JP3305433B2 - Thermotropic liquid crystal resin bonding structure and bonding method - Google Patents
Thermotropic liquid crystal resin bonding structure and bonding methodInfo
- Publication number
- JP3305433B2 JP3305433B2 JP16731193A JP16731193A JP3305433B2 JP 3305433 B2 JP3305433 B2 JP 3305433B2 JP 16731193 A JP16731193 A JP 16731193A JP 16731193 A JP16731193 A JP 16731193A JP 3305433 B2 JP3305433 B2 JP 3305433B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal polyester
- wholly aromatic
- bonding
- polyester resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 56
- 229920005989 resin Polymers 0.000 title claims description 40
- 239000011347 resin Substances 0.000 title claims description 40
- 239000004974 Thermotropic liquid crystal Substances 0.000 title description 38
- -1 bromine compound Chemical class 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 125000003118 aryl group Chemical group 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000007864 aqueous solution Substances 0.000 claims description 20
- 239000003973 paint Substances 0.000 claims description 17
- 229920001225 polyester resin Polymers 0.000 claims description 17
- 239000004645 polyester resin Substances 0.000 claims description 16
- 229920000728 polyester Polymers 0.000 claims description 13
- 229920003002 synthetic resin Polymers 0.000 claims description 13
- 239000000057 synthetic resin Substances 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 11
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 4
- 150000002739 metals Chemical group 0.000 claims description 4
- UPHOPMSGKZNELG-UHFFFAOYSA-N 2-hydroxynaphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=C(O)C=CC2=C1 UPHOPMSGKZNELG-UHFFFAOYSA-N 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims 19
- 238000004381 surface treatment Methods 0.000 claims 11
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 4
- 229910052794 bromium Inorganic materials 0.000 claims 4
- 239000003513 alkali Substances 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 230000007935 neutral effect Effects 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 claims 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 30
- 238000009210 therapy by ultrasound Methods 0.000 description 25
- 229920000106 Liquid crystal polymer Polymers 0.000 description 23
- 238000000576 coating method Methods 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 20
- 238000007747 plating Methods 0.000 description 20
- 239000000126 substance Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 17
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 16
- 239000010949 copper Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 230000002378 acidificating effect Effects 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005238 degreasing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 102100035182 Plastin-2 Human genes 0.000 description 4
- 101710081231 Plastin-2 Proteins 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 2
- AULKDLUOQCUNOK-UHFFFAOYSA-N 3,5-dichloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC(Cl)=C(O)C(Cl)=C1 AULKDLUOQCUNOK-UHFFFAOYSA-N 0.000 description 2
- XMEQDAIDOBVHEK-UHFFFAOYSA-N 3-bromo-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Br)=C1 XMEQDAIDOBVHEK-UHFFFAOYSA-N 0.000 description 2
- QGNLHMKIGMZKJX-UHFFFAOYSA-N 3-chloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Cl)=C1 QGNLHMKIGMZKJX-UHFFFAOYSA-N 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- OMNHTTWQSSUZHO-UHFFFAOYSA-N 4-hydroxy-3,5-dimethylbenzoic acid Chemical compound CC1=CC(C(O)=O)=CC(C)=C1O OMNHTTWQSSUZHO-UHFFFAOYSA-N 0.000 description 2
- LTFHNKUKQYVHDX-UHFFFAOYSA-N 4-hydroxy-3-methylbenzoic acid Chemical compound CC1=CC(C(O)=O)=CC=C1O LTFHNKUKQYVHDX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229920003233 aromatic nylon Polymers 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- JMSVCTWVEWCHDZ-UHFFFAOYSA-N syringic acid Chemical compound COC1=CC(C(O)=O)=CC(OC)=C1O JMSVCTWVEWCHDZ-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical compound FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PVRZMTHMPKVOBP-UHFFFAOYSA-N 1-n,4-n-dimethylbenzene-1,4-diamine Chemical compound CNC1=CC=C(NC)C=C1 PVRZMTHMPKVOBP-UHFFFAOYSA-N 0.000 description 1
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 1
- MWQVQEFJAIFHFZ-UHFFFAOYSA-N 2,3-dichloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Cl)=C1Cl MWQVQEFJAIFHFZ-UHFFFAOYSA-N 0.000 description 1
- NAQNEMNLLODUCG-UHFFFAOYSA-N 2,3-dichloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1Cl NAQNEMNLLODUCG-UHFFFAOYSA-N 0.000 description 1
- RYRZSXJVEILFRR-UHFFFAOYSA-N 2,3-dimethylterephthalic acid Chemical compound CC1=C(C)C(C(O)=O)=CC=C1C(O)=O RYRZSXJVEILFRR-UHFFFAOYSA-N 0.000 description 1
- 229940075142 2,5-diaminotoluene Drugs 0.000 description 1
- QTHMEINNGLIDSU-UHFFFAOYSA-N 2,5-dichloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC(Cl)=C(O)C=C1Cl QTHMEINNGLIDSU-UHFFFAOYSA-N 0.000 description 1
- QPBGNSFASPVGTP-UHFFFAOYSA-N 2-bromoterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Br)=C1 QPBGNSFASPVGTP-UHFFFAOYSA-N 0.000 description 1
- WIPYZRZPNMUSER-UHFFFAOYSA-N 2-chloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1Cl WIPYZRZPNMUSER-UHFFFAOYSA-N 0.000 description 1
- ZPXGNBIFHQKREO-UHFFFAOYSA-N 2-chloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1 ZPXGNBIFHQKREO-UHFFFAOYSA-N 0.000 description 1
- IWFVHBRPBOMFMG-UHFFFAOYSA-N 2-ethoxyterephthalic acid Chemical compound CCOC1=CC(C(O)=O)=CC=C1C(O)=O IWFVHBRPBOMFMG-UHFFFAOYSA-N 0.000 description 1
- NAUKGYJLYAEUBD-UHFFFAOYSA-N 2-ethylterephthalic acid Chemical compound CCC1=CC(C(O)=O)=CC=C1C(O)=O NAUKGYJLYAEUBD-UHFFFAOYSA-N 0.000 description 1
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical class OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 description 1
- VQBBXLZPRXHYBO-UHFFFAOYSA-N 2-methoxyterephthalic acid Chemical compound COC1=CC(C(O)=O)=CC=C1C(O)=O VQBBXLZPRXHYBO-UHFFFAOYSA-N 0.000 description 1
- OBCSAIDCZQSFQH-UHFFFAOYSA-N 2-methyl-1,4-phenylenediamine Chemical compound CC1=CC(N)=CC=C1N OBCSAIDCZQSFQH-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- NTKLFSYUWYPMCJ-UHFFFAOYSA-N 2-phenoxybenzene-1,4-diol Chemical compound OC1=CC=C(O)C(OC=2C=CC=CC=2)=C1 NTKLFSYUWYPMCJ-UHFFFAOYSA-N 0.000 description 1
- VMKYTRPNOVFCGZ-UHFFFAOYSA-N 2-sulfanylphenol Chemical compound OC1=CC=CC=C1S VMKYTRPNOVFCGZ-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
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- 239000010453 quartz Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- QERYCTSHXKAMIS-UHFFFAOYSA-N thiophene-2-carboxylic acid Chemical compound OC(=O)C1=CC=CS1 QERYCTSHXKAMIS-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- WKOLLVMJNQIZCI-UHFFFAOYSA-N vanillic acid Chemical compound COC1=CC(C(O)=O)=CC=C1O WKOLLVMJNQIZCI-UHFFFAOYSA-N 0.000 description 1
- TUUBOHWZSQXCSW-UHFFFAOYSA-N vanillic acid Natural products COC1=CC(O)=CC(C(O)=O)=C1 TUUBOHWZSQXCSW-UHFFFAOYSA-N 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気・電子部品、自動
車部品、機械部品等の分野で有用なサーモトロピック液
晶樹脂(以下、場合によってLCPと称する)からなる
成形品表面をメッキ、真空蒸着、スパッタリング等の方
法でメタライジング等の被覆をする、または他の合成樹
脂の被膜を積層あるいは塗料、接着剤等を塗布、接着す
る方法等のLCPからなる成形品表面に各種材料からな
る被膜を接合してなる接合構造およびその接合方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to plating and vacuum deposition of the surface of a molded article made of a thermotropic liquid crystal resin (hereinafter sometimes referred to as LCP) which is useful in the fields of electric / electronic parts, automobile parts, mechanical parts and the like. , A method such as metallizing by a method such as sputtering, or a method of laminating a film of another synthetic resin or a method of applying a paint, an adhesive, or the like, and applying a film made of LCP to a surface of a molded product made of LCP, etc. The present invention relates to a bonding structure formed by bonding and a bonding method.
【0002】[0002]
【従来の技術】近年、新しい合成樹脂としてLCPが注
目されその用途を伸ばしており、それにつれその成形品
を機能化したり装飾したりするため、表面にメッキ、蒸
着、スパッタリング等で金属被膜を形成する、他の合成
樹脂をラミネートする、塗料を塗布する、接着剤で各種
材料を接合する等が要求されるようになっている。2. Description of the Related Art In recent years, LCP has been attracting attention as a new synthetic resin, and its use has been extended, and in order to functionalize and decorate a molded product, a metal coating is formed on the surface by plating, vapor deposition, sputtering, or the like. There is a demand for laminating other synthetic resins, applying a paint, joining various materials with an adhesive, and the like.
【0003】LCPは一般に化学的には安定であるの
で、LCPからなる成形品表面に他の材料の被膜を形成
する際、LCPと該被膜間には化学的な結合力は余り期
待できない。そのため、何らかの方法によりLCP成形
品表面の前処理が必要になることが多い。これにはLC
P表面を粗化(一般にエッチングと称する)することが
考えられる。そして、この表面粗化の方法として種々な
ものが提案されている。例えば特開昭62−54073
号公報には、メタライジングの前処理用のエッチング液
としてクロム酸混液の利用が開示されている。しかし、
ここで使用している重クロム酸カリは、環境汚染の問題
を抱えており、廃液の処理に多大な費用を要する。ま
た、これは硫酸95%、重クロム酸カリ2%、水3%
(重量比)と極めて高濃度であるため取扱いに問題があ
る。[0003] Since LCP is generally chemically stable, when a film of another material is formed on the surface of a molded article made of LCP, little chemical bonding force can be expected between the LCP and the film. Therefore, it is often necessary to pretreat the surface of the LCP molded product by some method. This includes LC
It is conceivable that the P surface is roughened (generally referred to as etching). Various methods have been proposed for this surface roughening method. For example, JP-A-62-54073
Japanese Patent Application Laid-Open Publication No. H11-163,086 discloses the use of a chromic acid mixed solution as an etching solution for pretreatment of metallizing. But,
The potassium dichromate used here has a problem of environmental pollution, and requires a great deal of cost for treating the waste liquid. This is 95% sulfuric acid, 2% potassium dichromate, 3% water
(Weight ratio), and there is a problem in handling due to the extremely high concentration.
【0004】また特開平1−98637号公報には、L
CPに特定の充填剤を配合し硫酸溶液でエッチングする
方法が開示されているが、この場合も硫酸の濃度が80
%以上が必要であり取扱いに問題がある。Japanese Patent Laid-Open No. 1-98637 discloses L.
A method of blending a specific filler with CP and etching with a sulfuric acid solution is disclosed.
% Or more is required and there is a problem in handling.
【0005】LCP成形品の接合すべき材料が表面に形
成される被膜であって、それが金属である場合、例えば
メッキの場合の実用的な方法について、“日本接着学会
誌、Vol.26、No2、p.21(1990)”に
紹介されている。ここでエッチング後の表面状態につい
て「他の樹脂(すなわち、LCP以外の樹脂)に比べ粗
く、メッキ後の外観も悪い。」と指摘している。[0005] When a material to be joined to an LCP molded article is a film formed on the surface and is a metal, for example, a practical method in the case of plating is described in "Journal of the Adhesion Society of Japan, Vol. 26, No. 2, p. 21 (1990) ". Here, he points out that the surface state after etching is "rougher than other resins (that is, resins other than LCP) and the appearance after plating is poor".
【0006】上述のように、LCP成形品の接合方法に
おける一つの課題は、その前処理液には環境汚染および
安全性に問題があり、かつ高濃度で取扱いにくい前処理
液を使わなければならないことである。他の課題は、こ
の前処理は、エッチング(表面を粗化することを意味す
る)することであり、これは接合形成において機械的な
投錨効果による接着強度の向上を意図したものであっ
て、このような表面粗化の処理では必然的に製品表面の
平滑性が損なわれる恐れがある。As described above, one of the problems in the method of joining LCP molded articles is that the pretreatment liquid has a problem of environmental pollution and safety and must use a high concentration and difficult to handle pretreatment liquid. That is. Another problem is that the pre-treatment is etching (meaning roughening the surface), which is intended to improve the bonding strength by mechanical anchoring effect in the joint formation, Such surface roughening treatment may inevitably impair the smoothness of the product surface.
【0007】[0007]
【発明が解決しようとする課題】本発明は、これら従来
技術の課題を解消し、簡便な方法により、安全性が高く
取扱い易い液体を処理液として使用し、比較的マイルド
な条件で行い、製品表面の平滑性を損なうことなく他の
材料の被膜を形成することができるサーモトロピック液
晶樹脂接合構造およびその接合方法を提供することにあ
る。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and uses a liquid which is safe and easy to handle as a processing liquid by a simple method, and is performed under relatively mild conditions. It is an object of the present invention to provide a thermotropic liquid crystal resin bonding structure capable of forming a film of another material without impairing the surface smoothness, and a bonding method therefor.
【0008】このことをさらにまとめて以下に示す。 LCPという機械的強度、耐熱性、寸法精度、電気
特性、難燃性、成形加工性等に優れた材料を使用した工
業的に有用な成形品に対し、表面にメッキ、蒸着、スパ
ッタリング等で金属被膜を形成する、他の合成樹脂をラ
ミネートする、塗料を塗布するまたは接着剤で接合する
等の手段により装飾あるいは機能化し付加価値を上げ
る。This is further summarized below. For industrially useful molded products using LCP, a material with excellent mechanical strength, heat resistance, dimensional accuracy, electrical properties, flame retardancy, moldability, etc. Decorating or functionalizing by means such as forming a film, laminating another synthetic resin, applying a paint, or bonding with an adhesive increases the added value.
【0009】 LCPと他の材料の被膜との密着力が
実用上十分に出るような被膜形成方法を与える。The present invention provides a method for forming a film in which the adhesion between the LCP and a film of another material is sufficiently high for practical use.
【0010】 安全性が高い液体を使用し、比較的温
和な条件で行うことができる工業的に有利な被膜形成方
法の前処理法を与える。[0010] An industrially advantageous pretreatment method for a film forming method which can be performed under relatively mild conditions using a liquid having high safety is provided.
【0011】 他の材料の被膜を形成された製品の外
観が優れており、商品価値の高いLCP成形品を与え
る。[0011] The appearance of a product coated with another material is excellent, and an LCP molded product having high commercial value is provided.
【0012】[0012]
【課題を解決するための手段】本発明者等は、これらの
問題を解決するため種々の検討を行い本発明に達した。Means for Solving the Problems The present inventors have made various studies to solve these problems and arrived at the present invention.
【0013】すなわち、本発明は、接合を構成する1方
の面が超音波処理をされたサーモトロピック液晶樹脂か
らなる成形品表面であることを特徴とする接合構造に関
する。[0013] That is, the present invention relates to a bonding structure characterized in that one surface constituting the bonding is a surface of a molded product made of a thermotropic liquid crystal resin subjected to ultrasonic treatment.
【0014】また、本発明は、サーモトロピック液晶樹
脂に超音波振動を与えた後、これを接合することを特徴
とするサーモトロピック液晶樹脂の接合方法に関する。The present invention also relates to a method for bonding a thermotropic liquid crystal resin, which comprises applying an ultrasonic vibration to a thermotropic liquid crystal resin and then bonding the same.
【0015】以下に本発明をさらに説明する。本発明で
いうサーモトロピック液晶ポリマーとは、溶融時に光学
的異方性を示す熱可塑性である溶融可能なポリマーであ
る。このように溶融時に光学的異方性を示すポリマー
は、溶融状態でポリマー分子鎖が規則的な平行配列をと
る性質を示す。光学的異方性溶融相の性質は、直交偏光
子を利用した通常の偏光検査法により確認することがで
きる。Hereinafter, the present invention will be further described. The thermotropic liquid crystal polymer referred to in the present invention is a thermoplastic fusible polymer that exhibits optical anisotropy when melted. As described above, a polymer that exhibits optical anisotropy at the time of melting exhibits a property that the polymer molecular chains take a regular parallel arrangement in a molten state. The properties of the optically anisotropic molten phase can be confirmed by a usual polarization inspection method using a crossed polarizer.
【0016】上記液晶ポリマーとしては、たとえば、液
晶性ポリエステル、液晶性ポリカーボネート、液晶性ポ
リエステルイミド等、具体的には、(全)芳香族ポリエ
ステル、ポリエステルアミド、ポリアミドイミド、ポリ
エステルカーボネート、ポリアゾメチン等が挙げられ
る。The liquid crystal polymer includes, for example, liquid crystalline polyester, liquid crystalline polycarbonate, liquid crystalline polyesterimide, etc., specifically, (whole) aromatic polyester, polyesteramide, polyamideimide, polyestercarbonate, polyazomethine, etc. No.
【0017】サーモトロピック液晶ポリマーは、一般に
細長く、偏平な分子構造からなり、分子の長鎖に沿って
剛性が高く、同軸または平行のいずれかの関係にある複
数の連鎖伸長結合を有している。A thermotropic liquid crystal polymer generally has an elongated and flat molecular structure, has high rigidity along the long chain of the molecule, and has a plurality of chain-extended bonds in either a coaxial or parallel relationship. .
【0018】本発明において用いるサーモトロピック液
晶ポリマーには、一つの高分子鎖の一部が異方性溶融相
を形成するポリマーのセグメントで構成され、残りの部
分が異方性溶融相を形成しないポリマーのセグメントか
ら構成されるポリマーも含まれる。また、複数のサーモ
トロピック液晶ポリマーを複合したものも含まれる。In the thermotropic liquid crystal polymer used in the present invention, a part of one polymer chain is constituted by a polymer segment forming an anisotropic molten phase, and the remaining part does not form an anisotropic molten phase. Also included are polymers composed of polymer segments. Further, a composite of a plurality of thermotropic liquid crystal polymers is also included.
【0019】サーモトロピック液晶ポリマーを構成する
モノマーの代表例としては、(A)芳香族ジカルボン酸
の少なくとも1種、(B)芳香族ヒドロキシカルボン酸
系化合物の少なくとも1種、(C)芳香族ジオール系化
合物の少なくとも1種、(D)(D1)芳香族ジチオー
ル、(D2)芳香族チオフェノ−ル、(D3)芳香族チオ
−ルカルボン酸化合物の少なくとも1種、(E)芳香族
ヒドロキシアミン、芳香族ジアミン系化合物の少なくと
も1種、等が挙げられる。Representative examples of the monomers constituting the thermotropic liquid crystal polymer include (A) at least one aromatic dicarboxylic acid, (B) at least one aromatic hydroxycarboxylic acid compound, and (C) aromatic diol. (D) (D 1 ) aromatic dithiol, (D 2 ) aromatic thiophenol, (D 3 ) aromatic thiol carboxylic acid compound, (E) aromatic hydroxy Examples thereof include at least one of an amine and an aromatic diamine compound.
【0020】これらは単独で構成される場合もあるが、
多くは(A)と(C)、(A)と(D)、(A),
(B)と(C)、(A),(B)と(E)、あるいは
(A),(B),(C)と(E)等のように組合せて構
成される。Although these may be constituted independently,
Many are (A) and (C), (A) and (D), (A),
(B) and (C), (A), (B) and (E), or (A), (B), (C) and (E), and the like.
【0021】上記(A)芳香族ジカルボン酸系化合物と
しては、テレフタル酸、4,4′−ジフェニルジカルボ
ン酸、4,4′−トリフェニルジカルボン酸、2,6−
ナフタレンジカルボン酸、1,4−ナフタレンジカルボ
ン酸、2,7−ナフタレンジカルボン酸、ジフェニルエ
ーテル−4,4′−ジカルボン酸、ジフェノキシエタン
−4,4′−ジカルボン酸、ジフェノキシブタン−4,
4′−ジカルボン酸、ジフェニルエタン−4,4′−ジ
カルボン酸、イソフタル酸、ジフェニルエ−テル−3,
3′−ジカルボン酸、ジフェノキシエタン−3,3′−
ジカルボン酸、ジフェニルエタン−3,3′−ジカルボ
ン酸、1,6−ナフタレンジカルボン酸のごとき芳香族
ジカルボン酸またはクロロテレフタル酸、ジクロロテレ
フタル酸、ブロモテレフタル酸、メチルテレフタル酸、
ジメチルテレフタル酸、エチルテレフタル酸、メトキシ
テレフタル酸、エトキシテレフタル酸等、上記芳香族ジ
カルボン酸のアルキル、アルコキシまたはハロゲン置換
体が挙げられる。The aromatic dicarboxylic acid compound (A) includes terephthalic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-triphenyldicarboxylic acid, 2,6-
Naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, diphenylether-4,4'-dicarboxylic acid, diphenoxyethane-4,4'-dicarboxylic acid, diphenoxybutane-4,
4'-dicarboxylic acid, diphenylethane-4,4'-dicarboxylic acid, isophthalic acid, diphenylether-3,
3'-dicarboxylic acid, diphenoxyethane-3,3'-
Aromatic dicarboxylic acids such as dicarboxylic acid, diphenylethane-3,3'-dicarboxylic acid, 1,6-naphthalenedicarboxylic acid or chloroterephthalic acid, dichloroterephthalic acid, bromoterephthalic acid, methylterephthalic acid,
Alkyl, alkoxy or halogen-substituted aromatic dicarboxylic acids such as dimethyl terephthalic acid, ethyl terephthalic acid, methoxy terephthalic acid, ethoxy terephthalic acid and the like.
【0022】(B)芳香族ヒドロキシカルボン酸系化合
物としては、4−ヒドロキシ安息香酸、3−ヒドロキシ
安息香酸、6−ヒドロキシ−2−ナフトエ酸、6−ヒド
ロキシ−1−ナフトエ酸等の芳香族ヒドロキシカルボン
酸または3−メチル−4−ヒドロキシ安息香酸、3,5
−ジメチル−4−ヒドロキシ安息香酸、2,6−ジメチ
ル−4−ヒドロキシ安息香酸、3−メトキシ−4−ヒド
ロキシ安息香酸、3,5−ジメトキシ−4−ヒドロキシ
安息香酸、6−ヒドロキシ−5−メチル−2−ナフトエ
酸、6−ヒドロキシ−5−メトキシ−2−ナフトエ酸、
2−クロロ−4−ヒドロキシ安息香酸、3−クロロ−4
−ヒドロキシ安息香酸、2,3−ジクロロ−4−ヒドロ
キシ安息香酸、3,5−ジクロロ−4−ヒドロキシ安息
香酸、2,5−ジクロロ−4−ヒドロキシ安息香酸、3
−ブロモ−4−ヒドロキシ安息香酸、6−ヒドキシ−5
−クロロ−2−ナフトエ酸、6−ヒドロキシ−7−クロ
ロ−2−ナフトエ酸、6−ヒドロキシ−5,7−ジクロ
ロ−2−ナフトエ酸等の芳香族ヒドロキシカルボン酸の
アルキル、アルコキシまたはハロゲン置換体が挙げられ
る。(B) The aromatic hydroxycarboxylic acid compounds include aromatic hydroxycarboxylic acids such as 4-hydroxybenzoic acid, 3-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid and 6-hydroxy-1-naphthoic acid. Carboxylic acid or 3-methyl-4-hydroxybenzoic acid, 3,5
-Dimethyl-4-hydroxybenzoic acid, 2,6-dimethyl-4-hydroxybenzoic acid, 3-methoxy-4-hydroxybenzoic acid, 3,5-dimethoxy-4-hydroxybenzoic acid, 6-hydroxy-5-methyl -2-naphthoic acid, 6-hydroxy-5-methoxy-2-naphthoic acid,
2-chloro-4-hydroxybenzoic acid, 3-chloro-4
-Hydroxybenzoic acid, 2,3-dichloro-4-hydroxybenzoic acid, 3,5-dichloro-4-hydroxybenzoic acid, 2,5-dichloro-4-hydroxybenzoic acid, 3
-Bromo-4-hydroxybenzoic acid, 6-hydroxy-5
Alkyl, alkoxy or halogen-substituted aromatic hydroxycarboxylic acids such as -chloro-2-naphthoic acid, 6-hydroxy-7-chloro-2-naphthoic acid and 6-hydroxy-5,7-dichloro-2-naphthoic acid Is mentioned.
【0023】(C)芳香族ジオールとしては、4,4′
−ジヒドロキシジフェニル、3,3′−ジヒドロキシジ
フェニル、4,4′−ジヒドロキシトリフェニル、ハイ
ドロキノン、レゾルシン、2,6−ナフタレンジオー
ル、4,4′−ジヒドロキシジフェニルエーテル、ビス
(4−ヒドロキシフェノキシ)エタン、3,3′−ジヒ
ドロキシジフェニルエ−テル、1,6−ナフタレンジオ
−ル、2,2−ビス(4−ヒドロキシフェニル)プロパ
ン、ビス(4−ヒドロキシフェニル)メタン等の芳香族
ジオ−ルまたはクロロハイドロキノン、メチルハイドロ
キノン、t−ブチルハイドロキノン、フェニルハイドロ
キノン、メトキシハイドロキノン、フェノキシハイドロ
キノン、4−クロロレゾルシン、4−メチルレゾルシン
等の芳香族ジオ−ルのアルキル、アルコキシまたはハロ
ゲン置換体が挙げられる。(C) As the aromatic diol, 4,4 '
-Dihydroxydiphenyl, 3,3'-dihydroxydiphenyl, 4,4'-dihydroxytriphenyl, hydroquinone, resorcinol, 2,6-naphthalenediol, 4,4'-dihydroxydiphenyl ether, bis (4-hydroxyphenoxy) ethane, Aromatic diols such as 3,3'-dihydroxydiphenyl ether, 1,6-naphthalenediol, 2,2-bis (4-hydroxyphenyl) propane and bis (4-hydroxyphenyl) methane, or chlorohydroquinone And alkyl-, alkoxy- or halogen-substituted aromatic diols such as methylhydroquinone, t-butylhydroquinone, phenylhydroquinone, methoxyhydroquinone, phenoxyhydroquinone, 4-chlororesorcin and 4-methylresorcin. That.
【0024】(D1)芳香族ジチオールとしては、ベン
ゼン−1,4−ジチオ−ル、ベンゼン−1,3−ジチオ
−ル、2,6−ナフタレン−ジチオ−ル、2,7−ナフ
タレン−ジチオ−ル等が挙げられる。(D 1 ) As aromatic dithiol, benzene-1,4-dithiol, benzene-1,3-dithiol, 2,6-naphthalene-dithiol, 2,7-naphthalene-dithiol And the like.
【0025】(D2)芳香族チオフェノールとしては、
4−メルカプトフエノ−ル、3−メルカプトフェノ−
ル、6−メルカプトフェノ−ル等が挙げられる。(D 2 ) As the aromatic thiophenol,
4-mercaptophenol, 3-mercaptopheno-
And 6-mercaptophenol.
【0026】(D3)芳香族チオールカルボン酸として
は、4−メルカプト安息香酸、3−メルカプト安息香
酸、6−メルカプト−2−ナフトエ酸、7−メルカプト
−2−ナフトエ酸等が挙げられる。(D 3 ) Examples of the aromatic thiol carboxylic acid include 4-mercaptobenzoic acid, 3-mercaptobenzoic acid, 6-mercapto-2-naphthoic acid, 7-mercapto-2-naphthoic acid and the like.
【0027】(E)芳香族ヒドロキシアミン、芳香族ジ
アミン系化合物としては、4−アミノフェノ−ル、N−
メチル−4−アミノフェノール、1,4−フェニレンジ
アミン、N−メチル−1,4−フェニレンジアミン、
N,N′−ジメチル−1,4−フェニレンジアミン、3
−アミノフェノ−ル、3−メチル−4−アミノフェノ−
ル、2−クロロ−4−アミノフェノ−ル、4−アミノ−
1−ナフト−ル、4−アミノ−4′−ヒドロキシジフェ
ニル、4−アミノ−4′−ヒドロキシジフェニルエ−テ
ル、4−アミノ−4′−ヒドロキシジフェニルメタン、
4−アミノ−4′−ヒドロキシジフェニルスルフィド、
4、4′−ジアミノフェニルスルフィド(チオジアニリ
ン)、4,4′ジアミノジフェニルスルホン、2,5−
ジアミノトルエン、4,4′−エチレンジアニリン、
4,4′−ジアミノジフェノキシエタン、4,4′−ジ
アミノジフェニルメタン(メチレンジアニリン)、4,
4′−ジアミノジフェニルエ−テル(オキシジアニリ
ン)等が挙げられる。(E) As aromatic hydroxyamine and aromatic diamine compounds, 4-aminophenol, N-
Methyl-4-aminophenol, 1,4-phenylenediamine, N-methyl-1,4-phenylenediamine,
N, N'-dimethyl-1,4-phenylenediamine, 3
-Aminophenol, 3-methyl-4-aminopheno-
2-chloro-4-aminophenol, 4-amino-
1-naphthol, 4-amino-4'-hydroxydiphenyl, 4-amino-4'-hydroxydiphenylether, 4-amino-4'-hydroxydiphenylmethane,
4-amino-4'-hydroxydiphenyl sulfide,
4,4'-diaminophenyl sulfide (thiodianiline), 4,4'-diaminodiphenyl sulfone, 2,5-
Diaminotoluene, 4,4'-ethylenedianiline,
4,4'-diaminodiphenoxyethane, 4,4'-diaminodiphenylmethane (methylenedianiline),
4'-diaminodiphenyl ether (oxydianiline) and the like.
【0028】本発明で用いるサーモトロピック液晶ポリ
マーは、上記モノマーから溶融アシドリシス法やスラリ
ー重合法等の多様なエステル形成法等により製造するこ
とができる。The thermotropic liquid crystal polymer used in the present invention can be produced from the above monomers by various ester forming methods such as a melt acidification method and a slurry polymerization method.
【0029】分子量として本発明に用いるに好適なサー
モトロピック液晶ポリエステルのそれは、約2000〜
200000、好ましくは約4000〜100000で
ある。かかる分子量の測定は、例えば圧縮フィルムにつ
いて赤外分光法により末端基を測定して求めることがで
きる。また溶液形成を伴う一般的な測定法であるGPC
によることもできる。Of the thermotropic liquid crystal polyesters suitable for use in the present invention in terms of molecular weight,
200,000, preferably about 4000-100,000. The molecular weight can be measured, for example, by measuring the terminal groups of the compressed film by infrared spectroscopy. GPC, a general measurement method involving solution formation
It can also be.
【0030】これらのモノマーから得られるサーモトロ
ピック液晶ポリマーのうち下記一般式(1)で表わされ
るモノマー単位を必須成分として含む(共)重合体であ
る芳香族ポリエステルが好ましい。特に好ましいもの
は、該モノマー単位を5モル%以上含む芳香族ポリエス
テルである。Among the thermotropic liquid crystal polymers obtained from these monomers, an aromatic polyester which is a (co) polymer containing a monomer unit represented by the following general formula (1) as an essential component is preferable. Particularly preferred are aromatic polyesters containing 5% by mole or more of the monomer unit.
【0031】[0031]
【化1】 Embedded image
【0032】本発明の特に好ましい芳香族ポリエステル
は、p−ヒドロキシ安息香酸、フタル酸およびビフェノ
ールの3種の化合物からそれぞれ誘導される構造の繰返
し単位を有する下記式(2)で表わされるポリエステ
ル、この下記式(2)で表されるポリエステルのビフェ
ノールから誘導される構造の繰り返し単位は、その一部
または全部をジヒドロキシベンゼンから誘導される繰り
返し単位で置換されたポリエステルであることもでき
る。p−ヒドロキシ安息香酸およびヒドロキシナフタリ
ンカルボン酸の2種の化合物からそれぞれ誘導される構
造の繰返し単位を有する下記式(3)で表わされるポリ
エステルである。A particularly preferred aromatic polyester of the present invention is a polyester represented by the following formula (2) having a repeating unit having a structure derived from each of three compounds of p-hydroxybenzoic acid, phthalic acid and biphenol. The repeating unit having a structure derived from biphenol of the polyester represented by the following formula (2) may be a polyester in which part or all of the repeating unit is substituted with a repeating unit derived from dihydroxybenzene. A polyester represented by the following formula (3) having a repeating unit having a structure derived from two kinds of compounds, p-hydroxybenzoic acid and hydroxynaphthalenecarboxylic acid.
【0033】[0033]
【化2】 Embedded image
【0034】[0034]
【化3】 Embedded image
【0035】本発明のサーモトロピック液晶樹脂は、1
種または2種以上の混合物として使用することもでき
る。The thermotropic liquid crystal resin of the present invention comprises:
It can also be used as a species or a mixture of two or more.
【0036】サーモトロピック液晶樹脂はそれ単独で本
発明の成形品を構成することもできる。しかしながら、
サーモトロピック液晶樹脂の強度、耐熱性を向上するた
め、あるいは異方性、加工性、寸法精度等を改善するた
め等の理由で無機充填剤を添加する場合が多い。本発明
においては無機充填剤を含むものを使用することにより
接合の強度向上がなされるのでかかる態様は好ましい態
様である。The thermotropic liquid crystal resin alone can constitute the molded article of the present invention. However,
An inorganic filler is often added for the purpose of improving the strength and heat resistance of the thermotropic liquid crystal resin, or improving the anisotropy, processability, dimensional accuracy, and the like. In the present invention, the use of a material containing an inorganic filler improves the bonding strength, and such a mode is a preferable mode.
【0037】この無機充填剤は特に限定されず、その形
状としては例えば繊維状、粒状、フレーク状等の形状の
充填剤がある。繊維状の充填剤としてはガラス繊維、炭
素繊維、アルミナ繊維、石膏繊維、シラス繊維、アスベ
スト繊維、金属繊維、各種ウィスカー等がある。The inorganic filler is not particularly limited, and examples thereof include fillers having a fibrous, granular, or flake shape. Examples of the fibrous filler include glass fiber, carbon fiber, alumina fiber, gypsum fiber, shirasu fiber, asbestos fiber, metal fiber, and various whiskers.
【0038】本発明で特に好ましい無機充填剤は粉・粒
状の形状を有する充填剤であり、これを使用することに
より表面の平滑な成形品が得られるばかりでなく他の材
料の被膜との密着力が向上する。なお、アスペクト比が
10以下ならば形状は必ずしも球形である必要はなく、
不規則形状あるいは偏平な形状でもよい。A particularly preferred inorganic filler in the present invention is a filler having a powdery / granular shape. By using this filler, not only can a molded article having a smooth surface be obtained, but also the adhesion to a coating of another material can be obtained. Power improves. If the aspect ratio is 10 or less, the shape does not necessarily have to be spherical,
Irregular or flat shapes may be used.
【0039】粉・粒状充填剤としてはタルク、マイカ、
ワラストナイト、カオリン、セリサイト、クレー、ベン
トナイト、アルミナシリケート等の珪酸塩、アルミナ、
マグネシア、ジルコニア、酸化チタン、酸化亜鉛、酸化
鉄、酸化アンチモン等の金属酸化物、炭酸カルシウム、
炭酸マグネシウム、ドロマイト等の炭酸塩、硫酸カルシ
ウム、硫酸マグネシウム等の硫酸塩、その他燐酸カルシ
ウム、ピロ燐酸カルシウム、ガラスビーズ、ガラスフレ
ーク、二硫化モリブデン、窒化珪素、窒化ホウ素、炭化
珪素等が挙げられる。これらは例えば、ガラスバルー
ン、シラスバルーン、カーボンバルーン、中空ガラス繊
維等のように中空であってもよい。As the powder and granular filler, talc, mica,
Wollastonite, kaolin, sericite, clay, bentonite, silicates such as alumina silicate, alumina,
Metal oxides such as magnesia, zirconia, titanium oxide, zinc oxide, iron oxide, antimony oxide, calcium carbonate,
Examples thereof include carbonates such as magnesium carbonate and dolomite, sulfates such as calcium sulfate and magnesium sulfate, calcium phosphate, calcium pyrophosphate, glass beads, glass flakes, molybdenum disulfide, silicon nitride, boron nitride, and silicon carbide. These may be hollow like a glass balloon, a shirasu balloon, a carbon balloon, a hollow glass fiber, etc., for example.
【0040】上記充填剤は2種以上を複合して使用する
こともでき、必要に応じてシラン系やチタネート系等の
カップリング剤で予備処理して使用してもよい。The above-mentioned fillers can be used in combination of two or more kinds, and if necessary, may be used after being pretreated with a silane-based or titanate-based coupling agent.
【0041】これら充填剤は好ましくは5〜80重量
%、さらに好ましくは10〜70重量%添加する。これ
が5重量%未満では、前記の強度や加工性の改良効果が
発現しないことが、また被膜の密着力が不十分となるこ
とがある。80重量%を越える場合は、機械的強度等は
かえって低下するので好ましくない。These fillers are preferably added in an amount of 5 to 80% by weight, more preferably 10 to 70% by weight. If the content is less than 5% by weight, the effect of improving the strength and workability described above may not be exhibited, and the adhesion of the coating may be insufficient. If it exceeds 80% by weight, the mechanical strength and the like are undesirably reduced.
【0042】また、他のポリマーを混合したいわゆるL
CPポリマーブレンドあるいはLCPポリマーアロイと
して使用することも可能である。このような配合するこ
とができる他の樹脂としてはポリエチレン、ポリプロピ
レン、ポリブテン、ポリメチルペンテン等のポリオレフ
ィン系樹脂またはエラストマー、ポリエチレンテレフタ
レート、ポリブチレンテレフタレート、ポリエチレンナ
フタレート等のポリエステル系樹脂またはエラストマ
ー、脂肪族ナイロン、芳香族ナイロン等のポリアミド系
樹脂またはエラストマー、ポリスチレン系樹脂またはエ
ラストマー、ポリカーボネート樹脂、フッ素系樹脂、ポ
リサルホン樹脂、ポリオキシメチレン樹脂、ポリフェニ
レンサルファイド樹脂およびポリケトン樹脂等の各種エ
ンジニアリングプラスチック等が挙げられる。A so-called L obtained by mixing other polymers
It can be used as a CP polymer blend or an LCP polymer alloy. Other resins that can be blended include polyethylene, polypropylene, polybutene, polyolefin resins or elastomers such as polymethylpentene, polyethylene terephthalate, polybutylene terephthalate, polyester resins or elastomers such as polyethylene naphthalate, aliphatic, and the like. Examples include various engineering plastics such as polyamide resin or elastomer such as nylon and aromatic nylon, polystyrene resin or elastomer, polycarbonate resin, fluorine resin, polysulfone resin, polyoxymethylene resin, polyphenylene sulfide resin, and polyketone resin.
【0043】そのほか、サーモトロピック液晶樹脂には
本発明の目的を損なわない範囲で、酸化防止剤および熱
安定剤(例えばヒンダードフェノール類、ヒドロキノン
類、フォスファイト類、チオエーテル類)、光安定剤
(例えばベンゾフェノン類、ベンゾトリアゾール類、ヒ
ンダードアミン類、サリシレート類、レゾルシノール
類)、滑剤および離型剤、染料および顔料(例えばカー
ボンブラック、チタン白、フタロシアニン、硫化カドミ
ウム)を含む着色剤、難燃剤、可塑剤、帯電防止剤等の
通常の添加剤を配合し所定の特性を付与することができ
る。In addition, an antioxidant and a heat stabilizer (for example, hindered phenols, hydroquinones, phosphites, and thioethers) and a light stabilizer (thermotropic liquid crystal resin) as long as the object of the present invention is not impaired. For example, benzophenones, benzotriazoles, hindered amines, salicylates, resorcinols), lubricants and release agents, coloring agents including dyes and pigments (eg, carbon black, titanium white, phthalocyanine, cadmium sulfide), flame retardants, plasticizers Ordinary additives such as an antistatic agent can be blended to impart predetermined characteristics.
【0044】本発明ではこのサーモトロピック液晶樹脂
を従来公知の各種成形手段により成形した成形品として
用いる。その形状は、成形方法その他に応じてフィルム
状、板状、円盤状、矩形、柱状、ロッド状成形品からさ
らに複雑な形状を有する成形品等が例示されるが、特に
これらに限定されない。最も一般的に適用される成形品
は、射出成形法により成形された成形品である。その他
パイプやフィルム・シート等の押出成形法により成形さ
れた成形品、ボトル、異形物等のブロー成形法により成
形された成形品も例示されるが、同様にこれらに限定さ
れるものではない。In the present invention, this thermotropic liquid crystal resin is used as a molded article molded by various conventionally known molding means. Examples of the shape include, but are not limited to, film-shaped, plate-shaped, disk-shaped, rectangular, columnar, and rod-shaped molded products having more complicated shapes, depending on the molding method and the like. The most commonly applied molded article is a molded article formed by an injection molding method. Other examples include, but are not limited to, molded articles formed by blow molding such as pipes, films and sheets, and extrusion molding methods, and bottles and irregularly shaped articles.
【0045】本発明では、上記成形品に対し金属等の被
膜あるいは樹脂ラミネートを形成する前に、すなわち接
合構造を形成する前に、気体、液体等の適宜の超音波を
伝達する媒体中、好ましくは液体中で該成形体表面に超
音波振動を与えることにより前処理を行い、かかる処理
がされた成形品を用いることが必須の要件である。In the present invention, before forming a coating of metal or the like or a resin laminate on the molded article, that is, before forming a bonding structure, it is preferable to use a suitable medium such as a gas or a liquid for transmitting ultrasonic waves. It is an essential requirement that a pretreatment is performed by applying ultrasonic vibration to the surface of the molded body in a liquid, and a molded product subjected to such treatment is used.
【0046】超音波振動を与える装置としては、好まし
くは液体を介して超音波が印加され得る構造のものなら
ば特に限定されない。このような装置には水晶等を利用
した圧電振動子、チタン酸バリウム等を利用した電歪振
動子またはニッケル、フェライト等を利用した磁歪振動
子等の発信子により得られた20KHz以上、一般的に
は50KHz程度の振動数を有する超音波で容器に振動
を与えるものが有り、容器から液体に音波が伝播し、液
体を介して超音波が成形品に印加される。このような超
音波洗浄装置には、被印加物の形状、大きさに応じて出
力が数十ないし数百ワットの実験用のものから、数キロ
ワットないし数10キロワット程度の工業的なものまで
各種ある。The apparatus for applying ultrasonic vibration is not particularly limited as long as it preferably has a structure to which ultrasonic waves can be applied via a liquid. Such devices include a piezoelectric vibrator using quartz or the like, an electrostrictive vibrator using barium titanate or the like, or a magnetostrictive vibrator using nickel or ferrite or the like. There is a type which gives a vibration to a container by ultrasonic waves having a frequency of about 50 KHz. A sound wave propagates from a container to a liquid, and the ultrasonic wave is applied to a molded article through the liquid. Such ultrasonic cleaning devices have various outputs ranging from tens to hundreds of watts depending on the shape and size of the object to be applied, to industrial devices of several kilowatts to several tens of kilowatts. is there.
【0047】超音波振動を成形品に印加するには、例え
ば前記超音波洗浄装置の容器中に下記の液体をいれ、こ
れに必要に応じ脱脂処理したサーモトロピック液晶樹脂
成形品を浸漬し超音波を印加する。In order to apply ultrasonic vibration to the molded product, for example, the following liquid is placed in the container of the ultrasonic cleaning apparatus, and if necessary, a degreased thermotropic liquid crystal resin molded product is immersed in the container. Is applied.
【0048】この場合、印加時の温度としては室温でも
よいが、40℃以上、液体の沸点を超えない範囲に加熱
することにより、処理効果が向上することがある。印加
する超音波の周波数は、20KHz以上、好ましくは2
5KHz以上である。周波数の上限値は特に限定されな
いが、余りに高い周波数の超音波では装置的にも高価と
なるので、通常は10MHz以下の周波数である。In this case, the temperature at the time of applying the voltage may be room temperature, but by heating to a temperature not lower than 40 ° C. and not exceeding the boiling point of the liquid, the treatment effect may be improved. The frequency of the applied ultrasonic wave is 20 KHz or more, preferably 2 kHz.
5 kHz or more. The upper limit of the frequency is not particularly limited. However, since an ultrasonic wave having a too high frequency is expensive in terms of the apparatus, it is usually 10 MHz or less.
【0049】超音波の強度は特に限定されないが、通常
は液体中で0.1W/cm2以上であればよい。上限値
も特に限定されないが、余りに高出力では液温の上昇等
の現象も観察されるので通常は100W/cm2以下の
出力である。The intensity of the ultrasonic wave is not particularly limited, but may be generally 0.1 W / cm 2 or more in a liquid. Although the upper limit value is not particularly limited, too high output usually results in an output of 100 W / cm 2 or less because phenomena such as a rise in liquid temperature are observed.
【0050】本発明で、被膜との密着力を十分に発揮さ
せるためには、超音波の印加時間は好ましくは2分以上
必要であり、さらに好ましくは5分以上必要である。合
成樹脂製の電子部品等を成形後組立工程に供する前に、
フロン等の有機溶剤中で超音波を印加することがある
が、これは脱脂が目的であるから通常は室温で1分以内
で行われ、このような条件では本発明の前処理としての
効果が発現しない。In the present invention, the application time of the ultrasonic wave is preferably 2 minutes or more, and more preferably 5 minutes or more, in order to sufficiently exert the adhesion to the film. Before subjecting the synthetic resin electronic parts etc. to the assembly process after molding,
Ultrasonic waves may be applied in an organic solvent such as chlorofluorocarbon, but this is usually performed within 1 minute at room temperature because of the purpose of degreasing. Under such conditions, the effect of the pretreatment of the present invention may be reduced. Not expressed.
【0051】本発明における超音波処理の際に用いる液
体は特に限定されず、アルカリ性水溶液、酸性水溶液、
有機溶剤、水等が例として挙げられる。アルカリ性水溶
液としては、水酸化ナトリウム、水酸化カリウム、水酸
化リチウム、水酸化カルシウム、水酸化アルミニウム、
水酸化バリウム、アンモニア等のアルカリ性物質の水溶
液が挙げられ、アルカリ性物質は2種以上を混合して使
用することもできる。酸性水溶液としては硫酸、硝酸、
塩酸、クロム酸、重クロム酸等の酸性物質の水溶液が挙
げられ、酸性物質は2種以上を混合して使用することも
できる。有機溶剤としては、トルエン、キシレン、テト
ラリン等の脂肪族炭化水素、ヘキサン、ヘプタン等の脂
肪族炭化水素、デカリン等の脂環族炭化水素、四フッ化
エチレン、三フッ化エチレン、テトラクロロエタン、ト
リクロロエタン、トリクロロエチレン、四塩化炭素等の
ハロゲン化炭化水素、酢酸エチル、酢酸ブチル等のエス
テル類、アセトン、メチルエチルケトン等のケトン類、
エチルアルコール、イソプロピルアルコール等のアルコ
ール類、酢酸、プロピオン酸等の有機酸、n−メチルピ
ロリドン等のアプロティック溶剤、ペンタフロロフェノ
ール等のフロロフェノール系化合物、ジメチルホルムア
ミド、ジメチルスルフォキシド等が挙げられる。これら
も2種以上混合して使用することができる。さらに、有
機溶剤はアルカリ性水溶液または酸性水溶液に混合する
こともできる。The liquid used in the ultrasonic treatment in the present invention is not particularly limited, and may be an alkaline aqueous solution, an acidic aqueous solution,
Organic solvents, water and the like are mentioned as examples. Examples of the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, aluminum hydroxide,
An aqueous solution of an alkaline substance such as barium hydroxide or ammonia may be used, and two or more alkaline substances may be used in combination. Acidic aqueous solutions include sulfuric acid, nitric acid,
An aqueous solution of an acidic substance such as hydrochloric acid, chromic acid, and dichromic acid can be used, and two or more acidic substances can be used in combination. Examples of the organic solvent include aliphatic hydrocarbons such as toluene, xylene, and tetralin, aliphatic hydrocarbons such as hexane and heptane, alicyclic hydrocarbons such as decalin, ethylene tetrafluoride, ethylene trifluoride, tetrachloroethane, and trichloroethane. , Trichloroethylene, halogenated hydrocarbons such as carbon tetrachloride, ethyl acetate, esters such as butyl acetate, acetone, ketones such as methyl ethyl ketone,
Examples include alcohols such as ethyl alcohol and isopropyl alcohol, organic acids such as acetic acid and propionic acid, aprotic solvents such as n-methylpyrrolidone, fluorophenol compounds such as pentafluorophenol, dimethylformamide, dimethyl sulfoxide and the like. . These can also be used in combination of two or more. Further, the organic solvent can be mixed with an alkaline aqueous solution or an acidic aqueous solution.
【0052】このうち本発明においては超音波処理に特
にアルカリ性水溶液を使用することが好ましい。Among them, in the present invention, it is particularly preferable to use an alkaline aqueous solution for the ultrasonic treatment.
【0053】上記アルカリ性、酸性水溶液の濃度は通常
のエッチングに使われている濃度に比較すれば低濃度の
ものを使用することができる。水に溶解させるアルカリ
性または酸性物質の量として好ましくは100g/l以
上、さらに好ましくは200g/以上である。これが1
00g/l未満では被膜の密着強度が十分でない場合が
ある。濃度の上限は限定されないが、一般に濃度が高く
なると被膜の平滑性が損なわれる場合があるので、好ま
しくは1000g/l以下、さらに好ましくは650g
/lで処理するのがよい。この濃度は後述の超音波処理
時間と関連し、時間が短いと比較的高濃度が、時間が長
いと比較的低濃度が好ましい。The concentration of the alkaline or acidic aqueous solution can be lower than that used in ordinary etching. The amount of the alkaline or acidic substance dissolved in water is preferably at least 100 g / l, more preferably at least 200 g / l. This is 1
If it is less than 00 g / l, the adhesion strength of the coating may not be sufficient. The upper limit of the concentration is not limited, but generally, when the concentration is high, the smoothness of the coating may be impaired.
/ L is preferred. This concentration is related to the sonication time described later, and a relatively high concentration is preferable when the time is short, and a relatively low concentration is preferable when the time is long.
【0054】この超音波処理に先立ち、その処理液と異
なる液に浸漬しておくとさらに効果が増大することがあ
る。例えば超音波処理液として酸性水溶液を使用浸漬液
としてアルカリ性水溶液に浸漬する、あるいはこの逆を
行うと効果が上がる場合がある。また、超音波処理液と
して水を使う時は予め酸性あるいはアルカリ性水溶液に
浸漬すると良い結果が得られる。Prior to the ultrasonic treatment, the effect may be further increased by dipping in a liquid different from the treatment liquid. For example, when an acidic aqueous solution is used as the ultrasonic treatment liquid, and the immersion liquid is immersed in an alkaline aqueous solution, or vice versa, the effect may be improved. When water is used as the ultrasonic treatment liquid, a good result can be obtained by immersing it in an acidic or alkaline aqueous solution in advance.
【0055】サーモトロピック液晶樹脂成形品の表面に
形成される被膜は、金属、合成樹脂、塗料、接着剤等の
いずれかの材料からなる被覆である。The coating formed on the surface of the thermotropic liquid crystal resin molded product is a coating made of any material such as a metal, a synthetic resin, a paint, and an adhesive.
【0056】金属被膜を形成する方法は各種あるが、化
学メッキ、電気メッキ、スパッタリング、蒸着等の方法
が一般的である。Although there are various methods for forming a metal film, methods such as chemical plating, electroplating, sputtering, and vapor deposition are generally used.
【0057】メッキの工程は、従来公知のプラスチック
メッキ方法が採用することができる。一般的にはまず成
形品を有機溶剤、界面活性剤等で脱脂処理する。通常は
この後水酸化ナトリウムや硫酸の濃厚溶液でエッチング
処理するが、本発明の方法では前述した超音波による前
処理を行う。もちろん必要に応じて本発明における超音
波処理と従来のエッチング処理とを併用することもでき
る。For the plating step, a conventionally known plastic plating method can be adopted. Generally, the molded article is first degreased with an organic solvent, a surfactant or the like. Usually, thereafter, etching treatment is performed with a concentrated solution of sodium hydroxide or sulfuric acid. In the method of the present invention, the above-described pretreatment by ultrasonic waves is performed. Of course, if necessary, the ultrasonic treatment in the present invention and the conventional etching treatment can be used in combination.
【0058】次にコンデイショニング、触媒付与および
活性化工程の各工程を経て化学(無電解)メッキを行
う。この後、必要に応じて電気メッキを行う。化学メッ
キに使用される金属としては銅、ニッケル等が一般的で
ある。電気メッキに使用される金属は多種あり、例とし
て銅、ニッケル、クロム、金、銀、錫−鉛合金等が挙げ
られる。プラスチックメッキ法によるメッキ金属層の厚
さは、一般には200Å〜1000μmの範囲である。Next, chemical (electroless) plating is performed through the steps of conditioning, catalyst application and activation. Thereafter, electroplating is performed as necessary. Copper, nickel and the like are generally used as the metal used for the chemical plating. There are many types of metals used for electroplating, examples of which include copper, nickel, chromium, gold, silver, and tin-lead alloys. The thickness of the plated metal layer formed by the plastic plating method is generally in the range of 200 to 1000 μm.
【0059】スパッタリング法は、例えば1×10-3〜
2×10-4Torrという高真空中で陰陽両極間に例え
ば1万ボルト以上という高電圧を印加しグロー放電を発
生させ、かくすることにより陰極金属を飛散させ、この
飛散した金属がサーモトロピック液晶樹脂成形品表面に
沈積し、金属被膜を形成するものである。アルゴン等の
不活性ガスを共存させることも行われる。対象となる金
属は多種あり、銅、金、クロム、アルミニウム等の他、
酸化錫や酸化インジウム等の金属の酸化物の被膜も形成
することができる。The sputtering method is, for example, 1 × 10 −3 to
A high voltage of, for example, 10,000 volts or more is applied between the positive and negative electrodes in a high vacuum of 2 × 10 −4 Torr to generate a glow discharge, and thereby the cathode metal is scattered. The scattered metal is a thermotropic liquid crystal. It deposits on the surface of a resin molded product to form a metal coating. The coexistence of an inert gas such as argon is also performed. There are many types of metals, including copper, gold, chromium, aluminum, etc.
A coating of a metal oxide such as tin oxide or indium oxide can also be formed.
【0060】蒸着法には真空蒸着法や化学蒸着法等があ
る。真空蒸着法は例えば1×10-3〜1×10-4Tor
r程度という高真空下に、蒸着物質を加熱して、再び基
体表面である成形品表面に金属を蒸着させることにより
金属被膜を成形体表面に形成するものであって、金属と
してはアルミニウム等が使用される。The vapor deposition method includes a vacuum vapor deposition method and a chemical vapor deposition method. The vacuum deposition method is, for example, 1 × 10 −3 to 1 × 10 −4 Torr.
Under a high vacuum of about r, the deposition material is heated, and a metal film is formed on the surface of the molded body by vapor-depositing a metal on the surface of the molded product, which is the substrate surface. used.
【0061】化学蒸着法は金属や金属の酸化物を気化さ
せ反応室に送り、熱力学的平衡状態に近い状態で成形品
表面に金属や金属の酸化物を析出させて、これらの被膜
を形成する方法である。析出する物質としては、ホウ素
等の金属のほか、シリカ、アルミナ等の酸化物、炭化ケ
イ素等の炭化物、窒化ケイ素等の窒化物等が例示され
る。In the chemical vapor deposition method, a metal or a metal oxide is vaporized and sent to a reaction chamber, and a metal or a metal oxide is deposited on the surface of a molded article in a state close to a thermodynamic equilibrium state to form these films. How to Examples of the deposited substance include metals such as boron, oxides such as silica and alumina, carbides such as silicon carbide, nitrides such as silicon nitride, and the like.
【0062】その他、高真空下のプラズマ内で蒸発源か
らの母材料の蒸発粒子をイオン化し、該イオンを付着さ
せて被覆を行うイオンプレーティング法等によることも
できる。プラズマを発生させる方法としては、直流電界
を印加する直流励起法、高周波電界を印加する高周波励
起法がある。いずれの方法も採用することができる。Alternatively, an ion plating method or the like may be used in which the evaporated particles of the base material from the evaporation source are ionized in plasma under a high vacuum, and the ions are adhered to coat the particles. As a method for generating plasma, there are a DC excitation method in which a DC electric field is applied and a high-frequency excitation method in which a high-frequency electric field is applied. Either method can be adopted.
【0063】スパッタリング法、蒸着法またはイオンプ
レーティング法等により形成される被膜の厚さは、一般
には200Å〜1000Å程度である。The thickness of a film formed by a sputtering method, a vapor deposition method, an ion plating method or the like is generally about 200 to 1000 °.
【0064】超音波処理の後、サーモトロピック液晶樹
脂成形品を従来公知のプラスチック用塗料を塗布するな
らば、塗料の接着強度が向上する。サーモトロピック液
晶樹脂成形品を塗装するための塗料は特に限定されず、
通常プラスチック用として市販されている任意の塗料が
使用できる。例えば、エポキシ系、アクリル系、メラミ
ン系、アルキド系、ウレタン系溶剤型塗料等の各種塗料
を挙げることができる。これら塗料の塗布方法も、従来
公知の塗布方法によることができ、例えば超音波処理し
たサーモトロピック液晶樹脂成形品に対し、適宜に脱脂
洗浄した後スプレー塗工、刷毛塗り等の一般的な方法で
塗布される。塗料の膜厚は乾燥膜厚として一般的には、
0.1〜100μmの範囲である。After the ultrasonic treatment, if a conventionally known plastic coating material is applied to the thermotropic liquid crystal resin molded product, the adhesive strength of the coating material is improved. The paint for painting the thermotropic liquid crystal resin molded product is not particularly limited,
Any paint commercially available for plastics can be used. For example, various paints such as epoxy-based, acrylic-based, melamine-based, alkyd-based, and urethane-based solvent-based paints can be used. The coating method of these paints can also be a conventionally known coating method.For example, after ultrasonically treated thermotropic liquid crystal resin molded article, after appropriate degreasing and washing, spray coating, brush coating and the like are used in general methods. Applied. In general, the paint film thickness is a dry film thickness,
It is in the range of 0.1 to 100 μm.
【0065】また、超音波処理した面を接着剤を介して
接着すると、接着強度が向上する。この接着剤は特に限
定されず、プラスチック接着用として通常市販されてい
る接着剤のいずれも使用できる。例えば、アクリル系、
シアノアクリレート系、メラミン系、ウレタン系または
フェノール系の溶剤型または反応型接着剤等の各種接着
剤を挙げることができる。前処理したサーモトロピック
液晶樹脂成形品に対し、従来公知の方法であるスプレ
ー、ロールコーター、浸漬等の一般的な方法で塗布、接
着される。接着される相手材は、合成樹脂、金属等適宜
に任意のものが選択される。該接着剤の厚さは、一般に
は0.5〜1000μmである。When the ultrasonically treated surface is bonded via an adhesive, the bonding strength is improved. This adhesive is not particularly limited, and any of the adhesives that are generally commercially available for bonding plastics can be used. For example, acrylic,
Various adhesives such as cyanoacrylate-based, melamine-based, urethane-based or phenol-based solvent-based or reactive adhesives can be used. The pretreated thermotropic liquid crystal resin molded article is applied and adhered by a conventionally known method such as spraying, a roll coater, or dipping. As the mating material to be bonded, an arbitrary material such as a synthetic resin or a metal is appropriately selected. The thickness of the adhesive is generally 0.5 to 1000 μm.
【0066】また、予め超音波処理したサーモトロピッ
ク液晶樹脂成形品、例えばフィルムまたはシートに、溶
融した熱可塑性樹脂を圧着し、その後冷却することによ
ってもサーモトロピック液晶樹脂成形品に接合すること
もできる。かかる熱可塑性樹脂としては、特に限定され
ず、例えば、ポリエチレンテレフタレート、ポリブチレ
ンテレフタレート、ポリエチレンナフタレート等のポリ
エステル系樹脂またはエラストマー、脂肪族ナイロン、
芳香族ナイロン等のポリアミド系樹脂またはエラストマ
ー等の前記サーモトロピック液晶樹脂へのブレンドもし
くはアロイ用として例示した合成樹脂が使用できる。溶
融圧着する方法としては、予め超音波処理したサーモト
ロピック液晶樹脂成形品、例えばフィルムまたはシート
上に、溶融させた熱可塑性樹脂をTダイから押し出して
圧着する方法、あるいは熱プレスにより圧着する方法等
が採用できる。このようにすることにより熱可塑性樹脂
が積層されたラミネートが得られる。本発明のごとく予
め超音波処理をすることにより、接着強度が向上する。Alternatively, the thermoplastic resin can be joined to the thermotropic liquid crystal resin molded article by pressing a molten thermoplastic resin onto a thermotropic liquid crystal resin molded article, for example, a film or sheet, which has been subjected to ultrasonic treatment in advance, and then cooling. . Such a thermoplastic resin is not particularly limited, for example, polyethylene terephthalate, polybutylene terephthalate, polyester-based resin or elastomer such as polyethylene naphthalate, aliphatic nylon,
Synthetic resins exemplified for blending or alloying with the above-mentioned thermotropic liquid crystal resin such as polyamide resin such as aromatic nylon or elastomer or the like can be used. As a method of melt-compression bonding, a method of extruding a molten thermoplastic resin from a T-die onto a thermotropic liquid crystal resin molded product, for example, a film or a sheet, which has been subjected to ultrasonic treatment in advance, and a method of pressing with a hot press, or the like Can be adopted. By doing so, a laminate in which the thermoplastic resin is laminated is obtained. By performing the ultrasonic treatment in advance as in the present invention, the adhesive strength is improved.
【0067】溶融圧着する熱可塑性樹脂の厚さは、特に
限定されないが通常は0.1μm〜5mmの範囲であ
る。The thickness of the thermoplastic resin to be melt-pressed is not particularly limited, but is usually in the range of 0.1 μm to 5 mm.
【0068】[0068]
【実施例】以下、実施例により本発明を更に詳しく説明
する。The present invention will be described in more detail with reference to the following examples.
【0069】[使用したサーモトロピック液晶樹脂]L
CP−1:pーヒドロキシ安息香酸/テレフタル酸/ビ
フェノール/イソフタル酸からそれぞれ誘導される繰り
返し構成単位を有するサーモトロピック液晶ポリエステ
ル樹脂を調製した(ホットステージを装着した偏光顕微
鏡を用いて光学的異方性を観察したところ340℃以上
で溶融状態で光学的異方性を示した。)。[Thermotropic Liquid Crystal Resin Used] L
CP-1: A thermotropic liquid crystal polyester resin having a repeating structural unit derived from p-hydroxybenzoic acid / terephthalic acid / biphenol / isophthalic acid was prepared (optical anisotropy using a polarizing microscope equipped with a hot stage). Was observed, and showed an optical anisotropy in a molten state at 340 ° C. or higher.)
【0070】これに対し50重量%の粒状炭酸カルシウ
ム(平均粒径5μm)を配合し2軸押出機を用いて混
練、造粒した。On the other hand, 50% by weight of granular calcium carbonate (average particle size: 5 μm) was blended, kneaded and granulated using a twin screw extruder.
【0071】LCP−2:上記のサーモトロピック液晶
ポリエステル樹脂に対し40重量%のクレー(平均粒径
3μm)を配合し2軸押出機を用いて混練、造粒した。LCP-2: 40% by weight of clay (average particle size: 3 μm) was blended with the above-mentioned thermotropic liquid crystal polyester resin, and kneaded and granulated using a twin screw extruder.
【0072】[成形品の作成]上記混練、造粒した樹脂
について、射出成形機(東芝機械製ISー80)を用い
厚さが1.6mm、一辺が100mmの角板を成形し
た。[Preparation of Molded Article] The above kneaded and granulated resin was molded into a square plate having a thickness of 1.6 mm and a side of 100 mm using an injection molding machine (IS-80 manufactured by Toshiba Machine Co., Ltd.).
【0073】[超音波処理]超音波処理装置として井内
盛栄堂社製VS−150を使用。処理条件、処理液等は
後記実施例中に記載した。[Ultrasonic treatment] As an ultrasonic treatment device, VS-150 manufactured by Iuchi Seieido Co., Ltd. was used. The processing conditions, the processing solution, and the like are described in Examples below.
【0074】[金属メッキ]前処理を行ったあるいは脱
脂処理のみ行った角板の成形品について、次の工程によ
り厚さ1μmの化学銅メッキを施した。[Metal Plating] The preform-treated or degreasing-treated square plate was subjected to chemical copper plating with a thickness of 1 μm by the following process.
【0075】コンデイショニング:コンデイライザー
SP(150ml/l、40℃、4min) 触媒:キャタリストC(40ml/l、23℃、4m
in) 活性化:硫酸(100ml/l40℃、4min) 化学銅メッキ:OPC−カッパーHConditioning: Condilizer SP (150 ml / l, 40 ° C., 4 min) Catalyst: Catalyst C (40 ml / l, 23 ° C., 4 m)
in) Activation: sulfuric acid (100 ml / 140 ° C., 4 min) Chemical copper plating: OPC-Kappa H
【0076】なお、上記コンデイライザーSP、キャタ
リストC、OPC−カッパーHはいずれも奥野製薬工業
社製である。The condilizer SP, catalyst C and OPC-copper H are all manufactured by Okuno Pharmaceutical Company.
【0077】[スパッタリング膜の形成]JEOL社製
スパッタリング装置(JFC1500)を用い金の薄膜
を角板の成形体に形成した(アルゴンガス圧1×10-3
Torr)。膜厚は同装置に付属した制御システムによ
り設定した。[Formation of Sputtering Film] A thin gold film was formed on a square plate using a sputtering device (JFC1500) manufactured by JEOL (argon gas pressure 1 × 10 −3).
Torr). The film thickness was set by a control system attached to the apparatus.
【0078】[塗料の塗装]前処理を行ったあるいは脱
脂処理のみを行った角板の成形品について、神東塗料社
製アクリルラッカーを吹き付け、厚さ約10μmの塗膜
を形成した。[Coating of Paint] An acrylic lacquer manufactured by Shinto Paint Co., Ltd. was sprayed on the molded product of the square plate which had been subjected to the pretreatment or subjected to only the degreasing treatment to form a coating film having a thickness of about 10 μm.
【0079】[接着剤塗布]角板の成形体を10mm幅
に切断し、この試験片に常温硬化型エポキシ系接着剤を
10mm長さ塗布し、これにもう一枚の試験片を接着剤
を塗布した部分で重ね合わせ1昼夜放置した。[Applying Adhesive] A rectangular plate was cut to a width of 10 mm, a room-temperature-curable epoxy-based adhesive was applied to the test piece for a length of 10 mm, and another test piece was coated with the adhesive. The coated portions were overlapped and left for one day.
【0080】[密着度の測定]金属メッキした試料およ
び塗料を塗布した試料については、JIS K5400
−1990の碁盤目テープ法に準じて密着度の測定を行
った。これは1mm間隔で縦横11本の切れ目をナイフ
により付け(100個の升目ができる)、この部分にセ
ロファンテープを貼付け高速度でこれを引き剥す。残さ
れた膜の状態を同JISの表8の評価基準で点数を付け
密着度とした。すなわち、数字の大なる方が密着強度が
大であることを示す。[Measurement of Adhesion Degree] Regarding the sample plated with metal and the sample coated with paint, JIS K5400
The adhesion was measured according to the 1990 cross cut tape method. For this, eleven vertical and horizontal cuts are made with a knife at intervals of 1 mm (100 squares are formed), and a cellophane tape is attached to this portion and peeled off at a high speed. The state of the remaining film was scored based on the evaluation criteria shown in Table 8 of the same JIS, and used as the degree of adhesion. That is, a larger number indicates a higher adhesion strength.
【0081】接着剤の場合は、上記のように接着した試
験体を引張試験機により50mm/minの速度で引張
力を加え、破断した時の荷重をもって密着度とした。In the case of an adhesive, the test piece bonded as described above was subjected to a tensile force at a speed of 50 mm / min by a tensile tester, and the load at the time of breaking was taken as the degree of adhesion.
【0082】[表面平滑性の評価]金属メッキした試験
体について、スガ試験機社性光沢度計を用い、JISZ
8741に準拠して光沢度(60゜/60゜)を測定
し表面平滑性の尺度とした。[Evaluation of Surface Smoothness] The metal-plated test piece was measured using a JISZ Glossmeter manufactured by Suga Test Instruments Co., Ltd.
Gloss (60 ° / 60 °) was measured according to 8741 and used as a measure of surface smoothness.
【0083】実施例1 LCP−1により成形した角板をエースクリーンA−2
20(奥野製薬工業社製)を用い脱脂処理した後、30
0g/l濃度のKOH水溶液中、50℃で10分間超音
波処理した。これに上記の方法で化学銅メッキを施し
た。このものの密着度は10であり、光沢度は120%
であった。 Example 1 A square plate formed by LCP-1 was applied to A-screen A-2.
After degreasing using 20 (manufactured by Okuno Pharmaceutical), 30
Ultrasonic treatment was carried out at 50 ° C. for 10 minutes in an aqueous KOH solution having a concentration of 0 g / l. This was subjected to chemical copper plating by the above method. This product has an adhesion of 10 and a gloss of 120%.
Met.
【0084】比較例1 KOH水溶液中での超音波処理を省略した他は実施例1
と同様の操作を行った。このものの密着度は0であっ
た。 Comparative Example 1 Example 1 was repeated except that the ultrasonic treatment in the KOH aqueous solution was omitted.
The same operation as described above was performed. The degree of adhesion of this product was 0.
【0085】比較例2 超音波処理条件を50℃、1分間とした以外は実施例1
と同様の操作を行った。このものの密着度は0であっ
た。 Comparative Example 2 Example 1 was repeated except that the ultrasonic treatment was performed at 50 ° C. for 1 minute.
The same operation as described above was performed. The degree of adhesion of this product was 0.
【0086】比較例3 LCP−1により成形した角板を使用し、エースクリー
ンA−220で脱脂処理した後、前記“日本接着学会
誌、Vol.26、No2、p.21”に記載の方法に
準じて化学銅メッキした。すなわちエッチング液として
濃度750g/lのKOH水溶液を用い、70℃で25
分間浸漬しエッチングした。その後は実施例1のコンデ
イショニング以下の工程により化学銅メッキを施した。
このものの密着度は10であったが、光沢度は3%であ
った。 Comparative Example 3 A square plate formed by LCP-1 was used and degreased by A-screen A-220, followed by the method described in the aforementioned “Journal of the Adhesion Society of Japan, Vol. 26, No. 2, p. 21”. Chemical copper plating according to That is, a KOH aqueous solution having a concentration of 750 g / l is used as an etching solution,
It was immersed for minutes and etched. Thereafter, chemical copper plating was performed by the steps following the conditioning of Example 1.
The adhesion was 10 but the gloss was 3%.
【0087】比較例4 300g/l濃度のKOH水溶液中、50℃で10分間
浸漬(超音波は印加せず)した以外は実施例1と同様の
方法で化学銅メッキした。このものの密着度は0であっ
た。 Comparative Example 4 Chemical copper plating was carried out in the same manner as in Example 1 except that it was immersed in a 300 g / l KOH aqueous solution at 50 ° C. for 10 minutes (no ultrasonic wave was applied). The degree of adhesion of this product was 0.
【0088】実施例2 LCPー1に替えてLCP−2を使用した以外は実施例
1と同様の方法で実施した。このものの密着度は10で
あり、光沢度は128%であった。 Example 2 An experiment was carried out in the same manner as in Example 1 except that LCP-2 was used instead of LCP-1. This had an adhesion of 10 and a gloss of 128%.
【0089】実施例3 実施例1と同様の方法で超音波処理を行い、その後これ
にコーテイング膜厚500オングストロームの金のスパ
ッタリング膜を生成させた。このものの密着度は10で
あり、光沢度は95%であった。 Example 3 Ultrasonic treatment was performed in the same manner as in Example 1, and thereafter, a gold sputtering film having a coating film thickness of 500 Å was formed thereon. This had an adhesion of 10 and a gloss of 95%.
【0090】比較例5 KOH中での超音波処理を省略した以外は実施例3と同
様の方法でスパッタリング膜を生成した。このものの密
着度は0であった。 Comparative Example 5 A sputtering film was formed in the same manner as in Example 3 except that the ultrasonic treatment in KOH was omitted. The degree of adhesion of this product was 0.
【0091】実施例4 実施例1と同様の方法で超音波処理を行い、これに前記
の方法で塗膜を形成した。このものの密着度は10であ
り、光沢度は85%であった。 Example 4 Ultrasonic treatment was performed in the same manner as in Example 1, and a coating film was formed thereon by the above-described method. This had an adhesion of 10 and a gloss of 85%.
【0092】比較例6 KOH中での超音波処理を省略した以外は実施例4と同
様ので塗膜を形成した。このものの密着度は0であっ
た。 Comparative Example 6 A coating film was formed in the same manner as in Example 4 except that the ultrasonic treatment in KOH was omitted. The degree of adhesion of this product was 0.
【0093】比較例7 比較例4と同様の方法でエッチング処理を施し、これに
実施例4と同様の方法で塗膜を形成した。このものの密
着度は8であり、光沢度は48%であった。 Comparative Example 7 An etching treatment was performed in the same manner as in Comparative Example 4, and a coating film was formed thereon in the same manner as in Example 4. This had an adhesion of 8 and a gloss of 48%.
【0094】実施例7 LCP−1により成形した角板をエースクリーンA−2
20を用い脱脂処理した後、300g/l濃度のKOH
水溶液中、50℃で5分間浸漬した。これを水洗した後
100ml/lの硫酸中、40℃で5分間超音波処理し
た後に実施例1と同様の方法で化学銅メッキした。この
ものの密着度は10であり、光沢度は130%であっ
た。 Example 7 A square plate molded by LCP-1 was used as an A-screen A-2.
After degreasing treatment using KOH 20, KOH at a concentration of 300 g / l
It was immersed in an aqueous solution at 50 ° C. for 5 minutes. This was washed with water, sonicated in 100 ml / l sulfuric acid at 40 ° C. for 5 minutes, and then subjected to chemical copper plating in the same manner as in Example 1. The adhesion was 10 and the gloss was 130%.
【0095】比較例8 実施例7においてKOH水溶液浸漬後、超音波処理せず
化学銅メッキした。このものの密着度は0であった。 Comparative Example 8 In Example 7, after immersion in a KOH aqueous solution, chemical copper plating was performed without ultrasonic treatment. The degree of adhesion of this product was 0.
【0096】実施例8 実施例1と同様の超音波処理を行った後、上記の方法に
よる接着に供した。この剪断剥離強度をインストロン万
能引張試験機で測定したところ 38kg/cm2であ
った。 Example 8 The same ultrasonic treatment as in Example 1 was performed, and then subjected to the above-mentioned bonding. The shear peel strength was 38 kg / cm 2 as measured by an Instron universal tensile tester.
【0097】比較例9 超音波処理のみ省略し実施例8同様の方法で接着した。
剪断剥離強度は9kg/cm2 であった。 Comparative Example 9 Bonding was performed in the same manner as in Example 8 except that only the ultrasonic treatment was omitted.
The shear peel strength was 9 kg / cm 2 .
【0098】[0098]
【発明の効果】本発明は、サーモトロピック液晶樹脂成
形品表面に金属被膜を形成する、他の合成樹脂をラミネ
ートする、塗料を塗布する、接着剤で接合する等の手段
により接合構造を形成するに際し、予め超音波処理をし
たサーモトロピック液晶樹脂を使用するものであって、
かくすることにより接合される他の材料との密着力が実
用上十分なまでに向上する。しかも、この超音波処理に
よるならば安全な薬剤を使用し、しかも比較的温和な条
件で処理が可能となる。According to the present invention, a joint structure is formed by means such as forming a metal film on the surface of a thermotropic liquid crystal resin molded product, laminating another synthetic resin, applying a paint, or joining with an adhesive. At the time, using a thermotropic liquid crystal resin that has been subjected to ultrasonic treatment in advance,
By doing so, the adhesion to other materials to be joined is improved to a practically sufficient level. In addition, this ultrasonic treatment makes it possible to use a safe drug and to perform the treatment under relatively mild conditions.
【0099】サーモトロピック液晶樹脂は機械的強度、
耐熱性、寸法精度、電気特性、難燃性、成形加工性等に
優れており、これを使用した成形品は工業的に有用であ
るが、外観的美麗さに欠ける、表面が傷付易い、接着性
が悪い、電気導電性が低いという性質がある。そこで、
本発明における前処理を施した後、金属膜、塗膜、接着
剤等を施し、これ等の問題を解決することによりサーモ
トロピック液晶樹脂成形品の付加価値が高まり、新たな
用途展開が可能となる。Thermotropic liquid crystal resin has mechanical strength,
It is excellent in heat resistance, dimensional accuracy, electrical properties, flame retardancy, moldability, etc., and molded products using it are industrially useful, but lack in aesthetic beauty, the surface is easily scratched, It has the properties of poor adhesion and low electrical conductivity. Therefore,
After applying the pretreatment in the present invention, a metal film, a coating film, an adhesive, etc. are applied, and by solving these problems, the added value of the thermotropic liquid crystal resin molded product is increased, and new applications can be developed. Become.
【0100】例えば、クロム、ニッケル、銅、金等の金
属被膜を施した成形品は、自動車部品、電気・電子部
品、機械部品等に用いられる。特に電子回路基板のメッ
キに用いると、成形品の表面の平滑性が従来の方法に比
較し大幅に向上するため、よりファインなパターン形成
ができる。塗膜を施したものは、上記の用途の他にオー
ブンクック容器等の食器類にも用途が開ける。またサー
モトロピック液晶樹脂成形品同志や他の物質との良好な
接着が可能となり、複雑な製品の組立に威力を発揮す
る。For example, molded articles provided with a metal coating such as chromium, nickel, copper, and gold are used for automobile parts, electric / electronic parts, mechanical parts, and the like. In particular, when used for plating an electronic circuit board, the smoothness of the surface of the molded product is greatly improved as compared with the conventional method, so that a finer pattern can be formed. The coated product can be used for tableware such as oven cook containers in addition to the above-mentioned applications. In addition, good adhesion between thermotropic liquid crystal resin molded products and other substances is possible, and it is effective in assembling complicated products.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平4−33838(JP,A) 特開 平2−253949(JP,A) 特開 平4−283245(JP,A) 特開 平3−146544(JP,A) (58)調査した分野(Int.Cl.7,DB名) B32B 1/00 - 35/00 B29C 65/00 - 65/82 C08J 5/12 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-33838 (JP, A) JP-A-2-253949 (JP, A) JP-A-4-283245 (JP, A) JP-A-3-283 146544 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B32B 1/00-35/00 B29C 65/00-65/82 C08J 5/12
Claims (10)
に浸漬され、かつ、下記4条件の少なくとも2以上を充
足する条件で超音波洗浄された臭素化合物を含有しない
全芳香族液晶ポリエステル樹脂からなる成形品表面であ
り、他方が金属、合成樹脂、塗料および接着剤より選ば
れるいずれかであることを特徴とする接合構造。(A)表面処理液の温度が40℃から沸点の範囲、 (B)印加する超音波の周波数が20KHz〜10MH
zの範囲、 (C)超音波の強度が0.1W/cm 2 〜100W/c
m 2 の範囲、および (D)超音波の印加時間が2分以上。 Claims: 1. A surface treatment liquid in which one of surfaces constituting a joint is a surface treatment liquid
And satisfies at least two of the following four conditions.
The surface of the molded article der consisting wholly aromatic liquid crystal polyester resin containing no ultrasonic washed bromine compound under conditions in which the foot
The other is selected from metals, synthetic resins, paints and adhesives
Junction structure, characterized in that it is either to be. (A) the temperature of the surface treatment solution is in the range of 40 ° C. to the boiling point, and (B) the frequency of the applied ultrasonic wave is 20 KHz to 10 MH.
z: (C) The intensity of the ultrasonic wave is 0.1 W / cm 2 to 100 W / c
m 2 , and (D) ultrasonic application time is 2 minutes or more.
に浸漬され、かつ、下記3条件の少なくとも2以上を充
足する条件で2分以上超音波洗浄された臭素化合物を含
有しない全芳香族液晶ポリエステル樹脂からなる成形品
表面であり、他方が金属、合成樹脂、塗料および接着剤
より選ばれるいずれかであることを特徴とする接合構
造。(A)表面処理液の温度が40℃から沸点の範囲、 (B)印加する超音波の周波数が20KHz〜10MH
zの範囲、および (C)超音波の強度が0.1W/cm 2 〜100W/c
m 2 の範囲。 2. One of the surfaces constituting the bonding is a surface treatment liquid.
And satisfies at least two of the following three conditions.
The surface of a molded article made of a wholly aromatic liquid crystal polyester resin containing no bromine compound which has been subjected to ultrasonic cleaning for at least 2 minutes under the conditions to be added , and the other is metal, synthetic resin, paint and adhesive.
A joining structure characterized by being one selected from the following . (A) the temperature of the surface treatment liquid is in the range of 40 ° C. to the boiling point; (B) the frequency of the applied ultrasonic wave is 20 KHz to 10 MH
z, and (C) the intensity of the ultrasonic wave is 0.1 W / cm 2 to 100 W / c.
range of m 2.
−ヒドロキシ安息香酸及び(a)フタル酸、(b)ビフ
ェノール及び(c)ヒドロキシナフトエ酸から選ばれる
少なくとも1種の化合物から誘導される繰り返し単位構
造とする液晶ポリエステル樹脂からなることを特徴とす
る請求項1または2に記載の接合構造。3. The method according to claim 1, wherein the wholly aromatic liquid crystal polyester resin is p
A liquid crystal polyester resin having a repeating unit structure derived from at least one compound selected from hydroxybenzoic acid and (a) phthalic acid, (b) biphenol and (c) hydroxynaphthoic acid. Item 3. The bonding structure according to Item 1 or 2 .
填剤を含むものである請求項1ないし3のいずれか1項
に記載の接合構造。4. The bonding structure according to claim 1, wherein the wholly aromatic liquid crystal polyester resin contains a filler.
リエステル樹脂成形品を表面処理液に浸漬し、かつ、下
記4条件の少なくとも2以上を充足する条件で超音波洗
浄した後、当該被処理面と金属、合成樹脂、塗料および
接着剤より選ばれるいずれかと接合することを特徴とす
る全芳香族液晶ポリエステル液晶樹脂の接合方法。(A)表面処理液の温度が40℃から沸点の範囲、 (B)印加する超音波の周波数が20KHz〜10MH
zの範囲、 (C)超音波の強度が0.1W/cm 2 〜100W/c
m 2 の範囲、および(D)超音波の印加時間が2分以
上。 5. A wholly aromatic liquid crystal polyester resin molded article containing no bromine compound is immersed in a surface treatment liquid, and
Ultrasonic washing under conditions that satisfy at least 2 of the above 4 conditions
After cleaning, the surface to be treated and metal, synthetic resin, paint and
A method of bonding a wholly aromatic liquid crystal polyester liquid crystal resin, which is bonded to any one selected from adhesives . (A) the temperature of the surface treatment solution is in the range of 40 ° C. to the boiling point, and (B) the frequency of the applied ultrasonic wave is 20 KHz to 10 MH.
z: (C) The intensity of the ultrasonic wave is 0.1 W / cm 2 to 100 W / c
m 2 range, and (D) ultrasonic application time is 2 minutes or more
Up.
リエステル樹脂を表面処理液に浸漬し、かつ、下記3条
件の少なくとも2以上を充足する条件で2分以上超音波
洗浄した後、当該被処理面と金属、合成樹脂、塗料およ
び接着剤より選ばれるいずれかと接合することを特徴と
する全芳香族液晶ポリエステル液晶樹脂の接合方法。(A)表面処理液の温度が40℃から沸点の範囲、 (B)印加する超音波の周波数が20KHz〜10MH
zの範囲、および (C)超音波の強度が0.1W/cm 2 〜100W/c
m 2 の範囲。 6. A wholly aromatic liquid crystal polyester resin containing no bromine compound is immersed in a surface treatment solution, and
Ultrasound for at least 2 minutes under conditions that satisfy at least 2
After cleaning, the surface to be treated and metal, synthetic resin, paint and
And a bonding method for a wholly aromatic liquid crystal polyester liquid crystal resin. (A) the temperature of the surface treatment solution is in the range of 40 ° C. to the boiling point, and (B) the frequency of the applied ultrasonic wave is 20 KHz to 10 MH.
z, and (C) the intensity of the ultrasonic wave is 0.1 W / cm 2 to 100 W / c.
range of m 2.
−ヒドロキシ安息香酸及び(a)フタル酸、(b)ビフ
ェノール及び(c)ヒドロキシナフトエ酸から選ばれる
少なくとも1種の化合物から誘導される繰り返し単位構
造とする液晶ポリエステル樹脂からなることを特徴とす
る請求項5または6に記載の全芳香族液晶ポリエステル
液晶樹脂の接合方法。7. The method according to claim 7, wherein the wholly aromatic liquid crystal polyester resin is p
A liquid crystal polyester resin having a repeating unit structure derived from at least one compound selected from hydroxybenzoic acid and (a) phthalic acid, (b) biphenol and (c) hydroxynaphthoic acid. Item 7. The method for bonding a wholly aromatic liquid crystal polyester liquid crystal resin according to item 5 or 6.
填剤を含むものである請求項5ないし7のいずれか1項
に記載の全芳香族液晶ポリエステル樹脂の接合方法。8. The method for bonding a wholly aromatic liquid crystal polyester resin according to claim 5, wherein the wholly aromatic liquid crystal polyester resin contains a filler.
を含むものである請求項5ないし8のいずれか1項に記
載の全芳香族液晶ポリエステル樹脂の接合方法。9. An alkaline aqueous solution as the surface treatment liquid
The method for bonding a wholly aromatic liquid crystal polyester resin according to any one of claims 5 to 8 , comprising:
り100g以上のアルカリ性化合物が溶解したアルカリ
性水溶液を含むものである請求項5ないし9のいずれか
1項に記載の全芳香族液晶ポリエステル樹脂の接合方
法。10. One liter of the surface treatment liquid was applied.
100 g or more alkali compound dissolved alkali
10. A liquid according to any one of claims 5 to 9, which comprises a neutral aqueous solution .
2. The method for bonding a wholly aromatic liquid crystal polyester resin according to claim 1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16731193A JP3305433B2 (en) | 1993-06-15 | 1993-06-15 | Thermotropic liquid crystal resin bonding structure and bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16731193A JP3305433B2 (en) | 1993-06-15 | 1993-06-15 | Thermotropic liquid crystal resin bonding structure and bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH071670A JPH071670A (en) | 1995-01-06 |
| JP3305433B2 true JP3305433B2 (en) | 2002-07-22 |
Family
ID=15847402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16731193A Expired - Lifetime JP3305433B2 (en) | 1993-06-15 | 1993-06-15 | Thermotropic liquid crystal resin bonding structure and bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3305433B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003221456A (en) * | 2002-01-29 | 2003-08-05 | Japan Gore Tex Inc | High adhesion liquid crystal polymer film |
| JP6316733B2 (en) * | 2014-11-17 | 2018-04-25 | 上野製薬株式会社 | Laminate |
-
1993
- 1993-06-15 JP JP16731193A patent/JP3305433B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071670A (en) | 1995-01-06 |
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