JP3316281B2 - Back protector for laser processing - Google Patents
Back protector for laser processingInfo
- Publication number
- JP3316281B2 JP3316281B2 JP29047093A JP29047093A JP3316281B2 JP 3316281 B2 JP3316281 B2 JP 3316281B2 JP 29047093 A JP29047093 A JP 29047093A JP 29047093 A JP29047093 A JP 29047093A JP 3316281 B2 JP3316281 B2 JP 3316281B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- back side
- hole
- laser light
- processing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laser Beam Processing (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はレーザによるガスタービ
ンブレードの冷却用穴明け加工等においての裏面側部材
の損傷防止に適用されるレーザ加工用バックプロテクタ
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a back protector for laser processing which is used to prevent damage to a back surface side member in drilling for cooling a gas turbine blade using a laser.
【０００２】[0002]
【従来の技術】従来ガスタービンブレード翼は、高温に
さらされる為、翼に多数の穴を明け冷却する必要があ
る。これらの穴は、穴径が大きく（１〜２mm程度）、穴
の長さが比較的長く（１０mmを越える。）、表面に対す
る穴角度が大きく、かつ厳しい寸法精度が要求される。
また加工性に劣る耐熱合金である為、一般には放電加工
による穴明け加工が行なわれているが、近年図９に示す
ようなレーザ光２によるレーザ加工が検討されている。2. Description of the Related Art Conventionally, gas turbine blade blades are exposed to high temperatures and need to be cooled by drilling a number of holes in the blades. These holes require a large hole diameter (about 1 to 2 mm), a relatively long hole (over 10 mm), a large hole angle with respect to the surface, and strict dimensional accuracy.
In addition, since it is a heat-resistant alloy having poor workability, drilling is generally performed by electric discharge machining. In recent years, laser machining using a laser beam 2 as shown in FIG. 9 has been studied.
【０００３】[0003]
【発明が解決しようとする課題】上記従来のレーザ加工
において、穴４の精度をよくするため強力な細径のＹＡ
Ｇレーザ光２をブレード１に当て穴明け加工を行う場
合、貫通ビーム１４が裏面側の部材１６に達し、そこを
損傷することがあり、さらには裏面側の部材で反射され
たレーザ光２により貫通穴部の裏面側から再加工される
問題があった。In the above conventional laser processing, a powerful thin YA is used to improve the accuracy of the hole 4.
For drilling by applying G laser beam 2 to blade 1
In such a case , the penetrating beam 14 reaches the member 16 on the back side and may damage the member, and is further reflected by the member on the back side.
There was a problem that the laser beam 2 was used to rework from the back side of the through hole .
【０００４】[0004]
【課題を解決するための手段】本発明は上記課題を解決
するため次の手段を講ずる。The present invention employs the following means to solve the above-mentioned problems.
【０００５】すなわち、レーザ加工用バックプロテクタ
として、固体レーザ光で穴明け加工を行う金属からなる
加工対象材の加工面の裏側に沿って設けられ、加工面を
貫通し透過する固体レーザ光を減衰させる半透明部材
と、同半透明部材の裏側に沿って設けられ、半透明部材
を透過した固体レーザ光を拡散反射させるとともに、加
工面裏側に近接して配置された他の部材を保護できる銅
材からなる反射部材とを設けるものとした。That is, a back protector for laser processing is provided along the back side of a processing surface of a material to be processed made of a metal to be drilled with solid laser light, and attenuates the solid laser light penetrating and transmitting through the processing surface. A semi-transparent member that is provided along the back side of the semi-transparent member to diffusely reflect the solid-state laser light transmitted through the translucent member ,
Copper that can protect other members located near the back of the surface
And a reflection member made of a material .
【０００６】[0006]
【作用】上記手段において、耐熱合金鋼等の金属からな
る加工対象材の加工面にＹＡＧレーザ等の固体レーザ光
により穴あけ加工する場合、加工面にレーザ光を当てる
と、加工面を貫通したレーザ光は半透明部材で減衰さ
れ、次に反射部材で拡散反射され、さらに半透明部材に
入射した反射レーザ光は半透明部材で減衰されて貫通穴
の裏面部に帰る。この裏面部に帰ってきた反射レーザ光
は、大幅に減衰しているため、貫通穴部が裏面側から再
加工され、穴の形状が変形する恐れはない。また、反射
部材が固体レーザ光の波長領域で反射率の高い銅材で形
成されているので、半透明部材を透過した固体レーザ光
が反射部材の裏側には到達せず、ブレードのように加工
面の裏に近接して他の部材が配置されていても不用意に
加工されることがない。 In the above means, when drilling a processing surface of a processing target material made of a metal such as a heat-resistant alloy steel with a solid-state laser beam such as a YAG laser, a laser beam is applied to the processing surface and a laser penetrating the processing surface is used. The light is attenuated by the translucent member, then diffusely reflected by the reflecting member, and the reflected laser light incident on the translucent member is attenuated by the translucent member and returns to the back surface of the through hole. Since the reflected laser light returned to the back surface is greatly attenuated, the through-hole portion is reworked from the back surface side, and there is no possibility that the shape of the hole is deformed. Also reflection
The member is made of copper material with high reflectivity in the wavelength range of solid-state laser light.
Solid-state laser light transmitted through a translucent member
Does not reach the back side of the reflective member and is processed like a blade
Even if other members are placed close to the back of the surface, carelessly
There is no processing.
【０００７】また、加工面の裏側に近接した他の部材が
あっても、反射部材でレーザ光は反射されるため、そこ
に到達しない。従って他の部材が不用意に加工される恐
れもなくなる。Further, even if there is another member close to the back side of the processing surface, the laser light is reflected by the reflection member and does not reach there. Therefore, there is no possibility that other members are carelessly processed.
【０００８】このようにして、加工対象材の、目的の加
工面部のみを高精度に加工することができるようにな
る。[0008] In this manner, the processing target material, it is possible to process only the high precision machining surface of interest.
【０００９】[0009]
【実施例】上記記載の本発明の一実施例を図１〜図８に
より説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention described above will be described with reference to FIGS.
【００１０】図１および図２にて、加工対象のブレード
１の加工面ａの裏側ｂに沿って、ポリテトラフルオロエ
チレン（テフロン）薄板等の半透明部材１０が設けられ
る。さらに半透明部材１０の裏側に沿って反射部材９が
設けられる。反射部材９としては表面に拡散反射用の凹
凸ｃを有する銅材等を使用する。1 and 2, a translucent member 10 such as a polytetrafluoroethylene (Teflon) thin plate is provided along a back side b of a processing surface a of a blade 1 to be processed. Further, a reflection member 9 is provided along the back side of the translucent member 10. As the reflection member 9, a copper material having unevenness c for diffuse reflection on the surface is used.
【００１１】上記のブレード１を加工のためセットした
全体斜視図を図３に示す。図中、３はバックプロテク
タ、４は冷却穴、５は加工ヘッド、６は固定治具、７は
固定台、８は先端ノズルである。FIG. 3 is an overall perspective view of the blade 1 set for processing. In the figure, 3 is a back protector, 4 is a cooling hole, 5 is a processing head, 6 is a fixing jig, 7 is a fixing stand, and 8 is a tip nozzle.
【００１２】以上において、先端ノズル８から細いビー
ムのＹＡＧレーザ光２がブレード１の加工面ａの所定位
置に照射される。すると加工面ａは穴４があけられ、加
工面ａを貫通したレーザ光２は半透明部材１０で約５０
〜６０％減衰され、次に反射部材９で約９０％拡散反射
され、さらに半透明部材１０で約５０〜６０％減衰され
て貫通穴４の裏面ｂ部に帰る（図２参照）。このときは
大幅に減衰しているため、貫通穴４部の裏面ｂ側から再
加工され、穴の形状が変形する恐れはない。In the above, the YAG laser beam 2 of a thin beam is emitted from the tip nozzle 8 to a predetermined position on the processing surface a of the blade 1. Then, a hole 4 is formed in the processing surface a, and the laser beam 2 penetrating the processing surface a is
The light is attenuated by about 60%, then diffused and reflected by about 90% by the reflecting member 9, and further attenuated by about 50 to 60% by the translucent member 10 to return to the back surface b of the through hole 4 (see FIG. 2). At this time, since it is greatly attenuated, it is reworked from the back surface b side of the through hole 4 portion, and there is no possibility that the shape of the hole is deformed.
【００１３】以上においてポリテトラフルオロエチレン
が多少溶融しても、図５に示すように、透過率が向上す
るため、蒸発することなくその状態を維持する。As described above, even if the polytetrafluoroethylene is slightly melted, the transmittance is improved as shown in FIG. 5 and the state is maintained without evaporation.
【００１４】半透明部材１０としてポリテトラフルオロ
エチレンを用いた場合の透過特性を図４と図５に示す。
また反射部材９として銅を用いた場合の反射特性を図６
に示す。FIG. 4 and FIG. 5 show transmission characteristics when polytetrafluoroethylene is used as the translucent member 10.
FIG. 6 shows the reflection characteristics when copper is used as the reflection member 9.
Shown in
【００１５】上記で、半透明部材１０の代りに完全吸収
部材１７を用いると、図７に示すようにその燃焼ガスや
蒸発ガス等１７ａの影響をうける。また半透明部材１０
を除き、反射部材９だけを用いると、図８に示すように
加工穴４の裏面に再度高いエネルギーを与えることとな
り、加工穴の裏面側の精度を著しく低下させる原因とな
る。When the completely absorbing member 17 is used in place of the translucent member 10 as described above, it is affected by the combustion gas, evaporative gas and the like 17a as shown in FIG. Translucent member 10
When only the reflecting member 9 is used except for the above, high energy is again applied to the back surface of the processing hole 4 as shown in FIG.
【００１６】以上のように、半透明部材１０と反射部材
９を用いた場合、反射部材９の裏側にはレーザ光２はほ
とんど到達しない。このため、ブレード１のように加工
面ａの裏ｂに近接した他の部材があっても、他の部材が
不用意に加工される恐れもなくなる。As described above, when the translucent member 10 and the reflecting member 9 are used, the laser beam 2 hardly reaches the back side of the reflecting member 9. For this reason, even if there is another member close to the back surface b of the processing surface a like the blade 1, there is no possibility that the other member is carelessly processed.
【００１７】このようにして、加工対象の、目的の加工
面部のみを高精度に加工することができるようになる。
言葉をかえていえば、狭隘部での穴明け、切断、溶接等
の加工において、隣接部の保護手段としても有効であ
る。In this manner, only the target processing surface portion of the processing object can be processed with high precision.
In other words, it is effective as a means for protecting adjacent parts in processing such as drilling, cutting, and welding in a narrow part.
【００１８】[0018]
【発明の効果】以上説明したように、本発明によれば上
述した構成にしたことにより、加工面を貫通したレーザ
光は半透明部材で減衰され、また反射部材で拡散反射さ
れ、さらに反射レーザは半透明部材で減衰されて大幅に
減衰して裏面部に帰るため、貫通穴部が裏面側から再加
工されることがなくなり、加工対象部のみを高精度、高
効率で加工ができ、また反射部材が高い銅材で形成され
ているため加工面裏の他の部材が不用意に加工されるこ
ともない。また作業性の向上も計ることができる。As described above, according to the present invention, with the above-described structure, the laser beam penetrating the processing surface is attenuated by the translucent member, diffusely reflected by the reflecting member, and further reflected by the reflecting laser. since go back surface greatly attenuated is attenuated by the translucent member, prevents the through hole is re-machined from the back side, it can be processed only work regions precision, high efficiency, also The reflective member is made of high copper material
Other parts behind the machined surface may be inadvertently machined.
Not even. In addition, the workability can be improved.
【図１】図１は本発明の一実施例の構成斜視図である。FIG. 1 is a configuration perspective view of an embodiment of the present invention.
【図２】図２は同実施例の穴部の断面図である。FIG. 2 is a sectional view of a hole in the embodiment.
【図３】図３は同実施例の全体構成斜視図である。FIG. 3 is a perspective view of the overall configuration of the embodiment.
【図４】図４は同実施例の作用説明図である。FIG. 4 is an operation explanatory view of the embodiment.
【図５】図５は同実施例の作用説明図である。FIG. 5 is an operation explanatory view of the embodiment.
【図６】図６は同実施例の作用説明図である。FIG. 6 is an operation explanatory view of the embodiment.
【図７】図７は同実施例の作用説明図である。FIG. 7 is an operation explanatory view of the embodiment.
【図８】図８は同実施例の作用説明図である。FIG. 8 is an operation explanatory view of the embodiment.
【図９】図９は従来例の構成斜視図である。FIG. 9 is a configuration perspective view of a conventional example.
１ ブレード（ブレード部材） ２ レーザ光 ３ バックプロテクタ ４ 冷却穴 ５ 加工ヘッド ６ 固定治具 ７ 固定台 ８ 先端ノズル ９ 反射部材 １０ 透過部材 １２ 反射光 １３ 透過光 １４ 貫通ビーム １５ 中空部 １６ 裏面側部材 DESCRIPTION OF SYMBOLS 1 Blade (blade member) 2 Laser beam 3 Back protector 4 Cooling hole 5 Processing head 6 Fixing jig 7 Fixing stand 8 Tip nozzle 9 Reflecting member 10 Transmitting member 12 Reflected light 13 Transmitted light 14 Penetrating beam 15 Hollow portion 16 Backside member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 光斎 直樹 兵庫県高砂市荒井町新浜二丁目１番１号 三菱重工業株式会社高砂製作所内 (72)発明者 高際 幸一 兵庫県高砂市荒井町新浜二丁目１番１号 三菱重工業株式会社高砂製作所内 (72)発明者 高岡 重文 兵庫県高砂市荒井町新浜二丁目１番１号 三菱重工業株式会社高砂製作所内 (56)参考文献 特開 平２−37984（ＪＰ，Ａ) 特開 平６−285666（ＪＰ，Ａ) 特開 昭61−14093（ＪＰ，Ａ) 特開 平３−180287（ＪＰ，Ａ) 特開 平４−172194（ＪＰ，Ａ) 特開 平４−167992（ＪＰ，Ａ) 特公 昭62−29154（ＪＰ，Ｂ２) 実公 昭54−16383（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 26/18 B23K 26/00 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Naoki Kosai 2-1-1, Shinhama, Arai-machi, Takasago City, Hyogo Prefecture Inside the Takasago Works, Mitsubishi Heavy Industries, Ltd. No. 1-1 Inside Takasago Works, Mitsubishi Heavy Industries, Ltd. (72) Inventor Shigefumi Takaoka 2-1-1, Shinhama, Araimachi, Takasago City, Hyogo Prefecture Inside Takasago Works, Mitsubishi Heavy Industries, Ltd. (56) References JP-A-2-37984 (JP) JP-A-6-285666 (JP, A) JP-A-61-14093 (JP, A) JP-A-3-180287 (JP, A) JP-A-4-172194 (JP, A) 4-167992 (JP, A) JP-B-62-29154 (JP, B2) JP-B-54-16383 (JP, Y2) (58) Fields investigated (Int. Cl. 7 , DB name) B23K 26/18 B23K 26/00
Claims (1)
らなる加工対象材の加工面の裏側に沿って設けられ、加
工面を貫通し透過する前記固体レーザ光を減衰させる半
透明部材と、前記半透明部材の裏側に沿って設けられ、
前記半透明部材を透過した前記固体レーザ光を拡散反射
させるとともに、加工面裏側に近接して配置された他の
部材を保護できる銅材からなる反射部材とを備えてなる
ことを特徴とするレーザ加工用バックプロテクタ。A semi-transparent member provided along a back side of a processing surface of a processing target material made of metal for performing drilling with solid state laser light and attenuating the solid state laser light penetrating through the processing surface; Provided along the back side of the translucent member,
While diffusely reflecting the solid-state laser light that has passed through the translucent member, another solid-state laser disposed close to the back side of the processing surface
A back protector for laser processing, comprising: a reflecting member made of a copper material capable of protecting the member .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29047093A JP3316281B2 (en) | 1993-11-19 | 1993-11-19 | Back protector for laser processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29047093A JP3316281B2 (en) | 1993-11-19 | 1993-11-19 | Back protector for laser processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07136792A JPH07136792A (en) | 1995-05-30 |
| JP3316281B2 true JP3316281B2 (en) | 2002-08-19 |
Family
ID=17756433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29047093A Expired - Lifetime JP3316281B2 (en) | 1993-11-19 | 1993-11-19 | Back protector for laser processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3316281B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2897006B1 (en) | 2006-02-09 | 2008-05-09 | Snecma Sa | LASER BEAM CUTTING PROCESS |
| JP4945362B2 (en) * | 2007-07-30 | 2012-06-06 | 本田技研工業株式会社 | Drilling method and apparatus therefor |
| JP5071487B2 (en) * | 2010-01-06 | 2012-11-14 | 株式会社デンソー | Laser processing apparatus and laser processing method |
| JP5787555B2 (en) * | 2011-03-07 | 2015-09-30 | 三菱日立パワーシステムズ株式会社 | Method for manufacturing gas turbine member |
| JP6432402B2 (en) * | 2015-03-17 | 2018-12-05 | 株式会社デンソー | Laser processing equipment |
| KR102312646B1 (en) * | 2018-03-19 | 2021-10-14 | 두산중공업 주식회사 | Protecting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6229154B2 (en) | 2013-09-26 | 2017-11-15 | パナソニックＩｐマネジメント株式会社 | Ventilation equipment |
-
1993
- 1993-11-19 JP JP29047093A patent/JP3316281B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6229154B2 (en) | 2013-09-26 | 2017-11-15 | パナソニックＩｐマネジメント株式会社 | Ventilation equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07136792A (en) | 1995-05-30 |
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