JP3301429B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus capable of mounting an electronic component on a substrate by shortening a tact time by using a transfer head having a plurality of nozzles.

[0002]

2. Description of the Related Art As a device for automatically mounting an electronic component on a substrate, an electronic component mounting device is widely used. In the electronic component mounting apparatus, it is required that the tact time from the start of mounting to the end of mounting be reduced as much as possible.

[0003]

By the way, in a conventional electronic component mounting apparatus, a transfer head includes a plurality of nozzles, and the mounting operation in this apparatus is as follows. That is, first, the electronic component is sucked from the parts feeder to one nozzle used this time among the plurality of nozzles. Second, the transfer head is moved so that the nozzle that has sucked the electronic component is in the field of view of the imaging means such as a camera. Third, an image of one electronic component is captured by the imaging means. Fourth, a position shift of the electronic component from an ideal position is obtained from the captured image, and a correction amount is calculated. Fifth, the position is corrected based on the correction amount, and the electronic component is mounted on the board. As described above, in the conventional electronic component mounting apparatus, each electronic component is moved in the order of the parts feeder → imaging unit → substrate. Here, the time required for this movement is not negligible, and there is a problem that the tact time becomes longer accordingly.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus capable of mounting an electronic component on a substrate by shortening the tact time using a plurality of nozzles.

[0005]

An electronic component mounting apparatus according to the present invention comprises a positioning means for positioning a substrate, a parts feeder for supplying electronic components to be mounted on the substrate, and a plurality of nozzles. A transfer head for picking up and mounting the substrate on the substrate positioned by the positioning means, a moving means for moving the transfer head relative to the substrate, and a plurality of electronic components adsorbed by a plurality of nozzles. A single imaging means for imaging during a single transfer operation of the transfer head, wherein the transfer head includes a θ motor,
It has a spline mounted on the output shaft of the θ motor and a plurality of splines screwed to the spline, the plurality of nozzles are mounted on the plurality of splines, and the plurality of nozzles are A cylinder for selectively using / not using a nozzle which is selectively lowered is provided.

With the above arrangement, the electronic components of the parts feeder are sequentially sucked and picked up by a plurality of nozzles while operating the use / non-use selection cylinder to select the nozzles. Then, after one image capturing unit captures images of the plurality of electronic components sucked by the plurality of nozzles during one movement operation of the transfer head, the electronic components are mounted on the substrate. Here, in the conventional means, the transfer head moves between the parts feeder → the imaging means → the substrate by the number of electronic components, but according to this means, the transfer head moves once. Since it is only necessary to perform the movement, the time required for the movement can be saved correspondingly, and the tact time can be reduced.

[0007]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a base, and 2 and 3 are guide rails provided in parallel on the base 1 for transporting and positioning the substrate 4 in the X direction. Corresponding to the means. Reference numeral 5 denotes a parts feeder provided on the side of the base 1 for supplying various types of electronic components. Here, the part feeder of the present means includes a tube feeder, a tray feeder, and the like in addition to the tape feeder shown in FIG.

Reference numerals 6 and 7 denote gate-shaped Y frames provided on both edges of the base 1 in the Y direction. Reference numeral 8 denotes both ends of the Y frames 6 and 7 which are slidably guided.
(See FIG. 3), a Y table 9 that moves in the Y direction, an X table that slidably engages with the Y table 8 in the X direction, and moves in the X direction by an X motor 40 (see FIG. 3).
Reference numeral 10 denotes a transfer head provided on the X table 9 (details will be described later). That is, when the X motor 40 and the Y motor 41 are driven, the transfer head 10 can be relatively moved in the XY directions with respect to the substrate 4, and the X table 9 and the Y table 8 correspond to moving means.

Reference numeral 11 denotes electronic components A, B, C, and S which are attracted to four nozzles N1 to N4 provided in the transfer head 10.
This is a camera as an imaging unit that collectively captures the image of D. In the present embodiment, the camera 11 is provided at an intermediate position between the substrate 4 and the parts feeder 5, as shown in FIG. This arrangement is preferable because the distance between the parts feeder 5 and the camera 11 and the distance between the camera 11 and the substrate 4, that is, the moving distance of the transfer head 9 can be minimized. Further, a line image sensor may be used as the imaging means.

Next, the transfer head 10 will be described with reference to FIGS. FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 5 is a cross-sectional view of the transfer head of the electronic component mounting apparatus according to one embodiment of the present invention.

In FIG. 2, reference numeral 12 denotes a bracket integral with the X table 9, and reference numeral 13 denotes an L-shaped Z table which is supported by the bracket 12 so as to be able to move up and down in the Z direction, and which moves up and down when a Z motor 14 is driven. , 13a are horizontal portions of the Z table 13. A horizontal plate 15 is provided in the middle of the Z table 13. And, as shown in FIG. 5, four nozzles N1, N2,
N3 and N4 (note that the nozzles N2 and N4 are not shown in the figure) are inserted so as to be able to move up and down. The following nozzle N
2 and N4 have the same support structure as the nozzles N1 and N3 (however, the shape of the nozzle itself differs depending on the type of electronic component to be sucked), so only the nozzles N1 and N3 will be described.

At the tops of the nozzles N1 and N3, projecting pieces 16 and 17 are protruded radially. 18 and 19 are nozzles N
1, a cylinder for selecting use / non-use of a nozzle for selecting whether or not to use N3.
It is fixed to. Reference numerals 20 and 21 denote rods of the cylinders 18 and 19, and reference numerals 22 and 23 denote locking claws fixed to lower ends of the rods 20 and 21 and engaged with the protruding pieces 16 and 17, respectively. On the opposite side of the protruding pieces 16 and 17, protruding pieces 24 and 25
The projections 24 and 25 are provided with the horizontal portion 13.
The upper ends of the springs 24 and 25 whose lower ends are fixed to a are fixed, and the nozzles N1 and N3 are urged downward by the springs 24 and 25. Splines 28 and 29 are attached to the nozzles N1 and N3 so that they can move up and down and rotate integrally with each other in the middle stage.

Reference numeral 30 denotes a .theta. Motor fixed to the plate 15 so that its output shaft 31 faces downward. Reference numeral 32 denotes a spline fixed to the lower end of the output shaft 31 and screwed to splines 28 and 29. Therefore, when the θ motor 30 is driven and the output shaft 31 is rotated by Δθ from the origin position, the nozzles N1 and N3 can be rotated by an angle corresponding to the number of teeth of the splines 32, 28 and 29. Further, when the electronic component C sucked by the nozzle N3 is mounted on the substrate 4 using the nozzle N3, the cylinder 19 is driven to protrude the rod 21, and the locking claw 23 is indicated by a chain line in FIG. By lowering to the position (arrow M1), the nozzle N3 and the electronic component C are lowered as shown by the arrow M2, and the Z motor 14 is further driven to lower the Z table 13 by a small distance as shown by the arrow M3. It is.

Reference numerals 33 and 34 denote air pressure adjusting devices (not shown) for applying a negative pressure or a positive pressure to the inner holes of the nozzles N1 and N3.
2 is a light diffusing plate for brightening the background of the electronic components A, B and the like to make the contrast of the image clear when taking an image with the camera 11, as shown in FIG. .

FIG. 3 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 3, 42, 43
A cylinder for selecting use / non-use of the nozzles N2 and N4 is similar to the cylinders 18 and 19. 44 is X
An XY table driving unit including a driver for driving the motor 40 and the Y motor 41, and 45 is a Z motor 14, a θ motor 3
0,..., A transfer head drive unit composed of a driver for driving the cylinder 43; 46, a component recognition unit composed of a module for recognizing the position, size, etc. of the component from the image output by the camera 11; A storage unit 48 including a RAM (random access memory) for temporarily storing necessary information such as a correction amount, a CPU (central processing unit) 48 for controlling each component, and a ROM (read only) for storing a control program according to FIG. Memory).

Next, each step of the electronic component mounting method according to the present embodiment will be described with reference to FIG. FIG. 4 is a flowchart showing an electronic component mounting method according to one embodiment of the present invention. First, in steps 1 to 4, the transfer head 10 is brought close to the parts feeder 5, and the transfer head 10
Electronic components A in order to the four nozzles N1 to N4 provided for
~ D are adsorbed, and a pickup operation is performed. Next, the transfer head 10 is moved onto the camera 11 only once, and the images of the electronic components A to D are captured by one imaging operation during this one movement operation (step 5). Then, the component recognition unit 46 performs a recognition process on each of the electronic components A to D, and outputs the result to the control unit 48.

The control section 48 reads information such as an ideal position from the storage section 47, calculates the position correction amounts ΔX and ΔY and the angle correction amount Δθ of each electronic component, and writes them into the storage section 47 (steps 6 to 9). ). Then, the control unit 48 determines the position correction amount ΔX, Δ
Based on Y, the XY table driving unit 44 is instructed to drive the X table 9 and the Y table 8 to correct the position of the substrate 4 in the XY directions. The control unit 48 moves the transfer head 10 onto the substrate 4 and instructs the transfer head drive unit 45 to correct the angle of the corresponding nozzle based on the angle correction amount Δθ. A to D are implemented (steps 10 to 13). Of course, at the time of mounting, the cylinder on the nozzle to be mounted is driven to use this nozzle.

FIG. 6 is a view showing an example of an image by the electronic component mounting apparatus according to one embodiment of the present invention. In FIG.
S3 is an image of the electronic components A to C. Note that the nozzle N4 is in a suction error (or not used) state, and an image of the nozzle N4 is obtained instead of an image of the electronic component D. Thus, this means is not limited to the case where all of the nozzles are used.

[0019]

As described above, according to the present invention, the electronic components of the parts feeder are successively sucked and picked up by a plurality of nozzles of the transfer head, and these electronic components are moved during one transfer operation of the transfer head. Since the image is picked up by one image pickup means, the time required for moving the transfer head can be saved, the tact time can be reduced, and the electronic component can be mounted on the substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 3 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a flowchart illustrating an electronic component mounting method according to an embodiment of the present invention.

FIG. 5 is a sectional view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 6 is an exemplary view showing an image by the electronic component mounting apparatus according to the embodiment of the present invention;

[Explanation of symbols]

2 Guide rail 3 Guide rail 4 Substrate 5 Parts feeder 8 Y table 9 X table 10 Transfer head 11 Camera 13 Z table 14 Z motor 18, 19, 42, 43 Cylinder 28/29/32 for nozzle use / non-use selection Spline 30 θ motor 31 Output shaft N1 nozzle N2 nozzle N3 nozzle N4 nozzle A Electronic component B Electronic component C Electronic component D Electronic component

Claims (2)

(57) [Claims] An electronic device comprising: a positioning means for positioning a substrate; a parts feeder for supplying an electronic component to be mounted on the substrate; and a plurality of nozzles. The electronic component of the parts feeder is picked up and the substrate is positioned by the positioning means. A transfer head mounted on the substrate, moving means for moving the transfer head relative to the substrate, and a single moving operation of the transfer head for moving the plurality of electronic components sucked by the plurality of nozzles The imaging head includes a single imaging unit, and the transfer head includes a θ motor, a spline mounted on an output shaft of the θ motor, and a plurality of splines screwed to the spline. The plurality of nozzles are mounted on a plurality of splines, and a use / nonuse selection cylinder for nozzles for selectively lowering the plurality of nozzles is provided. Electronic component mounting apparatus characterized by the above-mentioned. 2. The transfer head is supported by a Z table which is moved up and down by a Z motor. A rod of the used / unused cylinder is projected, and a selected nozzle is driven by driving the Z motor. 2. The electronic component mounting apparatus according to claim 1, wherein said electronic component is sucked by said nozzle and mounted on a substrate.