエレメントとして使用し、吸脱着用貫通
穴２３に外気を通し、熱媒体用貫通穴２５に室内からの
排気を通して使用することが可能である。この場合、外
気と排気との間で熱交換が行われるため、冷暖房によっ
て温度調節された排気が無駄にならないといった効果の
他に、吸脱着用貫通穴２３において外気の湿度調節が可
能となるといった効果がある。即ち、夏期には、高温の
外気が室内からの冷房された排気によって冷却されると
同時に、外気中の水分がシリカ成形体１１へ吸着され
る。また、冬季には、低温の外気が室内からの暖房され
た排気によって暖められると同時に、外気中の水分がシ
リカ成形体１１へ吸着される。これによって、冷暖房の
効率を向上できると共に、室内を乾燥させ、室内に残る
湿気による結露等を防止することができる。Further, the silica molded body 11 of this embodiment is used as an element of a heat exchange type ventilation fan, through which outside air is passed through the through hole 23 for suction and desorption, and exhaust air from the room is passed through the through hole 25 for heat medium. It is possible. In this case, since heat is exchanged between the outside air and the exhaust air, in addition to the effect that the exhaust air whose temperature has been adjusted by cooling and heating is not wasted, the humidity of the outdoor air can be adjusted in the through hole 23 for suction and desorption. effective. That is, in the summer, the high-temperature outside air is cooled by the cooled exhaust air from the room, and at the same time, the moisture in the outside air is adsorbed on the silica molded body 11. In winter, low-temperature outside air is heated by heated exhaust air from the room, and at the same time, moisture in the outside air is adsorbed on the silica molded body 11. As a result, the efficiency of cooling and heating can be improved, the room can be dried, and dew condensation or the like due to moisture remaining in the room can be prevented.
【００１６】[0016]
【発明の効果】以上説明したように、本発明によれば、
物質の吸脱着時の温度調節を効率よく簡単に行えるシリ
カ成形体を提供できる。即ち、本発明のシリカ成形体
は、熱媒体用貫通穴と吸脱着用貫通穴とを近接して設け
たため、熱媒体は吸脱着用貫通穴にて発生した熱を効率
よく熱交換することができる。また、金属パイプの周囲
にシリカ成形体を設置する従来の技術と比べて、設置す
る手間が不要で、ただシリカ成形体に熱媒体用貫通穴と
吸脱着用貫通穴とを設けるのみでよい。更に、金属パイ
プを介さずシリカ成形体のみを介して熱交換を行うた
め、熱交換率が向上する。加えて、熱媒体用貫通穴の壁
面はコーティングされているため、熱媒体がシリカ成形
体内部に浸透して吸脱着系に侵入することが無い。 As described above, according to the present invention,
It is possible to provide a silica molded body capable of efficiently and easily controlling the temperature at the time of adsorption and desorption of a substance. That is, since the silica molded body of the present invention is provided with the heat medium through-hole and the through-hole for adsorption and desorption in close proximity, the heat medium can efficiently exchange heat generated in the through-hole for adsorption and desorption. it can. In addition, as compared with the conventional technique of installing a silica molded body around a metal pipe, installation work is not required, and it is only necessary to provide a through hole for a heat medium and a through hole for absorption and desorption in the silica molded body. Furthermore, since heat exchange is performed only through the silica molded body without using the metal pipe, the heat exchange rate is improved. In addition, the wall of the through hole for heat medium
Since the surface is coated, the heating medium is silica molded
It does not penetrate into the body and penetrate into the adsorption / desorption system.
【図１】本発明の一実施例のシリカ成形体の斜視図であ
る。FIG. 1 is a perspective view of a silica molded article according to one embodiment of the present invention.
【図２】図１のＡ−Ａ断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】本発明の一実施例のシリカ成形体の斜視図であ
る。FIG. 3 is a perspective view of a silica molded body according to one embodiment of the present invention.
【図４】本発明の一実施例のシリカ成形体の部品の斜視
図である。FIG. 4 is a perspective view of a part of a silica molded article according to one embodiment of the present invention.
【図５】図３のＢ−Ｂ断面図である。FIG. 5 is a sectional view taken along line BB of FIG. 3;
【図６】図３のＣ−Ｃ断面図である。FIG. 6 is a sectional view taken along the line CC of FIG. 3;
１，１１・・・シリカ成形体、 ３，２５・
・・熱媒体用貫通穴 ５，２３・・・吸脱着用貫通穴、 ７，２１・
・・コーティング層 １３・・・シリカ成形体部品、 １５・・・
波山 １７・・・表面、 １９・・・
裏面1,11 ・ ・ ・ Silica molding, 3,25 ・
..Through holes for heat medium 5, 23 ... Through holes for absorption and desorption, 7, 21
..Coating layer 13: Silica molded part, 15 ...
Namiyama 17 ・ ・ ・ Surface, 19 ・ ・ ・
Back
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山腰 富雄 宮崎県日向市大字日知屋字木原16303− ３ 富士デヴィソン化学株式会社 テク ニカルセンター内 (56)参考文献 特公 昭50−10709（ＪＰ，Ｂ１) 実公 昭42−1831（ＪＰ，Ｙ１) (58)調査した分野(Int.Cl.7，ＤＢ名) B01J 20/00 - 20/34 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tomio Yamakoshi 16303-3 Kihara, Hichiya, Hyuga City, Miyazaki Prefecture 3 Inside the Technical Center, Fuji Devison Chemical Co., Ltd. (56) References: Japanese Patent Publication No. Sho 50-10709 J. 42-1831 (JP, Y1) (58) Field surveyed (Int. Cl. 7 , DB name) B01J 20/00-20/34
Claims (2)
において、 熱媒体を通すための熱媒体用貫通穴と、その壁面にて物
質の吸脱着を行うための吸脱着用貫通穴とを有し、 該両貫通穴を近接して配置したことにより、上記熱媒体
用貫通穴と上記吸脱着用貫通穴との間での熱交換を可能
とし、 さらに、上記熱媒体用貫通穴の壁面をコーティングを施
し、壁面に熱媒体が浸透しないようにした ことを特徴と
するシリカ成形体。A silica molded article used for adsorbing and desorbing a substance has a through hole for a heat medium for passing a heat medium, and a through hole for adsorbing and desorbing a substance on the wall surface thereof. By arranging the two through holes close to each other, heat exchange between the heat medium through hole and the suction / detachment through hole is enabled, and the wall surface of the heat medium through hole is further reduced . Apply coating
And a heat-transfer medium that does not penetrate the wall surface .
壁面に釉薬を塗布した後、焼結し非浸透性の膜を生成さ
せることにより施したことを特徴とする請求項１記載の
シリカ成形体。2. The silica molding according to claim 1, wherein the coating is performed by applying a glaze to the wall surface of the through hole for a heat medium and then sintering to form a non-permeable film. body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32935492A JP3300440B2 (en) | 1992-12-09 | 1992-12-09 | Silica molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32935492A JP3300440B2 (en) | 1992-12-09 | 1992-12-09 | Silica molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06170222A JPH06170222A (en) | 1994-06-21 |
| JP3300440B2 true JP3300440B2 (en) | 2002-07-08 |
Family
ID=18220525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32935492A Expired - Fee Related JP3300440B2 (en) | 1992-12-09 | 1992-12-09 | Silica molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3300440B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4821563B2 (en) * | 2006-10-31 | 2011-11-24 | 株式会社デンソー | Adsorption module and method of manufacturing adsorption module |
| JP4830799B2 (en) * | 2006-11-08 | 2011-12-07 | 株式会社デンソー | Adsorption module |
-
1992
- 1992-12-09 JP JP32935492A patent/JP3300440B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06170222A (en) | 1994-06-21 |
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