JP3303507B2 - Mask for thin film formation - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film forming mask used for forming a thin film having a predetermined pattern on a surface of a body in a dry thin film forming method such as sputtering deposition.

[0002]

2. Description of the Related Art Dry thin film formation methods include sputter deposition,
There are vacuum deposition, ion plating, and the like. Here, a method of forming a thin film by sputtering deposition will be described as an example.

[0003] Sputter deposition means that when high-energy particles are irradiated on the surface of a scattering source (target), the high-energy particles collide with constituent atoms on the surface of the scattering source. It is to evaporate from the surface and deposit the constituent atoms of the evaporated scattering source surface on the surface of the element as the object to be deposited to form an evaporation film. At this time, the sputter-deposited film is formed almost uniformly on the surface of the element body.

There is a method of forming an electrode of an electronic component by sputter-depositing an electrode material, which is a scattering source, using the above-described sputter-deposition method. FIG. 1 shows a conventional thin film forming mask used when forming an electrode by using this method.
2 will be described with reference to FIG.

In FIG. 2 , a mask 1 is made of a substantially square metal plate and has a plurality of circular stepped holes 2 in the thickness direction. The stepped hole 2 includes an upper hole 2a having a predetermined pattern and a lower hole 2b having a larger outer shape than the upper hole 2a. The lower hole 2b has a shape in which the disc-shaped element 4 can be fitted and positioned, and the upper hole 2a has the same shape as the electrode 5 which is a sputter-deposited film coated on the element 4.

The element body 4 is fitted into the lower hole 2b of the mask 1, and the element body 4 is positioned with the surface of the element body 4 exposed from the upper hole 2a. When the electrode material is sputter deposited in this state, the surface of the element body 4 not covered with the mask 1 is coated with the electrode material, and the electrode 5 which is a sputter deposited film is formed. When the electrodes 5 are formed on both surfaces of the element body 4, the electrodes 5 can be simultaneously formed on both surfaces by covering both surfaces of the element body 4 with the mask 1 and depositing an electrode material by sputtering.

[0007] However, during the sputter deposition, the thickness T1 of the upper hole 2a of the mask 1 covering the surface of the element body 4 is thick, to form a deposited genital deposition film, as shown in FIG. 2, the electrode 5 The film thickness has a problem that the thickness near the inner periphery of the upper hole 2a gradually decreases.

[0008] Therefore, in order to reduce the size of the attached negative part,
What is necessary is just to make the thickness T1 of the upper hole 2a thin.
As shown in FIG. 3 , it is conceivable to form the thin film forming mask 6 by joining two metal plates.

In FIG. 3 , a mask 6 comprises a first metal plate 7 made of substantially rectangular stainless steel or the like, a second metal plate 8 superimposed on the metal plate 7, and a reinforcement made of stainless steel or the like at its outer peripheral end. The frame 3 is configured by joining by spot welding or the like.

The first metal plate 7 has a plurality of circular first through holes 9 (six in FIG. 3 ) for fitting and positioning the element body 4. The second metal plate 8 corresponds to the first through-hole 9 and has a circular second through-hole 1 which is a predetermined pattern for forming a film by sputter deposition on the element body 4.
0 (six in FIG. 3 ).

[0011]

However, in such a mask 6, the first metal plate 7 has a thickness T2.
Is the same as that of the mask 1, but the thickness of the second metal plate 8 must be thinner than that of the mask T 1 so as not to form a shadowed portion. Therefore, the mask 6 composed of the two metal plates 7 and 8 is thinner than the thickness of the mask 1 and is formed by joining two metal plates. And thermal deformation due to radiant heat at the time of sputtering increases. Therefore, the element body 4 fitted and positioned in the first through hole 9 of the mask 6 is displaced from the first through hole 9 of the mask 6, and the shape of the electrode 5 cannot be formed in a predetermined pattern and a predetermined position. There was a problem that.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and a thin film having a thin and thick bending strength T1 of a metal plate forming a masking part by a mask for securely positioning a body. An object of the present invention is to provide a forming mask.

[0013]

Therefore, in a mask for forming a thin film according to the present invention, a thin film forming mask for forming a thin film of a predetermined pattern on the surface of an element body through scattered particles from a scattering source through a mask is provided. A first through-hole for positioning a body on which a thin film is to be formed;
And a second metal plate having a second through-hole corresponding to the predetermined pattern are joined together, and penetrated through at least one of the first and second metal plates.
Projections so as to surround the hole is formed, said projection, said small
Formed with the same material and thickness as at least one metal plate
Characterized in der Rukoto those.

[0014]

According to the present invention, by providing the metal plate with the projections, the bending strength of the metal plate can be increased to the bending strength of the plate thickness or more.

[0015]

Embodiment An embodiment of the present invention will be described below with reference to FIG. However, the same parts as those in the above-described conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 1, the mask 20 is composed of a first metal plate 7, a second metal plate 21, and a reinforcing frame 3 joined to the outer peripheral end thereof as required.

The second metal plate 21 is made of stainless steel or the like having substantially the same size as the first metal plate 7, and corresponds to the first through-hole 9 provided in the first metal plate 7. A circular second through hole 22 (six in FIG. 1) having a predetermined pattern for forming a thin film by sputter deposition on the element body 4 is provided.
Then, a projection 23 having a convex cross section is provided by bead processing in a lattice shape or the like so as to surround the second through hole 22 of the entire second metal plate 21.

The mask 20 is formed by combining the first metal plate 7 and the second metal plate 21 with the first through hole 9 and the second through hole 22.
Are located almost concentrically and joined by spot welding, etc.
And is configured further reinforcing frame 3 are joined by spot welding or the like with the first metal plate 7 to the second metal plate 2 1 of the outer peripheral edge.

Since the purpose of the projections 23 is to increase the bending strength of the mask 20, the projections 23 are formed on the second metal plate 2.
The first metal plate 7 is not limited to the first metal plate 7.
May be provided on both the first metal plate 7 and the second metal plate 21.

Further, the shape of the projection 23 is not limited to the shape shown in FIG. 1, but may be any shape such as a V-shaped cross section as long as the bending strength of the metal plate increases.

Here, the first and second metal plates have a thickness of 0.1 mm.
The mask 6 according to the conventional example and the mask 20 according to the present example were formed using a 5 mm stainless steel metal plate, and were used 1000 times for sputtering deposition on the element body 4.
At this time, the masks 6, 20 undergo thermal deformation, and the masks 6, 2
Table 1 shows a comparison result of the number of failure occurrences in which the element body 4 was shifted from 0.
Shown in

[0022]

[Table 1]

As is clear from Table 1, even with a mask made of a metal material having the same material and thickness, the mask 20 having the projections 23 according to the present invention has a small thermal deformation during sputtering, The frequency with which the body 4 shifts has decreased.

As described above, in the embodiment of the present invention, the element body 4 and the electrode are circular, and the first and second through-holes of the mask 20 are indicated by circles in accordance with this. The first and second through-holes are not limited to circular shapes, but may have an appropriate shape according to the element body and the electrode shape. Further, the entire shape of the mask 20 is not limited to a square, but may be a predetermined shape such as a circle. Furthermore, the number of the first and second through holes of the mask 20 is not limited to six, but may be increased or decreased as appropriate.

[0025]

As described above, in the mask for forming a thin film according to the present invention, the bending strength of the metal plate can be increased to the bending strength of the plate thickness or more by providing the metal plate with the projection surrounding the through hole. it can. Therefore, it is possible to reduce the thickness of the metal plate, to form an electrode with a small number of hidden parts, and to reduce heat deformation due to heat generated by sputter deposition, so that the element body is less likely to be displaced from the mask, Electrodes can be stably formed on the element body. Also,
The life of the mask against thermal deformation is extended.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a mask for forming a thin film according to the present invention, (a) is a top view thereof, and (b) is an AA thereof.
FIG. 4 is a partial cross-sectional view taken along a line, showing a state where a mask is fitted on one surface of the element body.

FIG. 2 is a cross-sectional side view of a main part showing a mask for forming a thin film and a body for explaining general sputter deposition.

3A and 3B show a conventional mask for forming a thin film, wherein FIG. 3A is a top view thereof, and FIG. 3B is a partial cross-sectional view taken along a line BB of FIG. .

[Explanation of symbols]

 Reference Signs List 4 element body 7 first metal plate 9 first through hole 20 thin film forming mask 21 second metal plate 22 second through hole 23 protrusion

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 14/00-14/58 C23C 16/00-16/56 H01L 21/205 H05K 1/02

Claims (1)

(57) [Claims] 1. A thin film forming mask for forming a thin film of a predetermined pattern on a surface of a body through a mask by scattered particles from a scattering source, a first penetration for positioning a body to be formed into a thin film. A first metal plate having a hole and a second metal plate having a second through hole corresponding to the predetermined pattern are formed by joining, and at least one of the first and second metal plates is formed. A projection is formed on the metal plate so as to surround the through hole, and the projection is formed on the at least one metal.
A thin-film forming mask formed of the same material and the same thickness as the metal plate .