JP3314764B2 - Transport device and transport method for electronic component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer apparatus and a transfer method for an electronic component mounting apparatus, and more particularly, to a transfer apparatus and a transfer method.
The present invention relates to a transport device and a transport method for a mounting device that mounts electronic components on islands that sequentially reach a mounting work stage.

[0002]

2. Description of the Related Art A semiconductor pellet is bonded onto an island of a lead frame by a die bonder (mounting device). A transfer device for a die bonder transfers semiconductor pellets cut out of a wafer by suction nozzles and supplies the semiconductor pellets to islands of a lead frame. The transported semiconductor pellets are bonded to the island by a bonding tool corresponding to a die bonder. There is also known an apparatus in which a suction nozzle also serves as a bonding tool.

In the semiconductor pellet mounting process described above, since the islands that sequentially reach the mounting operation stage have a slight dimensional difference, the position of the transported semiconductor pellet (electronic component) with respect to each island is determined each time. Performs positioning with high accuracy while making fine adjustments. At the time of this positioning, the current island, which is the destination of the semiconductor pellet, is accurately measured using an image recognition device or the like, and the trajectory of the suction nozzle is calculated based on the position data.

[0004]

By the way, in the above-mentioned conventional transfer apparatus, the suction nozzle in a state where the semiconductor pellet is picked up is made to stand by, and the transfer is started after the accurate position data of the current island is given. I was
Therefore, until the position data is acquired, the suction nozzle that has picked up the semiconductor pellets simply stands by, and the existence of this waiting time makes it difficult to realize a higher speed of the bonding process.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a transfer apparatus and a transfer method for an electronic component mounting apparatus, which can further speed up processing such as bonding.

[0006]

In order to achieve the above object, a transport device for an electronic component mounting apparatus according to the present invention is provided for a mounting apparatus for mounting an electronic component on an island which sequentially reaches a mounting work stage. In the transfer device, position data detecting means for detecting position data of the island that has reached the mounting work stage, and electronic components from a transfer start position to a predetermined position of the mounting work stage prior to detection of the position data. Moving means for moving the electronic component, based on the position data, controlling the moving means during the movement of the electronic component, and trajectory control means for correcting the trajectory of the electronic component toward the island located on the mounting work stage. It is characterized by having.

In the transfer device for an electronic component mounting apparatus according to the present invention, the electronic component is moved to the island while correcting the trajectory of the electronic component based on the accurate position data on the current island acquired after the movement of the electronic component. It can be positioned accurately. Therefore, it is not necessary to wait the transfer tool holding the electronic components until the position data is acquired, so that the processing such as bonding can be further speeded up.

Here, in the present invention, it is preferable that the trajectory correction by the trajectory control means is started after a point in time when the moving electronic component changes from acceleration to deceleration. In this case, the influence of an impact or the like due to a change in acceleration when switching the trajectory is reduced.

Preferably, the trajectory of the electronic component is represented by a motion curve corresponding to one cycle of the sine wave, and the point at which the deceleration starts is a point corresponding to a half cycle of the sine wave. . In this case, since the trajectory correction is started after the moving electronic component is switched to the deceleration, the calculation of the corrected trajectory becomes easy.

Alternatively, instead of the above, the trajectory of the electronic component advances at a constant positive acceleration toward the point of time when the vehicle starts to decelerate, and becomes negative toward the island that has reached the mounting work stage from the point of time when the vehicle starts to decelerate. It is also a preferable embodiment that the movement path is represented by a moving trajectory that moves at a constant acceleration. Also in this case, since the trajectory correction is started after the moving electronic component is switched to the deceleration, the calculation of the corrected trajectory becomes easy.

According to the present invention, there is provided a method for mounting an electronic component on an island which sequentially reaches a mounting work stage. Prior to the detection of the position data, the electronic component is moved from the transport start position toward the predetermined position of the mounting work stage, and based on the position data during the movement of the electronic component, the electronic component is moved to the island located on the mounting work stage. It is characterized in that the trajectory of the electronic component is corrected toward the direction.

In the transport method for an electronic component mounting apparatus according to the present invention, the electronic component is moved onto the island while correcting the trajectory of the electronic component based on the accurate position data on the current island acquired after the movement of the electronic component. It can be positioned accurately. Therefore, it is not necessary to wait the transfer tool holding the electronic components until the position data is acquired, so that the processing such as bonding can be further speeded up.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail based on embodiments of the present invention with reference to the drawings. FIG.
FIG. 1 is a perspective view illustrating a configuration of a main part of an embodiment of a transport device according to the present invention.

The transfer device is provided with an X for arranging the wafer sheet 9.
A wafer stage (not shown) movable in the -Y direction,
A long lead frame 8, a camera 11 for recognizing a pellet position, a camera 12 for recognizing a frame position, a transport mechanism (not shown) having a suction nozzle (transport tool) 13 movably, and operation of each part. And a control unit 16 for performing overall control. The transfer device has a transfer function of transferring the semiconductor pellet 7 to the island 10 by the suction nozzle 13 and a function as a die bonder for bonding the semiconductor pellet 7 by a bonding tool (not shown). In this transfer device, the suction nozzle 13 may be configured to have both a function as a transfer tool and a function as a bonding tool.

The semiconductor sheet 7 cut out from the completed wafer is attached to the wafer sheet 9 in an arrangement in the state of the wafer before cutting, and is supplied to the wafer stage.
The lead frame 8 has a plurality of islands 10 formed at equal intervals in the longitudinal direction, moves on a rail (not shown) by a predetermined distance in the direction of arrow a, and mounts the islands 10 on which the semiconductor pellets 7 are to be mounted on the mounting work stage. S are sequentially reached.

The pellet position recognizing camera 11 confirms the position of the semiconductor pellet 7 located at the suction position A by the suction nozzle 13 on the wafer stage 9 and is positioned vertically above the suction position A on the wafer stage 9. Will be arranged. The frame position recognition camera 12 confirms the exact position of the island 10 located on the mounting work stage S and sends the image data to the position data calculation circuit 19.
The mounting work stage S on the lead frame 8 is disposed vertically above.

The transport mechanism raises the suction nozzle 13 from the suction position A to an ascending position B (transfer start position) by rotation of a motor (not shown).
After reaching the target position E vertically above the island 10 facing the upper island 10, it is lowered toward the bonding proper position Fb vertically below the target position E.

The control section 16 includes a drive circuit 17, a position data calculation circuit 19, and a trajectory correction circuit 18. The drive circuit 17 gives a command to the transport mechanism to move the suction nozzle 13 between the suction position A and the proper bonding position Fb. The position data calculation circuit 19 calculates the accurate position of the island 10 located on the mounting work stage S based on the image data of the frame position recognition camera 12 after the suction nozzle 13 starts moving from the suction position A. I do.

The trajectory correcting circuit 18 detects that the suction nozzle 13 has passed a passing position C substantially intermediate between the ascending position B and the target position E, and then adds the position data calculated by the position data calculating circuit 19 to the position data. Based on this, the trajectory of the suction nozzle 13 by the drive circuit 17 is corrected so as to face the target position E.

The frame position recognizing camera 12 and the position data calculating circuit 19 constitute position data detecting means, the driving circuit 17 and the transport mechanism constitute moving means, and the trajectory correcting circuit 18 constitutes trajectory controlling means. .

The suction position A, the rising position B, the passing position C, the virtual bonding proper position Fa set on the mounting work stage S, the virtual position D vertically above the virtual bonding proper position Fa, the target position E, and Each point indicating the bonding proper position Fb for actually performing the bonding is indicated by the nozzle tip of the suction nozzle 13, that is, the position of the semiconductor pellet 7 itself. Each position such as the ascending position B and the passing position C can be defined based on, for example, the rotation speed of a stepping motor (not shown) provided in the transport mechanism driven by the drive circuit 17.

Next, the operation of the transport device having the above configuration will be described with reference to FIGS. 2 to 4 show the suction nozzle 1 in the Y direction when moving from the rising position B to the target position E.
FIG. 2 shows the relationship between time and acceleration, FIG. 3 shows the relationship between time and speed, and FIG. 4 shows the relationship between time and distance, respectively. In FIG. 2, the motion curve is indicated by a cycloid curve, and a series of acceleration changes are represented as one cycle of a sine wave.

First, when power is turned on and an operation for starting supply of semiconductor pellets is performed, the wafer stage
In the −Y direction, the semiconductor pellets 7 attached on the wafer sheet 9 move to the suction position A in the order of their alignment. Next, the suction nozzle 13 starts operating in response to a command from the drive circuit 17, sucks the semiconductor pellet 7 at the suction position A, and rises vertically (Z direction) toward the rising position B. During this time, the lead frame 8 moves in the direction of arrow a so that the island 10 to be bonded this time is positioned on the mounting work stage S.

The control unit 16 includes a position data calculation circuit 19
However, the image data of the island 10 obtained by the frame position recognition camera 12 is fetched from the time when the suction nozzle 13 starts to move to the ascending position B, and based on the image data. The position data of the island 10 to be mounted this time is calculated.

When the suction nozzle 13 reaches the ascending position B,
The direction is changed in the Y direction without stopping, and the conveyance of the semiconductor pellet 7 is continued with the target of the predetermined virtual position D facing the virtual bonding proper position Fa of the mounting work stage S. The position measurement including the calculation of the position data of the island 10 is not completed at least when the suction nozzle 13 reaches the rising position B.

The suction nozzle 13 gradually increases the acceleration from the ascending position B toward an intermediate point between the ascending position B and the passing position C, and the acceleration approaches 0 after passing through the intermediate point to the passing position C (FIG. 2). ). This is because in FIG. 3, the speed gradually increases from the ascending position B toward the passing position C, and in FIG. Extend the distance.

If accurate position data of the current island 10 is obtained before the suction nozzle 13 reaches the passage position C, the trajectory correction circuit 18 outputs a trajectory correction command to the drive circuit 17 and Standard transport trajectory 14 set to
From the passing position C, the corrected transport path 15
The suction nozzle 13 is directed to the target position E while correcting the trajectory set as.

If the suction nozzle 13 remains at the standard transport trajectory 14, the phase after the passage position C is inverted from the phase before the passage, but the suction nozzle 13 has been changed to the corrected transport trajectory 15.
The vehicle heads for the target position E in accordance with the motion curves having different acceleration magnitudes and different times for the acceleration change (FIG. 2). This is because, in FIG. 3, the suction nozzle 13 after the passing position C decelerates more slowly than in the case of the standard transport trajectory 14, and in FIG.
The reach is longer than the reach.

The controller 16 moves the suction nozzle 13 to the target position E along the corrected transport trajectory 15, and after accurately positioning the suction nozzle 13 at the target position E, lowers the suction nozzle 13 vertically and moves the suction nozzle 13 to the mounting work stage S. Is accurately positioned with respect to the island 10 to be formed. After this positioning, the suction nozzle 13 stops suction, releases the semiconductor pellet 7 and places it on the island 10. Next, a bonding tool (not shown) bonds the semiconductor pellet 7 to the island 10.

From the viewpoint of drive control of the suction nozzle 13, it is desirable that changes in acceleration, speed, and distance at the time of switching the motion curve at the passing position C be sufficiently small. To realize this, in the present embodiment, the suction nozzle 1
The motion curve of No. 3 is represented by one cycle of a sine wave, and the time of orbit correction is set to a time corresponding to a half cycle. Therefore,
Since the correction of the trajectory is started after the time when the suction nozzle 13 changes from the acceleration to the deceleration and reaches the acceleration 0, the calculation of the corrected trajectory becomes easy, and the influence of the impact due to the change in the acceleration at the time of the trajectory switching becomes easy. Becomes smaller.

As described above, in this embodiment, prior to acquiring the position data of the island 10 located on the mounting work stage S, the suction nozzle is moved toward the virtual position D which is a predetermined position on the mounting work stage S. 13 can be moved, and the target position E can be accurately reached while correcting the initial standard transport trajectory 14 based on the position data acquired during the movement. This eliminates the need for the conventional waiting time of waiting at the ascending position B until the position data is acquired, so that the bonding process can be further speeded up.

Here, prior to the acquisition of the position data, the movement of the suction nozzle 13 is started, and once stopped at the virtual position D, the position data is acquired. Control to correct the trajectory is also conceivable. However, in this case, it is necessary to wait at the virtual position D until the position data can be acquired, so that the throughput is not improved.

In the present embodiment, the trajectory is corrected with the passing position C, ie, an intermediate point corresponding to a half cycle of the sine wave, as the time of the state change. You can also. For example, 1/4 of a sine wave
The trajectory is corrected at the time corresponding to the cycle or the time corresponding to the ３ cycle of the sine wave, respectively. Also in these cases, an operation and effect that the trajectory calculation becomes easy can be obtained.

The suction nozzle 13 shown in FIGS.
The trajectory shown in FIGS. 5 to 7 can be adopted in place of the trajectory of FIG. 5 to 7 show another example of a change in the movement of the suction nozzle 13 from the rising position B to the target position E. FIG. 5 shows the relationship between time and acceleration, and FIG. 6 shows the relationship between time and speed. Numeral 7 represents a change in movement in relation to time and distance.

In this example, the suction nozzle 13 is moved from the rising position B to the passing position C at a constant positive acceleration (FIG. 5).
The speed is increased linearly (FIG. 6), and the distance is extended while drawing a gentle line (FIG. 7). When the current position data of the island 10 is obtained before reaching the passing position C, the trajectory correcting circuit 18 corrects the standard transport trajectory 14 initially set in the drive circuit 17 from the time when the trajectory C is reached. The target position E is defined as a transport path 15 with negative constant acceleration (FIG. 5), linearly decelerating (FIG. 6), and drawing a gentle line.
Increase the distance (Fig. 7). In this case, the suction nozzle 13
Since the correction of the trajectory is started after switching to the deceleration, the calculation of the corrected trajectory becomes easy, and the influence of the impact due to the acceleration change at the time of the trajectory switching is reduced.

In this embodiment, as shown in FIG.
Although the example of moving linearly between the ascending position B and the target position E has been described, the present invention is not limited to this. For example, as shown in FIG. 8 showing another movement trajectory, when the movement trajectory from the ascending position B to the target position E is curved when viewed from above, the movement in the Y direction component is the same as the linear trajectory described above. The same is true. In this case, the same operation and effect as described above can be obtained.

In this embodiment, the ascending position B is the transfer start position according to the present invention. However, if the suction nozzle 13 is not moved up and down, the suction position A is the transfer start position. In this case, the virtual bonding proper position Fa becomes the virtual position as it is.

As described above, the present invention has been described based on the preferred embodiment. However, the transport device and the transport method for the electronic component mounting apparatus of the present invention are limited only to the configuration of the above-described embodiment. Instead, a transfer device and a transfer method for an electronic component mounting apparatus in which various modifications and changes have been made from the configuration of the above embodiment are also included in the scope of the present invention.

[0039]

As described above, according to the transfer device and the transfer method for an electronic component mounting apparatus of the present invention, it is possible to further speed up the processing such as bonding.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a main part of an embodiment of a transfer device according to the present invention.

FIG. 2 is a graph showing a change in acceleration of a suction nozzle according to the embodiment.

FIG. 3 is a graph showing a change in speed of a suction nozzle according to the embodiment.

FIG. 4 is a graph showing a change in distance of a suction nozzle according to the embodiment.

FIG. 5 is another graph showing a change in the acceleration of the suction nozzle in the embodiment.

FIG. 6 is another graph showing a change in speed of the suction nozzle in the embodiment.

FIG. 7 is another graph showing a change in the distance of the suction nozzle in the embodiment.

FIG. 8 is a diagram schematically showing another movement locus of the suction nozzle in the embodiment.

[Explanation of symbols]

 7: Semiconductor pellet 8: Lead frame 9: Wafer sheet 10: Island 11: Pellet position recognition camera 12: Frame position recognition camera 13: Suction nozzle 16: Control unit 17: Drive circuit 18: Trajectory correction circuit 19: Position data Calculation circuit A: Suction position B: Ascent position C: Passing position D: Virtual position E: Target position Fa: Virtual bonding proper position Fb: Bonding proper position S: Mounting work stage

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/52 H01L 21/60 H05K 3/34 H05K 13/02 B23P 19/00

Claims (5)

(57) [Claims] 1. A transport device for a mounting device that mounts electronic components on an island that sequentially reaches a mounting work stage, wherein: a position data detecting unit that detects position data of the island that has reached the mounting work stage; Prior to the detection of the position data, moving means for moving the electronic component from the transfer start position to a predetermined position on the mounting work stage, and controlling the moving means during the movement of the electronic component based on the position data. And a trajectory control means for correcting the trajectory of the electronic component toward the island located on the mounting work stage. 2. The transport device for an electronic component mounting apparatus according to claim 1, wherein the trajectory correction by said trajectory control means is started after a lapse of a point in time when the moving electronic component changes from acceleration to deceleration. 3. The trajectory of an electronic component is represented by a motion curve corresponding to one cycle of a sine wave, and the point at which the vehicle starts to decelerate is:
3. A point corresponding to a half cycle of the sine wave.
A transport device for an electronic component mounting device according to claim 1. 4. The trajectory of the electronic component advances at a positive constant acceleration toward the time point of the deceleration, and advances at a negative constant acceleration toward the island that has reached the mounting work stage from the time point of the deceleration. Trajectory,
A transport device for the electronic component mounting device according to claim 2. 5. A transport method for a mounting apparatus for mounting an electronic component on an island that sequentially reaches a mounting work stage, comprising: detecting a position data of the island that has reached the mounting work stage from a transfer start position; Moving the electronic component toward a predetermined position of the mounting work stage, and correcting a trajectory of the electronic component toward an island located on the mounting work stage based on the position data while the electronic component is moving. Transport method for an electronic component mounting apparatus.