JP3307281B2 - Semiconductor pressure sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diaphragm type semiconductor pressure sensor.

[0002]

2. Description of the Related Art FIG. 9 is a schematic configuration diagram of a conventional semiconductor pressure sensor. Reference numeral 1 denotes a pressure sensor chip, and a strain gauge resistor 3 whose resistance value changes in accordance with a change in pressure is formed on a thin diaphragm 2. The strain gauge resistor 3 is connected to an external terminal 5 by a wire 4.

A pedestal 6 made of glass or the like is joined to the pressure sensor chip 1 by anodic bonding or the like, and supports the pressure sensor chip 1. The pedestal 6 is provided with a through-hole 7 communicating with the diaphragm 2.

A package 8 houses the pressure sensor chip 1. The package 8 has an introduction hole 9 for introducing a measured pressure into the through hole 7.

In the semiconductor pressure sensor having the above configuration, the pressure to be measured is changed from the introduction hole 9 through the through hole 7 to the diaphragm 2.
Is applied to the diaphragm 2, the diaphragm 2 is distorted in accordance with the pressure to be measured, and the distortion is electrically detected by the strain gauge resistor 3 to measure the pressure to be measured.

[0006]

However, in the semiconductor pressure sensor having the above-described structure, when an external force or the like is applied to the package 8, the external force transmitted to the pressure sensor chip 1 through the pedestal 6 causes the diaphragm 2 to move. Is distorted,
There was a problem that accurate pressure measurement could not be performed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor pressure sensor capable of accurately measuring pressure even when an external force is applied to a package. It is to provide a sensor.

[0008]

According to the first aspect of the present invention,
A pressure sensor chip formed on a thin diaphragm having a strain gauge resistance whose resistance value changes in accordance with a pressure change, a pedestal having a through hole communicating with the diaphragm and supporting the pressure sensor chip; A package having an introduction hole for introducing a pressure to be measured into the hole and accommodating the pressure sensor chip to which the pedestal is adhered; and an external terminal electrically connected to the strain gauge resistor and drawn out of the package. In the semiconductor pressure sensor having the above structure, an external force interrupting portion for alleviating the propagation of external force is formed by hollowing a portion of the package where the pedestal is bonded.

According to a second aspect of the present invention, in the semiconductor pressure sensor according to the first aspect, the external force interrupting portion is a columnar hollow.
Department .

According to a third aspect of the present invention, in the semiconductor pressure sensor according to the first aspect, the external force interrupting portion is a spherical hollow.
Department .

According to a fourth aspect of the present invention, the pressure change
The resistance value of the strain gauge resistance changes with a thin diaphragm
A pressure sensor chip formed on a ram;
It has a through-hole leading to a flam and supports the pressure sensor chip.
Pedestal to be held and introduction for introducing a measured pressure into the through hole
The pressure sensor having a hole and the pedestal bonded thereto.
A package for storing the chip,
Electrically connected and pulled out of the package
A semiconductor pressure sensor having an external terminal;
Place the pedestal on the part of the package where the pedestal is bonded
Providing a bonding table for bonding, making the bonding table thinner
Thereby forming an external force blocking portion, and
A projection is formed at the tip of the base to support the side surface of the pedestal.
Those were Unishi.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter will be described with reference to the drawings Embodiments of the present invention. FIG. 1 is a schematic configuration diagram of a semiconductor pressure sensor according to a reference example of the present invention. Reference numeral 1 denotes a pressure sensor chip, and a strain gauge resistor 3 whose resistance value changes in accordance with a change in pressure is formed on a thin diaphragm 2. The strain gauge resistor 3 is connected to an external terminal 5 by a wire 4. The material of the external terminal 5 is copper, Kovar, stainless spring steel, 42 alloy, or the like, and it is desirable that the surface is plated with gold, silver, or the like from the viewpoint of moisture resistance and oxidation prevention.

Reference numeral 6 denotes a pedestal formed of glass or the like, which is joined to the pressure sensor chip 1 by anodic bonding or the like, and supports the pressure sensor chip 1. The pedestal 6 is provided with a through-hole 7 communicating with the diaphragm 2.

Reference numeral 8 denotes a package formed of plastic or the like, which houses the pressure sensor chip 1. Pedestal 6
Is a low-stress adhesive such as silicone resin or epoxy resin 10
To the package 8. The package 8 has an introduction hole 9 for introducing a measured pressure into the through hole 7.

Here, in this embodiment , the external force interrupting portion 12 is formed by providing a groove 11 near the pedestal 6 so as to surround the pedestal 6. Although the depth and width of the groove 11 are determined depending on the strength of the package 8, it is desirable that the depth and width be as deep and as wide as possible.

According to the present embodiment , since the groove 11 is provided so as to surround the pedestal 6, when an external force is applied to the package 8, the external force transmitted to the pressure sensor chip 1 via the pedestal 6 is applied to the groove. It concentrates on the thin external force interrupting portion 12 formed by 11. Therefore, the external force propagating to the pressure sensor chip 1 is reduced, and the pressure can be accurately measured even when the external force is applied to the package 8.

As shown in FIG. 2, a part of the groove 11 may be formed in the lower part of the pedestal 6. Thus, the bonding area between the pedestal 6 and the package 8 can be reduced, so that distortion generated between the pedestal 6 and the package 8 and increasing in proportion to the bonding area can be reduced.

FIG. 3 is a schematic configuration diagram of a semiconductor pressure sensor according to one embodiment of the present invention. In the present embodiment, instead of the groove 11 shown in FIG. 1, a columnar hollow portion (hereinafter referred to as a columnar hollow portion 13) is provided near a portion where the pedestal 6 is bonded to the package 8.
) Is provided to form the external force interrupting portion 12.

In this embodiment, the columnar hollow portion 13 is used.
Is formed in the same manner as the through-hole 7, and the columnar hollow portion 13 is formed.
Package 8 in a mold with pins inserted in the part
Is formed by pouring the member and pulling out the pin after the member is solidified.

According to this embodiment, when an external force is applied to the package 8, the pressure sensor chip 1
The external force propagating to the pressure sensor chip 1 can be reduced since the external force propagating to the pressure sensor chip 1 is concentrated on the thin external force blocking portion 12 formed by the columnar hollow portion 13. Further, the heat transmitted to the pressure sensor chip 1 via the package 8 can be reduced by the columnar hollow portion 13.

FIG. 4 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention. In the present embodiment, FIG.
Is replaced with a spherical hollow portion (hereinafter, spherical hollow portion 1) near the portion where the pedestal 6 is bonded to the package 8.
4), the external force interrupting portion 12 is formed.

In this embodiment, the spherical hollow portion 14 is used.
Is formed by entraining air when pouring the members of the package 8 into the mold, and by slightly reducing the pressure applied to the mold.

According to this embodiment, when an external force is applied to the package 8, the pressure sensor chip 1
Since the external force propagating to the pressure sensor chip 1 is concentrated on the external force blocking portion 12 formed by the spherical hollow portion 14, the external force propagating to the pressure sensor chip 1 can be reduced.

FIG. 5 is a schematic configuration diagram of a semiconductor pressure sensor according to another reference example of the present invention. In this reference example , instead of the groove 11 shown in FIG. 1, an outer wall near a portion where the pedestal 6 of the package 8 and the package 8 are bonded is dug (hereinafter, this portion is referred to as a dug portion 15). ) External force interrupter 1
2 are formed. Although the size of the dug portion 15 is determined depending on the strength of the package 8, it is desirable that the size be as large as possible.

According to this embodiment , when an external force is applied to the package 8, the external force propagating to the pressure sensor chip 1 via the pedestal 6 concentrates on the external force interrupting portion 12 formed by the dug portion 15. Therefore, the external force propagating to the pressure sensor chip 1 can be reduced.

FIG. 6 is a schematic configuration diagram of a semiconductor pressure sensor according to still another reference example of the present invention. In this reference example , FIG.
Instead of the groove 11 shown in FIG. 6, the pedestal 6 is bonded to the package 8, an adhesive pedestal 16 for supporting the pedestal 6 is provided, and the external force blocking portion 12 is formed by making the adhesive pedestal 16 thin. The external force blocking portion 12 provided on the bonding table 16 is determined depending on the strength of the bonding table 16, but it is preferable that the external force blocking section 12 be as thin as possible.

According to this embodiment , the pedestal 6 is attached to the package 8.
Is provided and the bonding table 16 is made thin.
When an external force is applied to the package 8, the external force propagating to the pressure sensor chip 1 via the pedestal 6 is reduced to a thin external force cutoff unit 1.
In addition, the concentration can be reduced by concentrating on the package 2, and since a thin portion for providing the external force blocking portion 12 is not formed on the outer wall of the package 8, the strength of the package 8 is not reduced.

FIG. 7 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention. In the present embodiment, FIG.
The external force blocking portion 12 is formed by thinning the portion of the bonding table 16 between the pedestal 6 and the bonding table 16 shown in FIG.
The vicinity of the through hole 7 of the pedestal 6 is supported by the bonding table 16.

In this embodiment, the pedestal 6 and the bonding table 1
In view of the fact that the bonding area with the base 6 becomes smaller, the bonding table 16
Is provided, and the pedestal 6 is fitted into the convex portion 17 to compensate for the shortage of adhesive strength between the pedestal 6 and the bonding table 16.

According to the present embodiment, when an external force is applied to the package 8, the bonding table 16 for bonding the pedestal 6 to the package 8 is provided, and the bonding table 16 is made thin.
The external force propagating to the pressure sensor chip 1 when an external force is applied to the package 8 can be reduced by the thin external force cutoff portion 12 without reducing the strength of the package 8, and the pedestal 6 and the bonding table can be reduced. By reducing the bonding area with the base 16, it is possible to reduce distortion generated between the pedestal 6 and the bonding base 16 and increasing in proportion to the bonding area.

As shown in FIG. 8, the pedestal 6 is
May be supported by the bonding table 16.
According to the present embodiment, it is possible to increase the stability when the pedestal 6 is supported by the bonding table 16.

[0032]

As described above, according to the first to third aspects of the present invention, there is provided a pressure sensor chip having a strain gauge resistor whose resistance value changes according to a pressure change formed on a thin diaphragm. A pedestal having a through hole communicating with the diaphragm and supporting the pressure sensor chip; a package having an introduction hole for introducing a measured pressure into the through hole and having the pedestal bonded to accommodate the pressure sensor chip; In a semiconductor pressure sensor having an external terminal which is electrically connected and pulled out of the package, an external force interrupting portion for alleviating the propagation of external force is formed by making the vicinity of the portion where the pedestal of the package is adhered hollow. When external force is applied to the package,
The external force can be concentrated on the external force blocking part formed by
Wear. Drunk, it was possible to provide a semiconductor pressure sensor capable of performing high accuracy pressure measurement when there is applied such a force to the package.

According to the fourth aspect of the present invention, the pressure change
The resistance value of the strain gauge changes according to
A pressure sensor chip formed on a diaphragm;
A pressure hole having a through hole communicating with the diaphragm;
The pressure to be measured is introduced into the pedestal supporting the
The pedestal is adhered and the pressure
A package for accommodating a force sensor chip,
Is electrically connected to the
Semiconductor pressure sensor having an external terminal
At the part of the package to which the pedestal is bonded.
A bonding table for bonding the pedestal is provided, and the bonding table is thinned.
By forming a flesh to form an external force blocking part,
At the tip of the bonding table, form a convex to support the side of the pedestal.
As a result, the external force blocking portion can be formed without reducing the strength of the package.

At this time, the portion of the bonding table to which the pedestal is bonded is made thin to form an external force blocking portion .
Then , by reducing the bonding area between the pedestal and the bonding table, it is possible to reduce distortion generated between the pedestal and the bonding table and increasing in proportion to the bonding area.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a semiconductor pressure sensor according to a reference example of the present invention.

FIG. 2 is a schematic configuration diagram of a semiconductor pressure sensor according to another reference example of the present invention.

FIG. 3 is a schematic configuration diagram of a semiconductor pressure sensor according to one embodiment of the present invention.

FIG. 4 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention.

FIG. 5 is a schematic configuration diagram of a semiconductor pressure sensor according to another reference example of the present invention.

FIG. 6 is a schematic configuration diagram of a semiconductor pressure sensor according to another reference example of the present invention.

FIG. 7 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention.

FIG. 8 is a schematic configuration diagram of a semiconductor pressure sensor according to another embodiment of the present invention.

FIG. 9 is a schematic configuration diagram of a conventional semiconductor pressure sensor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressure sensor chip 2 Diaphragm 3 Strain gauge resistance 4 Wire 5 External terminal 6 Pedestal 7 Through hole 8 Package 9 Introducing hole 10 Adhesive 11 Groove 12 External force cutoff part 13 Column hollow part 14 Spherical hollow part 15 Dig part 16 Bonding stand 17 Convex part

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01L 9/04 H01L 29/84

Claims (4)

(57) [Claims] 1. A pressure sensor chip formed by forming a strain gauge resistor whose resistance value changes according to a pressure change on a thin diaphragm, and a through hole communicating with the diaphragm to support the pressure sensor chip. A pedestal, a package having an introduction hole for introducing a pressure to be measured into the through-hole and having the pedestal adhered and accommodating the pressure sensor chip, and being electrically connected to the strain gauge resistor and pulled out of the package; A semiconductor pressure sensor having an external terminal, wherein an external force interrupting portion for alleviating the propagation of external force is formed by hollowing the vicinity of a portion of the package to which the pedestal is bonded. Semiconductor pressure sensor. 2. The semiconductor pressure sensor according to claim 1, wherein said external force interrupting portion is a hollow column . 3. The semiconductor pressure sensor according to claim 1, wherein said external force blocking portion is formed as a spherical hollow portion . 4. The resistance value changes according to the pressure change.
Formed by forming a strain gauge resistor on a thin diaphragm
A pressure sensor chip and a through hole communicating with the diaphragm
A base having the pressure sensor chip and supporting the pressure sensor chip;
It has an introduction hole for introducing the measured pressure
The base to which the pressure sensor chip is attached is
A cage, electrically connected to the strain gauge resistor,
Having external terminals drawn out of the package.
A semiconductor pressure sensor,
Bonding table for bonding the pedestal to a portion where the seat is bonded
Is provided, and the external force blocking portion is formed by making the bonding table thin.
And forming the pedestal at the tip of the bonding table.
Semiconductors pressure sensor you <br/> characterized in that so as to form a convex portion for supporting the side surface.