JP3313693B2 - Hot plate unit for semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot plate unit for a semiconductor manufacturing apparatus .

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, for example, when a silicon wafer having undergone a photosensitive resin coating step is heated and dried, an apparatus called a hot plate unit is usually used. The conventional example is shown in FIG.

The hot plate unit 41 includes a casing 42 having a bottom and a hot plate 43 made of a ceramic sintered body. The casing 42 is made of a metal material such as aluminum, and has an opening 44 at an upper portion thereof. On the lower surface of the hot plate 43, a resistor 45 having a predetermined pattern is formed, and on the upper surface, a silicon wafer W1, which is an object to be heated, is placed. Screw holes 46 are provided in a plurality of places on the outer peripheral portion of the hot plate 43, and a through hole 47 is formed in the upper edge of the opening of the casing 42 corresponding to the screw holes 46. Then, a screw 48 is inserted into the screw hole 46 and the through hole 47.
Into the hot plate 4
3 is fixed to the upper edge of the opening of the casing 42.

[0004]

However, in the case of the conventional hot plate unit 41, a metal casing 4 is required.
2, the fastening means such as the screw 48 is provided with the holes 46, 4
7 and is fastened. Therefore, the heat of the hot plate 43 was easily transmitted to the casing 42 via the screw 48. As a result, there is a problem that the outer peripheral temperature of the hot plate decreases.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a hot plate unit capable of obtaining a hot plate having excellent temperature uniformity.

[0006]

In order to solve the above-mentioned problems, according to the first aspect of the present invention, a hot plate made of a ceramic sintered body having a resistor is provided at an opening of a casing. A hot plate unit, wherein the hot plate is arranged with respect to an outer peripheral portion of the hot plate.
And a locking piece for locking the size of the opening.
With a locking device that is a ring-shaped spring material of the appropriate size
Fixed will be through the thermal insulation seal ring into the opening of the casing, the inner peripheral surface of the heat-insulating seal ring
For horizontally supporting the outer periphery of the lower surface of the hot plate
The gist is that the supporting step is formed over the entire circumference .

[0007]

[0008] The invention according to claim 2 is a method for opening a casing.
A hot pump made of ceramic sintered body with a resistor
A hot plate unit with a rate
The hot plate is located at an outer peripheral portion of the hot plate.
And a locking piece that locks with respect to the circumference of the opening.
The above-mentioned casing is provided by a locking member which is a spring material having a length less than 1 /
Fixed through a heat-insulating seal ring
Hot on the inner peripheral surface of the heat insulating seal ring.
Support step for horizontally supporting the outer periphery of the lower surface of the plate
The gist is that the part is formed over the entire circumference .

[0009] The invention described in claim 3 is based on claim 1 or
3. The hot plate unit for a semiconductor manufacturing apparatus according to claim 2 , wherein the material for forming the heat-insulating seal ring is a fluororesin.

[0010] The invention described in claim 4 is claim 1 or claim 3.
3. The hot plate unit for a semiconductor manufacturing apparatus according to claim 2 , wherein a material for forming the heat insulating seal ring is a polyimide resin or a polybenzimidazole resin.

Hereinafter, the "action" of the present invention will be described. According to the first aspect of the present invention, since the hot plate is fixed to the casing via the heat-insulating seal ring , the heat of the hot plate is not easily transmitted to the metal casing, and the temperature of the outer peripheral portion of the hot plate is reduced. Can be prevented from decreasing. Also, use one locking tool
The advantage is that fewer parts are required
is there.

[0012]

According to the second aspect of the present invention, the locking pieces of each spring material are locked at a plurality of locations separated from the outer peripheral portion of the hot plate. At this time, the hot plate is securely clamped and fixed to the opening of the casing by a suitable spring force acting on each locking piece. Further, if a plurality of small locking tools are used as in this configuration, the deformation of the locking tool itself, which is likely to occur when only one large locking tool is used, is avoided. Therefore, a more suitable spring force is obtained,
More secure fixing of the hot plate is achieved.

According to the third aspect of the present invention, since the material for forming the heat-insulating seal ring is a fluororesin, the heat-insulating seal ring has higher heat resistance, insulation and flame retardancy. According to the fourth aspect of the present invention, the heat insulating seal is provided.
The material for forming the ring is a polyimide resin or a polybenzimidazole resin. Therefore, the heat-insulating seal phosphorus
In addition to having high heat resistance, insulation properties and flame retardancy, the rubber is less likely to be thermally deformed than fluororesin or the like. Therefore, the ceramic sintered body hot plate does not tilt even at a high temperature of 200 ° C. or higher. The semiconductor wafer is directly placed on a hot plate made of a ceramic sintered body, or 50 to
Heating is performed indirectly at a distance of 200 μm, but if the hot plate is tilted, the uniformity of the semiconductor wafer is reduced. Polyimide resins and polybenzimidazole resins are advantageous because they hardly undergo thermal deformation even at high temperatures of 200 ° C. or higher.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A hot plate unit 1 according to a first embodiment of the present invention will now be described in detail with reference to FIGS.

The hot plate unit 1 shown in FIGS. 1 to 3 includes a casing 2 and a hot plate 3 as main components. The casing 2 is a metal member having a bottom (in this case, an aluminum member), and has an opening 4 having a circular cross section on an upper side thereof. Pin insertion sleeves 5 through which lift pins (not shown) are inserted are provided at three places at the center of the bottom 2 a of the casing 2. These lift pins raise and lower the silicon wafer W1 while supporting the silicon wafer W1 at three points. A hot plate 3 is provided on the outer periphery of the bottom 2a.
A lead wire drawing hole 7 for inserting a lead wire 6 for supplying a current to the lead wire is formed. A seal packing 8 is mounted in the lead wire drawing hole 7. Each lead wire 6
Is inserted through the through hole of the seal packing 8 and is drawn out of the casing 2.

The hot plate 3 of the present embodiment is formed by coating the silicon wafer W1 coated with the photosensitive resin with 200 to 300.
This is a low-temperature hot plate 3 for drying at a temperature of 0 ° C. The hot plate 3 is configured by providing a resistance pattern 10 as a resistor on a plate-like base material 9 made of a ceramic sintered body. This plate-shaped base material 9 is connected to the casing 2 via a heat insulating seal ring 14 described later.
Is installed in the opening 4. In addition, as shown in FIG. 3, in the present embodiment, the thickness 1 of the plate-shaped base material 9 is set to 3 mm. In addition to this value, the thickness l of the plate-shaped substrate 9 is set to 1 m
It may be changed to any value within the range of m to 10 mm.

As shown in FIG. 1, hot plate 3
The plate-shaped base material 9 constituting the casing 2 has a circular shape.
It is designed to have a slightly smaller diameter than the external dimensions of.
The resistance pattern 10 is formed concentrically or spirally on the lower surface side of the plate-shaped substrate 9. In the center of the hot plate 3, pin insertion holes 11 are provided at three positions corresponding to the respective lift pins.

As the ceramic sintered body constituting the plate-shaped substrate 9, it is preferable to select a nitride ceramic sintered body having excellent heat resistance and high thermal conductivity.
As the nitride ceramic, for example, aluminum nitride,
A sintered body of a metal nitride ceramic such as silicon nitride, boron nitride, titanium nitride or the like is preferable, and an aluminum nitride sintered body is particularly preferable. The reason is that the thermal conductivity is the highest in the above-mentioned sintered body. In addition to these, a sintered body of a metal carbide ceramic such as silicon carbide, zirconium carbide, titanium carbide, tantalum carbide, tungsten carbide, or the like may be selected.

The resistance pattern 10 according to the present embodiment is formed by baking a conductive paste on a plate-like base material 9 which is a sintered body. As the conductive paste, those containing metal particles, metal oxides, resins, solvents and the like are generally used. Suitable metal particles used for the conductive paste include, for example, gold, silver, platinum, palladium, lead, tungsten, nickel and the like. This is because these metals are relatively unlikely to be oxidized even when exposed to a high temperature, and have a sufficient resistance value to generate heat when energized. Suitable metal oxides used for the conductive paste include, for example, metal oxides such as lead oxide, zinc oxide, silica, boron oxide, alumina, yttria, and titania.

As shown in FIG.
A pad 10a as an external connection terminal is formed at the end of the zero. The base ends of the terminal pins 12 made of a conductive material are soldered to these pads 10a. As a result, electrical continuity between each terminal pin 12 and the resistance pattern 10 is achieved. On the other hand, a socket 6 a at the tip of the lead wire 6 is fitted to the tip of each terminal pin 12. Therefore, the lead wire 6 and the terminal pin 12
As a result, a current is supplied to the resistance pattern 10 via the resistor pattern 10, so that the temperature of the resistance pattern 10 rises and the entire hot plate 3 is heated.

As shown in FIG. 3, a plurality of screw holes 13 are provided in the upper edge of the opening 4 of the casing 2 at equal intervals, and a heat insulating seal ring 14 as a heat insulating seal member is provided. It is arranged. Heat-insulating seal ring 14
Similarly, a plurality of screw holes 15 are also provided at locations corresponding to the screw holes 13. Heat-insulating seal ring 1
A support step 16 for horizontally supporting the outer peripheral portion on the lower surface side of the hot plate 3 is formed on the entire inner periphery of the inner peripheral surface of the hot plate 3. When the hot plate 3 is supported by the supporting step 16, the height of the upper end surface of the heat insulating seal ring 14 and the height of the upper surface of the hot plate 3 are substantially the same.

As the heat insulating seal ring 14, an inorganic fiber heat insulating material such as ceramic fiber and glass wool, a porous resin such as a urethane foam resin and a foamed styrene resin, or a fluororesin can be used. In particular,
When ceramic fibers are used, it is advantageous to use those hardened with an inorganic binder in view of the low thermal conductivity. Specifically, it is preferable to use ceramic sol (available from Ibiden, trade name: ibiwool) hardened using silica sol or alumina sol.

When a fluororesin is used for the heat-insulating seal ring 14, there is an advantage that it is excellent in heat resistance, insulation and flame retardancy. As for heat resistance, there is a characteristic that the operating temperature range is wider than that of general-purpose synthetic resins. In addition, with respect to the insulating property, there is a characteristic that the dielectric loss is small and the insulation resistance is large. Furthermore, regarding flame retardancy,
There is a characteristic that it does not burn in air or in a gas having an oxygen concentration of 95% or less. More specifically, the fluororesin is polytetrafluoroethylene (ethylene tetrafluoride resin, PTFE), ethylene tetrafluoride-perfluorovinyl ether copolymer (PFA),
There are propylene hexafluoride copolymer (FEP), ethylene tetrafluoride-ethylene copolymer (ETFE), polyvinylidene fluoride (PVdF), and ethylene trifluorochloride resin (PCTFE).

As shown in FIG. 3, in this embodiment, the thickness L of the heat insulating seal ring 14 is set to 7 mm. In addition to this value, the thickness L of the heat-insulating seal ring 14 may be changed to any value within a range of 1 mm to 10 mm.

The bottom 2a of the casing 2 is provided with a fluid supply port 17 and a fluid discharge port 18 for communicating the inside and outside of the casing 2 with each other. Air as a fluid is supplied to the sealed space S1 in the casing 2 from the fluid supply port 17, and the air is discharged to the outside of the sealed space S1 from the fluid discharge port 18.

Next, the mounting structure of the hot plate 3 in the hot plate unit 1 of the present embodiment will be described. The hot plate unit 1 further includes a locking ring 21 as a locking tool. The locking ring 21 has an annular main body 22, a plurality of screw holes 23, and a plurality of locking pieces 24. The main body 22 includes the casing 2
Is a ring-shaped spring material having a size corresponding to the size of the opening 4 of FIG. The screw holes 23 are formed at equal intervals in the main body 22. These screw holes 23 are located at positions corresponding to the respective screw holes 15 on the heat-insulating seal ring 14 side. Each of the screw holes 15 and 23 has a screw 2 as a fastening means for fixing the locking ring 21 to the upper end surface of the heat-insulating seal ring 14.
5 are respectively inserted. The locking pieces 24 that can be locked to the outer peripheral portion of the hot plate 3 protrude at a plurality of spaced apart locations (here, six locations) on the inner peripheral edge of the main body 22. As shown by a dashed line in FIG.
4 may be slightly bent toward the lower surface of the main body 22. The above-described locking ring 21 can be relatively easily manufactured by punching a spring steel material or the like having a thickness of about 1 mm to 3 mm into a predetermined shape.

With the locking ring 21 disposed, each screw 2
5, the spring force (elastic return force) generated against the tightening force acts on each locking piece 24, and the locking pieces 24 press the hot plate 3 from above along the thickness direction. I do. As a result, the outer peripheral portion of the hot plate 3 is sandwiched between the locking pieces 24 and the heat-insulating seal ring 14 (specifically, the upper surface of the supporting step 16). In this way, the hot plate 3 is fixed to the casing 2 by the locking ring 21.

Next, a procedure for attaching the hot plate 3 using the locking ring 21 will be described. Prior to the mounting of the hot plate 3, the terminal pins 12 are soldered to the pads 10a of the plate-shaped substrate 9 in advance, and the sockets 6a of the lead wires 6 are attached to the respective terminal pins 12. The other end of the lead wire 6 is drawn out of the casing 2 through the lead wire drawing hole 7.

In this state, the heat insulating seal ring 14 is positioned and arranged on the upper surface of the opening 4 of the casing 2.
Further, the outer peripheral portion on the lower surface side of the plate-shaped base material 9 is supported by the supporting step 16, and the hot plate 3 is set horizontally on the heat-insulating seal ring 14. Next, the locking ring 21 is positioned and arranged on the upper surface side of the heat insulating seal ring 14. Thereafter, a screw 25 is inserted into each of the screw holes 13, 15, and 23 located coaxially, and the screw 25 is securely tightened to fix the three members 2, 14, and 21 so that they cannot be displaced from each other. I do. It can be understood that the means for fixing the heat insulating seal ring 14 to the casing 2 and the means for fixing the locking ring 21 to the casing 2 are shared.

When the above screwing is performed, each locking piece 24 of the locking ring 21 is engaged with the outer peripheral portion of the hot plate 3 on the upper surface side. As a result, the sandwiching and fixing of the hot plate 3 with respect to the heat insulating seal ring 14 is achieved. When the hot plate 3 is mounted as described above, the mounting of the hot plate unit 1 is completed.

Therefore, according to the present embodiment, the following effects can be obtained. (1) According to the present embodiment, the hot plate 3 is fixed to the opening 4 of the casing 2 via the heat-insulating seal ring 14. Therefore, it is possible to heat the outer peripheral portion of the hot plates 3, hardly transmitted to the casings grayed 2 via a screw 48 or the like. Therefore, it is possible to prevent the outer peripheral temperature of the hot plate from lowering, and to make the temperature of the processed surface of the silicon wafer W1 uniform.

In the hot plate unit 1 of the present embodiment, the hot plate 3 is mounted by using the locking ring 21 having the above structure as a locking tool. Therefore, each locking piece 24 of the locking ring 21 is
By fixing the hot plate 3 to the outer peripheral portion, the hot plate 3 is fixed. Therefore, unlike the related art, it is not necessary to form a screw hole for screw insertion in the outer peripheral portion of the hot plate 3. Therefore, it is possible to produce to Rukoto without the hot plate 3 drilling to the hard ceramic sintered body, it is possible to turn manufacturability and cost.

Further, since the hot plate 3 can be fixed without inserting any fastening means such as screws, no stress is applied to a specific portion, and the hot plate 3 is hardly damaged.

In addition, since the hot plate 3 is fixed in a sandwiched state, it is difficult for rattling to occur, and the hot plate 3 is securely fixed to the casing 2. (2) The locking ring 21 used in the present embodiment has a main body 22 made of a spring steel material having a size substantially equivalent to the size of the opening 4, and is provided at a plurality of separated locations in the main body 22. It has a locking piece 24. Therefore, each locking piece 24 is locked at a plurality of locations separated from the outer peripheral portion of the hot plate 3. At this time, the hot plate 3 is securely clamped and fixed to the opening 4 of the casing 2 via the heat insulating seal ring 14 by a suitable spring force acting on each locking piece 24.

Also, with this configuration, since only one locking ring 21 needs to be used, there is an advantage that the number of components can be reduced as compared with the case where a plurality of locking tools are used. Therefore, the assembling can be facilitated.

(3) Since fluorine resin is used as a material for forming the heat insulating seal ring 14, the heat insulating property, insulation property and flame retardancy of the heat insulating seal ring 14 can be improved.

Second Embodiment Next, a hot plate unit 1 according to a second embodiment of the present invention will be described with reference to FIG. Here, the points different from the first embodiment will be mainly described, and the common points will be denoted by the same reference numerals, and the description thereof will be omitted.

In the hot plate unit 1 of the present embodiment, the structure of the locking plate 31, which is a locking tool, is different from that of the first embodiment. That is, the main body 22 of the locking plate 31 used here does not have a ring shape,
In other words, the shape is such that a ring-shaped object is divided at a plurality of locations. Further, unlike the first embodiment, the hot plate 3 is fixed here using a plurality of (specifically, six) locking plates 31.

The main body 22 of each locking plate 31 is arc-shaped and made of spring steel, and has a length of 1/2 or less of the circumference of the opening 4 and a length of 1/50 or more (FIG. 4). Has a length of about 1/12). Further, it is more preferable that the length of the main body 22 is 3/10 to 1/20 of the circumference of the opening 4. Screw holes 23 are provided at both ends of the main body 22. The locking piece 24 is formed only at one end of the main body 22. These locking plates 31 are arranged at equal intervals, and a total of six locking pieces 24 press the hot plate 3 from above along the thickness direction.

Therefore, according to the present embodiment, the following effect can be obtained in addition to the effect described in the above (1) in the first embodiment. (4) In the present embodiment, the hot plate 3 is mounted using the six locking plates 31 having the above structure. Therefore, the locking pieces 2 of each locking plate 31
4 causes the hot plate 3 to be
To the opening 4 via a heat-insulating seal ring 14.

Further, if a plurality of small locking plates 31 are used as in this configuration, the deformation of the locking tool itself, which is likely to occur when only one large locking ring 21 is used as in the first embodiment, beforehand. To be avoided. Therefore, a more suitable spring force is obtained, and the hot plate 3 can be more securely fixed.

[Third Embodiment] Next, a third embodiment will be described. In the present embodiment, unlike the first embodiment, the material for forming the heat insulating seal ring 14 is a polyimide (PI) resin or a polybenzimidazole resin (PB).
I). The reason for using this polyimide resin is
This is because, in addition to being excellent in heat resistance, insulation properties and flame retardancy, it is also excellent in mechanical strength. In this embodiment, oxydianiline (ODA) and pyromellitic acid (PMD)
A) is used.

Therefore, according to the hot plate unit 1 of this embodiment, when each screw 25 is tightened when the hot plate 3 is fixed to the casing 2, the tightening force acts on the heat insulating seal ring 14. However, the heat insulating seal ring 14 made of a polyimide resin or a polybenzimidazole resin does not bend because of its high mechanical strength. Therefore, each of the screw holes 13 formed in the upper edge of the casing 2 is affected by the tightening force of the screw 25,
There is no displacement of the screw hole 15 formed in the heat insulating seal ring 14. As a result, each screw 25 can be inserted into each of the screw holes 13 and 15 without a sense of incompatibility.
5 can be prevented from becoming difficult to perform. At the same time, since the heat-insulating seal ring 14 is not bent by the tightening force of the screw 25, the hot plate 3 can be reliably horizontally supported.

Here, in the case where the heat insulating seal ring 14 made of a fluororesin and the heat insulating seal ring 14 made of a polybenzimidal resin are not provided, the temperature is raised to 200 ° C. and the hot plate 3 made of a ceramic sintered body is removed. The temperature difference T1 between the center and the outer periphery was measured. Further, the silicon wafer W1 is set at 10
The difference T2 between the highest temperature and the lowest temperature on the surface of the silicon wafer W1 when heated at 200 ° C. at a distance of 0 μm was measured.
The measurement results are shown in Table 1 below.

[0046]

[Table 1] According to Table 1, when the temperature of the hot plate 3 is raised to 200 ° C., the temperature difference T1 between the center and the outer periphery of the hot plate 3 made of a ceramic sintered body is 4 ° C. Therefore, the presence of the heat-insulating seal ring 14 made of polytetrafluoroethylene (tetrafluoroethylene resin) and the heat-insulating seal ring 14 made of polybenzimidal resin cause the temperature difference T1.
Can be made relatively small.

The heat insulating seal ring 14 made of polytetrafluoroethylene is considered to be thermally deformed at 200 ° C., and the hot plate 3 made of a ceramic sintered body is slightly inclined. As a result, it is estimated that the distance between the ceramic hot plate 3 and the silicon wafer W1 changes, and the temperature difference T2 between the highest temperature and the lowest temperature increases. On the other hand, since the polybenzimidal resin does not thermally deform even at 200 ° C., the temperature difference T2 is small and the silicon wafer W1 can be uniformly heated.

The embodiment of the present invention may be modified as follows. A locking piece 24 protruding from the main body 22 of the locking ring 21
Can be arbitrarily changed. The shape and number of the locking plates 31 can also be arbitrarily changed. Further, the number of the locking pieces 24 protruding from the main body 22 of the locking plate 31 may be two or more instead of one.

If a structure for fixing the locking ring 21 and the locking plate 31 to the casing 2 (or the heat insulating seal ring 14) side is separately provided, the screw 25 can be omitted.

A locking ring 21 or a locking plate 31
It is permissible to use not only a material having elasticity but also a material having no elasticity. The heat-insulating seal ring 14, which is an annular attachment, is formed of, for example, an elastic body, and a structure corresponding to the locking piece 24 of the locking tools 21, 31 is formed on a part of the heat-insulating seal ring 14 to protrude. Good. That is, the locking members 21 and 31 may be formed integrally with the heat insulating seal ring 14.

The portions that can be locked to the hot plate 3 in the locking members 21 and 31 need not be plate-like (that is, the locking pieces 24) as in the above-described embodiment, but may be rod-shaped or the like. Next, in addition to the technical ideas described in the claims, technical ideas grasped by the above-described embodiments are listed below together with their effects.

(1) The hot plate according to any one of claims 1 to 4 , wherein the hot plate is fixed to an opening of the casing via an annular attachment. (2) Any one of claims 1 to 4 and the technical idea (1)
Preferably, the locking tool has a plate-shaped main body, a screw hole which is provided through the main body and through which fastening means can be inserted, and a locking piece protruding from the main body. Therefore,
According to the invention described in the technical idea 2, the locking piece can be securely locked to the outer peripheral portion of the hot plate in a state where the main body is fixed to the casing using the fastening means.

(3) In the technical concept (1) or (2), a support step for supporting the hot plate is formed on an inner peripheral surface of the attachment. Therefore, according to the invention described in the technical concept (3), the hot plate is securely held and fixed by the locking piece and the upper surface of the supporting step.

(4) In the technical concept (2) or (3), the locking piece is slightly bent toward the lower surface of the main body. Therefore, according to the invention described in the technical idea 4, a larger spring force can be obtained, and more secure fixing can be achieved.

(5) Claims 1 to 4, Technical idea (1)
In (4), the hot plate is for heating and drying a silicon wafer. According to this configuration,
The temperature uniformity of the wafer heating surface can be improved.

[0056]

As described in detail above, according to the present invention,
Hot plate is secured by the locking piece and the upper surface of the supporting step
And a hot plate unit for a semiconductor manufacturing apparatus having excellent temperature uniformity.

[Brief description of the drawings]

FIG. 1 is a partially exploded perspective view of a hot plate unit according to a first embodiment.

FIG. 2 is a schematic sectional view of the same.

FIG. 3 is a partially enlarged sectional view of the same.

FIG. 4 is a partially exploded perspective view of a hot plate unit according to a second embodiment.

FIG. 5 is a partially enlarged cross-sectional view of a conventional hot plate unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Hot plate unit, 2 ... Casing, 3 ... Hot plate, 4 ... Opening, 10 ... Resistance pattern as a resistor, 14 ... Heat insulating seal ring (heat insulating seal member), 21 ... Locking member Locking ring, 24: locking piece as a part of locking tool, 31: locking plate as locking tool.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-7-130830 (JP, A) JP-A-4-87178 (JP, A) JP-A-6-37039 (JP, A) JP-A-6-37039 69326 (JP, A) JP 2001-118789 (JP, A) WO 99/25017 (WO, A1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 H01L 21/68 H05B 3/20 H05B 3/14

Claims (4)

(57) [Claims] 1. A hot plate unit comprising a ceramic sintered body hot plate having a resistor disposed in an opening of a casing, wherein the hot plate is
Has a locking piece that locks to the outer periphery of the hot plate
And a ring having a size substantially corresponding to the size of the opening.
The locking tool is Jo spring member will be secured through a heat insulating seal ring into the opening of the casing, the
On the inner peripheral surface of the heat-insulating seal ring, the lower surface of the hot plate
A support step for supporting the side outer periphery horizontally extends all around
A hot plate unit for a semiconductor manufacturing apparatus characterized by being formed as follows . 2. A casing having a resistor in an opening of a casing.
A hot plate with a hot plate made of
A hot plate unit, wherein the hot plate comprises:
Has a locking piece that locks to the outer periphery of the hot plate
And a spring material having a length equal to or less than half the circumference of the opening.
A heat-insulating seal is provided at the opening of the casing by a locking device.
The heat insulating seal
Water is applied to the inner peripheral surface of the ring,
Support steps for flat support are formed all around.
Hot play for semiconductor manufacturing equipment
Unit. 3. A material for forming the heat-insulating seal ring is a fluorine-containing material.
3. The resin according to claim 1 or 2,
A hot plate unit for a semiconductor manufacturing apparatus as described in the above. 4. A material for forming said heat-insulating seal ring is poly
Be an imide resin or polybenzimidazole resin
The semiconductor device according to claim 1 or 2, wherein
Hot plate unit for manufacturing equipment.