JP3306236B2 - Liquid crystal display - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device,
In particular, the present invention relates to a liquid crystal display device that effectively utilizes a COG region.

[0002]

2. Description of the Related Art Recently, liquid crystal display devices are mounted on various devices because of their light weight. For example, it has already been applied to remote controls such as mobile phones, electronic organizers, video and television sets, pagers and pagers, and has recently been applied to rectangular flexible substrates as disclosed in JP-A-10328.

[0003] However, the flexible substrate has been formed in a rectangular shape by linear cutting like a glass substrate. Further, on the transparent first insulating substrate 1, for example, a plurality of scanning lines arranged in parallel and a signal orthogonal to the scanning lines and provided on the transparent second insulating substrate 2 in parallel are provided. Lines are provided, the first insulating substrate 1 and the second insulating substrate 2 are bonded together via a seal 3, liquid crystal is injected therein, and the injection port is closed. Also, both substrates 1 and 2
The first insulating substrate 1 is formed large in size, and the bare chip 4 is in contact with a wiring (not shown) provided in this area in a non-overlapping portion by face-down or wire bonding. The flexible cable 5 is in contact with the input / output wiring of the chip.

[0004]

In the above configuration, if both the substrates 1 and 2 are glass substrates, the periphery of the substrate is a straight line and has a square shape due to the cleavage nature of the glass itself. In addition, the transition from the glass substrate to the flexible substrate resulted in a rectangular shape of the flexible substrate due to workability.
Therefore, the non-overlapping portion also has a rectangular shape, and this area cannot be effectively used.

On the other hand, a glass substrate is different from a resin substrate,
Since it has a certain degree of strength, the warpage of the substrate was not considered, but when a flexible resin substrate was used as in the present invention, the warpage of the substrate was likely to occur. As described above, if the chip 4 is fixed in a state where the size of the substrate is different and heat treatment is performed after bonding, warpage occurs due to a difference in thermal expansion coefficient.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. First, at least one side of the first insulating substrate has a non-linear shape, and a concave formed by the non-linear shape. At least a part of a semiconductor element for driving an electrode is arranged on a second insulating substrate corresponding to the above, and the display area is provided between the recesses where the semiconductor element is arranged.

Second, a semiconductor element for driving an electrode is arranged on the first insulating substrate, and a flow stopper made of the same material as a seal is provided so as to surround the semiconductor element, and opposes a region where the semiconductor element is arranged. This problem can be solved by providing a hole in the second insulating substrate and providing a protective resin for the semiconductor element in the hole. Third, the problem can be solved by providing an opening which is connected to an external atmosphere in a part of the flow stopper surrounding the semiconductor element.

Fourthly, at least one side of the seal provided on the first insulating substrate has a non-linear shape, and an electrode is provided on the first insulating substrate corresponding to the recess formed by the non-linear shape. At least a part of the semiconductor element that drives the semiconductor element is disposed between the recesses where the semiconductor element is disposed, and the second insulating substrate facing the arrangement area of the semiconductor element is disposed on the second insulating substrate. The problem can be solved by providing a large hole and providing a protective resin for the semiconductor element in the hole.

Fifth, the problem is solved by providing an active element, a wiring, or the like by a semiconductor technology in a region surrounded by the seal instead of the semiconductor chip. Sixth, similarly to the fifth aspect, the problem is solved by forming a sealed space with both substrates and a seal, and forming an active element formed directly by a chip or a semiconductor technology here.

[0010]

Since the flexible substrate is made of a thin resin, as shown in FIG. 1, in a region not overlapping with the lower substrate,
The side of the upper substrate facing the lower side of the lower substrate can be processed in a non-linear manner. In other words, if a concave is provided on the side by making it non-linear (curved, etc.), the semiconductor chip can be fixed in the meantime, while the liquid crystal injection region is enlarged as a display region between the fixed parts of the semiconductor element. it can. Therefore, this display area can be used as a display area for a tool box or the like on a display screen of a computer, for example.

Second, a hole is provided only in a portion corresponding to the chip fixing region of the lower layer substrate, and the sizes of both substrates are substantially equal (although the area decreases only in the fixing portion of the hole and the cable).
By doing so, the warpage of the substrate is suppressed even when heat treatment is applied. In addition, when the periphery of the semiconductor fixing region is surrounded by the sealing material, the resin does not flow during the resin potting of the semiconductor element, and good contact with the cable or the like can be achieved.

Third, if a port is provided in a part of the flow stopper to connect to the external atmosphere, the gas in the region surrounded by the seal does not expand and burst. Fourth, by achieving the first to third configurations at once, it is possible to realize a hybrid integrated circuit device having no warpage and capable of effectively utilizing a substrate. Fifth, if an active element, wiring, or the like is provided by a semiconductor technology in a region surrounded by the seal instead of the semiconductor chip, a sealing space is formed by the two substrates 10 and 11 and the seal. Can be isolated from the atmosphere.

Sixth, in the fifth configuration, complete sealing can be achieved without providing a hole.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. First, there is a transparent and flexible first insulating substrate 10 (substrate in the lower layer).
Transparent and flexible second insulating substrate 11
(Upper-layer substrate) are arranged to face each other. For example, in the case of a simple matrix liquid crystal display device, the first insulating substrate 10
Is provided with a plurality of scanning lines arranged in parallel,
The insulating substrate 11 is provided with a signal line orthogonal to the scanning line. In the case of an active matrix liquid crystal display device, a plurality of data lines and address lines are respectively arranged in parallel in a perpendicular arrangement on the first insulating substrate 10, and a switching element (for example, TFT) and a display electrode electrically connected thereto are provided. On the other hand, a counter electrode is provided on the entire surface of the second insulating substrate in order to set the voltage of the orientation of the liquid crystal between the display electrode and the second insulating substrate. Is provided.

The first insulating substrate 10 and the second insulating substrate 11 are opposed to each other and adhered by a seal 12 shown by a dotted line, and a liquid crystal is injected therein. The region where the first insulating substrate overlaps with the second insulating substrate 11 is
The non-overlapping region is a display region of the present liquid crystal display device, and the wiring extending from the display region to the chip 13 and the chip 1
3 is an area where wiring extending from 3 to the flexible cable 14 is arranged, and furthermore, the chip is, for example, an area where the chip is face-down and electrically connected.

Although it depends on the heat resistance of the substrate, instead of the semiconductor element 13, the active element and the wiring are formed directly by semiconductor technology. A feature of the present invention resides in that the side L of the second insulating substrate 11 has a non-linear shape. In other words, a glass substrate needs to be straight because of the cleavage properties of the glass itself. However, since the present invention is a thin resin-made flexible plate, it can be processed in any manner. Therefore, for example, when two chips 13 are provided,
Depressions 15 corresponding to this number are provided, and both sides of the depressions 15 can be effectively used as display areas. Also, by utilizing semiconductor technology, it is possible to directly
In the case of forming with D or the like, a display area other than a necessary circuit element arrangement area can be used.

The only difference between FIG. 1 and FIG. 2 is that the chip 13 is arranged at the center or on both sides.
In the case of (1), a total of three display areas are formed on both sides of the concave portion 15, but in the case of FIG. Therefore, the display area can be enlarged depending on the chip and the way of wiring. For example, a tool box can be arranged on a computer screen.

FIG. 6 shows an example in which the hybrid integrated circuit device (liquid crystal panel 20) shown in FIG. 5 is incorporated.
This is a case that covers this panel. Generally, when viewing the display device, the case is made of plastic and the display area is transparent. The band-like frame 22 hatched at a point is black in order to improve the recognizability. The width is on the order of a few millimeters to one centimeter. If the concave portion of the present invention is provided in this width, the chip can be shifted inward toward the display region by the amount of the concave portion, and the non-overlapping region can be enlarged or the region can be narrowed accordingly. Therefore, the flexibility of the wiring can be improved or the whole can be made compact.

Next, the embodiment shown in FIG. 3 will be described. In this configuration, both the first insulating substrate 10 and the second insulating substrate 11
Are also substantially the same size. A different part is that a hole 20 and a cutout 21 are provided in the upper substrate 11. The cutout 21 is an area for arranging the flexible cable 14, and the hole 20 is an area for arranging the chip 13, and is formed larger than the chip size. Although depending on the thickness of the substrate 11 of the liquid crystal display device, the distance between the substrates 10 and 11 and the thickness of the chip, the back surface of the chip is
More protruding or dented.

A feature of the present invention is that firstly, the opposing substrates 10 and 11 have substantially the same size. In order to have flexibility, it needs to be thin, whether it is a glass substrate or a resin, and if it is thin, it is deformed by a small external force. Therefore, only the hole 20 and the cut area 21 are provided, and the rest is exactly the same, since the body of the heat treatment always enters. In particular, if resin is used, drilling and the like are easy, so that it is easy to respond.

The second feature is that the area where the chips 13 are arranged is surrounded by the sealing material. FIG. 4 is a cross-sectional view of FIG. 3. When the bare chip is face-down, it is necessary to pot the resin 22 into a space formed by both substrates and the seal 12, thereby achieving one configuration of the sealing space and stopping the flow of the resin. ing. Here, if the substrate provided with the holes 20 and the cutout regions 21 in advance is bonded to the lower substrate 10 and then the resin 22 is potted, air may enter the sealing space, so that air can escape. Is prepared. Therefore, in the heat treatment step after the potting, the burst of the air that has entered can be prevented. Here, C
As described in the OG technique, an active element or a wiring may be directly formed by CVD which can be formed at a low temperature, and may be surrounded by a seal.

Further, in a region surrounded by a seal in advance, the substrate is formed by CVD or COG, and after forming the seal, a sealing resin is dropped, and a substrate of exactly the same size having no holes and cutout regions is attached. May be combined. As a result, both substrates function as a case like a hybrid integrated circuit device, and a good sealed space can be formed. Also, since the substrate size is the same, warpage can be eliminated.

[0023]

As is clear from the above description, first, by making the side L of the second insulating substrate non-linear, a region other than the region where the semiconductor element and the wiring are provided can be used as the display region. . Second, a seal space can be formed by surrounding the arrangement region of the semiconductor element with a seal, and a thick semiconductor chip or the like can be easily mounted by providing a hole.

Third, by providing an opening in a part of the seal space, it is possible to prevent air from entering during resin potting or the like. Fourth, by making the side M of the seal non-linear, the area other than the arrangement area of the semiconductor element can be effectively used as a display area, and the size of both substrates is substantially the same except for the hole and the cutout area. Warpage can be prevented.

Fifth, even if an active element or a wiring is formed by a CVD technique or the like which can be formed at a low temperature in the above-described configuration, a sealed space can be realized by the seal and the two substrates, and deterioration due to an external atmosphere can be prevented. . Sixth, since both substrates have exactly the same shape to prevent the panel from warping, and since a sealing space can be formed with the two substrates and a seal, a chip mounted therein or an IC circuit formed by CVD or the like can be externally mounted. It can be shielded from the atmosphere and can prevent deterioration.

[Brief description of the drawings]

FIG. 1 is a diagram of a first liquid crystal display device of the present invention.

FIG. 2 is a diagram of a second liquid crystal display device of the present invention.

FIG. 3 is a diagram of a third liquid crystal display device of the present invention.

FIG. 4 is a sectional view of FIG. 3;

FIG. 5 is a diagram illustrating a conventional liquid crystal display device.

FIG. 6 is a diagram illustrating a relationship between a liquid crystal display device and a case.

[Explanation of symbols]

 Reference Signs List 10 first insulating substrate 11 second insulating substrate 12 seal 13 chip 14 flexible cable 15 concave portion 20 hole 21 cutout area 23 port

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1333 500 G02F 1/1339 505 G02F 1/1345

Claims (5)

(57) [Claims] 1. A transparent and flexible first insulating substrate, a transparent and flexible second insulating substrate disposed to face the first insulating substrate,
In a liquid crystal display device having at least electrodes provided on the two substrates and liquid crystal injected between the two substrates, at least one side of the second insulating substrate has a non-linear shape, At least a part of a semiconductor element for driving the electrode is arranged on the first insulating substrate corresponding to the non-linear recess, and a display area is formed between the recesses where the semiconductor element is arranged. A liquid crystal display device characterized by the following. 2. A transparent and flexible first insulating substrate, a transparent and flexible second insulating substrate disposed opposite to the first insulating substrate,
In a liquid crystal display device having at least electrodes provided on the two substrates, a seal provided between the two substrates, and a liquid crystal injected between the two substrates, the first insulating substrate has A semiconductor element for driving an electrode is disposed, a flow stopper made of the same material as the seal is provided so as to surround the semiconductor element, and a hole is provided in the second insulating substrate facing a region where the semiconductor element is disposed. ,
A liquid crystal display device characterized in that a protective resin for the semiconductor element is provided in the hole. 3. The liquid crystal display device according to claim 2, wherein a part of the flow stopper surrounding the semiconductor element has an opening connected to an external atmosphere. 4. A transparent and flexible first insulating substrate, a transparent and flexible second insulating substrate disposed opposite to the first insulating substrate,
In a liquid crystal display device having at least electrodes provided on the two substrates, a seal provided between the two substrates, and a liquid crystal injected between the two substrates, the liquid crystal display device provided on the second insulating substrate At least one side of the provided seal has a non-linear shape, and at least a part of the semiconductor element for driving the electrode is arranged on the first insulating substrate corresponding to the recess formed by the non-linear shape, A display area is formed between the recesses in which the semiconductor elements are arranged, and a hole larger than the semiconductor element is provided in the second insulating substrate facing the arrangement area of the semiconductor element, and the semiconductor element is formed in the hole. A liquid crystal display device comprising a protective resin for an element. 5. The liquid crystal display device according to claim 2, wherein at least an active element and a wiring made of semiconductor technology are provided in a region surrounded by the seal.