JP3311575B2 - Measuring probe - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring probe, and more particularly, to an apparatus for measuring the voltage of fine wiring on a semiconductor chip and an apparatus for measuring the surface shape of a semiconductor chip. It is about structure.

[0002]

2. Description of the Related Art In designing and manufacturing a semiconductor integrated circuit (hereinafter referred to as LSI) device, it is necessary to accurately measure a voltage inside a semiconductor chip for an operation analysis of a transistor circuit and the like. On the other hand, in recent years, the integration degree of an LSI device has been improved, and accordingly, the wiring width has been increasingly narrowed. As a device for measuring the voltage of fine wiring inside a chip, a device using an electron beam is known. However, due to the high integration of semiconductor circuits and the increase in the operating speed thereof, the measurement speed and measurement performance of the electron beam device are increased. Is becoming inadequate.

Therefore, while the development of an inspection technique and a voltage waveform observation technique capable of dealing with fine wiring is desired, the present inventors have developed a wiring search function using a conductive fine probe to which an atomic force microscope technique is applied. And a device equipped with a voltage measurement function using a light beam. FIG. 21A is a cross-sectional view of a measurement probe of a voltage measurement device according to a conventional example. The measurement probe is provided on an actuator of a voltage measurement device (not shown). The actuator moves the measurement probe in the vertical direction. In FIG. 21 (A), reference numeral 1 denotes a probe portion to be brought into contact with a measurement target. The probe portion 1 is formed by sharpening a hard metal such as tungsten. Reference numeral 2 denotes a light reflection film provided on the upper end of the probe unit 1. The light reflection film 2 reflects a laser beam for measuring a voltage of a measurement target. Reference numeral 3 denotes an electro-optic crystal provided on the reflection film. The electro-optic crystal 3 generates birefringence depending on the voltage of the object to be measured, and changes the polarization state of the laser light.

Reference numeral 4 denotes a transparent electrode provided on the electro-optic crystal 3. The transparent electrode 4 is connected to a ground line. Reference numeral 5 denotes an insulating light guide tube provided on the transparent electrode 4. Light guide tube 5
Is provided to guide the laser light to the electro-optic crystal.
Reference numeral 6 denotes a movable electrode joined to the axis of the probe portion, and reference numerals 7A and 7B denote opposing electrodes which together with the movable electrode 6 constitute a capacitive sensor.
8A and 8B are Y-shaped beams supporting the light guide tube.
The beams 8A and 8B are provided vertically above and below the capacitive sensor, and allow the light guide tube 5 to freely move in the vertical direction. FIG. 21B shows a Y-shaped beam portion viewed from above. 9
Is an insulating frame supporting the counter electrodes 7A and 7B and the beams 8A and 8B.

[0005] The electro-optic crystal 3 and the probe 1 are connected to the reflection film 3 on the electro-optic crystal 3 as shown in FIG.
And a bonding layer 2A are laminated on the probe portion 1 and a bonding layer 1A is formed on the probe portion 1 by being heated and pressed through a low melting point metal film 10 to join them. When exchanging the probe part 1, the probe part 1 is gripped by tweezers or the like and joined by heat.

Next, the operation principle of the measuring probe will be described. This probe has two functions. The first is a displacement detection function. That is, when the probe 1 is brought into contact with the measurement target, the probe 1 is pushed upward. As a result, the light guide tube 5 also moves upward. By this movement, the gap between the opposing electrode 7A and the movable electrode 6 increases, and the gap between the movable electrode 6 and the movable electrode 7B decreases. As a result, the beams 8A and 8B bend, and the capacitances formed by the two sets of electrodes 7A, 7B and 6 change. By detecting this change in capacitance, the force that the probe 1 receives from the measurement target can be detected. By applying this function, it is possible to acquire the uneven shape of the surface of the measurement object (atomic force microscope).

The second is a voltage detection function. First, a voltage is applied to the object to be measured, and the laser light is guided to the electro-optic crystal 3 via the light guide tube 5 with the transparent electrode grounded. Then
The laser light that has passed through the electro-optic crystal 3 is reflected by the light reflection film 2. At this time, the electro-optic crystal 3 has birefringence due to the electric field between the transparent electrode 4 and the reflection film. Thereby, the polarization state of the laser light changes. The amount of change in the polarization state depends on the voltage applied to the measurement target. The voltage of the measurement target can be measured from the amount of change in the polarization state.

[0008]

However, the conventional measuring probe has the following problems. As shown in FIG. 21A, the capacitive sensor is
Must be arranged by disposing the movable electrode 6 between the opposed electrodes 7A and 7B provided in the inside of the device, the assembly becomes very difficult. Poor probe reproducibility.

Also, as shown in FIG. 21A, the beam portions 8A and 8B are provided vertically above and below the capacitive sensor, and furthermore, as shown in FIG.
And 8B are joined to the inner wall of the frame 9 by an adhesive. Therefore, if the beams 8A and 8B bend during assembly for some reason, the light guide tube 5 cannot be supported accurately. Here, assuming that the length of one beam portion is L / 2, the width is W, the thickness is t, and the Young's modulus of the beam portion (spring material) is E, the spring constant K is expressed by the following equation (1). That is, K = 16EWt ³ / L ³ (1) Therefore, when the force to be pulled in the horizontal direction becomes excessive and the beams 8A and 8B are bent, the spring constant K increases. When K becomes large, it becomes difficult to accurately detect a minute force of 1 μm or less received from the measurement target.

Further, as shown in FIG. 21C, since the electro-optic crystal 3 and the probe 1 are heated and pressed through the low melting point metal film 10, the low melting point metal film forms the bonding layer 2 A. As a result, the light enters the reflective layer 2 and foggs the reflective layer 2.
As a result, the reflectance of the reflective layer 2 becomes uneven,
An error is included in the amount of change in the polarization state of the laser light, which makes it difficult to accurately measure the voltage.

The present invention has been made in view of the problems of the conventional example, and has as its object to provide a measurement probe which is easy to assemble and capable of detecting displacement with high accuracy.

As shown in FIG. 1, one embodiment of a measurement probe according to the present invention is provided with a support means for supporting a fixed electrode and a movable electrode which forms a capacitance in opposition to the fixed electrode at one end. A hollow light guide tube, an elastic body connected to one end of the light guide tube to support the light guide tube, an electro-optic conversion element provided at the other end of the light guide tube, and the electro-optic conversion device. A probe connected to an element, an insulator provided between the support means and the elastic body, and a low melting point metal for bonding between the support means and the insulator and between the insulator and the elastic body. And a membrane.

As shown in FIG. 1, one embodiment of the measurement probe of the present invention is such that the elastic body has a frame portion bonded to the insulator, and the frame portion extends from the frame portion toward the center of the light guide tube. And a plurality of extending beam portions, wherein the frame portion and the beam portions are formed of a thin plate integrally formed.

[0014]

[0015]

[0016]

[0017]

[0018]

[0019]

[0020]

In the measurement probe according to the present invention, the elastic body, the insulator, and the supporting means are joined via the low melting point metal film in a state where the movable electrode and the fixed electrode face each other. Therefore,
A position detector (capacitive sensor) including the movable electrode of the light guide tube and the fixed electrode of the support means can be easily configured in a narrow space formed by the elastic body and the support means. The principle of operation of this sensor is as follows. First, when the probe attached to one end of the electro-optical conversion element contacts the measurement target,
Since the probe is pushed upward, the distance between the movable electrode and the fixed electrode is reduced. As a result, the capacity increases.
Since the displacement of the probe can be detected from the change in capacitance, the uneven shape of the measurement target can be measured. This capacitance gap can be determined by adjusting the moving means and moving the fixed electrode in the vertical direction. In addition, when measuring the voltage of the measurement target, the probe portion is brought into contact with the measurement target,
It can be obtained optically by an electro-optical conversion element.

[0022]

In the measuring probe of the present invention, the measuring probe can be manufactured using an elastic body having a plurality of beams extending from the frame toward the center of the light guide tube, so that the assembly is easy. Become. In addition, since the beam portion of the elastic body has a curved shape from the light guide tube toward the frame, even if a displacement occurs between the elastic body and the support means during the assembly of the measurement probe, the curved shape can be obtained. Since both parts are bent, variations in the tension in the horizontal direction can be absorbed.

[0024]

[0025]

[0026]

[0027]

[0028]

[0029]

[0030]

[0031]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 20 are explanatory diagrams of a measurement probe according to an embodiment of the present invention, a method of manufacturing the same, and a method of replacing a needle thereof. (1) First Embodiment FIG. 1A is a sectional view of a measurement probe according to a first embodiment of the present invention, and FIG. 1B is a half of the measurement probe viewed from above. FIG.

In FIG. 1A, reference numeral 11 denotes a probe unit for bringing the tip of the needle into contact with the object to be measured. In the present embodiment, the probe portion 11 is divided into a needle tip portion and a needle holding portion as described later in order to facilitate needle replacement. 12 is a probe part 1
1 is an electro-optical conversion element provided on the optical element 1. The electro-optic conversion element 12 includes a transparent electrode, an electro-optic crystal, a light reflection film, and the like. A method for joining the electro-optic crystal and the needle holding part of the probe part 11 will be described in a fourth embodiment.

Reference numeral 13 denotes a light guide tube to which the electro-optic conversion element 12 is attached on one side and the other forms a movable electrode 13A.
One end of the light guide tube 13 is processed into a seat shape so that the electro-optic conversion element 12 can be attached. The other end is processed into a flange shape so as to form the movable electrode 13A. The light guide tube 13 has a structure that insulates the movable electrode 13A from the seat shape to which the electro-optical conversion element 12 is attached. The movable electrode 13A
Constitutes one electrode of the capacitive sensor.

Reference numeral 14 denotes a conductive movable beam that supports the light guide tube 13 so that the probe 11 can freely move in the vertical direction. The movable beam part 14 is an example of an elastic body, and forms a leaf spring. In addition, the movable beam part 14 includes upper and lower two beam parts,
It consists of an insulating ring that fixes this beam. The upper beam is connected to an extraction electrode 13D that is electrically connected to the movable electrode 13A, and the lower beam is an extraction electrode 13E that is electrically connected to the transparent electrode of the electro-optic crystal.
Connect to The movable beam portion 14 having a stress absorbing function will be described with reference to FIGS.

Reference numeral 15 denotes a counter electrode (fixed electrode) arranged to face the movable electrode 13A. The opposite electrode 15 forms the other electrode of the capacitive sensor. 16 is a counter electrode 15
This is a gap adjusting screw for adjusting the vertical movement of.
The gap adjusting screw 16 is an example of a moving unit. Reference numeral 17 denotes a conductive electrode support that supports the gap adjusting screw 16 and the counter electrode 15. The electrode support 17 is an example of a support unit.

Reference numeral 18 denotes an insulating ring provided between the movable beam 14 and the electrode support 17. 19 is a shielding plate,
It is used by grounding together with the extraction electrode 13D. Reference numeral 20 denotes an insulating ring provided between the extraction electrode 13E and the shielding plate 19. Reference numeral 21 denotes an insulating ring provided between the electrode support 17 and the connection ring 22. The connection ring 22 connects an actuator (not shown) and the measurement probe.

In the present embodiment, when the movable electrode 13A and the opposing electrode 15 face each other, the movable electrode shield plate 19 and the insulating ring 20, the insulating ring 20 and the extraction electrode 13E, the extraction electrode 13E Between the movable beam 14 and the movable beam 1
4, between the extraction electrode 13D, the extraction electrode 13D and the insulating ring 18, between the insulating ring 18 and the electrode support 17,
The electrode support portion 17 and the insulating ring 21 and the insulating ring 21 and the connection ring 22 are each thermally bonded via a low melting point metal film. Thus, the measurement probe has an integral structure.

Next, the operation principle of the measurement probe according to the present embodiment will be described. First, when the probe 11 attached to the tip of the electro-optical conversion element 12 comes into contact with the measurement target, the probe 11 is pushed upward, so that the movable electrode 13A
The distance between the electrode and the counter electrode 15 is reduced. As a result, the capacitance created by the movable electrode 13A and the counter electrode 15 increases. The displacement of the probe 11 is detected from the change in capacitance. Probe part 1
By moving 1 horizontally, it is possible to measure the uneven shape of the measurement object.

The method of measuring the voltage of the object to be measured is as follows.
Same as the prior art. First, a voltage is applied to the object to be measured, and the probe 11 is brought into contact with the object to be measured in a state where the transparent electrode is grounded.
To the laser beam. Then, the laser light that has passed through the electro-optic conversion element 12 is reflected by a light reflection film (not shown). At this time, in the electro-optic conversion element 12, birefringence occurs in the electro-optic crystal due to the electric field between the transparent electrode and the light reflecting film. Thereby, the polarization state of the laser light changes. The amount of change in the polarization state depends on the voltage applied to the measurement target. The voltage of the measurement target can be measured from the amount of change in the polarization state.

As described above, in the first measurement probe according to the first embodiment of the present invention, the movable electrode 13A and the counter electrode 1
5 are opposed to each other, between the movable beam shielding plate 19 and the insulating ring 20, between the insulating ring 20 and the extraction electrode 13E,
Between the extraction electrode 13E and the movable beam portion 14, between the movable beam portion 14 and the extraction electrode 13D, between the extraction electrode 13D and the insulating ring 1.
8, between the insulating ring 18 and the electrode support 17, between the electrode support 17 and the insulating ring 21, and between the insulating ring 2 and the insulating ring 21.
1 and the connection ring 22 are each thermally bonded via a low melting point metal film to form an integral structure.

Therefore, the movable beam portion 14 and the electrode support portion 1
It is possible to provide a measurement probe having a simple structure provided with a capacitive sensor in a narrow space formed by the insulating ring 7 and the insulating ring 18. The gap of this capacitance can be determined by adjusting the gap adjusting screw 16 and moving the counter electrode 15 in the vertical direction. Therefore, this measuring probe can be applied to a voltage waveform measuring device and a surface shape measuring device.

Next, a method of manufacturing the measurement probe according to the first embodiment of the present invention will be described. 2 and 3 show a process chart for forming a measurement probe. First, in FIG. 2A, the light guide tube 13 and the conductive movable beam portion 14 are shown.
Are assembled into a first component unit 100. The light guide tube 13 has a movable electrode 13A serving as one electrode of the capacitive sensor.
And an annular insulating tube 13B for insulating the movable beam portion 14, and a conductive tube portion 13C provided with a seat portion for attaching the electro-optic crystal.

For the movable electrode 13A, a hole having substantially the same diameter as the inner diameter of the tube portion 13C is formed in a metal plate such as Au or Cu, and the electrode portion is processed into a flange shape. The annular insulating tube 13B is made of ceramics which can be easily processed. The inside diameter of the insulating tube 13B is made substantially the same as the inside diameter of the tube portion 13A. As the conductive tube portion 13C, an aluminum tube having a diameter of about 2.5 mmφ is used, and one end is folded inward to form a seat shape. The tube portion 13A is not limited to aluminum and may be any light material. By forming it in a seat shape, the electro-optical conversion element 12 can be easily attached.

The movable beam portion 14 has an upper leaf spring portion 14A which is electrically connected to the movable electrode 13A and a lower leaf spring portion 14 which is electrically connected to the tube portion 13A.
B and an insulating ring 14C for insulating the upper leaf spring portion 14A and the lower leaf spring portion 14B. The upper leaf spring portion 14A and the lower leaf spring portion 14B are formed from a stainless steel foil having a thickness of about 20 μm. The shape will be described in a third embodiment. The insulating ring 14C uses ceramics or the like. The outer diameter of the ring 14C is about 20 to 25 mmφ.

First, Ni or Au plating is applied to the end surfaces of the insulating tube 13B and the insulating ring 14C to join the parts.
Au plating is applied to the end surface of A, and Au plating is applied to the upper leaf spring portion 14A and the lower leaf spring portion 14B. In this state, a metal sheet (Zn) is sandwiched between the components, and FIG.
As shown in (A), the components are arranged in the axial direction, and then the components are heated to about 400 to 500 ° C. while applying a force to the components from the axial direction. After heating, the part is gradually cooled. As a result, a metal compound (Au-Zn) is generated on the contact surface between the components, and the components are fixed to each other, and the first component unit 100 is completed.

Next, referring to FIG.
The gap adjusting screw 16 and the conductive electrode support 17 are assembled into a second component unit 200. Counter electrode 1
5 is formed from a metal tube having an outer diameter of about 2.5 mmφ. One end is processed into a flange shape to face the movable electrode 13A.
A male screw is cut on the outer surface of the counter electrode 15 and placed. The smaller the screw pitch, the higher the accuracy of the gap adjustment.

The gap adjusting screw 16 is formed from an annular metal. On the inner surface of the gap adjusting screw 16, a female screw matching the male screw of the counter electrode 15 is cut and placed. The electrode support 17 is made of a circular metal (brass or Ni steel) plate having a thickness of about 1 mm and an outer diameter of about 20 to 25 mmφ. In addition, an opening for inserting the counter electrode 15 is formed at the center of the electrode support 17. First of all, the engagement of each component is performed by the electrode support 1.
7, the counter electrode 15 is inserted with the flange shape down,
The counter electrode 15 is screwed from above the electrode support 17 with the gap adjusting screw 16. Thus, the electrode support 17 and the counter electrode 15 are temporarily assembled, and the second component unit 200 is completed. Then, as shown in FIG. 2C, the first component unit 100 and the second component unit 100 are opposed to each other so that the movable electrode 13A of the first component unit 100 and the counter electrode 15 of the second component unit 200 face each other. With the component units 200 facing each other, an insulating ring 18 and a lead electrode 13D are formed between the first component unit 100 and the second component unit 200. The extraction electrode 13D is to conduct to the movable electrode 13A via the upper leaf spring portion 14A. The insulating ring 18 insulates the electrode support 17 from the extraction electrode 13D.

Under the first component unit 100, a lead electrode 13E, an insulating ring 20, and a shielding plate 19 are formed.
The extraction electrode 13E is to conduct to the tube 13C via the lower leaf spring 14B. The insulating ring 20 is connected to the extraction electrode 13
E and the shield plate 19 are insulated. Extraction electrode 13
D and 13E are formed from brass or Ni steel having a thickness of about 1 mm, and the shielding plate 19 is formed from brass or Ni steel having a thickness of about 0.5 mm.

The parts are joined by a lower temperature process so that the parts joined in the preceding step are not melted. First, Ni or Au is applied to the end faces of the insulating rings 18 and 20.
-Sn plating is applied, and Au-Sn plating is applied to the extraction electrodes 13D and 13E, the electrode support 17 and the end of the shielding plate 19. In this state, the components are arranged in the axial direction as shown in FIG. 2 (B).
Heat at about 0 ° C. After heating, the part is gradually cooled. As a result, the two component units 100 and 200 are fixed.
The counter electrode 15 is temporarily fixed.

Further, the electro-optical conversion element 12, the connecting ring 22 and the insulating ring 23 are joined to the above-mentioned component unit using a unit assembling jig 600 as shown in FIG. The electro-optical conversion element 12 has a needle holding portion joined in advance. The joining method will be described in a second embodiment. The connection ring 22 is formed in an annular shape from brass or Ni steel having a thickness of about 2.0 mm. The connection ring 22 is a portion to be attached to a vertical actuator (not shown), and the insulating ring 24 insulates the electrode support 17 from the connection ring 22.

The unit assembling jig 600 is composed of a frame having a concave portion with a step inside. At the bottom of the jig 600, there is a surface for receiving the shielding portion 19 of the component unit, and there is a surface for receiving the electro-optical conversion element 12 at a position below this surface. An opening is provided at the center of the bottom to receive the needle holder of the electro-optical conversion element 12. Note that the depth from the upper surface of the jig 600 to each surface is specified so that the components are not distorted during assembly.

When the Au-Sn process is used in the previous step for joining the components, a metal film having a low melting point is formed so that the portion joined in the step is not melted.
Indium or the like is used for the low melting point metal film. First, the end surfaces of the insulating ring 23 are plated with Ni and Au, and the end portions of the connection ring 22, the electro-optical conversion element 12, and the light guide tube 13 are plated with Au. Indium is applied between these parts. In this state, the components are sequentially stored in a unit assembling jig 600 as shown in FIG. 3, and then heated at about 170 ° C. while being pressed in the axial direction. After heating, the part is gradually cooled.

As a result, a measurement probe having a capacitive sensor as shown in FIG. 1A is completed. Note that the capacitive sensor includes a movable electrode 13A and a counter electrode 15, and the gap is adjusted by a gap adjusting screw 16 to the counter electrode 15.
Can be easily adjusted by moving the vertical direction. After the joining is completed, the temporary fixing of the counter electrode 15 is released, and the gap interval is adjusted to a desired value, for example, 10 μm. At the time of this adjustment, the electro-optic conversion element 12 is held at the center of the unit assembly jig 600 so that an excessive load is not applied to the movable beam portion 14. Thereafter, the permanent fixing of the counter electrode 15 is performed. For permanent fixation of the counter electrode 15, an adhesive that is less likely to shrink and change with time is used.

As described above, in the method of manufacturing the measurement probe according to the first embodiment of the present invention, the first component unit 100 in which the light guide tube 13 and the movable beam portion 14 are assembled, the counter electrode 15 and the gap The second assembled screw 16
The insulating ring 18 and the lead electrode 13D are formed between the first component unit 100 and the insulating ring 18 and between the insulating ring 18 and the second component unit 200. After applying the Sn film and pressing these components in the axial direction, the heating temperature (400
(About 500 ° C.), which is about 240 ° C. lower than the heating temperature.

Accordingly, the first component unit 100 is not broken down, and the first component unit 100 and the second component unit 200 are sandwiched between the insulating ring 18 and the lead electrode 13D without using a fastener such as a bolt. In this state, the first component unit 100 and the second component unit 200 can be integrated.
As a result, a measurement probe including a capacitive sensor in a narrow space between the first component unit 100 and the second component unit 200 can be manufactured with high reproducibility.

In the present embodiment, Au—Sn is used for joining the first component unit 100 and the second component unit 200.
Although the case of applying a film has been described, a combination of Au-Cr or the like can be used as a higher temperature process. Au-Cu, Au-P
Combinations such as b can also be used. By forming different types of metals that can be eutectic in this way,
The component unit can be integrated without depending on fastening tools such as bolts.

In the present embodiment, for convenience of explanation, a method of assembling separately at each step has been described. However, the present invention is not limited by these steps.
It goes without saying that further simplification of the process or separation of the process can be performed more finely. (2) Second Embodiment FIGS. 4 (A) to 4 (C) show a process chart for bonding an electro-optic crystal and a needle holder according to a second embodiment of the present invention. In the second embodiment, a case is shown in which only the needle holding portion 11A of the probe portion 11 is attached to the electro-optical conversion element 12 of the measurement probe according to the first embodiment.

In FIG. 4A, first, the electro-optical conversion element 12 is formed. The electro-optic conversion element 12 includes an electro-optic crystal 12A, a light reflection film 12B, and a transparent electrode (not shown).
The light reflecting film 12B is formed on a surface opposite to the surface on the light guide tube 13 side as shown in FIG. The light reflecting film 12B is an electro-optic crystal 12
An Au (gold) film having a thickness of about several thousand Å is formed on A by a vacuum deposition method or the like. As the light reflection film 12B, an Al (aluminum) film, a Cu (copper) film, a Ni (nickel) film, or the like can be used in addition to the Au film in consideration of the adhesion strength and the reflectance with the electro-optic crystal 12A.

Next, a block layer 12C is formed on the light reflecting film 12B. The block layer 12C is formed by forming a Cr (chromium) film having a thickness of about several thousand Å by a vacuum deposition method or the like. The Cr film is used to prevent penetration of a low melting point metal during thermal bonding. For the block layer 12C, a metal other than Cr can be used as long as the metal has low reactivity with the low melting point metal. After that, a bonding layer 12D is formed on the block layer 12C. As the bonding layer 12D, an Au film having a thickness of about several thousand Å is formed by a vacuum deposition method or the like. Thereby, the light reflection film 12B, the block layer 12C, and the bonding layer 12C are formed.
The electro-optic conversion element 12 comprising the electro-optic crystal 12A in which D is sequentially stacked is completed.

Next, in FIG. 4B, a needle holding portion 11A of the probe portion 11 is formed. The needle holding portion 11A has a diameter of 2 mm,
It is made of a tungsten round bar with a length of about 5 mm, and has a structure in which the tip of the needle is separately prepared and attached later. Needle holder
A bonding layer 11B is formed on the surface of 11A on the electro-optical conversion element side. As the bonding layer 11B, an Au film having a thickness of about several thousand Å is formed by a vacuum deposition method or the like.

Then, in FIG. 4 (C), a low melting point metal film 24 is formed between the bonding layer 12D of the electro-optical conversion element 12 and the bonding layer 11B of the needle holder 11A and thermally bonded. The heating temperature is about 170 ° C. Indium (In) is used for the low melting point metal film 24. The melting point of indium is 156 ° C. If the temperature of the bonding portion is set to a temperature higher by about 10 ° C. to 20 ° C. than this temperature, the bonding layer (Au film) 12D and the needle holder
The bonding layer (Au film) 11B of 11A is fused with indium.
At this time, indium tries to penetrate into the light reflection layer (Au film) 12C, but is blocked by the block layer 12C (Cr film). Then, when gradually cooled, the electro-optical conversion element 12 and the needle holding portion 11A are joined.

As described above, in the method of manufacturing the measurement probe according to the second embodiment of the present invention, the electro-optic crystal 12
A block layer between the light reflecting layer 12B on A and the joining layer 12D.
Since the 12C is formed, when the electro-optical conversion element 12 and the needle holding portion 11A are thermally joined, indium which is going to penetrate into the light reflecting layer 12B can be blocked by the blocking layer 12C.

Therefore, since the light reflecting layer 12B below the block layer 12C can be protected from indium penetration, a predetermined reflectance of the light reflecting layer 12B on the electro-optic crystal 12A can be maintained. The electro-optic conversion element 12 and the needle holder 11A can be joined without impairing the function of the light reflection layer 12B. In the present embodiment, the light reflection layer 12B and the block layer 12C
Have been described separately, but FIG.
As shown in (A), a block / light reflection layer 27 which also serves as the light reflection layer 12B and the block layer 12C may be provided.
A Cr film is used for the block / light reflecting layer 27. Thereby, the film forming step can be omitted.

In this embodiment, the case where the light reflecting layer 12B is a single layer has been described. However, the light reflecting layer 12B may have a laminated structure in which a transparent layer responsible for the adhesive strength and a light reflecting layer are combined. . Further, in the present embodiment, the case where the light reflection layer 12B, the block layer 12D and the bonding layer 12D are sequentially laminated has been described, but the adhesion strength between the light reflection layer 12B and the block layer 12C or between the block layer 12C and the bonding layer 12D is described. Is weak,
When the heat fusion reaction is not stable, a tie layer may be provided between these layers as shown in FIG. FIG.
In (B), 25 and 26 are tie layers. An AuIn alloy film is used for the connection layer 25, and a NiCr alloy film is used for the connection layer 26.

As described above, the light reflection layer 12B and the block layer 12C
By using a NiCr alloy film between the two, and using an AuIn alloy film between the block layer 12C and the bonding layer 12D, the electro-optic conversion element 12 and the needle holder 11A can be connected without impairing the function of the light reflection layer 12B. Can be joined. This greatly contributes to providing a measurement probe of a voltage measurement device using the electro-optic effect.

(3) Third Embodiment FIGS. 6 and 7 show a configuration diagram of a movable beam portion of a measurement probe according to a third embodiment of the present invention. In the third embodiment, the movable beam portion of the measurement probe according to the first embodiment has a stress absorbing function. FIG. 6 (A)
In the figure, reference numeral 28 denotes a movable beam portion having a stress absorbing function for supporting the light guide tube and the like in the horizontal direction. The movable beam portion 28 includes four long straight beams 81, 83, 85, and 87 and a short beam 8 having a shape bent at 90 ° from the straight beam 81 on the same plane.
2. Similarly, a short beam 84 bent 90 ° from the straight beam 83 and a short beam 8 bent 90 ° from the straight beam 85
6. Short beam 88 bent 90 ° from straight beam 87
And an inner frame 89 for fixing the short beams 82, 84, 86, 88 and the light guide tube, and an outer frame 810 for fixing the straight beams 81, 83, 85, 87. The inner frame 89 is provided with an opening 811 having a diameter of about 2.5 mmφ for accommodating a light guide tube or the like. The diameter of the outer frame body 810 is 20
It is about 25 mm.

The straight beams 81, 83, 85, 87 constitute a leaf spring. L is the length of each of the straight beams 81, 83, 85, 87, and its value is about 10 mm. W is the width of these beams, and its value is about 0.75 mm.
T (not shown) is the thickness of each beam and frame, and its value is about 20 μm. In the movable beam portion 28 having such a beam portion bent at 90 °, the short beams 82, 84, 86,
The spring by 88 is sufficiently hard to ignore. Therefore, the spring coefficient K of the movable beam portion 28 can be approximated by the equation (1), similarly to the prior art. In the present embodiment, the spring coefficient K of the movable beam part 28 is about 70 N / m.

Next, a method of forming the movable beam portion 28 will be described. First, a resist film is patterned on a stainless steel foil having a thickness of about 20 μm. Then, using the resist film as a mask, the stainless steel foil is etched. As a result, the opening 811 is formed in the inner frame 89 as shown in FIG.
, And short beams 82, 84, 86, 8 from the inner frame 89.
8 extends and further comprises straight beams 81, 83, 85, 87 bent at 90 ° from the short beams 82, 84, 86, 88, respectively, and the straight beams 81, 83, 85, 87 and the outer frame body 810.
Thus, the movable beam 28 integrated with the above can be formed.
By integrating the movable beam portion 28, it is possible to minimize the occurrence of an error such as a displacement during the assembly of the probe.

FIG. 6B shows a movable beam portion 29 having another shape. In FIG. 6B, the movable beam portion 29 includes straight beams 91, 9 extending from the inner frame 99 to the outer frame 910.
3, 95, 97 have a Roman "T" shape.
Without joining the straight beams 91, 93, 95, 97 directly to the outer frame 910, short beams 92, 94,
96, 98. In this way, the short beam 92,
94, 96, 98 absorb horizontal stress.

FIG. 7A is a functional explanatory view of the movable beam portion having a stress absorbing function. In FIG. 7A, 28A
Reference numeral 28 denotes an upper leaf spring portion that supports an upper portion of the light guide tube 13;
B is an upper leaf spring supporting the lower part of the light guide tube 13.
Rd is an elastic portion formed by a leaf spring such as straight beams 91, 93, 95, 97, etc., and Ro is a short beam 9 bent at 90 °.
2, 94, 96 and 98 are tension release parts.

As shown in FIG. 7A, the tension releasing portion Ro is provided between the outer frame body 810 and the light guide tube 13 by an elastic portion R.
It is considered to be connected in series with d, and operates so as to release the horizontal tension even if a shift or the like occurs during assembly. Such an operation is performed by the short beams 82, 84, 86, 88 or 92, 94, as shown in FIGS. 6A and 6B.
This is achieved by absorbing horizontal stresses 96 and 98.

As described above, in the measurement probe according to the third embodiment of the present invention, the straight beam 8
Short beams 82, 84, 86, 8 each of which is bent at 90 ° from the light guide tube 13 toward the outer frame 810.
8, the short beams 82, 84, and 8 are provided even if the movable probe 28 and the electrode support 17 as shown in FIG.
6 and 88 are bent to rotate the inner frame 89.

Therefore, the variation in the tension in the horizontal direction can be absorbed by the movable beam portion 28. Therefore, even if a displacement or the like occurs during the assembly, the straight beams 81, 83, 85,
Since an excessive tension is not applied to 87, the error of the spring constant K is reduced. In the present embodiment, the case where the tension releasing portions Ro are provided symmetrically on the left and right sides of the light guide tube 13 has been described. However, as shown in FIG. 7B, the tension releasing portions Ro may be provided on only one side. . Even in this case, the straight beam is distorted in the center direction to release the tension, and the elastic portion Rb having a soft spring effect is provided.
Is configured.

In the present embodiment, as shown in FIGS. 6A and 6B, a case where the elastic portion Rd and the tension releasing portion Ro are clearly separated mechanically has been described. It may be constituted by a curved beam as shown in (A) and (B). In FIG. 8A, the movable beam portion 30 includes arc-shaped beams 103 to 106 extending from the inner frame 101 to the outer frame 102.
have. In the present embodiment, arc-shaped beams 103 and 104
Between the beam and the arc-shaped beams 105 and 106
And the space between them. In this way, during assembly, the space between the arc-shaped beams 103 and 104 expands and contracts, and the space between the arc-shaped beams 105 and 106 expands and contracts, thereby absorbing horizontal stress.

Further, in FIG. 8B, the movable beam 31
Has a Roman "S" shaped beam 303-305 extending from the inner frame 301 to the outer frame 302. In this way, the "S" shaped beams 303, 304 or 305 expand and contract to absorb horizontal stress. As a result, a soft spring effect is given to the light guide tube 13, so that the probe portion 1
No bias to 1 is applied. In addition, an unnecessary force is not applied to the wiring on the semiconductor chip.

(4) Description of Fourth Embodiment FIG. 9A shows a configuration diagram of a measurement probe according to a fourth embodiment of the present invention. In the fourth embodiment,
Unlike the first to third embodiments, an electromagnetic sensor is provided instead of the capacitive sensor. In FIG. 9A, reference numeral 41 denotes a probe for bringing the tip of the needle into contact with a measurement target, and reference numeral 42 denotes a magnetic body attached to a shaft connected to the probe 41. A substance having high magnetic permeability is used for the magnetic body 42. The substance having high magnetic permeability is pure iron, mild steel, a Ni—Fe alloy, ferrite, or the like. The magnetic body 42 is formed by winding any of these substances around a part of the shaft of the probe 41. Thus, a core can be formed. If a light guide tube is used for this shaft, the electro-optical conversion element as described in the first embodiment can be attached.

Reference numeral 43A denotes a movable beam that supports an upper axis of the probe 41 so as to freely move the probe 41 in the vertical direction. Reference numeral 43B denotes a movable beam that supports a lower axis of the probe 41. It is a movable beam part to support. As the movable beams 43A and 43B, beams having a stress absorbing function as described in the third embodiment may be used. The horizontal tension during assembly can be absorbed.

Reference numeral 44 denotes an electromagnetic coil disposed at a position surrounding the magnetic body 42. The electromagnetic coil 44 constitutes a differential transformer. The differential transformer 44 can be configured by vertically arranging and coupling three coils at a position surrounding the magnetic body 42 and reversing the winding directions of the two coils at both ends. One coil (referred to as a primary side) has n1 turns, and the other two coils (referred to as a secondary side) both have n2 turns. The differential transformer applies an AC voltage to its primary side and extracts an electromotive force from its secondary side. The displacement of the search unit 41 is detected from the electromotive force extracted from the secondary side.

Reference numeral 45 denotes a frame supporting the differential transformer 44, and reference numeral 46 denotes an actuator for moving the measurement probe in the vertical direction. A piezo drive element is used for the actuator 46. Next, the operation principle of the electromagnetic sensor according to the present embodiment will be described. First, an AC voltage is applied to the primary side of the differential transformer, and the electromotive force is extracted from the secondary side. In this state, when the tip of the probe 41 is brought into contact with the object to be measured, the probe 41 is pushed upward, and the magnetic material 4 supported by the movable beam 14 is moved upward.
2 moves upward in the differential transformer 44.

As shown in FIG. 9B, when the magnetic body 42 is at the center, the differential transformer 44 does not generate a voltage (Va = Vb = 0) on the secondary side. When it moves upward, the coupling with the upper coil becomes stronger, and a voltage Va having a positive phase is induced. Conversely, when the magnetic body 42 moves downward, the coupling with the lower coil is strengthened, and a voltage Vb of the opposite phase is induced. By detecting the displacement of the probe section 41 from the change in the output voltage, the pressing force from the measurement target to the probe section 41 can be obtained. With this pressing force, the uneven shape of the measurement object can be measured (atomic force microscope).

As described above, in the measurement probe according to the fourth embodiment of the present invention, the differential transformer 44 is disposed around the magnetic body 42 attached to the shaft of the probe 41. Therefore, the voltage V induced by the magnetic body 42 moving up and down in the differential transformer 44 due to the vertical movement of the probe 41
The displacement of the probe section 41 can be detected from the changes in a and Vb.

As a result, it is possible to provide a simple and compact measurement probe having an electromagnetic sensor for changing the displacement of the probe 41 into an electric signal. This measuring probe can be applied to a voltage waveform measuring device and a surface shape measuring device. Further, in the present embodiment, the volume of the core can be smaller than the volume of the movable electrode of the conventional capacitive sensor. For this reason, the load on the movable beams 43A and 43B can be reduced. When the load on the core decreases, the movable beams 43A and 43A
Since the time during which B is stabilized becomes faster, high-speed scanning becomes possible.

(5) Fifth Embodiment FIGS. 10A to 10C are explanatory views of a method for exchanging a needle of a measurement probe according to a fifth embodiment of the present invention.
In the fifth embodiment, the needle tip of the measurement probe as described in the first to fourth embodiments is replaced. In FIG. 10A, the probe portion is previously set to the needle holding portion 11A.
And the needle tip 51 are formed separately. Needle tip 51
Is formed by first patterning a resist film on a conductive Si substrate, and then etching the Si substrate using the resist film as a mask. The diameter of the needle tip 51 is about 1 mmφ. The patterning of the resist film is performed separately when defining the needle tip 51 and when sharpening the tip. An aqueous solution of KOH (potassium hydroxide) is used as an etching solution. The tip can be sharpened by multiple etchings.

Then, a soft magnetic film 52 is formed on the surface opposite to the pointed tip. The soft magnetic film 52 includes iron (F
e) or an alloy film of Fe.Ni is used. The soft magnetic film 52 is formed by a vacuum evaporation method or a plating method. The method for forming the needle holding portion 11A is as described in the second embodiment. For the needle adsorption, a permanent magnet may be bonded to tungsten. Alternatively, a magnetic material may be fixed to the tip of the tungsten rod and magnetized by a coil or the like.

Next, when attaching the needle tip 51 to the needle holding section 11A, the completed needle tip 51 is placed on the mounting table in FIG. 10B. The mounting table preferably has a structure that protects the needle tip. Then, the needle holding portion 11A is slowly brought close to the needle tip portion 51. Then, as shown in FIG. 10B, the needle holder 11A attracts the needle tip 51 by magnetic force. Thus, the attachment of the needle tip 51 is completed.

When removing the needle tip 51 from the needle holder 11A, the needle tip 51 is moved onto the tip peeling electromagnetic coil 53 as shown in FIG. 10C. This electromagnetic coil includes a DC drive type and an AC drive type. In the DC method, a large magnetic force that overcomes the magnetic force of the needle holding portion 11A is applied to the needle tip portion 51 to drop the needle tip portion 51 from the needle holding portion 11A. Therefore, it is necessary to provide a stopper so that a large force is not applied to the movable beam as described in the first embodiment.

As described above, in the method for exchanging the needle of the measuring probe according to the fifth embodiment of the present invention, the needle holding portion 11A in which the needle tip portion 51 is separated from the probe portion is magnetized in advance.
When attaching the needle tip 51 to the needle holder 11A, bring the needle holder 11A closer to the needle tip 51 to pull the needle tip 51, and when removing the needle tip 51 from the needle holder 11A, hold the needle. The needle tip 51 is dropped by applying a magnetic force to cancel the magnetic force of the portion 11A. Therefore, only the tip 51 of the probe can be easily replaced, and it is sufficient to manufacture only the tip 51 of the probe. In addition, the needle tip 51 can be replaced with good reproducibility without using tweezers or the like.

In this embodiment, the needle tip 51 is made of Si
Since it is composed of the tip made of the substrate and the soft magnetic film 52 formed on the opposite surface, the whole tip of the needle does not have to be made of a magnetic material. Further, since the Si substrate is used as a material, the cost can be reduced as compared with the case where the whole is made of a metal such as tungsten. (6) Sixth
Embodiment FIGS. 11A to 11C are views illustrating a method for exchanging a needle of a measurement probe according to a sixth embodiment of the present invention. In the sixth embodiment, unlike the fifth embodiment, the needle attached to the common beam is replaced by using a special jig.

In FIG. 11A, first, a plurality of needle tip portions 201 form a needle tip portion array 203 in which a part of a two-dimensional lattice-like common beam 202 is formed. Needle tip array 203
A resist film is patterned on a conductive Si substrate, and thereafter, the resist film is used as a mask to form the Si substrate by etching. Si substrate is 100μm thick
The diameter of the needle tip 201 is about 1 mmφ.

In FIG. 11B, the length N of one side of the lattice forming the common beam 202 is about 5 mm. An opening is provided between the common beams 202. This opening is necessary for applying a dedicated jig. Note that an aqueous solution of KOH (potassium hydroxide) is used for the etching solution as in the fifth embodiment. The tip is sharpened by etching multiple times.

Further, as shown in FIG. 11C, a soft magnetic film 52 is formed on the surface opposite to the pointed tip. The material and manufacturing method of the soft magnetic film 52 are the same as in the fifth embodiment. Thus, a needle tip array 203 in which the plurality of needle tips 201 form a part of a two-dimensional lattice-like common beam 202 can be formed. FIG. 12A shows another needle tip array 205 in which a sharpened tip is provided in a concave portion. By forming the needle tip 204 in the recess, the needle tip 204 can be protected during other forming steps.

FIG. 12B shows the needle tip array 20.
3 shows a state in which a groove 206 is provided in a common beam 202 on both sides (around) of each needle tip 201. The groove 206 is provided in the common beam 202 on the surface having a pointed tip. The groove 206 is formed by laser processing. YAG, CO for laser processing
_{2. Use} excimer laser or the like. This groove 206 may be formed by isotropic etching. This way the groove
The needle tip 201 can be easily separated from the common beam 202 with the boundary 206.

Next, a cutting tool with needle tip protection for separating the needle tip 201 from the common beam 202 will be described.
FIG. 13A shows a cross-sectional view of a cutting tool with needle tip protection. In FIG. 13A, reference numeral 401 denotes a cutting portion provided with a concave portion 401A for protecting the tip of the needle. The cutting section 401
The protrusions 401B are provided at intervals so as to correspond to the grooves 206 on both sides (around) of the needle tip portion 201 described with reference to FIG. The material of the cutting portion 401 is a metal such as Fe or brass. The cutting portion 401 may be formed in a square pillar shape or a column shape.

Reference numeral 402 denotes a frame for housing the cutting portion 401,
A concave portion corresponding to the cross-sectional shape of the cutting portion 401 is provided. A spring 403 is provided in the recess. The spring 403 functions to push up the cutting portion 401, and the common beam 2 is generated by the pressing force from above and the repulsive force of the spring 403.
02 can be separated from the needle tip 201. Thus, the cutting tool 400 with needle tip protection is constituted.

Next, with reference to FIG. 13 (B), a description will be given of a case where the tip of the needle stuck to the common beam is replaced using a cutting tool with needle tip protection. FIG.
In (B), when attaching the needle tip section 201 to the needle holding section 11A, the needle tip array 203 is placed on the cutting tool 400. At this time, the projection 401B of the cutting tool 400 and the groove 206 of the needle tip 201
Align with. As a result, the sharp portion of the needle tip 201 enters the recess 401A, and the needle tip is protected.
Then, the needle holding portion 11A is slowly brought close to the needle tip portion 201 and pressed. Then, the needle holder 11A attracts the needle tip 51 by magnetic force. At the same time, the groove 206 around the needle tip 201 is broken. Thus, the needle tip 201 is easily separated from the common beam 202 with the groove 206 as a boundary, and the attachment of the needle tip 201 is completed. The removal of the needle tip 201 from the needle holder 11A is the same as that described in the fifth embodiment. Therefore, the description is omitted.

As described above, in the method for exchanging the needle of the measuring probe according to the sixth embodiment of the present invention, a plurality of needle tips 20 are provided.
1 is formed in a state of being attached to the two-dimensional lattice-like common beam 202. Therefore, the needle tips 201 can be removed one by one from the common beam 202 and replaced one by one using the cutting tool 400 with needle tip protection. That is, in the present embodiment,
With the pointed portion of the needle tip 201 protected by the recess 401A of the cutting tool 400, the needle holder 11A is pressed from the side on which the soft magnetic film 52 is formed to break the common beam 202 around the needle tip 201. ing.

Accordingly, one needle tip 20 from the common beam 202
Only one can be separated. As a result, it is not necessary to break the needle tip 201 before changing the needle.
Exchange of 201 becomes easy. Furthermore, in the present embodiment, a groove 206 is provided in the common beam 202 of the individual needle tip 201, and the cutting tool 400 with needle tip protection is used to cut the common beam 202 from the needle tip 201.
Of the common beam 20 of the needle tip 201 when changing the needle.
Only 2 can be separated with good reproducibility. As a result,
One needle tip 201 can be easily separated from the common beam 202. As a result, a measurement probe capable of automatically changing needles can be provided.

(7) Seventh Embodiment FIGS. 14A to 14D are views for explaining a method of exchanging a needle of a measurement probe according to a seventh embodiment of the present invention. In the seventh embodiment, unlike the fifth and sixth embodiments, the needle replacement is performed by taking the magnetic beads with the needle in and out of the dedicated storage device using magnetic force.

In the present embodiment, the probe portion is formed separately in advance into the needle holding portion 61 and the magnetic beads 63 with needles. The magnetic beads 63 are formed by joining a needle having a diameter of about 0.5 mmφ and a length of about 1 mm to a magnetic substance having a diameter of about 1.5 mmφ. Then, the needle holder 61 is magnetized. The magnetization can be obtained by a method using an electromagnetic coil or a method using a permanent magnet. In the present embodiment, the needle 62 is bonded to the magnet 62. The magnetic beads 63
Are stored in a dedicated needle storage section 64. The needle storage portion 64 has a stepped opening, and the stepped opening is formed of the magnetic beads 63.
It consists of a portion where the outer edge of the needle is hooked and a portion where the needle fits. The magnetic beads 63 are stored in the needle storage section 64 so that the needles face downward.

Next, the needle changing method will be described with reference to FIGS. When attaching the magnetic beads 63 to the needle holder 61, the needle holder 61 is first lowered vertically toward the needle storage part 64 in FIG. Then, as shown in FIG. 14 (B), the needle holding portion 6 is attached to the magnetic beads 63 stored in the needle storage portion 64.
1 and the magnetic beads 6 by the magnetic force of the needle holder 61.
3 Install. Thereafter, as shown in FIGS. 14C and 14D, the magnetic beads 63 attached to the needle holding portion 61 are slowly pulled up from the needle storage portion 64 to the outside. This completes the mounting of the needle.

Further, the magnetic beads 63 from the needle holder 61
15A, first, the magnetic beads 6 are directed toward the vacant opening of the needle storage section 64 in FIG.
The needle holder 61 with 3 is lowered vertically.
Then, as shown in FIG. 15B, the magnetic beads 63 are inserted into the openings of the needle storage section 64. Then, FIG.
As shown in (C), the needle holding part 61 or the needle storage part 64 is moved in the horizontal direction, and
Is separated. Thus, as shown in FIG.
Removal of the needle is completed.

As described above, in the method for exchanging the needle of the measuring probe according to the seventh embodiment of the present invention, the magnet is previously joined to the tip of the needle holder 61, and the magnetic beads are attached to the needle holder 61. When attaching 63, the magnetic beads 63 housed in the needle housing 64 so that the tip of the needle faces downward,
The needle holding unit 61 is brought close to the needle holding unit 61 by the magnetic force of the needle holding unit 61. When removing the needle from the needle holding section 61, the needle attached to the needle holding section 61 is inserted into the needle storage section 64,
The needle holding section 61 or the needle storage section 64 is moved in the horizontal direction to separate the needle holding section 61 and the needle.

Therefore, only the magnetic beads 63 of the probe portion can be replaced with good reproducibility, similarly to the first needle replacement method of the present invention. The probe part is a magnetic bead 63 with a needle.
It is enough to manufacture only. (8) Eighth Embodiment FIGS. 16A to 16D are views illustrating a method of replacing a needle of a measurement probe according to an eighth embodiment of the present invention. In the eighth embodiment, unlike the seventh embodiment, the magnetic beads with a needle are removed using a dedicated needle remover. Further, a detecting means for detecting the vertical movement of the probe portion is provided, and the presence or absence of the needle is confirmed by the detecting means.

In this embodiment, the probe portion is previously formed separately from the needle holder 76 and the magnetic beads 71 with needles. As shown in FIG. 16A, the magnetic beads 71 are provided with a flange-shaped (disk-shaped) projection 71A around a magnetic substance having a diameter of about 1.5 mmφ, and a step is provided between the projection and the magnetic substance. ing. This step is a value larger than the thickness of the thin plate of the needle remover. As in the seventh embodiment, a needle 71B having a diameter of about 0.5 mmφ and a length of about 1 mm is joined to this magnetic body.

FIG. 16B is a sectional view of the needle remover. In FIG. 16B, reference numeral 72 denotes a needle remover,
A film-like thin plate 72B having a thickness of several hundred μm and a thin plate 72B
Consists of a pier 72A supporting the pier. The pier 72A may be a frame. The thin plate 72B has a protrusion 71 as shown in FIG.
A hole 73 into which the magnetic beads 71 accompanied by A can be directly inserted.
have. The hole 73 has an opening area having an opening width φ2,
An opening region having an opening width φ1 smaller than the width of the projection 71A is provided continuously to the opening region.

The holes 73 may be distinguished from each other like the opening widths φ1 and φ2, but may be holes 75 whose opening area is gradually narrowed as shown in FIG. 74
Indicates a needle removal tool provided with a punched hole 75. That is, the manufacturing conditions of the needle remover include a hole 73 into which a needle 71B with a projection 71A can be inserted, and a thin plate 72B.
Moving in the horizontal direction along the surface of the needle, the diameter is reduced, and the projection 71A is engaged with the thin plate 72B.
The thickness of the thin plate 72B is smaller than that of the step 71B.

Next, the needle changing method will be described with reference to FIGS. 17 and 18. First, the needle holder 76 is magnetized. The magnetization method is as described in the seventh embodiment. In the present embodiment, the magnet 77 is
Is glued. The magnetic beads 71 are stored in a dedicated needle storage section 78. The needle accommodating portion 78 has an opening, and the width of the opening is such that a flange-shaped projection of the magnetic beads 71 is hooked. The magnetic beads 71 are placed in the needle storage 78 so that the needle faces downward.

For example, the magnetic beads 71 are
17A, first, in FIG. 17A, the needle holding portion 76 is lowered vertically toward the needle storage portion 78. Then, as shown in FIG. 17B, the needle holding portion 76 is brought close to the magnetic beads 71 stored in the needle storage portion 78, and the magnetic beads 71 are attached by the magnetic force of the needle holding portion 76. At this time, it is determined whether or not the magnetic beads 71 have been attached to the needle holding portion 76 based on the output of the detecting means.
For example, when the detecting unit detects the downward movement of the needle holding unit 76, it is possible to determine “the state in which the magnetic beads 71 are attached to the needle holding unit 76” from the detection result.

When it is confirmed by the output of the detecting means that the magnetic beads 71 have been attached to the needle holding section 76, as shown in FIGS. 17C and 17D, the needle storage section 78 is provided.
The magnetic beads 71 attached to the needle holding portion 76 are slowly pulled up to the outside. This completes the mounting of the needle. When removing the magnetic beads 71 from the needle holding portion 76, first, in FIG.
The needle holding portion 76 with the magnetic beads 71 is vertically lowered toward the hole 73 of FIG. Then, the magnetic beads 71 are inserted into the holes 73 of the needle remover 72. The magnetic beads 71 are inserted until the projection 71A of the magnetic beads 71 is positioned below the thin plate 72A.

Thereafter, as shown in FIG. 18B, the needle holder 76 or the needle remover 72 is moved in the horizontal direction. By this movement, the protrusion 71A of the magnetic beads 71 comes to be caught on the thin plate 72A of the needle remover. And FIG.
As shown in (C), the magnetic beads 71 reach the end of the hole 73. In this state, the needle holding section 76 is further moved in the horizontal direction as shown in FIG. As a result, the magnetic beads 71 are separated from the needle holder 76 as shown in FIG. The separated magnetic beads 71 fall. At this time, it is determined whether or not the magnetic beads 71 have been removed from the needle holding unit 76 based on the output of the detecting unit.
For example, when the detection unit detects the upward movement of the needle holding unit 76, it is possible to determine “the state in which the magnetic beads 71 are removed from the needle holding unit 76” from the detection result. This completes the removal of the needle.

As described above, in the measuring probe needle replacement method according to the eighth embodiment of the present invention, the needle holding portion 76 from which the magnetic beads 71 are separated from the probe portion is magnetized in advance. When attaching the magnetic beads 71 to the needle holder 76, the magnetic beads 7 are attached in the same manner as in the seventh embodiment.
The needle holding portion 76 is brought close to the magnetic beads 71 stored in the needle storing portion 78 such that 1 faces downward, and the magnetic beads 71 are attached by the magnetic force of the needle holding portion 76.

Further, the magnetic beads 71 are
When removing the needle 71A, the magnetic beads 71 are directly inserted into the hole 73 of the needle removal tool 72 until the projection 71A is hidden, and in this state, the needle holding part 76 or the needle storage part 78 is moved in the horizontal direction. Moved to a narrow area. As a result, the projection 71A is gradually hooked on the thin plate. Therefore, the magnetic beads 71 can be separated from the needle holding portion 76 with good reproducibility by the thin plate 72A.

Thus, only the magnetic beads 71 of the probe portion can be replaced with good reproducibility, similarly to the seventh embodiment of the present invention. Further, it is sufficient for the probe portion to manufacture only the magnetic beads 71. Further, in the present embodiment, when the detecting means detects the downward movement of the probe part at the time of needle replacement, the state of the state in which the magnetic beads 71 are attached to the needle holding part 76 is determined from the detection result. Can be determined. When the detecting means detects the upward movement of the probe portion, the result of the detection indicates that “the magnetic beads 71
6). Therefore, the voltage waveform measuring device or the surface shape measuring device can automatically recognize whether or not the needle has been replaced. Automatic needle exchange can be realized without a complicated mechanism for removing the needle.

(9) Ninth Embodiment FIGS. 19A to 19C are views illustrating a method for exchanging a needle of a measurement probe according to a ninth embodiment of the present invention. In the ninth embodiment, unlike the fifth embodiment,
The needle tip is attached or detached via heat without using magnetic force. In the present embodiment, the probe portion is formed separately from the needle holding portion 11A and the needle tip portion 51 as in the fifth embodiment. Then, the needle tip 51 is attached to the needle holder 11A.
In the case of mounting, as shown in FIG. 19A, a low melting point metal film 55 is formed between the needle holder 11A and the needle tip 51, and the needle holder 11A and the needle tip 51 are overlapped. The low melting point metal film 55 is heated under the pressure.
For the low melting point metal film 55, low-temperature solder or the like is used. Before forming the low melting point metal film 55 on the needle tip portion 51, it is preferable to form an Au film or the like which is easily compatible with the metal film 53 by a vapor deposition method or a plating method. As the heating means, an infrared lamp 54 or the like is used.

Thereafter, in FIG. 19B, the infrared lamp 54 is turned off, and the low-melting point metal film 55 is gradually cooled to attach the needle holder 11A and the needle tip 51. When removing the needle tip 51 from the needle holder 11A, as shown in FIG. 19C, the low melting point metal film 55 is heated and the needle tip 51 is removed from the needle holder 11A. As described above, in the needle replacement method for the measurement probe according to the ninth embodiment of the present invention, when the needle tip 51 is attached to the needle holder 11A, the distance between the needle tip 51 and the needle holder 11A is changed. When the needle tip 51 is detached from the needle holder 11A by thermal bonding via the low melting point metal film 55, the needle tip 51 and the needle holder 11A are removed.
The heat is applied to the joint surface between them to separate them. Therefore, similarly to the fifth embodiment of the present invention, the needle tip portion 51 of the probe portion is provided.
Only can be replaced with good reproducibility. Further, it is sufficient to manufacture only the tip portion 51 of the probe.

(10) Tenth Embodiment FIG. 20 shows a configuration diagram of a scanning probe microscope according to a tenth embodiment of the present invention. In the tenth embodiment, the surface shape of a sample is obtained using the measurement probes described in the first to fifth embodiments. Also,
In this embodiment, the needle tip is replaced by the needle replacement method described in the sixth to ninth embodiments.

In FIG. 20, reference numeral 500 denotes a scanning probe microscope. Reference numeral 501 denotes a measurement probe, which uses any of the measurement probes described in the first to fifth embodiments. If only the surface shape is to be obtained, the measurement probe including the electromagnetic sensor described in the fourth embodiment is suitable. If the voltage of the sample 507 is to be measured, the measurement probe including the capacitive sensor described in the first embodiment is suitable. Reference numeral 502 denotes a vertical actuator for raising and lowering the measurement probe 501 in the vertical direction.
Reference numeral 503 denotes a fine movement stage for moving the vertical movement actuator 502 in the horizontal direction, 504 denotes a coarse positioning stage for moving the sample 507 in the X and Y directions, and 505 and 506 denote motors for driving the coarse positioning stage 505. is there. Reference numeral 507 denotes a sample (object to be measured) such as a semiconductor wafer.

Next, the operation of the microscope will be described. First,
The sample 507 is placed on the coarse positioning stage 505. It is checked whether or not the needle tip is attached to the needle holder of the measurement probe 501. If the needle tip is not attached,
The needle tip is attached by the needle replacement method described in the ninth embodiment. Then, the coarse positioning stage 50
4 is moved below the measurement probe 501. Thereafter, the measurement probe 501 is brought into contact with the sample surface using the fine movement stage 503 and the vertical movement actuator 502, and the three-dimensional shape of the sample 507 is obtained from the output of the measurement probe 501 from the capacitive sensor or the like. When replacing the needle tip, the needle tip is replaced by the needle replacement method described in the sixth to ninth embodiments.

As described above, in the scanning probe microscope according to the tenth embodiment of the present invention, the measuring probe described in the first to fifth embodiments is used. The surface shape can be obtained. Therefore, the reliability of the scanning probe microscope is improved. In the present embodiment, only the needle tip can be easily replaced by the needle replacement method described in the sixth to ninth embodiments. Therefore, since the needle can be replaced in a short time, the operating efficiency of the scanning probe microscope is improved.

[0120]

As described above, according to the measuring probe of the present invention, since the elastic body, the support means and the insulator form an integral structure in a state where the movable electrode faces the fixed electrode, it is narrow. A measurement probe having a simple structure provided with a capacitive sensor in a space can be provided.

In the measuring probe of the present invention, since the beam portion of the elastic body has a curved shape from the light guide tube toward the frame, even if the measuring probe is misaligned during assembly,
Since the curved beam portion bends, it is possible to absorb variations in tension in the horizontal direction.

[0122]

[0123]

[0124]

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a measurement probe according to a first embodiment of the present invention.

FIG. 2 is a diagram (part 1) illustrating a process of forming a measurement probe according to the first embodiment of the present invention.

FIG. 3 is a diagram (part 2) illustrating a process of forming a measurement probe according to the first embodiment of the present invention.

FIG. 4 is a process diagram for joining an electro-optic crystal and a needle holder of a measurement probe according to a second embodiment of the present invention.

FIG. 5 is an explanatory view of a modification of the joining method according to the second embodiment of the present invention.

FIG. 6 is a plan view of a beam portion having a stress absorbing function of a measurement probe according to a third embodiment of the present invention.

FIG. 7 is a functional explanatory view of a beam portion with a stress absorbing beam function according to a third embodiment of the present invention.

FIG. 8 is a plan view of another beam portion having a stress absorbing function according to a third embodiment of the present invention.

FIG. 9 is a configuration diagram of a measurement probe according to a fourth embodiment of the present invention.

FIG. 10 is an explanatory diagram of a needle replacement method of a measurement probe according to a fifth embodiment of the present invention.

FIG. 11 is an explanatory diagram of a method of exchanging a needle of a measurement probe according to a sixth embodiment of the present invention.

FIG. 12 is a sectional view of a needle tip attached to a common beam according to a sixth embodiment of the present invention.

FIG. 13 is a cross-sectional view of a cutting tool with needle tip protection according to a sixth embodiment of the present invention and a state when the needle is attached.

FIG. 14 is an explanatory view when a measurement probe according to a seventh embodiment of the present invention is attached to a needle.

FIG. 15 is an explanatory diagram at the time of needle removal of a measurement probe according to a seventh embodiment of the present invention.

FIG. 16 is a configuration diagram of a needle and a needle remover of a measurement probe according to an eighth embodiment of the present invention.

FIG. 17 is an explanatory diagram of a measurement probe according to an eighth embodiment of the present invention when a needle is attached.

FIG. 18 is an explanatory diagram at the time of needle removal of a measurement probe according to an eighth embodiment of the present invention.

FIG. 19 is an explanatory diagram of a method for replacing a needle of a measurement probe according to a ninth embodiment of the present invention.

FIG. 20 is a configuration diagram of a scanning probe microscope to which a measurement probe according to a tenth embodiment of the present invention is applied.

FIG. 21 is a configuration diagram of a measurement probe according to a conventional example.

[Explanation of symbols]

1, 11, 41: probe part, 11A, 61, 76: needle holding part, 12: electro-optical conversion element, 3, 12A: electro-optical crystal, 4: transparent electrode, 2, 12B: light reflecting film, 12C ... Block layer, 1A, 1B, 11B, 12D: bonding layer, 12A: electro-optic crystal, 5, 13: light guide tube, 6, 13A: movable electrode, 13B
... Circular insulating tube, 13C ... Tube, 13D, 13E ... Extraction electrode,
8A, 8B, 14, 28, 29, 30, 31, 43A, 43
B: movable beam portion, 14A, 28A: upper leaf spring portion, 14B, 28B
... lower leaf spring part, 7A, 7B, 15 ... counter electrode (fixed electrode), 16 ... gap adjusting screw, 17 ... electrode support part, 14
C, 18, 20, 21, 23 ... insulating ring, 19 ... shielding plate, 22 ... connecting ring, 10, 24, 55 ... low melting point metal film, 25, 26 ... connecting layer, 27 ... block light reflecting layer, 42 ... magnetic material, 44 ... electromagnetic coil (differential transformer), 9, 45, 402 ... frame, 51, 201, 204 ... needle tip, 52 ... soft magnetic film, 54 ... infrared lamp, 62, 7
7: magnet, 63, 71: magnetic beads with needle, 64, 7
8: Needle storage section, 71A: Projection, 71B: Needle, 72, 74: Needle remover, 72A: Thin plate, 72B: Bridge pier, 73, 75: Drilled hole, 81, 83, 85, 87, 91, 93, 95,97
... straight beams, 82, 84, 86, 88, 92, 94, 9
6,98 ... short beam, 89, 99, 101, 301 ... inner frame, 53 ... electromagnetic coil, 100 ... first component unit, 20
0 ... second component unit. 102, 302, 810, 910: outer frame, 103-106: arc-shaped beam, 203, 205: needle tip array, 202: common beam, 206: groove, 303-305:
"S" shaped beam, 401 ... cut section, 401B ... projection, 403 ...
Spring, 400: Cutting tool with needle tip protection, 500: Scanning probe microscope, 501: Measuring probe, 502: Vertical movement actuator, 503: Fine movement stage, 504: Coarse positioning stage, 505, 506: Motor, 600: Unit Jig for assembly, 811 ... opening.

Continued on the front page (72) Inventor Hideki Sekiguchi 1015 Uedanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Yuji Sakata 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Limited (72) Invention Person Akira Fujii 1015 Uedanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Akinori Miyamoto 1015, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Yasutoshi Umehara Nerima-ku, Tokyo 1-32-1 Asahicho within Advantest Co., Ltd. (72) Inventor Toshihiko Hara 1-32-1, Asahicho, Nerima-ku, Tokyo Intraventure Co., Ltd. (72) Inventor Yoshiaki Ogiso 1, Asahicho, Nerima-ku, Tokyo No. 32 No. 1 In Advantest Co., Ltd. (56) References JP-A-8-62284 (JP, A) JP-A 8-64644 (JP, A) JP2875953 (JP, B2) (58) Fields investigated (Int) .Cl. ⁷ , DB name) G01R 31/302 G01R 1/06

Claims (4)

(57) [Claims] 1. A light guide tube provided at one end with a support means for supporting a fixed electrode, a movable electrode facing the fixed electrode and forming a capacitance, and connected to one end of the light guide tube. An elastic body that supports the light guide tube; a first metal film that joins the light guide tube and the elastic body; an electro-optic conversion element provided at the other end of the light guide tube; A probe connected to an element; an insulator provided between the support means and the elastic body; and a bond between the support means and the insulator and between the insulator and the elastic body. A second metal film having a lower melting point than the first metal film, wherein the elastic body extends from the outer frame toward a center of the light guide tube; A plurality of first beams; a plurality of second beams extending from the first beams in a direction perpendicular to the first beams; A thin plate integrally formed with an inner frame connected to a second beam and installed around the light guide tube; the first beam is connected to the outer frame or the inner side via a second beam; A measurement probe which is connected to a frame. 2. A supporting means for supporting a fixed electrode; a hollow light guide tube provided at one end with a movable electrode facing the fixed electrode to form a capacitor; and a light guide tube connected to one end of the light guide tube. An elastic body that supports the light guide tube; a first metal film that joins the light guide tube and the elastic body; an electro-optic conversion element provided at the other end of the light guide tube; A probe connected to an element; an insulator provided between the support means and the elastic body; and a bond between the support means and the insulator and between the insulator and the elastic body. A second metal film having a lower melting point than the first metal film, wherein the elastic body is bonded to the insulator and connected to the outer frame, and is directed toward a center of the light guide tube. A plurality of extended first beams, each of which is connected to the plurality of first beams and has a shorter beam length than the first beams; 2 is a thin plate integrally formed with an inner frame body connected to the second beam and installed around the light guide tube, and the second beam is oriented in the direction of the first beam. A measurement probe characterized by being bent from a shape. A supporting means for supporting the fixed electrode; a hollow light guide tube provided at one end with a movable electrode facing the fixed electrode to form a capacitance; and a light guide tube connected to one end of the light guide tube. An elastic body that supports the light guide tube; a first metal film that joins the light guide tube and the elastic body; an electro-optic conversion element provided at the other end of the light guide tube; A probe connected to an element; an insulator provided between the support means and the elastic body; and a bond between the support means and the insulator and between the insulator and the elastic body. A second metal film having a lower melting point than the first metal film, wherein the elastic body is bonded to the insulator, and is connected to the outer frame and is directed toward a center of the light guide tube. A plurality of extending beam portions, and an inner frame connected to the beam portions and installed around the light guide tube are integrally formed. Measuring probe, characterized in that the made thin, the beam portion is S-shaped curved shape extending to the outer frame portion from said inner frame. 4. A supporting means for supporting the fixed electrode, a hollow light guide tube provided at one end with a movable electrode facing the fixed electrode and forming a capacitance, and connected to one end of the light guide tube. An elastic body that supports the light guide tube; a first metal film that joins the light guide tube and the elastic body; an electro-optic conversion element provided at the other end of the light guide tube; A probe connected to an element; an insulator provided between the support means and the elastic body; and a bond between the support means and the insulator and between the insulator and the elastic body. A second metal film having a lower melting point than the first metal film, wherein the elastic body is bonded to the insulator, and is connected to the outer frame and is directed toward a center of the light guide tube. A plurality of extending beam portions, and an inner frame connected to the beam portions and installed around the light guide tube are integrally formed. Measuring probe, characterized in that the made thin, the beam portion is an arc-shaped curved shape extending to the outer frame portion from said inner frame.