JP3300822B2 - Base paper for heat-sensitive stencil printing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of heat-sensitive stencil printing base paper.

[0002]

2. Description of the Related Art In general, heat-sensitive stencil printing paper is prepared by laminating a thermoplastic resin film and an ink-permeable porous support with an adhesive, and further preventing fusion of the film surface with a heating element of a thermal head. For preventing sticking. Examples of adhesives conventionally used for the base paper include acrylic resins (JP-B-47-1187 and JP-B-51-33004) and vinyl acetate resins (JP-B-47-1188). ), A vinyl acetate resin to which a rosin resin is added (JP-A-59-16786), a methoxylated polyamide resin (JP-A-59-115899), and a vinyl chloride copolymer (JP-A-59-215894). JP-A-62-1589), chlorinated polypropylene resin (JP-A-62-1589),
Urethane resin (JP-A-61-116595),
Examples include a reaction prepolymer of diisocyanate and polyether diol (JP-A-62-181374) and a mixed adhesive of an active hydrogen-containing resin and a polyisocyanate (JP-A-2-29987).

[0003] Conventionally used bonding methods include, for example, dissolving or diluting an adhesive with an organic solvent.
１５15% solution, applied to a thermoplastic film or a porous support, and then bonded to a porous support or a thermoplastic film and dried.
No. 1589), a hot-melt adhesive is applied to a film, and the hot-melt adhesive is applied by laminating the film onto a porous support and pressing the film with a heating roll (Japanese Patent Laid-Open No. 59-167).
No. 90, etc.), a one-component solventless laminating bonding method in which a polyurethane prepolymer is melt-coated and pressed by a roll to bond (Japanese Patent Application Laid-Open Nos. 61-11659 and 62-1).
No. 81374, etc.), an ultraviolet ray and an electron beam-curable non-solvent laminating method (WO 89/0187) in which an ultraviolet ray and an electron beam curable adhesive are melted and applied by pressing with a roll.
No. 2).

[0004] In general, a heat-sensitive structure in which a thermoplastic resin film and an ink-permeable porous support are adhered to each other with an adhesive and further provided with a stick prevention layer for preventing fusion with a heating element of a thermal head. In the case of stencil printing paper, it is necessary to obtain stronger and more uniform adhesion with as little adhesive as possible. When the amount of the adhesive is large, the perforation of the film is deteriorated and the eyes of the porous support are closed, so that the passage of ink is hindered and a clear printed matter cannot be obtained. On the other hand, when the amount of the adhesive is small, the adhesive strength is weakened, the film is easily lifted, and the film is peeled off during printing, so that the printing durability is reduced.

As for the adhesive itself, when a vinyl acetate resin, a vinyl acetate resin to which a rosin resin is added, a methoxylated polyamide resin, a vinyl chloride copolymer, a chlorinated polypropylene resin, etc. are used, the printing ink is softened. ,
Because of swelling and dissolution, if the amount of the adhesive is small, the printing durability decreases, and if the amount of the adhesive is large, a clear printed matter cannot be obtained.
In addition, when using a urethane adhesive, which is a reaction prepolymer of diisocyanate and polyether diol, although the ink resistance is good and the printing strength is large with a small amount, the pot life of the adhesive solution and the management of humidity are adjusted. It is difficult and tends to cause uneven curing.

As for the bonding method, since a large amount of an organic solvent is used in the wet lamination method, there are problems such as a work environment and a facility cost of a solvent recovery device.
In particular, high-sensitivity films have poor solvent resistance due to low crystallinity,
There are problems such as shrinkage of the film upon contact with an organic solvent to cause curl and decrease in perforation. On the other hand, in the case of the hot lamination method, it is necessary to heat the adhesive to about 100 ° C. in order to reduce the viscosity of the adhesive, and when the films are laminated, the film shrinks to cause wrinkles or strong curling. There is a problem. Particularly, in the case of a high-sensitivity film, the melting point is low and the heat shrinkage is large, so that at present the hot lamination method has not been implemented. In the case of the solventless lamination method, it is necessary to cure the adhesive, and aging at 30 to 50 ° C. for 3 to 5 days is required, resulting in poor workability. In addition, when using an ultraviolet ray and an electron beam curing adhesive, a dedicated facility is required, and facility cost is required.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances of the prior art, and comprises bonding a porous support and a thermoplastic resin film with an adhesive.
In the heat-sensitive stencil printing paper having a structure in which a stick prevention layer is provided on the film surface, the adhesive strength is strong, and the adhesive layer has excellent heat deterioration resistance, moisture deterioration resistance, ink resistance, and is clear and has excellent printing durability. To provide a heat-sensitive stencil sheet for high-perforation with which a printed matter obtained is obtained, and further to provide a heat-sensitive stencil sheet for use in which the adhesive composition used is solvent-free and has no environmental pollution, and no contamination of the working environment. For that purpose.

[0008]

SUMMARY OF THE INVENTION The present inventors have found that, when producing a heat-sensitive stencil sheet having the above constitution, the adhesive strength is high, the adhesive can be bonded at a low temperature, and the high-sensitivity film can be easily bonded. As a result of intensive studies on an adhesive which can be bonded substantially without a solvent, the present invention has been reached.

That is, the present inventionAccording to the following invention is provided
Is done.Adhesion of porous support and thermoplastic resin film
And stick to film surface
In the heat-sensitive stencil printing base paper provided with a layer,
The agent has at least (a) one or more polymerizable unsaturated double bonds in the molecule.
Polymerizable substanceas well as  (B) Organic peroxideComposition containing And (B) having one or more polymerizable unsaturated double bonds in the molecule
Polymerizable substances and  (C) contact with the organic peroxide to generate radicals
Reducing agentMix the composition containingThat things consist of
Characteristic heat-sensitive stencil printing paper.

Further, according to the present invention, there is provided a heat-sensitive stencil base paper characterized in that the polymerizable substance contains a polymer soluble in the polymerizable substance. A heat-sensitive stencil sheet comprising at least one metal salt selected from the group consisting of metal, magnesium, aluminum, cadmium and lead is provided, and the composition comprises the (a) molecule
Having at least one polymerizable unsaturated double bond therein
Of a composition comprising a quality and (ii) an organic peroxide, said heavy polymerizable
In the substance, a polymer soluble in the polymerizable substance,
Lithium metal, magnesium, aluminum, cadmium
Of at least one metal selected from the group consisting of
The present invention provides a heat-sensitive stencil sheet comprising a composition comprising an acidic phosphorus compound ( including a salt) .

[0011] The present invention provides at least the above-mentioned adhesive as an adhesive.
(B) having one or more polymerizable unsaturated double bonds in the molecule
Polymerizable substanceas well as  (B) Organic peroxideComposition containing And (B) having one or more polymerizable unsaturated double bonds in the molecule
Polymerizable substances and  (C) contact with the organic peroxide to generate radicals
Reducing agentMix the composition containingCharacterized by
However, the composition is fast-curing, polyester film, paper
Shows excellent adhesiveness, peel strength, flexibility and durability
Is good, the heat-sensitive stencil sheet of the present invention is
Gives printed material with high perforation and clarity and excellent print durability
It becomes something that can be obtained. Of course, the composition is substantially insoluble
According to the present invention, it is possible to adhere to the environment,
No environmental pollution.

In the present invention, the initial adhesive strength can be improved by incorporating a polymer soluble in the polymerizable substance into the polymerizable substance as the component (A). The working life can be extended by adding a salt of a specific metal to the adhesive composition, and furthermore, by adding an acidic phosphorus compound to the adhesive composition, Can accelerate the hardening of the part.

Hereinafter, the present invention will be described in more detail. In the present invention, examples of the polymerizable substance having at least one or more polymerizable unsaturated double bonds in a molecule used as the component (A) of the adhesive composition include acrylic acid, methacrylic acid and alkyls thereof. Ester, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, dimethylaminomethyl (meth) acrylate, diethylaminomethyl (meth) acrylate, acid phosphooxyethyl methacrylate, acid phosphooxypropyl methacrylate,
Examples include acrylic monomers such as glycidyl methacrylate, and oligomers such as urethane acrylate, epoxy acrylate, and polyester acrylate.
These polymerizable substances may be used alone or in combination of two or more. The content of these polymerizable substances is 20 to 94% by weight, preferably 40 to 80% by weight in the adhesive composition.

If you want to give the adhesive flexibility,
A polymerizable substance having at least one or more polymerizable unsaturated double bonds in a molecule represented by the following general formula (1) can be added. Formula ^{_{(1) CH 2 = CR 1}} -CO- (OCH 2 CHR 2) n-OR 3 ( where, wherein R ¹ and R ² are hydrogen or methyl, R
³ represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or a phenyl group having 1 to 4 alkyl groups, respectively, and n represents an integer of 2 to 27. )

The polymerizable substance represented by the general formula (1) includes, for example, methoxydiethylene glycol (meth)
Examples include acrylate, methoxytetraethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, and polypropylene polyglycol (meth) acrylate. These polymerizable substances are used alone or in combination of two or more. The amount of the polymerizable substance represented by the general formula (1) is 5 to 70% by weight, preferably 10 to 6% by weight of the total polymerizable substance.
0% by weight. When the content is less than 5% by weight, the effect of imparting flexibility is not obtained. On the contrary, when the content is more than 70% by weight, the cured product becomes too sticky and too soft, and the adhesive strength becomes weak.

The adhesive composition used in the present invention preferably contains a polymer soluble in the polymerizable substance in order to practically increase the initial adhesive strength. Examples of such a soluble polymer include acrylonitrile / butadiene rubber, (meth) acrylate copolymer,
Polyurethane, styrene / butadiene rubber, chloroprene rubber, butadiene rubber, natural rubber, methyl methacrylate / butadiene / styrene copolymer, methyl methacrylate / butadiene / acrylonitrile / styrene copolymer, styrene / acrylonitrile copolymer, acrylonitrile / styrene / Butadiene copolymer, polymethyl methacrylate, phenol resin, and the like. These polymers can be used in combination of two or more as long as they have good compatibility. The proportion of the soluble polymer contained in the adhesive composition is 5 to 60% by weight, preferably 10 to 50% by weight.
It is. When the polymer concentration is low, since the viscosity is low, the initial adhesive strength is low, and the floating between the film and the porous support is likely to occur. When the polymer concentration is high, the viscosity is too high, which is not preferable. The initial bond strength referred to here is
The adhesive force in a state where the film and the porous support are joined due to the viscosity of the adhesive before the adhesive substantially starts the reaction.

In the present invention, examples of the organic peroxide used as the component (b) of the adhesive composition include benzoyl peroxide, lauroyl peroxide, methyl ethyl ketone peroxide, tertiary butyl peroxide, and pinene hydroperoxide. , Paramethane hydroperoxide, diisopropyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene dihydroperoxide, tertiary butyl hydroperoxide and the like, but are not limited thereto. The amount of the organic peroxide to be used is 0.1 to 20% by weight, preferably 1 to 10% by weight in the adhesive composition. If it is less than 0.1% by weight, the curing rate is low, and if it exceeds 20% by weight, the storage stability is poor and the adhesion to the plastic film is undesirably reduced.

In the present invention, the reducing agent used as component (c) of the adhesive composition includes, for example, triethylamine, tripropylamine, tributylamine, triamylamine, ethylenediethanolamine,
Tertiary amines such as N, N'-diethyl paratoluidine; oxime compounds such as methyl ethyl ketone oxime, methyl isobutyl ketone oxime, acetophenone oxime, p, p'-benzozoquinone dioxime;
Thiourea derivatives such as mercaptobenzimidazole, methylthiourea, diethylthiourea, dibutylthiourea, tetramethylthiourea, ethylenethiourea, thiobarbituric acid; cobalt naphthenate, copper naphthenate, vanadyl acetylacetonate, vanadyl stearate, vanadium naphthenate Metal salts such as vanadium acetylacetonate, vanadyl oxalate, and titanium acetylacetonate. Depending on the purpose, several types of these reducing components can be used in combination. The amount of the reducing agent used is 0.05 to 15% by weight, preferably 0.1 to 10% by weight in the adhesive composition. If it is less than 0.05% by weight, the curing speed is low, and if it exceeds 15% by weight, the curing is too fast.

As described above, the adhesive composition used in the present invention contains a polymerizable substance (including a soluble polymer if necessary), an organic peroxide and a reducing agent as essential components, but has a high stability. Various antioxidants and polymerization inhibitors for the purpose of improvement, antistatic agents for the purpose of preventing static electricity, and depending on the purpose, plasticizers, fillers, thickeners, colorants, etc. can be used in combination. .

In particular, in the adhesive composition used in the present invention, a metal salt of an alkaline earth metal, magnesium, aluminum, cadmium or lead can be added for the purpose of extending the usable time. When a metal salt is added, vanadyl acetylacetonate is preferred as the reducing agent. The amount of these metal salts used in the adhesive composition,
0.1 to 10% by weight.

In the adhesive composition used in the present invention, phosphorous acid or / and the following general formulas (2) and (3) are used in order to accelerate the curing of the part in contact with air. ,
An acidic phosphorus compound represented by (4) can also be added. General formula (2) R ⁴ —P (R ⁵ ) —OH (wherein R ⁴ represents an aryl group, and R ⁵ represents a hydroxyl group or an aryl group.) General formula (3) R ⁶ —OP (OR ⁷ ) (O) —OH wherein R ⁶ is an aryl group, an alkyl group having 1 to 5 carbon atoms, a halogenated alkyl group or —R ⁸ OR ⁹ (R ⁸ and R ⁹ have 1 to 5 carbon atoms) R ⁷ represents a hydrogen atom or R ⁶ . ｝ General formula (4) R ¹⁰ —P (R ¹¹ ) (O) —OH (wherein R ¹⁰ represents an aryl group, and R ¹¹ represents a hydroxyl group or an aryl group, respectively)

Examples of the acidic phosphorus compound include monomethyl phosphate, monoethyl phosphate, dimethyl phosphate, diethyl phosphate, monoisopropyl phosphate, diisopropyl phosphate, monobutyl phosphate, dibutyl phosphate, and mono-β-chloroethyl. Phosphate, di-β-chloroethyl phosphate, mono-β-bromoethyl phosphate, di-β-bromoethyl phosphate, monoethoxyethyl phosphate, diethoxyethyl phosphate, monobutoxyethyl phosphate, di-phosphate Butoxyethyl phosphate, phenyl phosphate,
Diphenyl phosphate, phenylphosphonic acid,
Examples thereof include diphenyl phosphonic acid, phenyl phosphinous acid, and diphenyl phosphinous acid, and one or a mixture of two or more thereof is used. The amount of the acidic phosphorus compound added is 0.01 to 10% by weight, preferably 0.5 to 7% by weight in the adhesive composition.

Embodiments of the adhesive composition according to the present invention include the following methods. A polymerizable substance (including a soluble polymer if necessary), an organic peroxide, a reducing agent, and other additives are appropriately mixed and applied to a film surface or a porous support surface, and adhered to the porous support or the film. Method. A composition containing a polymerizable substance (including a soluble polymer as necessary), a reducing agent, and other additives, which are applied to a film surface or a porous support surface as it is or after dissolving and dispersing it in a solvent. Is applied and adhered to the porous support or film,
Method of reaction curing. A composition in which an organic peroxide is dissolved in a polymerizable substance (in which a soluble polymer and / or a stabilizer and other additives are dissolved as necessary) is applied to an adherend, and the polymerizable substance and a reducing agent are applied. (A soluble polymer and / or a stabilizer and other additives are dissolved as necessary) to another adherend, and the reaction is cured by contact. As a particularly preferred embodiment, or a liquid A containing a polymerizable substance (including a soluble polymer as necessary), an organic peroxide, a metal salt, and a phosphorus compound, and a polymerizable substance (including a soluble polymer as necessary) And a method in which the B liquid containing a reducing agent as a main component is mixed and used immediately before use.

The viscosity of the adhesive composition of the present invention is adjusted by the addition amount of a soluble polymer, an organic peroxide, a reducing agent and other additives in consideration of the characteristics of the coating apparatus, the amount of adhesion, the initial adhesiveness, and the like. It is possible to The viscosity of the adhesive composition is
5,000 cps or less, preferably 500 to 3,000
cps. The term "substantially no solvent" as used in the present invention means that the amount of the organic solvent added is 10% or less. The adhesion amount of the adhesive composition of the present invention is 0.2 to 5.0.
g / m ^2, preferably not 0.3 to 3.0 g / m ^2, more preferably at 0.5 to 1.0 g / m ^2. If the amount of adhesion is small, the adhesive strength is weak and the printing durability is reduced. If the amount of adhesion is large, not only is it uneconomical, but also the passage of ink is hindered and the image quality is reduced.

The porous support used in the present invention may be, for example, a natural fiber such as Kozo, Mitsuta or Manila hemp, or a synthetic fiber such as polyester, vinylon, nylon, polypropylene, rayon or the like alone or as a mixture.
/ M ² , and a 50-200 mesh screen composed of one or a mixture of two or more synthetic fibers.

The thermoplastic resin film used in the present invention includes polyester having a thickness of 0.5 to 8 μm,
Films such as polyvinylidene chloride, polypropylene, and vinylidene chloride / vinyl chloride copolymer can be used. Particularly, a polyester film having a thickness of 1 to 3 μm is preferably used, and a polyester film having a melting point of 150 to 250 ° C. and low crystallinity (having a crystallinity of 15% or less) can also be used.

The stick preventing layer in the present invention has a function of preventing the thermoplastic resin film that has been melted by heat from being fused to the thermal head during thermal perforation by the thermal head, and the surface of the thermoplastic resin film in contact with the thermal head. It is applied to. Examples of the stick preventive used include a fatty acid metal salt, a phosphate ester type surfactant, a fluid lubricant such as silicone oil, and a thermal fusion preventive such as a fluorine compound having a perfluoroalkyl group. The coating amount is 0.001-2 g /
m ² , preferably 0.005 to 1 g / m ² .

[0028]

EXAMPLES The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

Example 1 A solution in which a soluble polymer was dissolved in a polymerizable substance was divided into two equal parts according to the formulation shown in Table 1 below, and an organic peroxide and a polymerization inhibitor were added to Liquid A, and a reducing agent was added to Liquid B. Then, an adhesive composition was obtained in which the liquid A and the liquid B were mixed at a weight ratio of 1: 1. The adhesive composition was coated so that the amount of adhesion was 0.6 g / m ² .
11 consisting of 15% polyester fiber and 85% Manila hemp
g / m ² of a porous support, 1.5 μm thick,
It was bonded to a polyester film having a heat shrinkage of 25% at 100 ° C. A 0.5% aqueous dispersion of an alkyl higher alcohol ester-modified silicone oil emulsion was applied to the surface of the film, dried at 60 ° C., and provided with a stick prevention layer having a dry adhesion of 0.05 g / m ^2. I got

[0030]

[Table 1]

The heat-sensitive stencil sheet obtained as described above was printed using a digital stencil printing machine (Ricoh Corporation, Preport VT 2500). As a result, 5,000 or more clear prints were obtained. It had excellent durability. Further, even when this heat-sensitive stencil sheet was stored at 50 ° C. for 7 days, no deterioration in image quality was observed.

Example 2 According to the compounding method shown in Table 2 below, a solution in which a soluble polymer was dissolved in a polymerizable substance was divided into two equal parts, and solution A was added with cumene hydroperoxide and a metal salt, and solution B was used with vanadyl acetyl. Acetonate was added to obtain an adhesive composition of liquid A and liquid B. The solution A and the solution B are mixed at a weight ratio of 1: 1 and the thickness is 1.5 μm so that the adhesion amount becomes 0.7 g / m ² .
15% of polyester fiber, Manila hemp 8
It was bonded to an 11 g / m ² porous support consisting of 5%. A 0.5% aqueous dispersion of an alkyl higher alcohol ester-modified silicone oil emulsion was applied to the film surface and dried at 60 ° C. to obtain a dry adhesion amount of 0.05 g /
An m ² stick prevention layer was provided to obtain a heat-sensitive stencil sheet.

[0033]

[Table 2]

The heat-sensitive stencil sheet obtained as described above was printed using a digital stencil printing machine (Ricoh Preport VT 2500). As a result, 5,000 or more clear prints were obtained. It had excellent durability. Further, even when this heat-sensitive stencil sheet was stored at 50 ° C. for 7 days, no deterioration in image quality was observed.

Example 3 A solution in which a soluble polymer was dissolved in a polymerizable substance was divided into two equal parts according to the compounding method shown in Table 3 below, and cumene hydroperoxide and a metal salt were added to liquid A, and vanadyl acetyl was added to liquid B. Acetonate was added to obtain an adhesive composition of liquid A and liquid B. Solution A was applied to a polyester film having a thickness of 1.5 μm and a heat shrinkage of 25% at 100 ° C. (adhesion amount: 0.3 g / m ² ).
%, And 85% of Manila hemp, applied to an 11 g / m ² porous support (adhesion amount: 0.3 g / m ² ), and then bonded together. 0.5% of emulsion
The aqueous dispersion is applied and dried at 60 ° C.
A stick prevention layer of 5 g / m ² was provided to obtain a heat-sensitive stencil sheet.

[0036]

[Table 3]

The heat-sensitive stencil sheet obtained as described above was printed using a digital stencil printing machine (Ricoh Preport VT 2500). As a result, 5,000 or more clear prints were obtained. It had excellent durability. Further, even when this heat-sensitive stencil sheet was stored at 50 ° C. for 7 days, no deterioration in image quality was observed.

Comparative Example 1 The same thermoplastic resin film and porous support as those in Example 1 were used, and a polyurethane prepolymer adhesive (trade name: Takenate A-260, terminal isocyanate prepolymer, average molecular weight 2) was used as the adhesive. 000, manufactured by Takeda Pharmaceutical Co., Ltd.] was heated to 100 ° C., supplied to a coating roller of a solventless laminator, applied to the surface of the porous support, and bonded to a film. The amount of the adhesive applied is 0.
It was 6 g / m ² . A 0.5% aqueous dispersion of an alkyl higher alcohol ester-modified silicone oil emulsion was applied to the surface of the film, dried at 60 ° C., and provided with a stick prevention layer having a dry adhesion of 0.05 g / m ^2. I got

The heat-sensitive stencil sheet obtained as described above was strongly curled, and could not be fed by a stencil printer, and jam occurred three times out of five times. As a result of printing in the same manner as in Example 1, the printed matter had missing characters and white spots in solid portions. One day after the lamination, the number of printings was 900. The number of printings after storage of this heat-sensitive stencil sheet at 50 ° C. for 7 days is 5,
Although the number of sheets was 000, there were many missing characters and solid white spots.

Comparative Example 2 The same thermoplastic resin film and porous support as those in Example 1 were used, and an acrylic resin was used as an adhesive [trade name;
Thermorack L230A, OH value 30, Soken Chemical Co., Ltd.
Co., Ltd.) and isocyanate [trade name: Coronate L, NCO
23% content, manufactured by Nippon Polyurethane Industry Co., Ltd.]
Mixing was performed so that O / OH = 2.5 to obtain an adhesive. The adhesive was heated to 100 ° C., supplied to an application roller of a solventless laminator, applied to the surface of the porous support, and bonded to a film. The amount of adhesive applied is 0.6 g / m ²
Met. 0.5% of alkyl higher alcohol ester-modified silicone oil emulsion
The aqueous dispersion is applied and dried at 60 ° C.
A stick prevention layer of 5 g / m ² was provided to obtain a heat-sensitive stencil sheet.

The heat-sensitive stencil sheet obtained as described above was strongly curled, and could not be fed by the stencil printing machine, and jam occurred 5 out of 10 times. As a result of printing in the same manner as in Example 1, the printed matter did not have any missing characters, but had white spots in a solid portion. One day after the lamination, the number of printings was 600.
Further, after the heat-sensitive stencil sheet was stored at 50 ° C. for 7 days, the number of printings was 5,000. However, many missing characters and solid white spots occurred.

[0042]

The heat-sensitive stencil printing paper according to claim 1 is porous.
Adhesive is bonded to the thermoplastic support and the thermoplastic resin film
And a stick prevention layer is provided on the film surface.
In the heat-sensitive stencil printing paper, the adhesive is at least used.
(A) having one or more polymerizable unsaturated double bonds in the molecule
Polymerizable substanceas well as  (B) Organic peroxideComposition containing And (B) having one or more polymerizable unsaturated double bonds in the molecule
Polymerizable substances and  (C) contact with the organic peroxide to generate radicals
Reducing agentMix the composition containingThat it consists of
Excellent in adhesive strength, high perforation and clear printing durability
Gives printed matter with excellent properties. Moreover, the composition is substantially
Environmentally friendly and work environment.
There is no dye.

In the heat-sensitive stencil printing paper according to the second aspect, since the polymerizable substance as the component (A) contains a soluble polymer in the polymerizable substance, the initial adhesive strength is improved. Adds effect.

[0044] The heat-sensitive stencil printing paper according to claim 3 further comprises a salt of at least one metal selected from the group consisting of alkaline earth metals, magnesium, aluminum, cadmium and lead in the composition. Therefore, the effect that the usable time can be extended is added.

The base paper for heat-sensitive stencil printing according to claim 4 is characterized in that the composition comprises (a) one or more polymerizable unsaturated diamines per molecule.
Including polymerizable substances having heavy bonds and (ii) organic peroxides
In the composition, the polymerizable substance may be compatible with the polymerizable substance.
Soluble polymers, alkaline earth metals, magnesium,
Selected from the group consisting of luminium, cadmium and lead
Since at least one kind of metal salt is further contained an acidic phosphorus compound, the effect of accelerating the curing of the portion in contact with air is added.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-25855 (JP, A) JP-A-1-283171 (JP, A) JP-A-4-173294 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) B41N 1/24 102

Claims (4)

(57) [Claims] 1. A porous support and a thermoplastic resin film
With an adhesive and stick it on the film surface.
Heat-sensitive stencil printing paper with a protective layer
The adhesive has at least (a) one or more polymerizable unsaturated double bonds in the molecule.
Polymerizable substanceas well as  (B) Organic peroxideComposition containing And (B) having one or more polymerizable unsaturated double bonds in the molecule
Polymerizable substances and  (C) contact with the organic peroxide to generate radicals
Reducing agentMix the composition containingThat things consist of
Characteristic heat-sensitive stencil printing paper. 2. The heat-sensitive stencil sheet according to claim 1, wherein the polymerizable substance contains a polymer soluble in the polymerizable substance. 3. The composition according to claim 1, wherein the composition contains a salt of at least one metal selected from the group consisting of alkaline earth metals, magnesium, aluminum, cadmium and lead. Base paper for heat-sensitive stencil printing. 4. The method according to claim 1, wherein (a) at least one polymerizable polymer is present in the molecule.
Polymerizable substance having saturated double bond and (ii) organic peroxidation
Of the composition containing the polymerizable substance in the polymerizable substance.
Soluble polymers, alkaline earth metals, magnesium
Selected from the group consisting of aluminum, cadmium and lead.
At least one metal salt and acidic phosphorus compound
The heat-sensitive stencil sheet according to any one of claims 1 to 3, which comprises a composition comprising: